CN217426012U - Cover plate and electronic equipment - Google Patents
Cover plate and electronic equipment Download PDFInfo
- Publication number
- CN217426012U CN217426012U CN202220318179.5U CN202220318179U CN217426012U CN 217426012 U CN217426012 U CN 217426012U CN 202220318179 U CN202220318179 U CN 202220318179U CN 217426012 U CN217426012 U CN 217426012U
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive ink
- sub
- conductive
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model provides an apron electronic equipment. The utility model discloses electronic equipment, include: a metal frame body; the apron, the apron includes the plate body subassembly, the plate body subassembly includes along the glass layer that the first direction links to each other in proper order, transparent conducting layer and prevent the fingerprint rete, the glass layer transparent conducting layer with prevent that the thickness direction of each in the fingerprint rete is first direction, wherein transparent conducting layer with the metal framework electricity is connected. Therefore, according to the utility model discloses thereby electronic equipment has the weak advantage that influences little to the display module assembly of the electrostatic field of apron.
Description
Technical Field
The utility model relates to an apron technical field, concretely relates to apron and electronic equipment.
Background
In the related art, in order to effectively reduce fingerprint oil and dust resistance on a glass cover plate of an electronic device during use, an AF film is generally coated on the glass cover plate, but the microstructure of AF lotion is composed of silica based on functional groups with fluorine, after AF is plated on the surface, the silica based is combined with glass, and the functional groups with fluorine are outward and are organic, so that a hydrophobic effect is formed. The electric charges generated by friction are transferred by the electric charges of two objects, the electron transfer to the other side is determined by the constraint capacity of atoms on the electrons on the two sides, and the physical knowledge shows that the fluorine atoms are short of one electron due to small radius of the atoms, so that the electron is easier to adsorb by the fluorine atoms compared with other atoms, and after the friction, the electron of the finger skin is attracted by the fluorine atoms, so that the product (cover plate) is negatively charged (static electricity), and the display of a display module below is influenced by the static electricity.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving one of the technical problems in the related art at least to a certain extent. To this end, embodiments of the present invention provide a cover plate and an electronic device.
The utility model discloses electronic equipment, include:
a metal frame body; and
the apron, the apron includes the plate body subassembly, the plate body subassembly includes along the glass layer that the first direction links to each other in proper order, transparent conducting layer and prevent the fingerprint rete, the glass layer transparent conducting layer with prevent that the thickness direction of each in the fingerprint rete is first direction, wherein transparent conducting layer with the metal framework electricity is connected.
Therefore, according to the utility model discloses thereby electronic equipment has the weak advantage that influences little to the display module assembly of the electrostatic field of apron.
In some embodiments, the anti-fingerprint film layer comprises an AF film layer and a first silica primer layer;
the transparent conducting layer comprises a conducting film layer and a second silicon dioxide priming layer, and the glass layer, the second silicon dioxide priming layer, the conducting film layer, the first silicon dioxide priming layer and the AF film layer are sequentially connected along the first direction.
In some embodiments, the conductive film layer is one of an ITO thin film layer and an AZO thin film layer.
In some embodiments, the cover plate further includes a conductive ink layer sandwiched between a side surface of the transparent conductive layer and the metal frame body, and the transparent conductive layer is electrically connected to the metal frame body through the conductive ink layer.
In some embodiments, the glass layer has a first surface and a second surface opposite in the first direction, the first surface being conformed to the transparent conductive layer;
the cover plate further comprises a window ink layer, the window ink layer is provided with a third surface and a fourth surface which are opposite to each other in the first direction, and the third surface is attached to the edge position of the second surface;
the metal frame body comprises a body and a baffle plate, the thickness direction of the baffle plate is the first direction, an installation groove is defined by the inner wall surface of the body and the baffle plate, and the plate body assembly is arranged in the installation groove;
the conductive ink layer comprises
A first sub conductive ink segment having a fifth surface and a sixth surface opposite to each other in the first direction, the fifth surface being attached to the fourth surface, the sixth surface being attached to the baffle, the first sub conductive ink segment being electrically connected to the baffle; and
the second sub-conductive ink section is connected with the first sub-conductive ink section, the second sub-conductive ink section is electrically connected with the body, the second sub-conductive ink section is arranged on the side surface of the glass layer and the side surface of the transparent conductive layer, and/or the second sub-conductive ink section is arranged on the side surface of the glass layer, the side surface of the transparent conductive layer and the side surface of the anti-fingerprint film layer.
The utility model also provides an apron, the apron is above-mentioned the utility model discloses in the electronic equipment of embodiment the apron.
