CN217426684U - Plug for wafer cleaning device and wafer processing equipment - Google Patents
Plug for wafer cleaning device and wafer processing equipment Download PDFInfo
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- CN217426684U CN217426684U CN202220361193.3U CN202220361193U CN217426684U CN 217426684 U CN217426684 U CN 217426684U CN 202220361193 U CN202220361193 U CN 202220361193U CN 217426684 U CN217426684 U CN 217426684U
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- cleaning device
- wafer cleaning
- temperature measuring
- plug
- wafer
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Abstract
The embodiment of the application provides a plug of a wafer cleaning device and wafer processing equipment. When the wafer cleaning device is cleaned, the first part can be arranged in the temperature measuring hole of the wafer cleaning device, and at least one of the first part and the second part seals the temperature measuring hole. Through setting up first portion and second portion, and at least one shutoff temperature measurement hole of first portion and second portion, when making washing wafer cleaning device, the cleaning solution can't get into the temperature measurement hole, has guaranteed the unobstructed of temperature measurement hole, and then makes temperature detector can normally work, very big reduction wafer cleaning device's change frequency, reduced use cost simultaneously.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a plug for a wafer cleaning device and wafer processing equipment.
Background
With the rapid development of semiconductor manufacturing technology, a series of processing flows of wafers are more sophisticated. After the chemical mechanical polishing process is performed on the wafer, the polishing slurry and particles are easily remained on the surface of the wafer, so that the cleaning of the wafer becomes an indispensable process.
The wafer cleaning device is provided with a cleaning chamber and a temperature measuring hole communicated with the cleaning chamber, and when the wafer is placed in the cleaning chamber for cleaning, a temperature detector penetrates through the temperature measuring hole to monitor the temperature in the cleaning chamber. The cleaning device for cleaning the wafer also needs to be cleaned at regular time, however, when the cleaning device is cleaned, cleaning liquid is easy to remain in the temperature measuring holes of the wafer cleaning device, and the cleaning liquid can form a blocking layer in the drying process, so that a temperature detector generates deviation when detecting the temperature in the wafer cleaning device through the temperature measuring holes, and then the part of the wafer cleaning device, which is provided with the temperature measuring holes, needs to be replaced, and the use cost is increased.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a plug and wafer processing equipment for wafer cleaning device, through setting up first portion and second part, and at least one shutoff temperature measurement hole in first portion and the second part prevents that the cleaning solution from getting into in the temperature measurement hole.
In a first aspect, an embodiment of the present application provides a plug for a wafer cleaning apparatus, where the plug includes:
a first portion; and
a second portion connecting the first portion;
when the wafer cleaning device is cleaned, the first part is arranged in a temperature measuring hole of the wafer cleaning device, and at least one of the first part and the second part seals the temperature measuring hole.
The beneficial effects of the embodiment of the application are as follows: through setting up first portion and second portion, and at least one shutoff temperature measurement hole of first portion and second portion, when making washing wafer cleaning device, the cleaning solution can't get into the temperature measurement hole, has guaranteed to wash the unobstructed in back temperature measurement hole, and then makes temperature detector can normally work, effectively protects wafer cleaning device simultaneously, has reduced the frequency that change wafer cleaning device was equipped with the temperature measurement hole part, has reduced use cost.
In some embodiments, the first portion is adapted to a size of the temperature measurement hole of the wafer cleaning device, so that the first portion is disposed at the temperature measurement hole.
In some embodiments, the peripheral wall of the first portion has an external thread, the wafer cleaning device has an inner wall surface forming the temperature measuring hole, the inner wall surface has an internal thread, and the external thread and the internal thread cooperate to locate the first portion in the temperature measuring hole.
In some of these embodiments, the first portion and the second portion are both resilient, and the first portion is an interference fit with the temperature sensing hole such that the first portion seals the temperature sensing hole.
In some embodiments, the first portion is coaxially disposed with the second portion, the second portion has a first surface connected with the first portion, the first surface is perpendicular to the axial direction of the second portion, and the first surface abuts against a surface of the wafer cleaning apparatus when the first portion is located in the temperature measuring hole.
In some of these embodiments, the peripheral dimension of the second portion decreases in a direction away from the first portion.
In some of these embodiments, the second portion has a through hole that extends through the second portion in a direction perpendicular to an axial direction of the second portion.
In some embodiments, the first portion and the second portion are integrally formed of the same material.
In some embodiments, the first portion is located in the temperature measuring hole, and the peripheral wall of the second portion has a plurality of grooves.
In a second aspect, an embodiment of the present application provides a wafer processing apparatus, including:
a bulkhead for a wafer cleaning apparatus as claimed in any preceding claim;
a temperature detector; and
the wafer cleaning device is provided with the temperature measuring hole;
when the wafer cleaning device is in a working state, the temperature detector is positioned in the temperature measuring hole; when the wafer cleaning device is cleaned, the first part of the plug is accommodated in the temperature measuring hole, and at least one of the first part and the second part plugs the temperature measuring hole.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view of a bulkhead for a wafer cleaning apparatus according to an embodiment of the present disclosure;
fig. 2 is a perspective view of a wafer cleaning device according to an embodiment of the present application;
fig. 3 is a perspective view of a bulkhead for a wafer cleaning device mounted to the wafer cleaning device according to an embodiment of the present disclosure;
FIG. 4 is a partial schematic view of a bulkhead for a wafer cleaning apparatus mounted to the wafer cleaning apparatus according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of another alternative bulkhead for a wafer cleaning apparatus according to an embodiment of the present disclosure;
FIG. 6 is a schematic view of a bulkhead for a wafer cleaning apparatus according to an embodiment of the present disclosure;
FIG. 7 is a schematic view of a bulkhead for a wafer cleaning apparatus according to an embodiment of the present disclosure;
fig. 8 is a schematic view of a bulkhead for a wafer cleaning device and a wafer processing apparatus according to an embodiment of the disclosure.
Reference numerals: 100. a bulkhead for the wafer cleaning apparatus; 110. a first portion; 111. an external thread; 120. a second portion; 121. a first surface; 122. a through hole; 123. a groove; 200. wafer processing equipment; 210. a wafer cleaning device; 211. and (4) temperature measuring holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
With the rapid development of semiconductor manufacturing technology, a series of processing flows of wafers are more sophisticated. After the chemical mechanical polishing process is performed on the wafer, the polishing slurry and particles are easily remained on the surface of the wafer, so that the cleaning of the wafer becomes an indispensable process.
The wafer cleaning device is provided with a cleaning chamber and a temperature measuring hole communicated with the cleaning chamber, and when the wafer is placed in the cleaning chamber for cleaning, a temperature detector penetrates through the temperature measuring hole to monitor the temperature in the cleaning chamber. The cleaning device for cleaning the wafer also needs to be cleaned at regular time, however, when the cleaning device is cleaned, cleaning liquid is easy to remain in the temperature measuring holes of the wafer cleaning device, and the cleaning liquid can form a blocking layer in the drying process, so that deviation is generated when the temperature detector penetrates through the temperature measuring holes to detect the temperature in the wafer cleaning device. The embodiment of the application provides a plug for a wafer cleaning device and wafer processing equipment, and aims to solve the technical problem.
In a first aspect, an embodiment of the present disclosure provides a plug 100 for a wafer cleaning apparatus, and referring to fig. 1, the plug 100 may include a first portion 110 and a second portion 120.
Referring to fig. 1 to 3, the second portion 120 is connected to the first portion 110. When the wafer cleaning device 210 is cleaned, the first portion 110 may be disposed in the temperature measuring hole 211 of the wafer cleaning device 210, and at least one of the first portion 110 and the second portion 120 blocks the temperature measuring hole 211.
By arranging the first part 110 and the second part 120 and sealing the temperature measuring holes 211 of at least one of the first part 110 and the second part 120, cleaning liquid cannot enter the temperature measuring holes 211 when the wafer cleaning device 210 is cleaned, so that smoothness of the temperature measuring holes 211 after the cleaning is finished is ensured, the temperature detector can work normally, the wafer cleaning device is effectively protected, the frequency of replacing the parts, provided with the temperature measuring holes 211, of the wafer cleaning device 210 is reduced, and the use cost is reduced.
The first portion 110 may be sized to fit within the temperature sensing aperture 211 of the wafer cleaning apparatus 210 such that the first portion 110 is disposed within the temperature sensing aperture 211. Alternatively, the outer circumferential wall of the first part 110 may be arranged to abut against the wall surface of the temperature measuring hole 211, so that the first part 110 is in interference fit with the temperature measuring hole 211 to fix the first part 110 in the temperature measuring hole 211.
The first part 110 is designed to be matched with the size of the temperature measuring hole 211, so that the first part 110 can be better clamped in the temperature measuring hole 211, and meanwhile, the temperature measuring hole 211 can be directly sealed through the first part 110, and liquid can be prevented from being immersed into the temperature measuring hole 211. Further, the first portion 110 may be connected to the entire wall surface of the wafer cleaning apparatus for forming the temperature measuring hole 211, so as to block the cleaning liquid from contacting the wall surface forming the temperature measuring hole 211, thereby effectively preventing the cleaning liquid from remaining in the temperature measuring hole 211, and simultaneously increasing the contact area between the first portion 110 and the wall surface of the temperature measuring hole 211, and improving the installation stability of the first portion 110 in the temperature measuring hole.
Referring to fig. 4, the peripheral wall of the first portion 110 may have an external thread 111, and the inner wall of the wafer cleaning device 210 forming the temperature measuring hole 211 may have an internal thread, and the external thread 111 and the internal thread are engaged to locate the first portion 110 in the temperature measuring hole 211. Through set up external screw thread 111 at the perisporium face of first portion 110, the internal wall face of wafer cleaning device 210 sets up the internal thread, and internal thread and external screw thread 111 cooperate, improve the installation stability of first portion 110, make that first portion 110 can be inseparable connect in wafer cleaning device 210, threaded connection's mode simple structure makes things convenient for the dismouting simultaneously.
It will be appreciated that the first portion 110 and the second portion 120 may each be resilient, with the first portion 110 having an interference fit with the temperature sensing bore 211 such that the first portion 110 seals the temperature sensing bore 211. Further, when the first portion 110 is positioned in the temperature measurement hole 211, the outer wall surface of the first portion 110 is attached to the inner wall surface of the wafer cleaning apparatus 210, which forms the temperature measurement hole 211. The first part 110 and the second part 120 are arranged to be both resilient to facilitate pushing the first part 110 into the temperature sensing hole 211 and to facilitate pulling the first part 110 out of the temperature sensing hole 211. Further, the first portion 110 and the second portion 120 may be made of a resin material or a rubber material, and further, the first portion 110 and the second portion 120 may be made of a Polyetheretherketone (PEEK) resin material, which is resistant to a temperature of 260 degrees, excellent in mechanical properties, good in self-lubrication, resistant to chemical corrosion, flame retardant, and high in wear resistance, so that the plug 100 can resist corrosion of a cleaning solution, and the service life of the plug 100 is prolonged.
In other embodiments, the first portion 110 and the second portion 120 may be made of a hard material with high strength, wear resistance and impact resistance.
Referring to fig. 4, the first portion 110 and the second portion 120 may be cylindrical, the first portion 110 and the second portion 120 may be coaxially disposed, the second portion 120 has a first surface 121 facing the first portion 110, the first surface 121 is connected to an outer circumferential wall of the first portion 110, and the first surface 121 is perpendicular to an axial direction of the second portion 120. When the first portion 110 is located in the temperature measuring hole 211, the first surface 121 is in contact with the surface of the wafer cleaning device 210, so that the plug is prevented from being pushed into the temperature measuring hole 211 excessively, and the plug is prevented from being difficult to be taken out of the temperature measuring hole 211. Further, the first surface 121 surrounds the outer periphery of the first portion 110, and when the first surface 121 of the second portion 120 abuts against the surface of the wafer cleaning device 210, the second portion 120 can cover the temperature measuring hole 211, further sealing the temperature measuring hole 211, and preventing the cleaning liquid from entering.
Further, referring to fig. 5, the outer dimension of the second portion 120 may gradually decrease in a direction away from the first portion 110. In particular, the second portion may be hemispherical, conical. The peripheral size of the second portion 120 is designed to be gradually reduced, so that the peripheral volume of the second portion 120 is reduced, the probability of falling off of the first portion 110 caused by collision of the second portion 120 is reduced when the wafer cleaning device 210 is cleaned, and meanwhile, materials and production cost can be saved.
In some embodiments, referring to fig. 6, the second portion 120 may have a through hole 122, and the through hole 122 penetrates the second portion 120 along a direction perpendicular to the axial direction of the second portion 120. Through setting up through-hole 122, can be convenient for external structure spare stretch into to through-hole 122 in pull second part 120, perhaps be convenient for the staff wears to locate pull second part 120 in through-hole 122 to the dismantlement of the end cap of being convenient for. In other embodiments, the peripheral wall of the second portion 120 may have symmetrically disposed grooves to facilitate the worker to pull the plug 100 out of the wafer cleaning apparatus 210.
It is understood that the first portion 110 and the second portion 120 may be integrally formed of the same material. The first portion 110 and the second portion 120 are designed to be integrally formed by the same material, so that the structural strength of the plug 100 can be improved, the plug 100 is not easy to damage, the repeated use can be realized, and the mass production of the plug is facilitated.
In some embodiments, referring to fig. 7, the peripheral wall of the second portion 120 may have a plurality of grooves 123. By providing a plurality of grooves 123 in the peripheral wall of the second portion 120, friction can be increased, facilitating the installation and removal of the plug. Alternatively, the groove may be a bar-shaped groove parallel to the axial direction of the second portion 120, and a plurality of bar-shaped grooves may be uniformly distributed along the outer circumference of the second portion 120; the groove may be an annular groove provided in the outer peripheral wall of the second portion 120, and a plurality of annular grooves may be provided side by side in the axial direction of the second portion 120.
In a second aspect, referring to fig. 8, the present embodiment provides a wafer processing apparatus 200, and the wafer processing apparatus 200 may include the bulkhead 100 for the wafer cleaning device 210, a temperature probe (not shown), and the wafer cleaning device 210. The wafer cleaning device 210 may have a temperature measurement hole 211. When the wafer cleaning device 210 is in a working state, the temperature detector is located in the temperature measuring hole 211; when the wafer cleaning device 210 is cleaned, the first portion 110 of the plug is accommodated in the temperature measuring hole 211, and at least one of the first portion 110 and the second portion 120 blocks the temperature measuring hole 211.
By arranging the first part 110 and the second part 120 and sealing at least one of the temperature measuring holes 211 of the first part 110 and the second part 120, cleaning liquid cannot enter the temperature measuring holes 211 when the wafer cleaning device 210 is cleaned, so that smoothness of the temperature measuring holes 211 is ensured, the temperature detector can work normally, the replacement frequency of the part of the wafer cleaning device 210 where the temperature measuring holes 211 are arranged is greatly reduced, and the use cost of the wafer processing equipment 200 is reduced.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A bulkhead for a wafer cleaning apparatus, the bulkhead comprising:
a first portion; and
a second portion connecting the first portion;
when the wafer cleaning device is cleaned, the first part is arranged in a temperature measuring hole of the wafer cleaning device, and at least one of the first part and the second part seals the temperature measuring hole.
2. The plug for a wafer cleaning device as claimed in claim 1, wherein the first portion is adapted to the size of the temperature measuring hole of the wafer cleaning device so as to locate the first portion at the temperature measuring hole.
3. The plug for a wafer cleaning device as claimed in claim 2, wherein the peripheral wall surface of the first portion has an external thread, the wafer cleaning device has an inner wall surface forming the temperature measuring hole, the inner wall surface has an internal thread, and the external thread and the internal thread cooperate to locate the first portion in the temperature measuring hole.
4. The plug for a wafer cleaning device as claimed in claim 1, wherein the first portion and the second portion are both resilient, and the first portion is in interference fit with the temperature sensing hole such that the first portion seals the temperature sensing hole.
5. The plug for a wafer cleaning device as claimed in claim 1, wherein the first portion is coaxially disposed with the second portion, the second portion has a first surface connected with the first portion, the first surface is perpendicular to the axial direction of the second portion, and the first surface abuts against the surface of the wafer cleaning device when the first portion is located in the temperature measuring hole.
6. The plug for a wafer cleaning apparatus as claimed in claim 5, wherein the second portion has a peripheral dimension that decreases in a direction away from the first portion.
7. The plug for a wafer cleaning device as claimed in claim 1, wherein the second portion has a through hole extending therethrough in a direction perpendicular to an axial direction of the second portion.
8. The bottom plug of claim 1, wherein the first portion and the second portion are integrally formed of the same material.
9. The plug for a wafer cleaning device as claimed in claim 1, wherein the first portion is located in the temperature measuring hole, and the peripheral wall of the second portion has a plurality of grooves.
10. A wafer processing apparatus, comprising:
a bulkhead for a wafer cleaning apparatus as claimed in any one of claims 1 to 9;
a temperature detector; and
the wafer cleaning device is provided with the temperature measuring hole;
when the wafer cleaning device is in a working state, the temperature detector is positioned in the temperature measuring hole; when the wafer cleaning device is cleaned, the first part of the plug is accommodated in the temperature measuring hole, and at least one of the first part and the second part plugs the temperature measuring hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220361193.3U CN217426684U (en) | 2022-02-22 | 2022-02-22 | Plug for wafer cleaning device and wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220361193.3U CN217426684U (en) | 2022-02-22 | 2022-02-22 | Plug for wafer cleaning device and wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217426684U true CN217426684U (en) | 2022-09-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220361193.3U Active CN217426684U (en) | 2022-02-22 | 2022-02-22 | Plug for wafer cleaning device and wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217426684U (en) |
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2022
- 2022-02-22 CN CN202220361193.3U patent/CN217426684U/en active Active
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