CN217414976U - CPU film covering die - Google Patents
CPU film covering die Download PDFInfo
- Publication number
- CN217414976U CN217414976U CN202121663769.3U CN202121663769U CN217414976U CN 217414976 U CN217414976 U CN 217414976U CN 202121663769 U CN202121663769 U CN 202121663769U CN 217414976 U CN217414976 U CN 217414976U
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- China
- Prior art keywords
- mould
- cpu
- die
- sets
- groove
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- 210000002489 tectorial membrane Anatomy 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 20
- 238000010030 laminating Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 239000003292 glue Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000001680 brushing effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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Abstract
CPU tectorial membrane mould, by last mould shrouding, it constitutes to go up mould and die block, it sets up an air chamber to go up the mould shrouding, it passes through screw locking with last mould shrouding to go up the mould, it sets up the draw-in groove that is used for fixed EVA insole to go up the mould, the draw-in groove front side sets up the feed port, set up a plurality of and the communicating gas pocket of air chamber of last mould shrouding on the border week of draw-in groove, it sets up the flash tank window to go up the mould rear portion, the die block passes through the axle sleeve connection of rear end with last mould, set up the flash tank on the border lip guard of die block, the flash tank front end has and communicates with each other with the feed chute of last mould, the flash tank rear end communicates with each other with the flash window. The utility model discloses an in-mould integrated into one piece structure once only compounds into sole with EVA and CPU, CPU rerum natura is good, only needs very thin one deck just can satisfy rerum natura requirements such as wear-resisting, limited slip, resistant book to can all-round cladding EVA. The EVA middle sole is used as the filling core of the sole, so that the elasticity is good and the wearing is comfortable; the production process is simple, the labor cost is low, and the energy is saved and the environment is protected.
Description
Technical Field
The utility model relates to a sole tectorial membrane technical field, concretely relates to CPU tectorial membrane mould.
Background
Present sole can be made by different materials such as EVA, PVC, PU, CPU and TPU, in the preparation technology of sole, generally only need through glue with two kinds of different materials carry out the adhesion fixed can, for example constitute the sole that forms by EVA and CPU, this kind of sole adopts single mould production well and glues and the big end laminating shaping of CPU material through artifical brush by the EVA material, this type sole exists following not enoughly: the shoe materials are simply attached through glue, so that the firmness and the durability are poor, the shoe materials are easy to fall off, and the service life is short; the labor cost is high; the production process is complicated, such as glue brushing, bottom combining and finishing; the artificial combined shoe sole has the quality problems of deformation, non-uniform size, rubber stripping and the like; the production flow is complex and not environment-friendly, and the glue brushing process is polluted.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the not enough of prior art existence, provide a CPU tectorial membrane mould.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model provides a CPU tectorial membrane mould, by last shrouding, it constitutes to go up mould and die block, it sets up an air chamber to go up the mould shrouding, install the sealing strip above the air chamber, it sets up the mould lock that is used for sealing the mould to use to go up the mould shrouding front end, it sets up the vacuum valve with vacuum machine and air chamber intercommunication to go up mould shrouding side, it passes through screw locking with last mould shrouding to go up the mould, it sets up the draw-in groove that is used for fixed EVA insole to go up the mould, the draw-in groove front side sets up the feed port, set up a plurality of and the communicating gas pocket of air chamber of last mould shrouding on the draw-in groove inboard week, it sets up the flash window to go up the mould rear portion, the die block passes through the axle sleeve connection of rear end with last mould, set up the flash groove on the die block border lip, the flash groove front end has and communicates with each other with the feed port of last mould, the flash groove rear end communicates with each other with the flash window.
Air holes with the diameter of about 1mm are uniformly formed on the circumference of about 1mm of the inner side of the clamping groove of the upper die.
A plurality of upper die positioning nails are arranged in the clamping grooves of the upper dies and used for fixing and positioning the EVA middle sole.
The outer side of the upper die clamping groove is provided with a plurality of die nails, and the bottom die is provided with positioning holes corresponding to the die nails of the upper die.
The front end of the upper die is provided with an upper die handle.
And a retaining wall is arranged on the side surface of the bottom die so as to improve the connection sealing property of the upper die and the bottom die.
The use process of the CPU film laminating die comprises the steps that an upper die and an upper die sealing plate are locked and fixed through a die lock through screws, an EVA insole is manufactured firstly, the EVA insole is fixed in a clamping groove of the upper die, a vacuum valve is opened, the EVA insole is tightly attached to an upper cover of the CPU die and is not prone to falling, then an upper die and a lower die of the CPU die are closed, a CPU raw material is poured into the EVA insole through a feeding hole, a 2-3mm gap is reserved between the EVA insole and the CPU bottom die after the EVA insole is closed, a flash window is arranged at the rear end of the CPU upper die, when the flash window has a material to overflow, the CPU raw material is proved to be full, the filling is finished, and the bottom is taken.
The utility model compounds EVA and CPU into sole at one time through the in-mold integrated molding structure, the CPU has good physical property, only needs a thin layer to meet the physical property requirements of wear resistance, skid resistance, folding resistance and the like, and can coat EVA in all directions; the EVA middle sole is used as the filling core of the sole, so that the elasticity is good and the wearing is comfortable; meanwhile, the differentiation of manual assembly is avoided, and the rejection rate in the production process is reduced; the integrated forming process ensures that the sole has strong attaching tension and no adhesive opening risk; the production process is simple, the labor cost is low, and the energy is saved and the environment is protected; the standardized production of the sole can be realized.
Description of the drawings:
the present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic view of the use state of the film covering mold of the present invention.
In the figure, an upper die sealing plate 1, an upper die 2, a bottom die 3, an EVA insole 4, a shaft sleeve 5, an air chamber 11, a sealing strip 12, a die lock 13, a vacuum valve 14, a feed hole 21, a clamping groove 22, an air hole 23, a flash window 24, a die nail 25, an upper die positioning nail 26, an upper die handle 27, a flash tank 31, a positioning hole 32 and a retaining wall 33 are arranged.
The specific implementation mode is as follows:
as shown in fig. 1, a CPU film coating mold, comprises an upper mold sealing plate 1, an upper mold 2 and a bottom mold 3, wherein the upper mold sealing plate 1 is provided with an air chamber 11, a sealing strip 12 is installed on the air chamber 11, the front end of the upper mold sealing plate is provided with a mold lock 13 for sealing the mold, the side surface of the upper mold sealing plate 1 is provided with a vacuum valve 14 communicated with a vacuum machine and the air chamber, the upper mold 2 is locked with the upper mold sealing plate 1 through screws, the upper mold is provided with a clamping groove 22 for fixing an EVA insole, the front side of the clamping groove is provided with a feeding hole 21, the inner side circumference of the clamping groove 22 is provided with a plurality of air holes 23 communicated with the air chamber 11 of the upper mold sealing plate 1, the rear part of the upper mold is provided with a flash window 24, the bottom mold 3 is connected with the upper mold 2 through a shaft sleeve 5 at the rear end, a flash groove 31 is arranged on the circumference of the bottom mold 3, the front end of the flash groove 31 is communicated with the feeding hole 21 of the upper mold, and the rear end of the flash groove 31 is communicated with the flash window 24. Air holes with the diameter of about 1mm are uniformly formed on the circumference of about 1mm of the inner side of the clamping groove of the upper die. And a plurality of upper die positioning nails 26 are arranged in the clamping grooves of the upper dies and used for fixing and positioning the EVA insole. And a plurality of die nails 25 are arranged on the outer side of the upper die clamping groove, and positioning holes 32 are arranged on the bottom die corresponding to the die nails of the upper die. The front end of the upper die is provided with an upper die handle 27. Retaining walls 33 are arranged on the side surfaces of the bottom die to improve the connection sealing property of the upper die and the bottom die.
According to the use process of the CPU film laminating mold, an upper mold and an upper mold sealing plate are locked and fixed through a mold lock through screws, an EVA insole is manufactured firstly, the EVA insole is fixed in a clamping groove of the upper mold, a vacuum valve is opened, the EVA insole and an upper cover of the CPU mold are tightly attached together and are not prone to dropping, then an upper mold and a lower mold of the CPU mold are closed, a CPU raw material is poured into the EVA insole and the CPU bottom mold through a feeding hole, a gap of 2-3mm is reserved between the EVA insole and the CPU bottom mold after the CPU raw material is closed, and a sealing groove is formed in the mold surface of the bottom mold to prevent the CPU material from overflowing. The front end of the flash groove of the bottom die is provided with a feed chute connected with the feed port, and the rear end of the flash groove is provided with a flash groove connected with the flash window. After the upper die and the lower die are assembled, the rear end of the CPU upper die is provided with a flash window, when the flash window overflows, the CPU raw material is proved to be filled, the filling is finished, and the bottom is taken.
Claims (6)
1. The utility model provides a CPU tectorial membrane mould, characterized by is by last shrouding, it constitutes to go up mould and die block, it sets up an air chamber to go up the mould shrouding, install the sealing strip above the air chamber, it sets up the mould lock that is used for sealing the mould to go up the mould shrouding front end, it sets up the vacuum valve with vacuum machine and air chamber intercommunication to go up mould shrouding side, it passes through screw locking with last mould shrouding to go up the mould, it sets up the draw-in groove that is used for fixed EVA insole to go up the mould setting, the draw-in groove front side sets up the feed port, set up a plurality of and the communicating gas pocket of air chamber of last mould shrouding on the draw-in groove inboard week, it sets up the flash window to go up the mould rear portion, the die block passes through the axle sleeve connection of rear end with last mould, set up the flash groove on the die block border lip, the flash groove front end has and communicates with each other with the flash window, the flash groove rear end communicates with each other with the flash window.
2. The CPU film covering mold according to claim 1, wherein about 1mm of the circumference of the inside of the neck of the upper mold is uniformly provided with air holes having a diameter of about 1 mm.
3. The CPU laminating die according to claim 1, wherein a plurality of upper die positioning nails are arranged in the clamping grooves of the upper die for fixing and positioning the EVA insole.
4. The CPU laminating die of claim 1, wherein a plurality of die nails are disposed on the outer side of the upper die clamping groove, and the positioning holes are disposed on the bottom die corresponding to the die nails of the upper die.
5. The CPU mold according to claim 1, wherein the upper mold handle is provided at the front end of the upper mold.
6. The CPU film covering mold according to claim 1, wherein a retaining wall is provided on a side surface of the bottom mold to improve the sealing property of the connection between the upper mold and the bottom mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121663769.3U CN217414976U (en) | 2021-07-21 | 2021-07-21 | CPU film covering die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121663769.3U CN217414976U (en) | 2021-07-21 | 2021-07-21 | CPU film covering die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217414976U true CN217414976U (en) | 2022-09-13 |
Family
ID=83169329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121663769.3U Active CN217414976U (en) | 2021-07-21 | 2021-07-21 | CPU film covering die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217414976U (en) |
-
2021
- 2021-07-21 CN CN202121663769.3U patent/CN217414976U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240327 Address after: 253000 No.28 Shuangyi Road, Xinhua Industrial Park, Decheng District, Dezhou City, Shandong Province Patentee after: DEZHOU XINHUARUN TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 253000 No. 1105, yard 179, Xiangyang Road, Decheng District, De Zhou City, Shandong Province Patentee before: Li Yucai Country or region before: China |