Drawings
Fig. 1 is a schematic view of a cover plate according to an embodiment of the present invention.
Reference numerals:
a cover plate 100;
a glass layer 1;
a transparent conductive layer 2, a conductive film layer 21, a second silicon dioxide priming layer 22;
the anti-fingerprint film layer 3, the AF film layer 31 and the first silicon dioxide priming layer 32;
a window ink layer 4;
conductive ink layer 5, first sub-conductive ink segment 51, and second sub-conductive ink segment 52.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
The electronic device according to an embodiment of the present invention is described below with reference to the drawings. As shown in fig. 1, an electronic device according to an embodiment of the present invention includes a metal frame body and a cover plate 100 according to an embodiment of the present invention.
The cover plate 100 according to an embodiment of the present invention includes a plate body assembly. The plate body subassembly includes along the glass layer 1, transparent conducting layer 2 that the first direction links to each other in proper order and prevents fingerprint rete 3, and the thickness direction of each in glass layer 1, transparent conducting layer 2 and the fingerprint rete 3 is the first direction.
According to the utility model discloses apron 100 is through setting up glass layer 1, transparent conducting layer 2 and preventing that fingerprint rete 3 links to each other in proper order along the first direction, and glass layer 1, transparent conducting layer 2 and the thickness direction of preventing each in the fingerprint rete 3 are the first direction. That is to say, transparent conducting layer 2 and prevent fingerprint rete 3 laminating together to can make and prevent static (surface charge) on the fingerprint rete 3 and can be guided to other parts of being connected with transparent conducting layer 2 electricity by transparent conducting layer 2, thereby avoid the electric charge gathering on the apron 100, and then make the electrostatic field on the apron 100 weak, little to the influence of the display module assembly that links to each other with apron 100.
Therefore, the cover plate 100 according to the embodiment of the present invention has an advantage that the electrostatic field is weak so as to have a small influence on the display module.
The transparent conductive layer 2 is electrically connected to the metal frame. That is, the static electricity (surface charge) on the fingerprint-proof film layer 3 can be guided to the metal frame body by the transparent conductive layer 2, so that the charge accumulation on the cover plate 100 is avoided, and further, the influence of the static electric field on the cover plate 100 on the display module connected with the cover plate 100 is small.
Therefore, the electronic device according to the embodiment of the present invention has an advantage that the electrostatic field of the cover plate 100 is weak, thereby having little influence on the display module.
An electronic device according to an embodiment of the present invention is specifically described below with reference to the cover plate 100 according to an embodiment of the present invention.
As shown in fig. 1, an electronic device according to an embodiment of the present invention includes a metal frame (not shown in the figure) and a cover plate 100 according to an embodiment of the present invention. According to the utility model discloses electronic equipment can be cell-phone, panel computer hand, on-vehicle computer and various terminal equipment, consequently according to the utility model discloses apron 100 can be cell-phone apron, panel computer apron, on-vehicle computer apron and various terminal display protection glass apron.
The cover plate 100 according to an embodiment of the present invention includes a plate body assembly. The plate body subassembly includes along the glass layer 1, transparent conducting layer 2 that the first direction links to each other in proper order and prevents fingerprint rete 3, and the thickness direction of each in glass layer 1, transparent conducting layer 2 and the fingerprint rete 3 is the first direction. Specifically, glass layer 1, transparent conducting layer 2 and prevent fingerprint rete 3 the same shape, glass layer 1, transparent conducting layer 2 and prevent fingerprint rete 3 and paste in proper order along first direction and be in the same place. The first direction may be an up-down direction as indicated by arrow a in fig. 1. For example, glass layer 1, transparent conducting layer 2 and prevent fingerprint rete 3 from bottom to top setting gradually.
As shown in fig. 1, the anti-fingerprint film layer 3 includes an AF film layer 31 and a first silica primer layer 32. Specifically, the AF film layer 31 is formed of a high-transmittance fingerprint-proof AF film, and can effectively prevent fingerprints, oil and dust, and has a very high light transmittance. The first silicon dioxide base layer 32 is electroplated silicon dioxide (SiO) 2 ) A base layer. The AF film layer 31 facilitates molding on the silicon dioxide base layer. The anti-fingerprint film layer 3 can effectively prevent fingerprints, oil and dust.
In some embodiments, the thickness of the anti-fingerprint film layer 3 is less than or equal to a preset value. That is, the thickness of the AF film layer 31 plus the thickness of the first bottom silicon dioxide layer 32 is less than or equal to a predetermined value. Specifically, the thickness of the anti-fingerprint film layer 3 is greater than or equal to 35nm and less than or equal to 45 nm. Therefore, the thickness of the plate body assembly is thinner, and the occupied space of the plate body assembly is reduced. For example, the thickness of the anti-fingerprint film layer 3 in the vertical direction is 35nm or more and 45nm or less.
The transparent conductive layer 2 includes a conductive film layer 21 and a second silicon dioxide primer layer 22. Specifically, the conductive film layer 21 is a film layer composed of a transparent conductive material. The second silicon dioxide base layer 22 is a plating silicon dioxide base layer. The conductive film layer 21 is formed on the silicon dioxide base layer.
In some embodiments, the conductive film layer 21 is one of an ITO thin film layer and an AZO thin film layer. The ITO thin film is an n-type semiconductor material, and has high electrical conductivity, high visible light transmittance, high mechanical hardness, and good chemical stability. AZO is short for aluminum-doped zinc oxide (ZnO) transparent conductive glass, and ZnO is a direct band-gap wide-bandgap n-type semiconductor material with a II-VI family hexagonal wurtzite structure and has high thermal stability and chemical stability. The ITO film layer or the AZO film layer is plated on the glass, so that the glass is conductive. The conductive film layer 21 makes the cover plate 100 conductive, so that static electricity on the cover plate 100 can be guided to other components electrically connected with the conductive film layer 21, thereby avoiding charge accumulation on the cover plate 100, and further making the electrostatic field on the cover plate 100 weak and having little influence on the display module connected with the cover plate 100.
As shown in fig. 1, the glass layer 1, the second silica base layer 22, the conductive film layer 21, the first silica base layer 32, and the AF film layer 31 are sequentially connected along the first direction. The glass layer 1, the second silica base layer 22, the conductive film layer 21, the first silica base layer 32, and the AF film layer 31 are identical in shape and are sequentially attached along the first direction, and a side surface of each of the glass layer 1, the second silica base layer 22, the conductive film layer 21, the first silica base layer 32, and the AF film layer 31 constitutes a part of a side surface of the plate body assembly. For example, the glass layer 1, the second bottom silicon dioxide layer 22, the conductive film layer 21, the first bottom silicon dioxide layer 32, and the AF film layer 31 are connected in sequence from bottom to top.
In some embodiments, the metal frame includes a body and a baffle plate, the thickness direction of the baffle plate is a first direction, the inner wall surface of the body and the baffle plate define a mounting groove, and the plate body assembly is disposed in the mounting groove. Specifically, the body is the annular, and the baffle links to each other so that inject the mounting groove with the internal face of body, plate body subassembly's shape and the shape looks adaptation of mounting groove, and plate body subassembly's side surface sets up with the internal face of body relatively. The glass layer 1 is one end of the plate body assembly adjacent to the baffle plate. For example, the baffle plate is positioned below the plate assembly to support the plate assembly.
As shown in fig. 1, in some embodiments, cover sheet 100 further comprises window ink layer 4. The window ink layer is positioned at the edge position of the surface of the glass 1 far away from the transparent conducting layer 2. Specifically, the thickness direction of the window ink layer 4 is a first direction, the window ink layer 4 is annular, the glass layer 1 has a first surface and a second surface opposite to each other in the first direction, and the first surface is attached to the transparent conductive layer 2. The window ink layer 4 has a third surface and a fourth surface opposite to each other in the first direction, and the third surface of the window ink layer 4 is attached to the edge of the second surface. The window ink layer 4 is sprayed below the edge position of the plate body assembly and used for blocking the internal structure of the electronic equipment, so that the appearance of the electronic equipment is more attractive.
For example, the second surface of the glass layer 1 is the lower surface of the glass layer 1, the third surface of the window ink layer 4 is the upper surface of the window ink layer 4, and the lower surface of the glass layer 1 is attached to the upper surface of the window ink layer 4.
As shown in fig. 1, in some embodiments, the cover sheet 100 further comprises a conductive ink layer 5. The conductive ink layer 5 is formed using a conductive ink having a conductive property. The conductive ink layer 5 is sandwiched between the side surface of the transparent conductive layer 2 and the metal frame body, and the transparent conductive layer 2 is electrically connected to the metal frame body through the conductive ink layer 5. Specifically, the conductive ink layer 5 is connected to the inner wall surface of the body and the transparent conductive layer 2 (conductive film layer 21) so as to guide static electricity on the cover plate 100 to the metal frame body through the conductive ink layer 5. The contact area of the conductive ink layer 5 and the metal frame body is large, so that the transparent conductive layer 2 is conveniently electrically connected with the metal frame body, and the electric connection stability of the transparent conductive layer 2 and the metal frame body is high.
As shown in fig. 1, in some embodiments, conductive ink layer 5 includes a first sub-conductive ink segment 51 and a second sub-conductive ink segment 52, and second sub-conductive ink segment 52 is connected to first sub-conductive ink segment 51.
The thickness direction of the first sub conductive ink segment 51 is a first direction, the first sub conductive ink segment 51 has a fifth surface and a sixth surface opposite to each other in the first direction, the fifth surface is attached to the fourth surface, the sixth surface is attached to the baffle, and the first sub conductive ink segment 51 is electrically connected (attached) to the baffle. Thereby electrically connecting the first sub conductive ink segments 51 with the transparent conductive layer 2 and the metal frame body.
For example, the thickness direction of the first sub conductive ink segment 51 is the up-down direction, the fifth surface of the first sub conductive ink segment 51 is the upper surface of the first sub conductive ink segment 51, the sixth surface of the first sub conductive ink segment 51 is the lower surface of the first sub conductive ink segment 51, the upper surface of the first sub conductive ink segment 51 is attached to the lower surface of the window ink layer 4, and the lower surface of the first sub conductive ink segment 51 is attached (electrically connected) to the baffle.
Alternatively, a second sub-conductive ink segment 52 is electrically connected to the body, the second sub-conductive ink segment 52 being provided on the side surface of the glass layer 1 and the side surface of the transparent conductive layer 2. Specifically, one surface of the second sub conductive ink segment 52 is attached (electrically connected) to the inner wall surface of the body, and the other surface of the second sub conductive ink segment 52 is attached to the side surface of the glass layer 1 and the side surface of the transparent conductive layer 2, whereby the second sub conductive ink segment 52 can be electrically connected to the transparent conductive layer 2 and the metal frame body.
Alternatively, the second sub-conductive ink segments 52 are provided on the side surfaces of the glass layer 1, the transparent conductive layer 2, and the anti-fingerprint film layer 3. Thereby, the second sub-conductive ink segment 52 can be electrically connected with the transparent conductive layer 2 and the metal frame body. Specifically, one surface of the second sub conductive ink segment 52 is attached (electrically connected) to the inner wall surface of the body, and the other surface of the second sub conductive ink segment 52 is attached to the side surface of the glass layer 1, the side surface of the transparent conductive layer 2, and the side surface of the fingerprint prevention film layer 3, so that the second sub conductive ink segment 52 can be electrically connected to the transparent conductive layer 2 and the metal frame body.
In some embodiments, the plate body assembly includes a first side surface, a second side surface, a third side surface, and a fourth side surface connected end to end in this order, the first side surface and the third side surface being disposed opposite to each other in the second direction, the second side surface and the third side surface being disposed opposite to each other in the third direction, any two of the first direction, the second direction, and the third direction being perpendicular to each other, each of the first side surface, the second side surface, the third side surface, and the fourth side surface being constituted by side surfaces of the glass layer 1, the transparent conductive layer 2, and the anti-fingerprint film layer 3. At least one of the first side surface, the second side surface, the third side surface, and the fourth side surface is provided with a second sub conductive ink segment 52. The second direction may be a left-right direction as indicated by arrow B in fig. 1.
Optionally, one second sub-conductive ink segment 52 is disposed on each of the first side surface and the third side surface, that is, one second sub-conductive ink segment 52 is disposed between the first side surface and the metal frame body, and one second sub-conductive ink segment 52 is disposed between the third side surface and the metal frame body.
For example, the first side surface is a left side surface of the board assembly, the third side surface is a right side surface of the board assembly, and the second sub conductive ink segment 52 is disposed on each of the left side surface and the right side surface of the board assembly.
The utility model also provides a display module, according to the utility model discloses display module includes the touch-sensitive screen and according to the utility model discloses the apron 100 of embodiment, touch-sensitive screen, glass layer 1, transparent conducting layer 2 and prevent that fingerprint rete 3 links to each other in proper order along the first direction. Specifically, the touch screen is attached to the second surface of the glass layer 1. For example, the touch screen, the glass layer 1, the transparent conductive layer 2 and the anti-fingerprint film layer 3 are sequentially connected from bottom to top.
Therefore, the display module according to the embodiment of the present invention has an advantage that the electrostatic field of the cover plate 100 is weak, thereby having little influence on the touch screen.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the present disclosure, the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although the above embodiments have been shown and described, it should be understood that they are exemplary and should not be construed as limiting the present invention, and that many changes, modifications, substitutions and alterations to the above embodiments by those of ordinary skill in the art are intended to be within the scope of the present invention.
