CN217413710U - Semiconductor element inspection jig - Google Patents
Semiconductor element inspection jig Download PDFInfo
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- CN217413710U CN217413710U CN202220162308.6U CN202220162308U CN217413710U CN 217413710 U CN217413710 U CN 217413710U CN 202220162308 U CN202220162308 U CN 202220162308U CN 217413710 U CN217413710 U CN 217413710U
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Abstract
The utility model is suitable for the electronic components detection field, provides a semiconductor component inspection clamp, which comprises an installation base, a clamping base component, a clamping component, a release control component and a clamping adjusting component; compared with the traditional clamping mode, the distance of the clamping base assembly and the elastic force of the clamping elastic piece in the clamping assembly can be changed through mechanical adjustment so as to adapt to different element clamping, thereby avoiding the situation that the clamping force is too large or too small when the clamping plate is directly driven by a driving device to clamp in the traditional mode, and meanwhile, the compression type clamping mode of the clamping elastic piece of the clamping assembly has a certain buffering effect, and further preventing the elements from being damaged.
Description
Technical Field
The utility model belongs to electronic components detects the field, especially relates to semiconductor element inspection anchor clamps.
Background
A semiconductor device is an electronic device that performs a specific function by using the specific electrical characteristics of a semiconductor material, and can perform operations such as signal generation, reception, conversion, and amplification, and also perform functions such as energy conversion.
Semiconductor component anchor clamps among the prior art are mostly traditional centre gripping mode, carry out the centre gripping through driving a pair of or a plurality of splint, have advantages such as simple structure.
However, in the clamping manner in the prior art, when the clamping is performed, the clamping force is too large or too small, when the clamping force is too small, the clamping is unstable, the clamping mechanism may be damaged due to unstable combination with a testing mechanism after power-on, and when the clamping force is too large, the clamping mechanism may directly cause physical damage such as crushing to the element.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a semiconductor element inspection jig aims at solving among the prior art too big or the too little condition of clamping-force.
The embodiment of the utility model provides a realize like this, a semiconductor element inspection anchor clamps for the clamping element, anchor clamps include:
mounting a base;
the clamping base assemblies are symmetrically arranged and slide relative to the mounting base along the direction away from each other, a reset piece is arranged between the clamping base assemblies and the mounting base, and when the clamping base assemblies move away from each other, the reset piece stores energy;
the clamping assemblies are arranged in a pair in number, are arranged in a sliding mode with the clamping base assemblies along the sliding direction of the clamping base assemblies, clamping elastic pieces are arranged between the clamping assemblies and the clamping base assemblies, and the movement stroke of the clamping assemblies is constant;
the release control assembly is arranged on the mounting base and used for driving the clamping base assemblies to move away from each other; and
and the clamping adjusting assembly is used for adjusting the clamping diameter of the clamping assembly and the clamping tightness of the clamping assembly.
As a further aspect of the present invention: the clamping adjustment assembly comprises:
the clamping size adjusting mechanism is used for adjusting the distance between a pair of clamping base assemblies, so that the maximum distance of the clamping assemblies is consistent with the element clamping diameter when the clamping base assemblies are at the minimum distance; and
and the clamping tightness adjusting mechanism is used for adjusting the sliding damping borne by the pair of clamping components in the motion stroke.
As a further aspect of the present invention: the tight degree adjustment mechanism of centre gripping includes:
a clamp spring for blocking the pair of clamp assemblies from sliding in a direction away from each other;
the clamping force adjusting ring moves along the telescopic direction of the clamping spring and is used for adjusting the sliding damping of the clamping spring; and
the clamping force adjusting piece is used for driving the clamping force adjusting ring to move.
As a further aspect of the present invention: the clamping base assembly comprises:
the fixing base is arranged in a sliding mode relative to the mounting base and is matched with the release control assembly; and
and the adjusting base is arranged in a sliding manner relative to the fixed base, is in sliding fit with the clamping assembly and is used for driving the clamping assembly to clamp the element.
As a further aspect of the present invention: the clamping size adjusting mechanism comprises:
the adjusting screw rod is rotatably arranged on the fixed base, is in threaded fit with the adjusting bases and is used for driving the pair of adjusting bases to move along the direction away from each other;
the adjusting nut is used for driving the adjusting screw rod to rotate; and
and the adjusting ruler is used for acquiring the clamping diameter of the pair of clamping components.
As a further aspect of the present invention: the release control assembly includes:
the driven blocks are oppositely and fixedly arranged with the clamping base assembly, and the adjacent sides of the pair of driven blocks are of an intersected inclined plane structure;
the driving block is in sliding fit with the inclined surfaces of the pair of driven blocks and is used for driving the pair of driven blocks to move away from each other through sliding; and
and the telescopic driving piece is used for driving the driving block to move.
The embodiment of the utility model provides a semiconductor element inspection jig, compare in traditional centre gripping mode, the elastic force of centre gripping elastic component all can realize changing in order to adapt to different component centre grippings through mechanical adjustment in the distance of centre gripping base subassembly and the centre gripping subassembly to the too big or undersize condition of clamping-force that probably appears when having avoided the tradition directly to carry out the centre gripping by drive arrangement drive grip block, the compressed centre gripping mode of centre gripping elastic component that adds the subassembly simultaneously has certain buffering effect, further prevent the destruction to the component.
Drawings
Fig. 1 is a structural diagram of a semiconductor device inspection jig according to an embodiment of the present invention;
fig. 2 is a partially enlarged view of an adjusting structure of a semiconductor device inspection jig according to an embodiment of the present invention;
fig. 3 is a structural diagram of a release control assembly of a semiconductor device inspection jig according to an embodiment of the present invention.
In the drawings: 1-an installation base, 2-a telescopic driving piece, 3-a driving block, 4-a driven block, 5-a clamping reset piece, 6-a guide piece, 7-a fixed base, 8-an adjusting screw rod, 9-an adjusting nut, 10-a clamping base table, 11-an adjusting ruler, 12-a clamping block, 13-an insulating pad, 14-a buffer pad, 15-a clamping slide block, 16-a clamping spring, 17-a clamping force adjusting ring and 18-a clamping force adjusting piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description is provided to illustrate specific embodiments of the present invention.
As shown in fig. 1 and 3, a semiconductor device inspection jig for holding a device according to an embodiment of the present invention includes:
a mounting base 1;
the clamping base assemblies are symmetrically arranged and slide along the direction away from each other relative to the mounting base 1, a reset piece is arranged between the clamping base assemblies and the mounting base 1, and when the clamping base assemblies move away from each other, the reset piece stores energy;
the clamping assemblies are arranged in a pair in number, are arranged in a sliding mode with the clamping base assemblies along the sliding direction of the clamping base assemblies, clamping elastic pieces are arranged between the clamping assemblies and the clamping base assemblies, and the movement stroke of the clamping assemblies is constant;
the release control assembly is arranged on the mounting base 1 and used for driving the clamping base assemblies to move away from each other; and
and the clamping adjusting assembly is used for adjusting the clamping diameter of the clamping assembly and the clamping tightness of the clamping assembly.
The utility model discloses an in the embodiment, through the implementation mode that has changed the centre gripping, realized the purpose, the mode is: during the centre gripping, the control release control subassembly makes a pair of centre gripping base subassembly draw close the motion each other in the energy release of the piece that resets of energy storage, thereby it is a pair of to drive the centre gripping subassembly is close to each other, realize the centre gripping under the compression of centre gripping elastic component, compare in traditional centre gripping mode, the elastic force of centre gripping elastic component all can realize changing in order to adapt to different component centre gripping through mechanical adjustment in the distance of centre gripping base subassembly and the centre gripping subassembly, thereby the too big or undersize condition of clamping-force that probably appears when having avoided the tradition directly to carry out the centre gripping by drive arrangement drive grip block, the centre gripping mode of the centre gripping elastic component compression of holding the subassembly has certain buffering effect simultaneously, further prevent the destruction to the component.
In an example of the present invention, the clamping base assembly can be an adjusting base 7 and a clamping base 10, the clamping assembly can be a clamping block 12, two sides of the clamping block 12 are respectively provided with a buffer pad 14 and an insulating pad 13 for protecting the components from fast hard impact and protecting the components from conduction with the outside during clamping, the release control member can be a driven block 4, a clamping reset member 5, a telescopic driving member 2 and a driving block 3, when in use, the telescopic driving member 2 contracts to drive the driving block 3 to move, so that the driven block 4 makes sliding motion approaching each other under the action of the clamping reset member 5, thereby driving the adjusting base 7 and the clamping base 10 to move, so that the clamping block 12 contacts with the original, compresses the clamping elastic member to realize clamping, completely depends on a clamping manner of a spring and a machine, the clamping force is inconvenient, and the deviation possibly generated in the electromechanical control can not be generated, the source of damage to the elements is avoided, and of course, the structure and the cooperation are both arranged for realizing the functions thereof, and have the replaceability of equivalent effect, and the structure is not specifically limited.
As shown in fig. 1 and 2, as a preferred embodiment of the present invention, the clamping adjustment assembly includes:
a clamping size adjusting mechanism for adjusting the distance between a pair of the clamping base assemblies so that the maximum distance of the clamping assemblies is consistent with the element clamping diameter when the clamping base assemblies are at the minimum distance; and
and the clamping tightness adjusting mechanism is used for adjusting the sliding damping borne by the pair of clamping components in the motion stroke.
Specifically, the clamping tightness adjusting mechanism comprises:
a clamp spring 16 for resisting sliding of a pair of the clamp assemblies in a mutually away direction;
a clamping force adjusting ring 17 moving along the telescopic direction of the clamping spring 16 for adjusting the sliding damping of the clamping spring 16; and
a clamping force adjuster 18 for driving movement of the clamping force adjustment ring.
In an example of the utility model, make the clamp force adjustable ring 17 precession or back-out rather than screw-thread fit through rotating clamp force regulating part 18, come compression in proper order or release clamping spring 16, reach and adjust when clamping element, clamping spring 16 is to the effort size of grip block 12, to the clamp force size of component promptly, of course, structure here and cooperation all set up in order to realize its function, have the replaceability of equivalent effect, do not do specific limited to its structure here.
As shown in fig. 1 and 2, as a preferred embodiment of the present invention, the clamping base assembly includes:
a fixed base 7, which is arranged in a sliding manner relative to the mounting base 1 and is matched with the release control component; and
and the adjusting base is arranged in a sliding manner relative to the fixed base 7, is in sliding fit with the clamping assembly and is used for driving the clamping assembly to clamp the element.
Thus, in a related aspect, the grip size adjustment mechanism includes:
the adjusting screw rod 8 is rotatably arranged on the fixed base 7, is in threaded fit with the adjusting bases, and is used for driving the pair of adjusting bases to move along the direction away from each other;
the adjusting nut 9 is used for driving the adjusting screw rod 8 to rotate; and
and the adjusting ruler 11 is used for acquiring the clamping diameter of the pair of clamping components.
The utility model discloses an in an example, adjust the base and can be centre gripping base station 10, during the use, adjust the implementation and do: the adjusting nut 9 is rotated to drive the adjusting screw rod 8 to rotate, so that the pair of clamping base stations 10 are driven to move close to or away from each other, the clamping diameter is controlled, and the clamping diameter can be read out through the adjusting ruler 11.
As shown in fig. 3, as a preferred embodiment of the present invention, the release control assembly includes:
the driven block 4 is oppositely and fixedly arranged with the clamping base component, and the adjacent sides of the pair of driven blocks are in an intersected inclined plane structure;
a driving block 3 which is in sliding fit with the inclined surfaces of the pair of driven blocks 4 and is used for driving the pair of driven blocks 4 to move away from each other through sliding; and
and the telescopic driving piece is used for driving the driving block 3 to move.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of the present invention.
Claims (6)
1. A semiconductor component inspection jig for holding a component, the jig comprising:
mounting a base;
the clamping base assemblies are symmetrically arranged and slide relative to the mounting base along the direction away from each other, a reset piece is arranged between the clamping base assemblies and the mounting base, and when the clamping base assemblies move away from each other, the reset piece stores energy;
the clamping assemblies are arranged in a pair in number, are arranged in a sliding mode with the clamping base assemblies along the sliding direction of the clamping base assemblies, clamping elastic pieces are arranged between the clamping assemblies and the clamping base assemblies, and the movement stroke of the clamping assemblies is constant;
the release control assembly is arranged on the mounting base and used for driving the clamping base assemblies to move away from each other; and
and the clamping adjusting assembly is used for adjusting the clamping diameter of the clamping assembly and the clamping tightness of the clamping assembly.
2. The semiconductor component inspection jig of claim 1, wherein the clamping adjustment assembly comprises:
the clamping size adjusting mechanism is used for adjusting the distance between a pair of clamping base assemblies, so that the maximum distance of the clamping assemblies is consistent with the element clamping diameter when the clamping base assemblies are at the minimum distance; and
and the clamping tightness adjusting mechanism is used for adjusting the sliding damping borne by the pair of clamping components in the motion stroke.
3. The semiconductor component inspection jig of claim 2, wherein the clamping tightness adjusting mechanism comprises:
a clamp spring for blocking the pair of clamp assemblies from sliding in a direction away from each other;
the clamping force adjusting ring moves along the telescopic direction of the clamping spring and is used for adjusting the sliding damping of the clamping spring; and
the clamping force adjusting piece is used for driving the clamping force adjusting ring to move.
4. The semiconductor component inspection jig of claim 3, wherein the clamping base assembly comprises:
the fixing base is arranged in a sliding mode relative to the mounting base and matched with the release control assembly; and
and the adjusting base is arranged in a sliding manner relative to the fixed base, is in sliding fit with the clamping assembly and is used for driving the clamping assembly to clamp the element.
5. The semiconductor element inspection jig according to claim 4, wherein the clamping size adjusting mechanism comprises:
the adjusting screw rod is rotatably arranged on the fixed base, is in threaded fit with the adjusting bases and is used for driving the pair of adjusting bases to move along the direction away from each other;
the adjusting nut is used for driving the adjusting screw rod to rotate; and
and the adjusting ruler is used for acquiring the clamping diameter of the pair of clamping components.
6. The semiconductor component inspection jig of claim 1, wherein the release control assembly comprises:
the driven blocks are oppositely and fixedly arranged with the clamping base assembly, and the adjacent sides of the pair of driven blocks are of an intersected inclined plane structure;
the driving block is in sliding fit with the inclined surfaces of the pair of driven blocks and is used for driving the pair of driven blocks to move away from each other through sliding; and
and the telescopic driving piece is used for driving the driving block to move.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220162308.6U CN217413710U (en) | 2022-01-21 | 2022-01-21 | Semiconductor element inspection jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220162308.6U CN217413710U (en) | 2022-01-21 | 2022-01-21 | Semiconductor element inspection jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217413710U true CN217413710U (en) | 2022-09-13 |
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ID=83176638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220162308.6U Active CN217413710U (en) | 2022-01-21 | 2022-01-21 | Semiconductor element inspection jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217413710U (en) |
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2022
- 2022-01-21 CN CN202220162308.6U patent/CN217413710U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221226 Address after: Room B186, Floor 2, No. 1500 Tingwei Road, Shanyang Town, Jinshan District, Shanghai, 201199 Patentee after: Shanghai Jiayi Electronic Technology Co.,Ltd. Address before: 266404 in the plant area, No. 8687 Binhai Avenue, Huangdao District, Qingdao, Shandong Province Patentee before: Qingdao Tongxin Intelligent Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |