CN217426690U - Wafer film expanding machine - Google Patents

Abstract

The utility model discloses a wafer film expanding machine, this wafer film expanding machine includes the base, expand the membrane spare, lift cylinder and wafer ring, the base is located to the membrane spare, the one side that deviates from the base of membrane spare is equipped with circular arch, the base is located to the lift cylinder, wafer ring connects in the lift cylinder, wafer ring is located one side that circular arch deviates from the base, wafer ring corresponds circular arch setting, and wafer ring's internal diameter is greater than the wafer ring of circular bellied external diameter and can expand the membrane relatively under the effect of lift cylinder and move to circular arch and prop wafer ring's blue membrane, in order to expand the membrane to blue membrane. The embodiment of the utility model provides a wafer expands membrane machine can only utilize the lift cylinder drive to realize expanding the membrane to blue membrane, and need not to set up drive assembly to be favorable to simplifying the structure that the wafer expanded membrane machine, the processing of being convenient for, thereby be favorable to reducing the cost that the wafer expanded membrane machine, the power take off of wafer expanded membrane machine is reliable and stable moreover.

Description

Wafer film expanding machine

Technical Field

The utility model relates to a wafer processing equipment technical field especially relates to a wafer film expanding machine.

Background

After the wafer is cut, gaps among crystal grains on the wafer are small, so that adjacent crystal grains are easy to collide in the process of removing unqualified crystal grains, the adjacent crystal grains are subjected to phenomena of edge breakage, scratching and the like, and the quality of the crystal grains is reduced. Therefore, in order to ensure the quality of the die, it is generally necessary to expand the wafer by using a wafer film expander to increase the gap between adjacent dies.

In the related art, a wafer film expanding machine usually adopts a rotating motor as an actuator, and the rotating motor is connected to an outer pressing plate through a gear and a lifting nut in a transmission manner, so that when a film is required to be expanded, the rotating motor drives the gear to rotate so as to drive the outer pressing plate to press a wafer iron ring to descend, and a blue film is pressed against by a fixed position of a support ring, so that the blue film expanding action is realized. However, in such a manner, the power mechanism of the wafer film expanding machine at least includes parts such as a motor, a gear, a lifting nut, and the like, so that the structure of the power mechanism is relatively complex, and the assembly requirement between the parts is high, which leads to high requirement on the processing precision of the parts and increases the cost.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model discloses wafer film expanding machine adopts the cylinder as the power unit of wafer film expanding machine, simple structure, the processing of being convenient for to be favorable to reducing the cost of wafer film expanding machine, output reliable and stable moreover.

In order to achieve the above object, the utility model discloses a wafer film expanding machine, include:

a base;

the film expanding piece is arranged on the base, and a circular bulge is arranged on one surface of the film expanding piece, which is far away from the base;

the lifting cylinder is arranged on the base; and

the crystal ring is connected to the lifting cylinder, is positioned on one side of the circular protrusion, which is far away from the base, corresponds to the circular protrusion, and has an inner diameter larger than the outer diameter of the circular protrusion;

the wafer ring can move to the circular bulge relative to the film expanding piece under the action of the lifting cylinder to support the blue film of the wafer ring, so that the blue film is expanded.

As an optional implementation manner, in the embodiment of the utility model, wafer film expander still includes elastomeric element and compresses tightly the piece, elastomeric element locates the base, and in the direction of motion of wafer ring, elastomeric element highly be higher than circular protruding height, the wafer ring bears and establishes on the elastomeric element, compress tightly the piece connect in lift cylinder just is located keeping away from of wafer ring expand one side of membrane piece, compress tightly the piece and be in under the effect of lift cylinder can with the wafer ring butt, in order to drive the wafer ring is relative expand the membrane piece and move extremely circular protruding the propping blue membrane, in order to right the blue membrane expands the membrane, elastomeric element is in deformation takes place under the effect of wafer ring.

As an optional implementation manner, in the embodiment of the present invention, the wafer film expanding machine further includes a positioning component, the positioning component is disposed on the base, the positioning component is used for defining a positioning space with the base, the elastic component is located in the positioning space, and the wafer ring is located in the positioning space and abuts against the positioning component.

As an optional implementation manner, in an embodiment of the present invention, the wafer film expander further includes a calibration component, the calibration component is disposed on the base, and the calibration component is configured to calibrate a position of the wafer ring in the positioning space.

As an optional implementation manner, in the embodiment of the present invention, the calibration assembly includes a calibration cylinder and a calibration component, the calibration cylinder is located the base, the calibration component connect in the calibration cylinder, the calibration component is equipped with a calibration groove, the calibration groove have with the internal face of the outer profile looks adaptation of crystal ring, the calibration cylinder is used for driving the calibration component is relative the base activity, in order to promote the crystal ring is relative the base activity, until the internal face with the outer profile laminating of crystal ring.

As an optional implementation manner, in an embodiment of the present invention, the wafer film expanding machine further includes a guiding component, the base is provided with a guiding through hole, the guiding component is connected to the pressing piece, and the guiding component is slidably disposed through the guiding through hole.

As an optional implementation manner, in the embodiment of the present invention, the wafer film expanding machine further includes a limiting gasket, the limiting gasket is disposed on the base, and in the axial direction of the film expanding member, the height of the limiting gasket is lower than the height of the circular protrusion, the limiting gasket abuts against the wafer ring to limit the movement stroke of the wafer ring moving under the action of the lifting cylinder.

As an optional implementation manner, in an embodiment of the present invention, the base is provided with a positioning groove, and the limiting gasket is disposed on the positioning groove.

As an optional implementation manner, in an embodiment of the present invention, the limiting gasket is used for defining a limiting space with the base, and the membrane expansion member is located in the limiting space and abuts against the limiting gasket.

As an optional implementation manner, in the embodiment of the present invention, the base is provided with a through groove, the circular protrusion is provided with a through hole, the through hole corresponds to the through groove and is set up and communicated with the through groove, just the through hole corresponds to the hollow portion on the wafer ring is set up, the through hole with the through groove is used for the blue membrane of the wafer ring to expand the membrane and then the membrane stripping device passes, so that the membrane stripping device can strip the blue membrane from the wafer ring.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the embodiment of the utility model provides a wafer expands membrane machine, through setting up the lift cylinder of being connected with the wafer ring, and set up the circular arch that the external diameter is less than the wafer ring internal diameter on expanding the membrane piece, and will expand the membrane piece and set up the below at the wafer ring, thereby can utilize lift cylinder drive wafer ring downstream to the blue membrane that circular arch propped the wafer ring, circular arch can apply the effort to blue membrane this moment, in order to realize expanding the membrane to blue membrane, it is visible, the wafer expands membrane machine of this application is when realizing expanding the membrane action to blue membrane, only need utilize lift cylinder drive to realize, and need not to set up transmission assembly, thereby be favorable to simplifying the structure that the wafer expanded membrane machine, be convenient for process, thereby be favorable to reducing the cost that the wafer expanded membrane machine, and the power take off of wafer expanded membrane machine is reliable and stable.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a wafer film expanding machine disclosed in an embodiment of the present invention;

FIG. 2 is an exploded view of the wafer film expanding machine of FIG. 1;

fig. 3 is a schematic structural diagram of a wafer film expanding machine not shown with a pressing member and a wafer ring according to an embodiment of the present invention;

FIG. 4 is an exploded view of the wafer film expander shown in FIG. 3 without the pressing member and the wafer ring;

fig. 5 is a schematic structural diagram of a wafer ring and a calibration cylinder disclosed in an embodiment of the present invention.

Description of the main reference numerals

100. A wafer film expanding machine; 10. a base; 101. a through groove; 102. an avoidance groove; 103. a guide through hole; 104. a positioning groove; 11. a film expanding piece; 111. a circular protrusion; 112. a through hole; 113. reinforcing ribs; 12. a lifting cylinder; 13. a wafer ring; 14. an elastic member; 15. a pressing member; 16. a guide member; 17. a positioning member; 18. calibrating the component; 181. calibrating the cylinder; 182. a calibration component; 183. calibrating the groove; 1831. an inner wall surface; 19. spacing gasket.

200. A blue film.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.

Referring to fig. 1 and fig. 2, an embodiment of the present invention discloses a wafer film expanding machine, the wafer film expanding machine 100 includes a base 10, a film expanding piece 11, a lifting cylinder 12 and a wafer ring 13, the film expanding piece 11 is disposed on the base 10, and one side of the film expanding piece 11 deviating from the base 10 is provided with a circular protrusion 111, and the lifting cylinder 12 is disposed on the base 10. The wafer ring 13 is connected to the lifting cylinder 12, the wafer ring 13 is located on one side of the circular protrusion 111 departing from the base 10, the wafer ring 13 is arranged corresponding to the circular protrusion 111, and the inner diameter of the wafer ring 13 is larger than the outer diameter of the circular protrusion 111. The wafer ring 13 can move to the circular protrusion 111 relative to the film expanding piece 11 under the action of the lifting cylinder 12 to support the blue film 200 of the wafer ring 13 so as to expand the blue film 200, so that gaps between crystal grains on a wafer can be enlarged, adjacent crystal grains cannot be collided in the process of rejecting unqualified crystal grains, and the phenomena of edge breakage, scratching and the like of the adjacent crystal grains are avoided so as to ensure the quality of the crystal grains.

The embodiment of the utility model provides an in wafer film expanding machine 100, expand membrane piece 11 and set up on base 10, and expand membrane piece 11 and be located between wafer ring 13 and base 10, namely, it is located the below of wafer ring 13 to expand membrane piece 11, through set up the circular arch 111 that the external diameter is less than wafer ring 13 internal diameter on expanding membrane piece 11, and set up the lift cylinder 12 of being connected with wafer ring 13, thereby can utilize lift cylinder 12 drive wafer ring 13 along the direction (for example the downward direction in fig. 1) that is close to expanding membrane piece 11 to move to circular arch 111 and prop the blue membrane 200 of wafer ring 13, circular arch 111 can exert the upward effort to blue membrane 200 this moment, so that blue membrane 200 expands, and then realize the expanding action to blue membrane 200. Therefore, when the wafer film expanding machine 100 expands the blue film 200, the blue film can be expanded only by driving the lifting cylinder 12 without arranging transmission components such as gears and lifting nuts, the number of parts of the power mechanism of the wafer film expanding machine 100 is reduced, the structure of the wafer film expanding machine 100 is simplified, the cost of the wafer film expanding machine 100 is reduced, and the lifting cylinder 12 is used as a power source of the wafer film expanding machine 100 due to the fact that the cylinder has the characteristic of reliable action, power output of the wafer film expanding machine 100 is stable and reliable, and film expanding quality is improved.

In some embodiments, the base 10 may have a plate-shaped structure, and the base 10 may have a through groove 101, the circular protrusion 111 may have a through hole 112, the through hole 112 is disposed corresponding to the through groove 101 and is communicated with the through groove 101, and the through hole 112 is disposed corresponding to a hollow portion on the wafer ring 13, that is, when the blue film 200 is disposed on the wafer ring 13, the through hole 112 may be disposed corresponding to the blue film 200, so that the through hole 112 and the through groove 101 may be used for the film peeling device to pass through after the blue film 200 of the wafer ring 13 is subjected to film expansion, so that the film peeling device can act on the blue film 200 to peel the blue film 200 from the wafer ring 13, so that the blue film 200 after the expansion is separated from the wafer ring 13.

Further, in order to improve the structural strength of the film expanding member 11, the inner surface of the through hole 112 is provided with a rib 113 to ensure that the circular protrusion 111 can support the blue film 200 to expand the blue film 200.

In some embodiments, the wafer film expanding machine 100 further includes an elastic component 14 and a pressing component 15, the elastic component 14 is disposed on the base 10, and in a moving direction of the wafer ring 13, for example, in an up-down direction in fig. 1, a height of the elastic component 14 is higher than a height of the circular protrusion 111, the wafer ring 13 is supported on the elastic component 14, the pressing component 15 is connected to the lifting cylinder 12 and is located on one side of the wafer ring 13 away from the film expanding component 11, and the pressing component 15 can abut against the wafer ring 13 under the action of the lifting cylinder 12 to drive the wafer ring 13 to move relative to the film expanding component 11 to the circular protrusion 111 to support the blue film 200, so as to expand the blue film 200, and the elastic component 14 deforms under the action of the wafer ring 13. Like this, make wafer ring 13 can not keep fixed connection with lift cylinder 12, thereby make wafer ring 13 can be suitable for the activity in the direction of motion of perpendicular to wafer ring 13, with the position of the relative diffusion of membrane spare 11 of adjustment wafer ring 13, thereby ensure that blue membrane 200 on wafer ring 13 can just to circular arch 111 setting, after ensuring that lift cylinder 12 drive wafer ring 13 along the direction motion certain distance that is close to diffusion of membrane spare 11, circular arch 111 can butt blue membrane 200 and prop blue membrane 200 of wafer ring 13, and then realize the diffusion of membranes.

Moreover, set up elastomeric element 14, because the direction motion that compresses tightly 15 along being close to expand membrane piece 11 in the drive of lift cylinder 12, when driving wafer ring 13 along the direction motion that is close to expand membrane piece 11, wafer ring 13 can compress elastomeric element 14 and make it take place elastic deformation, make elastomeric element 14 have along the trend of keeping away from the direction recovery deformation that expands membrane piece 11, thereby make wafer ring 13 can stably the centre gripping compress tightly between 15 and elastomeric element 14, avoid wafer ring 13 to take place to rock at the membrane in-process that expands, the skew, in order to ensure to expand the membrane effect.

Further, since the wafer ring 13 is placed on the elastic member 14 by using a clamp, an avoiding groove 102 is further provided on the base 10 to avoid the clamp.

The pressing member 15 may have a plate-shaped structure, the elastic member 14 may be a spring pin, a rubber column, a silica gel column, or the like, and the number of the elastic members 14 may be multiple, for example, two, three, four, eight, sixteen, or more, and the multiple elastic members 14 are respectively abutted to the wafer ring 13, so that the contact area between the elastic members 14 and the wafer ring 13 can be increased, and the stability of the wafer ring 13 supported on the elastic members 14 can be improved. For example, in the embodiment shown in fig. 1 and fig. 2, the outer contour of the wafer ring 13 is a square contour, so that the wafer ring 13 has four opposite corners, the number of the elastic members 14 is eight, and two elastic members 14 are arranged corresponding to one corner.

In some embodiments, as shown in fig. 2 and fig. 3, in order to ensure the moving smoothness of the wafer ring 13, the number of the lifting cylinders 12 may be multiple, for example, two, three, four, or more, the plurality of lifting cylinders 12 are uniformly distributed on the base 10, the number of the pressing members is multiple, for example, two, three, four, or more, the plurality of pressing members 15 are respectively connected to the corresponding lifting cylinders 12, and the plurality of pressing members 15 can be abutted to the wafer ring 13 under the action of the corresponding lifting cylinders 12, so as to drive the wafer ring 13 to move relative to the film expanding member 11 to the circular protrusion 111 to support the blue film 200, so as to expand the blue film 200.

Further, the wafer film expanding machine 100 further includes a guide component 16, for example, a guide post, a guide rod, etc., the base 10 is provided with a guide through hole 103, the guide component 16 is connected to the pressing piece 15, and the guide component 16 slidably penetrates through the guide through hole 103, so that when the lifting cylinder 12 drives the pressing piece 15 to move relative to the base 10, the guide component 16 and the guide through hole 103 can guide the movement of the pressing piece 15, so that the pressing piece 15 can move relative to the base 10 along a predetermined line under the action of the guide component 16 and the guide through hole 103, so that the wafer ring 13 can move relative to the base 10 along the predetermined line, and the motion stability of the wafer ring 13 can be improved.

Alternatively, the number of the guide components 16 may be multiple, for example, two, three, four or more, the plurality of guide components 16 are respectively connected to the pressing member 15, the plurality of guide through holes 103 may correspond to the plurality of guide through holes 103, the plurality of guide through holes 103 and the plurality of guide components 16 are arranged in a one-to-one correspondence, the plurality of guide components 16 are respectively slidably connected to the corresponding guide through holes 103, and the plurality of guide components 16 and the plurality of guide through holes 103 are arranged, so that the guiding effect is better. Illustratively, in the embodiment shown in fig. 2, there are two lifting cylinders 12, two pressing members 15, four guide members 16, and four guide through holes 103, and each pressing member 15 is connected to two guide members 16.

In some embodiments, as shown in fig. 1 to 4, the wafer film expanding machine 100 further includes a positioning component 17, the positioning component 17 is disposed on the base 10, and the positioning component 17 is configured to define a positioning space with the base 10, wherein the elastic component 14 is located in the positioning space, and the wafer ring 13 is located in the positioning space and abuts against the positioning component 17, so that when the wafer ring 13 is placed on the elastic component 14, the positioning space defined by the positioning component 17 and the base 10 can be used to position the wafer ring 13, which is convenient to ensure that the wafer ring 13 can be disposed corresponding to the film expanding piece 11, so as to ensure that the blue film 200 on the wafer ring 13 can be disposed opposite to the circular protrusion 111, and further ensure that after the lifting cylinder 12 drives the wafer ring 13 to move for a certain distance in a direction close to the film expanding piece 11, the circular protrusion 111 can abut against the blue film 200 and support the blue film 200 of the wafer ring 13, the film expansion of the blue film 200 is realized.

For example, the positioning component 17 may be a positioning column, a positioning pin, or a plate-shaped structure with a positioning groove therethrough. When the positioning component 17 is a positioning column or a positioning pin, the positioning component 17 may be a plurality of, for example, two, three, four, eight, sixteen or more, the plurality of positioning components 17 are disposed on the base 10 in a surrounding manner to form the aforementioned positioning space between the base 10, for example, in the embodiment shown in fig. 1 and 2, the outer contour of the wafer ring 13 is a square contour, and then the wafer ring 13 has four opposite corners, each corner includes two sides, the positioning components 17 are eight, two positioning components 17 correspond to one corner, and are located in two positioning components 17 in the same corner, one of the positioning components 17 abuts against one side of the corner, and the other positioning component 17 abuts against the other side of the same corner, so as to improve the positioning effect of the positioning component 17. When the positioning component 17 is a plate-shaped structure with a through positioning groove, the shape of the positioning groove can be adapted to the shape of the outer contour of the wafer ring 13, and the positioning space is formed by the enclosing between the inner side wall surface of the positioning groove and the base 10.

In some embodiments, as shown in fig. 1, fig. 2, and fig. 5, the wafer film expanding machine 100 further includes a calibration component 18, the calibration component 18 is disposed on the base 10, and the calibration component 18 may be configured to calibrate a position of the wafer ring 13 in the positioning space, so as to ensure that the blue film 200 on the wafer ring 13 can be disposed over against the circular protrusion 111, and thus ensure that the circular protrusion 111 can abut against the blue film 200 and support the blue film 200 of the wafer ring 13 after the lifting cylinder 12 drives the wafer ring 13 to move for a certain distance along a direction close to the film expanding member 11, so as to realize film expansion of the blue film 200.

Further, the calibration assembly 18 includes a calibration cylinder 181 and a calibration member 182, the calibration cylinder 181 is disposed on the base 10, the calibration member 182 is connected to the calibration cylinder 181, and the calibration member 182 is provided with a calibration recess 183, the calibration recess 183 has an inner wall surface 1831 adapted to the outer contour surface of the wafer ring 13, and the calibration cylinder 181 is configured to drive the calibration member 182 to move relative to the base 10, so as to push the wafer ring 13 to move relative to the base 10 until the inner wall surface 1831 is attached to the outer contour surface of the wafer ring 13. It can be known that, when the calibration cylinder 181 drives the calibration component 182 to move in the direction close to the wafer ring 13, so that the inner wall surface 1831 of the calibration groove 183 contacts the outer contour surface of the wafer ring 13, if the inner wall surface 1831 of the calibration groove 183 does not completely adhere to the outer contour surface of the wafer ring 13, this indicates that the blue film 200 on the wafer ring 13 is not disposed opposite to the circular protrusion 111, which requires the calibration cylinder 181 to continue driving the calibration component 182 to move relative to the base 10, so as to push the wafer ring 13 to move relative to the base 10, until the inner wall surface 1831 of the calibration groove 183 adheres to the outer contour surface of the wafer ring 13, and adjust the position of the wafer ring 13, so that the blue film 200 on the wafer ring 13 is disposed opposite to the circular protrusion 111.

In some embodiments, as shown in fig. 2 to 4, the wafer film expanding machine 100 further includes a limiting gasket 19, the limiting gasket 19 is disposed on the base 10, and in the axial direction of the film expanding member 11, the height of the limiting gasket 19 is lower than the height of the circular protrusion 111, the limiting gasket 19 abuts against the wafer ring 13 to limit the movement stroke of the wafer ring 13 under the action of the lifting cylinder 12, so as to avoid the situation that the blue film 200 is cracked due to the excessively large film expanding degree of the blue film 200 because the movement stroke of the wafer ring 13 is too large, that is, by disposing the limiting gasket 19, the film expanding degree of the blue film 200 can be controlled within a reasonable range, so as to solve the problem that the blue film 200 is cracked due to the excessively large film expanding degree of the blue film 200.

Further, spacing gasket 19 can also be used for prescribing a limit to the space with base 10, expand membrane piece 11 and be located spacing space and with spacing gasket 19 butt to prescribe a limit to the position of gasket 19 on base 10, in order to ensure that circular protrusion 111's through-hole 112 can just be to the logical groove 101 setting on base 10, so that the device of shelling passes logical groove 101 and through-hole 112 in proper order, in order to act on blue membrane 200 in order to peel off blue membrane 200 wafer ring 13, thereby be convenient for blue membrane 200 after the expansion break away from wafer ring 13.

Illustratively, the limiting shims 19 may be a plurality of blocks, for example, two, three, four, eight, sixteen or more blocks, and a plurality of limiting members are disposed around the base 10 to form the aforementioned limiting space with the base 10, for example, in the embodiment shown in fig. 3 and 4, the limiting shims 19 may be four blocks, and the four limiting shims 19 are respectively located at four corners of the film expanding member 11 and respectively abut against the four corners of the film expanding member 11, so as to improve the limiting effect of the limiting members. It is understood that in other embodiments, the limiting component may be a single piece, and the limiting pad 19 has a through limiting groove, the shape of the limiting groove can be adapted to the shape of the outer contour of the membrane expansion member 11, and the inner side wall surface of the limiting groove and the base 10 enclose to form the limiting space.

In some embodiments, the base 10 is provided with a positioning groove 104, and the spacing washer 19 is provided in the positioning groove 104, so as to determine the position of the spacing washer 19 on the base 10, and thus facilitate the installation of the spacing washer 19.

The above detailed description is made on the wafer film expanding machine disclosed in the embodiment of the present invention, and the specific examples are applied herein to explain the principle and the implementation manner of the present invention, and the description of the above embodiments is only used to help understanding the wafer film expanding machine and the core idea thereof; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, and in summary, the content of the present specification should not be understood as the limitation of the present invention.

Claims (10)

1. A wafer film expanding machine is characterized by comprising:

a base;

the film expanding piece is arranged on the base, and a circular bulge is arranged on one surface of the film expanding piece, which is far away from the base;

the lifting cylinder is arranged on the base; and

the crystal ring is connected to the lifting cylinder, is positioned on one side, away from the base, of the circular protrusion, corresponds to the circular protrusion, and is larger than the outer diameter of the circular protrusion in inner diameter;

the crystal ring can move to the circular bulge relative to the film expanding piece under the action of the lifting cylinder to support the blue film of the crystal ring, so that the blue film is expanded.

2. The wafer film expanding machine according to claim 1, wherein the wafer film expanding machine further comprises an elastic component and a pressing component, the elastic component is arranged on the base, the elastic component is higher than the height of the circular bulge in the moving direction of the wafer ring, the wafer ring is supported on the elastic component, the pressing component is connected to the lifting cylinder and located on one side of the wafer ring, away from the film expanding component, the pressing component can be abutted against the wafer ring under the action of the lifting cylinder to drive the wafer ring to move relative to the film expanding component until the circular bulge supports the blue film so as to expand the blue film, and the elastic component deforms under the action of the wafer ring.

3. The wafer film expander according to claim 2, wherein the wafer film expander further comprises a positioning component, the positioning component is arranged on the base, the positioning component is used for defining a positioning space with the base, the elastic component is arranged in the positioning space, and the wafer ring is arranged in the positioning space and abutted to the positioning component.

4. The wafer film expander of claim 3, further comprising a calibration component, wherein the calibration component is disposed on the base, and the calibration component is configured to calibrate a position of the wafer ring in the positioning space.

5. The wafer film expander according to claim 4, wherein the calibration assembly comprises a calibration cylinder and a calibration part, the calibration cylinder is disposed on the base, the calibration part is connected to the calibration cylinder, the calibration part is provided with a calibration groove, the calibration groove has an inner wall surface adapted to the outer contour surface of the wafer ring, and the calibration cylinder is used for driving the calibration part to move relative to the base so as to push the wafer ring to move relative to the base until the inner wall surface is attached to the outer contour surface of the wafer ring.

6. The wafer film expanding machine of claim 2, further comprising a guide component, wherein the base is provided with a guide through hole, the guide component is connected to the pressing piece, and the guide component is slidably arranged through the guide through hole.

7. The wafer film expanding machine according to any one of claims 1 to 6, further comprising a limiting gasket, wherein the limiting gasket is arranged on the base, the height of the limiting gasket is lower than the height of the circular protrusion in the axis direction of the film expanding piece, and the limiting gasket is abutted against the wafer ring to limit the movement stroke of the wafer ring moving under the action of the lifting cylinder.

8. The wafer film expanding machine of claim 7, wherein the base is provided with a positioning groove, and the limiting gasket is arranged on the positioning groove.

9. The wafer film expanding machine of claim 7, wherein the limiting gasket is used for limiting a limiting space with the base, and the film expanding piece is located in the limiting space and abutted against the limiting gasket.

10. The wafer film expanding machine according to any one of claims 1 to 6, wherein the base is provided with a through groove, the circular protrusion is provided with a through hole, the through hole is arranged corresponding to the through groove and is communicated with the through groove, the through hole is arranged corresponding to a hollow part on the wafer ring, and the through hole and the through groove are used for a film peeling device to pass through after a blue film of the wafer ring is expanded, so that the blue film can be peeled off the wafer ring by the film peeling device.

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