Claims (6)
1. An electronic device, comprising:
a metal frame body; and
the apron, the apron includes the plate body subassembly, the plate body subassembly includes along the glass layer that the first direction links to each other in proper order, transparent conducting layer and prevent the fingerprint rete, the glass layer transparent conducting layer with prevent that the thickness direction of each in the fingerprint rete is first direction, wherein transparent conducting layer with the metal framework electricity is connected.
2. The electronic device of claim 1,
the anti-fingerprint film layer comprises an AF film layer and a first silicon dioxide priming coat;
the transparent conducting layer comprises a conducting film layer and a second silicon dioxide priming layer, and the glass layer, the second silicon dioxide priming layer, the conducting film layer, the first silicon dioxide priming layer and the AF film layer are sequentially connected along the first direction.
3. The electronic device of claim 2, wherein the conductive film layer is one of an ITO thin film layer and an AZO thin film layer.
4. The electronic device of claim 1, wherein the cover plate further comprises a conductive ink layer sandwiched between a side surface of the transparent conductive layer and the metal frame, and the transparent conductive layer is electrically connected to the metal frame through the conductive ink layer.
5. The electronic device of claim 4,
the glass layer is provided with a first surface and a second surface which are opposite in the first direction, and the first surface is attached to the transparent conductive layer;
the cover plate further comprises a window ink layer, the window ink layer is provided with a third surface and a fourth surface which are opposite to each other in the first direction, and the third surface is attached to the edge position of the second surface;
the metal frame body comprises a body and a baffle plate, the thickness direction of the baffle plate is the first direction, an installation groove is defined by the inner wall surface of the body and the baffle plate, and the plate body assembly is arranged in the installation groove;
the conductive ink layer comprises
A first sub conductive ink segment having a fifth surface and a sixth surface opposite to each other in the first direction, the fifth surface being attached to the fourth surface, the sixth surface being attached to the baffle, the first sub conductive ink segment being electrically connected to the baffle; and
the second sub-conductive ink section is connected with the first sub-conductive ink section, the second sub-conductive ink section is electrically connected with the body, the second sub-conductive ink section is arranged on the side surface of the glass layer and the side surface of the transparent conductive layer, and/or the second sub-conductive ink section is arranged on the side surface of the glass layer, the side surface of the transparent conductive layer and the side surface of the anti-fingerprint film layer.
6. A cover plate, characterized in that the cover plate is the cover plate in an electronic device according to any one of claims 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220318179.5U CN217426012U (en) | 2022-02-16 | 2022-02-16 | Cover plate and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220318179.5U CN217426012U (en) | 2022-02-16 | 2022-02-16 | Cover plate and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217426012U true CN217426012U (en) | 2022-09-13 |
Family
ID=83176343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220318179.5U Active CN217426012U (en) | 2022-02-16 | 2022-02-16 | Cover plate and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217426012U (en) |
-
2022
- 2022-02-16 CN CN202220318179.5U patent/CN217426012U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104461189B (en) | Touch panel | |
| CN202142025U (en) | Touch panel device | |
| EP2876532B1 (en) | Touch window and touch device including the same | |
| KR100988646B1 (en) | Light sense assisting apparatus having electro-conductive transparent layer | |
| US20090135161A1 (en) | Panel-type input device and electronic apparatus having the same | |
| US9949366B2 (en) | Touch panel | |
| CN210955909U (en) | Cover plate, display module and display device | |
| US9569044B2 (en) | Touch panel having conductive and insulated light shielding layers | |
| CN108073335B (en) | Touch panel | |
| US10824280B2 (en) | Touch sensor and display device having the same | |
| US20090135159A1 (en) | Touch panel assembly | |
| CN106257324A (en) | Embedded touch display device | |
| CN217426012U (en) | Cover plate and electronic equipment | |
| US20190163301A1 (en) | Touch apparatus | |
| CN104635974A (en) | Touch control device | |
| US9351400B1 (en) | Electrical connections between conductive contacts | |
| CN104182067B (en) | A kind of contact panel and its manufacture method | |
| CN103064572B (en) | Touching display screen and preparation method thereof | |
| EP2508967A2 (en) | Touch panel capable of decreasing response time and reducing interference | |
| CN109584713B (en) | Display module and terminal equipment | |
| CN114690957B (en) | Embedded touch display device | |
| CN111258463B (en) | Integrative black capacitive touch-sensitive screen of putting out screen | |
| CN103543889A (en) | Method for manufacturing monolayer capacitive touch screen | |
| US20120182704A1 (en) | Electronic device | |
| US20190275769A1 (en) | Plastic laminate structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |