CN217443490U

CN217443490U - Module test fixture

Info

Publication number: CN217443490U
Application number: CN202221111029.3U
Authority: CN
Inventors: 陆鹏军; 张路华; 高宇辰; 蔡广明
Original assignee: Shenzhen Smart Semiconductor Ltd
Current assignee: Shenzhen Smart Semiconductor Ltd
Priority date: 2022-05-10
Filing date: 2022-05-10
Publication date: 2022-09-16
Anticipated expiration: 2032-05-10

Abstract

The utility model discloses a module test fixture, including upper cover plate, infrabasal plate, connecting portion, upper cover plate and infrabasal plate pass through connecting portion swing joint, the upper cover plate is provided with test component, test component includes first movable rod, second movable rod one end is provided with first locating hole, first movable rod passes through first locating hole and second movable rod screw connection, be provided with the test thimble on the second movable rod, be provided with first conduit in the second movable rod, placed first wire in the first conduit, first wire one end and test thimble electric connection, the utility model discloses can improve efficiency of software testing, convenient to use, safety can improve the accuracy of photoelectric parameter test.

Description

Module test fixture

Technical Field

The utility model relates to a module test technical field specifically indicates a module test fixture.

Background

In the production process of the LED module, in order to measure parameters, performance and reliability of the module, the LED module usually needs to be tested. The modules are generally provided with corresponding test points: such as: positive test point, negative test point, ground point, etc. According to the actual requirements of customers, the test points have a plurality of processing modes: bare, tinned, and terminals placed thereon. When the photoelectric test system is used for carrying out photoelectric test on the module, the module needs to be electrified.

In the prior art, when a test point is exposed or tinned, a wire needs to be welded on the test point; when a terminal is located on the test point, a first wire needs to be inserted into the terminal wiring hole. Then the photoelectric test system is connected with the first lead. The current access method through the first wire has the following disadvantages: the testing efficiency is low; when welding LED module manual work, need weld first wire to the module test point through soldering tin, this process inevitable can produce the influence to the module outward appearance, for example: the test points are tin balls, white oil layer damage, copper sheet damage, dirt, fingerprints and the like, and the appearance problems can seriously affect the product shipment; the number of uses of the terminal is also consumed: the service life of the terminal is limited by times, generally about 5 times, and when the times exceed the times, a terminal supplier cannot provide quality assurance; the line diameter of the first wire, the length of the first wire, poor welding, dirty welding, the first wire shielding the LED lamp bead and the like can influence electric parameter and optical parameter, so that the test data is inaccurate.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, provide a module test fixture that can make test data accurate.

The purpose of the utility model is realized through the following technical scheme:

the utility model provides a module test fixture, includes upper cover plate, infrabasal plate, connecting portion, upper cover plate and infrabasal plate pass through connecting portion swing joint, the upper cover plate is provided with test component, test component includes first movable rod, second movable rod one end is provided with first locating hole, first movable rod passes through first locating hole and second movable rod screw connection, be provided with the test thimble on the second movable rod, be provided with first conduit in the second movable rod, placed first wire in the first conduit, first wire one end and test thimble electric connection.

Furthermore, a second positioning hole is formed in the other end of the first movable rod, the first movable rod is connected with the upper cover plate through the second positioning hole in a screw mode, a third positioning hole is formed in the other end of the second movable rod, and the second movable rod is connected with the upper cover plate through the third positioning hole in a screw mode.

Furthermore, a spring is arranged in the test thimble and used for pressing the upper cover plate to the lower substrate, and the test thimble is pressed with the test point.

Furthermore, upper cover plate check blocks are arranged on two sides of the upper cover plate and connected with a connecting socket, and the upper cover plate check blocks are fixedly connected with the connecting socket through screws.

Furthermore, the other end of the first lead is connected with a conductive gasket, and the other end of the conductive gasket is fixed on the upper cover plate stop block through a nut.

Furthermore, the upper cover plate is provided with a sixth positioning hole, the lower substrate is correspondingly provided with a positioning column, and the positioning column is pressed in the sixth positioning hole.

Furthermore, the lower substrate is provided with a buckle, the buckle is provided with a movable pressing part, and the movable pressing part is pressed to drive the buckle to turn outwards.

Further, the infrabasal plate is provided with a test board placing area, the test board placing area is thinner than the infrabasal plate, the test board placing area is provided with a plurality of fourth positioning holes, a test board positioning sheet is placed on the fourth positioning holes, and the test board positioning sheet is connected with the infrabasal plate through fourth positioning hole screws.

Furthermore, the lower substrate is also provided with a test board taking-out area, and the thickness of the test board taking-out area is smaller than that of the test board placing area.

Further, the connecting part is a hinge.

Compared with the prior art, the utility model following advantage and beneficial effect have:

the utility model discloses compare with the first wire access mode of prior art:

1. the test efficiency can be improved: the test fixture is adopted, and the first lead does not need to be welded at the test point or inserted into the terminal wiring port. The module can be directly placed into the corresponding test placement area, and the upper cover plate and the lower substrate are pressed together, so that tight electrical connection can be realized.

2. Can not influence module outward appearance, terminal life and product shipment: because the first wire does not need to be welded and is arranged in the terminal wiring port, only a pressing mode is adopted, and the appearance of the module and the terminal are not affected basically.

3. The accuracy of photoelectric parameter testing is improved:

a: the thimble contact is adopted, so that when the modules of the same model are tested, the accuracy of the electrical parameter test data cannot be influenced due to the fact that the lengths of the first wires are inconsistent and the wire diameter of the first wires is not consistent;

b: reducing light parameter test effects: because welding is not needed, welding dirt does not exist; the movable rod adopts transparent material, and the movable rod has certain distance with the module, can not directly cover LED lamp pearl because of first wire, and influence light and join in marriage test data.

4. The module test commonality is high: the test board can be suitable for modules with different shapes and different test points.

a: and a plurality of fourth positioning holes are formed in the bottom of the lower substrate, so that the module positioning sheets in different shapes can be conveniently fixed.

b: the fifth positioning holes arranged on the periphery of the upper cover plate can be used for fixing the movable rods with different shapes and different bridging modes simultaneously as required.

c: the design method of the movable rod is diversified: for example, the shape, the length, the bridging mode between the first movable rod and the second movable rod, the rotation of a certain angle between the movable rod and the positioning hole of the upper cover plate can be performed, the number of the test thimbles and the like can be designed and manufactured as required, and the matching jig is used for positioning and testing.

Drawings

FIG. 1 is a top view of a module test fixture in an open state;

FIG. 2 is a bottom view of the module testing fixture in an open state;

FIG. 3 is a perspective view of a module testing fixture in an open state;

FIG. 4 is a schematic view of a positioning plate for placing a module testing fixture;

FIG. 5 is a side view of a module test fixture in an open position;

FIG. 6 is a top view of a closed state of a module testing fixture;

FIG. 7 is a perspective view of a closed state of a module testing fixture;

FIG. 8 is a side view of a closed state of a modular test fixture;

FIG. 9 is a perspective view of embodiment 2;

FIG. 10 is a schematic view of example 2;

FIG. 11 is a perspective view of the PCB module test fixture;

FIG. 12 is a schematic view of the prior art;

FIG. 13 is a schematic diagram of a second prior art;

FIG. 14 is a prior art side view;

wherein, 1-upper cover plate, 2-first movable rod, 3-second movable rod, 4-fifth positioning hole, 5-connecting part, 6-lower base plate, 7-test plate placing area, 8-test plate taking area, 9-fourth positioning hole, 10-buckle, 11-positioning column, 12-connecting socket, 13-screw, 14-upper cover plate baffle, 15-test thimble, 16-sixth positioning hole, 17-first wire, 18-nut, 19-conductive gasket, 20-second positioning hole, 21-first positioning hole, 22-first wire conduit, 23-third positioning hole, 24-test plate positioning sheet, 25-terminal wiring hole, 26-second positive electrode test point, 27-second negative electrode test point, 28-a third negative pole test point, 29-a first positive pole test point, 30-a first negative pole test point, 31-a jog reset switch and 32-a movable pressing part.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It is to be understood that the terms "comprises," "comprising," and "having" and any variations thereof in the description and claims of the invention and the above-described drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. In the claims, the description and the drawings of the present application, relational terms such as "first" and "second" and the like may be used solely to distinguish one entity/action/object from another entity/action/object without necessarily requiring or implying any actual such relationship or order between such entities/actions/objects.

As shown in fig. 1, 2, 6, 7 and 8, a module testing jig comprises an upper cover plate 1, a lower base plate 6 and a connecting portion 5, wherein the upper cover plate 1 and the lower base plate 6 are movably connected through the connecting portion 5, the upper cover plate 1 is designed to be hollow, so as to avoid a protruding portion of a PCB module, facilitate replacement of a first movable rod 2 and a second movable rod 3, and save manufacturing cost of the upper cover plate 1, the connecting portion 5 is a hinge, the upper cover plate 1 is provided with a testing component, the testing component comprises a first movable rod 2 and a second movable rod 3, one end of the second movable rod 3 is provided with a first positioning hole 21, the first movable rod 2 is in screwed connection with the second movable rod 3 through the first positioning hole 21, the second movable rod 3 is provided with a testing thimble 15, a first conduit 22 is arranged in the second movable rod 3, a first conductor 17 is arranged in the first conduit 22, the position of first wire 17 is fixed, the utility model discloses do not need to weld first wire 17, terminal wiring mouth is put into to first wire 17, only adopts the pressfitting mode, can not exert an influence to module outward appearance and terminal basically, can not directly cover LED lamp pearl because first wire 17, and influences the optical parameter test data, improves the test accuracy, 17 one end of first wire and the 15 electric connection of test thimble, first movable rod 2, second movable rod 3, upper cover plate 1 and the optional transparent acrylic of infrabasal plate 6.

The other end of the first movable rod 2 is provided with a second positioning hole 20, the first movable rod 2 is in screw connection with the upper cover plate 1 through the second positioning hole 20, the other end of the second movable rod 3 is provided with a third positioning hole 23, the second movable rod 3 is in screw connection with the upper cover plate 1 through the third positioning hole 23, the lengths and the shapes of the first movable rod 2 and the second movable rod 3 can be changed according to the positions of a second positive test point 26 and a third negative test point 28 on the PCB module, the first movable rod 2 and the second movable rod 3 can rotate for a certain angle relative to the upper cover plate 1, the upper cover plate 1 is further provided with a plurality of fifth positioning holes 4 all around, and the movable rods with different shapes and different bridging modes can be fixed simultaneously according to needs.

In an embodiment, a spring (not shown) is disposed in the testing thimble 15, and is used for pressing the second positive test point 26 and the third negative test point 28 tightly by the testing thimble 15 when the upper cover plate 1 is pressed on the lower substrate 6, so that the PCB module is not loosened during testing, and the testing accuracy is higher. Upper cover plate stoppers 14 are arranged on two sides of the upper cover plate 1, the upper cover plate stoppers 14 are connected with a connecting socket 12, the upper cover plate stoppers 14 are fixedly connected with the connecting socket 12 through screws 13, and corresponding male heads can be inserted into the connecting socket 12.

As shown in fig. 3, the other end of the first wire 17 is connected to a conductive pad 19, and the other end of the conductive pad 19 is fixed to the upper cover stopper 14 by a nut 18. The upper cover plate 1 is provided with a sixth positioning hole 16, the lower substrate 6 is correspondingly provided with a positioning column 11, and the positioning column 11 is pressed in the sixth positioning hole 16, so that the upper cover plate 1 is accurately pressed with the lower substrate 6, and the testing accuracy is ensured. The lower substrate 6 is provided with a buckle 10, the buckle 10 is provided with a movable pressing part 32, the movable pressing part 32 is pressed, one end of the buckle 10 is turned outwards, the movable pressing part 32 is loosened, the buckle 10 presses the upper cover plate 1, the upper cover plate 1 and the lower substrate 6 are tightly pressed, and the movable pressing part 32 has certain elasticity.

As shown in fig. 4 and 5, the lower substrate 6 is provided with a test board placing area 7, the thickness of the test board placing area 7 is smaller than that of the lower substrate 6, so that when the PCB module is placed into the lower substrate 6, the upper cover plate 1 can be closed with the lower substrate 6, the test board placing area 7 is provided with a plurality of fourth positioning holes 9, the fourth positioning holes 9 are provided with test board positioning pieces 24, and the test board positioning pieces 24 are in screw connection with the lower substrate 6 through the fourth positioning holes 9.

The infrabasal plate 6 still is provided with and surveys test panel and takes out district 8, survey test panel and take out 8 thickness in district and be less than and survey test panel and place district 7, survey test panel and take out district 8 and survey test panel and place district 7 and have the difference in height, conveniently place and take out the PCB module.

As shown in fig. 12, in the first prior art, wire bonding is required to be performed on the first positive test point 29 and the first negative test point 30 when the test points are exposed, and this way of testing may affect the appearance of the module, the service life of the terminal, and the product shipment;

as shown in fig. 13 and 14, in the second prior art, in the manner of placing terminals on the second positive test point 26 and the second negative test point 27, a second wire (not shown in the figure) needs to be inserted into the terminal wiring hole 25, and then the second wire is connected to the photoelectric test system, so that the second wire directly covers the LED lamp bead, thereby affecting the optical parameter test data.

Example 1

As shown in fig. 11, the upper cover plate 1 is opened, the test board positioning plate 24 is screwed on the lower substrate 6 through the fourth positioning hole 9, the PCB module is placed, the movable pressing member 32 is pressed, the upper cover plate 1 is clamped into the positioning post 11 through the sixth positioning hole 16 and covered on the lower substrate 6, the movable pressing member 32 is released, the buckle 10 presses the upper cover plate 1, and the test member presses the second positive test point 26 and the third negative test point 28 on the PCB module for testing.

Example 2

As shown in fig. 9 and 10, a jog reset switch 31 is disposed on the upper cover plate 1, when the upper cover plate 1 is opened, the module testing jig is in a power-off state, so as to prevent a worker from contacting with the charged testing thimble 15 during the stitching process, the testing board positioning plate 24 is screwed onto the lower substrate 6 through the fourth positioning hole 9, a PCB module is placed, the movable pressing part 32 is pressed, the upper cover plate 1 is clamped into the positioning column 11 through the sixth positioning hole 16 and covers the lower substrate 6, the movable pressing part 32 is released, the upper cover plate 1 is pressed by the buckle 10, and after the stitching process, the testing part is in a power-on state, and the testing part presses the second positive testing point 26 and the third negative testing point 28 on the PCB module for testing.

It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention and the technical principles applied, and any changes, modifications, substitutions, combinations, and simplifications made by those skilled in the art without departing from the spirit and principle of the present invention should be considered as equivalent replacement modes within the scope of the present invention.

Claims

1. The utility model provides a module test fixture which characterized in that: including upper cover plate, infrabasal plate, connecting portion, upper cover plate and infrabasal plate pass through connecting portion swing joint, the upper cover plate is provided with test component, test component includes first movable rod, second movable rod one end is provided with first locating hole, first movable rod passes through first locating hole and second movable rod screw connection, be provided with the test thimble on the second movable rod, be provided with first conduit in the second movable rod, placed first wire in the first conduit, first wire one end and test thimble electric connection.

2. The module testing jig of claim 1, wherein: the other end of the first movable rod is provided with a second positioning hole, the first movable rod is connected with the upper cover plate through the second positioning hole through a screw, the other end of the second movable rod is provided with a third positioning hole, and the second movable rod is connected with the upper cover plate through the third positioning hole through a screw.

3. The module test fixture of claim 2, wherein: and a spring is arranged in the testing thimble and is used for pressing the testing thimble and the testing point when the upper cover plate is pressed on the lower base plate.

4. The module testing jig of claim 3, wherein: and upper cover plate check blocks are arranged on two sides of the upper cover plate and are connected with the connecting socket, and the upper cover plate check blocks are fixedly connected with the connecting socket through screws.

5. The module testing jig of claim 4, wherein: the other end of the first lead is connected with a conductive gasket, and the other end of the conductive gasket is fixed on the upper cover plate stop block through a nut.

6. The module testing jig of claim 5, wherein: the upper cover plate is provided with a sixth positioning hole, the lower substrate is correspondingly provided with a positioning column, and the positioning column is pressed in the sixth positioning hole.

7. The module test fixture of claim 6, wherein: the lower substrate is provided with a buckle, the buckle is provided with a movable pressing part, and the movable pressing part is pressed to drive the buckle to turn outwards.

8. The module testing jig of claim 7, wherein: the utility model discloses a setting up the infrabasal plate, including infrabasal plate, survey test panel and place the district thickness and be less than the infrabasal plate, survey test panel and place the district and be provided with a plurality of fourth locating holes, place on the fourth locating hole and survey the test panel spacer, survey test panel spacer and infrabasal plate and pass through fourth locating hole screwed connection.

9. The module testing jig of claim 8, wherein: the lower substrate is also provided with a test board taking-out area, and the thickness of the test board taking-out area is smaller than that of the test board placing area.

10. The module testing jig of claim 9, wherein: the connecting part is a hinge.