CN217411715U - Perovskite component substrate surface perovskite layer remove device - Google Patents
Perovskite component substrate surface perovskite layer remove device Download PDFInfo
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- CN217411715U CN217411715U CN202221085255.9U CN202221085255U CN217411715U CN 217411715 U CN217411715 U CN 217411715U CN 202221085255 U CN202221085255 U CN 202221085255U CN 217411715 U CN217411715 U CN 217411715U
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Abstract
The utility model discloses a perovskite subassembly substrate surface perovskite layer remove device, including at least one cleaning unit, each cleaning unit includes: the cleaning container is provided with a cleaning cavity and an opening part communicated with the cleaning cavity, and the opening part can be used for allowing at least one perovskite component substrate to freely enter and exit the cleaning cavity along a set direction; the substrate fixing frame is used for fixing the perovskite component substrate and is in transmission connection with a driving mechanism, and the driving mechanism can drive the substrate fixing frame fixed with the perovskite component substrate to move along the set direction; and the drying mechanism is matched with the opening part and is used for drying the cleaned perovskite component base material. The utility model discloses the perovskite layer on subassembly substrate surface can be detached completely to the device to do not destroy electrically conductive basement and backplate glass, handle bad subassembly or low efficiency subassembly with the environmental protection mode, reduce the manufacturing cost of enterprise simultaneously.
Description
Technical Field
The utility model belongs to the technical field of photovoltaic module makes and uses, concretely relates to perovskite subassembly substrate surface perovskite layer remove device.
Background
The most central problem of the photovoltaic industry is how to efficiently utilize solar energy with low cost, and no matter the traditional crystalline silicon solar cell technology or the recently developed perovskite solar cell technology, the problems of energy conservation and emission reduction can be encountered in the production process, and how to efficiently utilize each raw material is related to the manufacturing cost of a photovoltaic module.
The perovskite solar cell technology is different from the traditional crystalline silicon technology and is a photovoltaic technology capable of being processed by solution, namely, a core photosensitive layer (perovskite layer) of the cell can be prepared by a solution method by using methods such as spin coating, spray coating and the like. However, during the production of perovskite solar cells, the presence of poor or inefficient components is inevitable. Due to the nature of perovskite batteries, the perovskite components with high photoelectric conversion rate all contain lead element at present. According to the current policy, lead-containing substances should be disposed of as hazardous wastes. However, in the perovskite solar cell module, the weight ratio of the conductive substrate to the back plate glass (namely the module substrate) is more than 99.5%, and the weight ratio of the perovskite layer is less than 0.01%. If these bad or low-efficiency components are disposed of entirely as hazardous waste, a huge waste of raw materials and high unnecessary expenses of the enterprise are incurred. How to digest and handle these components has been a benign development in the perovskite field.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a perovskite subassembly substrate surface perovskite layer remove device to overcome the not enough that exist among the prior art.
In order to achieve the above object, the embodiment of the present invention adopts a technical solution comprising:
the embodiment of the utility model provides a perovskite layer removing device on the surface of a perovskite component substrate,
comprising at least one washing unit, each washing unit comprising:
the cleaning container is provided with a cleaning cavity and an opening part communicated with the cleaning cavity, and the opening part can be used for allowing at least one perovskite component substrate to freely enter and exit the cleaning cavity along a set direction;
the substrate fixing frame is used for fixing the perovskite component substrate and is in transmission connection with a driving mechanism, and the driving mechanism can drive the substrate fixing frame fixed with the perovskite component substrate to move along the set direction;
and the drying mechanism is matched with the opening part and is used for drying the cleaned perovskite component substrate.
Furthermore, a cleaning liquid inlet and a cleaning liquid outlet are formed in the cleaning container, and the cleaning liquid inlet and the cleaning liquid outlet are respectively communicated with the cleaning cavity.
Furthermore, the cleaning liquid inlet and the cleaning liquid outlet are respectively arranged at the upper part and the lower part of the cleaning container.
Further, the opening part is arranged at the top of the cleaning container, and the set direction is a vertical direction; in some particular cases, the substrate may even be inserted obliquely into the wash chamber.
Further, the perovskite component substrate surface perovskite layer removing device further comprises an ultrasonic module, and the ultrasonic module is arranged outside or inside the cleaning cavity.
Further, the ultrasonic module is mounted on a wall of the cleaning vessel.
Furthermore, the drying mechanism comprises two oppositely-arranged slit air ports, the two slit air ports are distributed on two sides of the opening portion, and the air outlet direction of each slit air port points to the surface of the corresponding side of the perovskite component substrate passing through the opening portion.
Furthermore, the air outlet direction of each slit air port forms an included angle of 30-60 degrees with the corresponding side surface of the perovskite component substrate passing through the opening part.
Furthermore, each slit air port is formed on one side surface of an air inlet substrate, an air inlet is further formed in the air inlet substrate, and the air inlet is communicated with the slit air ports.
Further, the substrate includes a plate, block, or other structure, preferably a plate.
Further, the perovskite component substrate surface perovskite layer removing device comprises a plurality of cleaning units, and the cleaning units are sequentially arranged.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses perovskite subassembly substrate surface perovskite layer remove device can detach the perovskite layer on subassembly substrate surface completely to do not destroy electrically conductive basement and backplate glass, handle bad subassembly or low efficiency subassembly with the environmental protection mode, reduce the manufacturing cost of enterprise simultaneously.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural view of a perovskite component in one embodiment of the present application.
Fig. 2 is a schematic structural view of a perovskite layer removal device on the surface of a perovskite substrate according to an embodiment of the present application.
Fig. 3 is a schematic sectional view of the slit tuyere of fig. 2.
Fig. 4 is a schematic structural diagram of the substrate holder in fig. 2.
Description of reference numerals: 1. the cleaning device comprises a cleaning container, 2 parts of a cleaning liquid outlet, 3 parts of a load transfer wheel, 4 parts of a cleaning liquid inlet, 5 parts of a power switch, 6 parts of a drying mechanism, 61 parts of an air inlet base, 62 parts of a slit air port, 7 parts of an air inlet, 8 parts of a perovskite component base material, 9 parts of a base material fixing frame, 91 parts of a base material branch fixing frame, 92 parts of a base material supporting bracket, 93 parts of a limiting joint, 10 parts of an ultrasonic module, 11 parts of a conductive base, 12 parts of a buffer layer, 13 parts of a perovskite layer, 14 parts of an electrode and 15 parts of back plate glass.
Detailed Description
The present invention will be more fully understood from the following detailed description, which should be read in conjunction with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms. Therefore, specific functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present invention in virtually any appropriately detailed embodiment.
Examples
A perovskite component substrate surface perovskite layer removing device, as shown in fig. 2, comprising at least one cleaning unit, each cleaning unit comprising:
a cleaning container 1 having a cleaning chamber and an opening portion communicating with the cleaning chamber, the opening portion allowing at least one perovskite module substrate 8 to freely enter and exit the cleaning chamber in a predetermined direction;
the substrate fixing frame 9 is used for fixing the perovskite component substrate 8, the substrate fixing frame 9 is in transmission connection with the driving mechanism, and the driving mechanism can drive the substrate fixing frame 9 fixed with the perovskite component substrate 8 to move along a set direction;
and a drying mechanism which is provided in cooperation with the opening portion and is used for drying the cleaned perovskite module substrate 8.
A cleaning liquid inlet 4 and a cleaning liquid outlet 2 are arranged on the cleaning container 1, and the cleaning liquid inlet 4 and the cleaning liquid outlet 2 are respectively communicated with the cleaning cavity; in the present embodiment, the cleaning liquid inlet 4 and the cleaning liquid outlet 2 are provided at the upper and lower portions of the cleaning vessel 1, respectively.
In the present embodiment, the opening portion is provided at the top of the cleaning vessel 1, and the setting direction is a vertical direction; in some particular cases, the substrate may even be inserted obliquely into the wash chamber.
In some implementations, the perovskite component substrate surface perovskite layer removing device further comprises an ultrasonic module 10, wherein the ultrasonic module 10 is arranged outside or inside the cleaning cavity; in this embodiment, the ultrasonic module 10 is installed on the container wall of the cleaning container 1, and four ultrasonic modules 10 are arranged on the container sidewall of the cleaning container 1, so that the center of the container sidewall of the cleaning container 1 is the center of the circle, and each ultrasonic module 10 is radially distributed around the center of the circle, so that the perovskite component substrate 8 is uniformly subjected to ultrasonic in the cleaning container 1, and further the cleaning is uniform.
In this embodiment, as shown in fig. 3, the drying mechanism 6 includes two slit vents 62 disposed oppositely, the two slit vents 62 are disposed at two sides of the opening portion, the air outlet direction of each slit vent 62 points to a corresponding side surface of the perovskite component substrate 8 passing through the opening portion, that is, the air outlet direction of each slit vent 62 forms an included angle of 30-60 ° with the corresponding side surface of the perovskite component substrate 8 passing through the opening portion, each slit vent 62 is formed on a side surface of an air inlet substrate 61, the air inlet substrate 61 is further provided with an air inlet 7, and the air inlet 7 is communicated with the slit vents 62.
In this embodiment, the drying mechanism 6 is in an air drying form, and other drying methods, such as infrared drying, may also be adopted; in addition, in the implementation process, the air inlet substrate can be a plate, a block or other structures, and in the embodiment, the plate is preferably a plate, so that the occupied space is small and the weight is light.
In a specific implementation process, the perovskite layer removing device on the surface of the perovskite component substrate comprises a plurality of cleaning units, and the cleaning units are sequentially arranged.
In this embodiment, as shown in fig. 4, the substrate fixing frame 9 includes two substrate branch fixing frames 91 and a substrate supporting bracket 92 disposed between the substrate branch fixing frames 91 and located at the bottom end of the substrate branch fixing frame 91, and two ends of the substrate supporting bracket 92 are further provided with a limiting joint 93 at least for limiting and fixing the substrate supporting bracket 92 on the substrate branch fixing frame 91.
In the present embodiment, a power switch 5 is further disposed on the container wall of the cleaning container 1, and the power switch 5 is disposed above the container wall of the cleaning container 1.
In order to allow the wash tank 1 to be moved easily, a weight transfer wheel 3 is provided at the bottom end of the wash tank 1.
In specific implementation, the cleaning device comprises four cleaning units, wherein the four cleaning units are arranged in sequence, the first three cleaning containers 1 are filled with the organic solvent through the cleaning liquid inlet 4, and the last cleaning container 1 is filled with water through the cleaning liquid inlet 4.
The perovskite component in this embodiment includes, as shown in fig. 1, a conductive substrate 11, a buffer layer 12, a perovskite layer 13, an electrode 14, and a back plate glass 15, which are sequentially disposed from bottom to top, and the conductive substrate 11, the buffer layer 12, the perovskite layer 13, the electrode 14, and the back plate glass 15 are encapsulated by an encapsulating material to form the perovskite component.
Since the perovskite material used is solvent processable, dissolution can be carried out with organic solvents and the solubility is up to 2M. The perovskite layer content in the perovskite subassembly is very low, therefore, adopts the solvent to wash the perovskite layer, can get rid of the perovskite layer on subassembly substrate surface fast, high efficiency, can not destroy the substrate simultaneously, and the subassembly substrate can be retrieved for use, has both reduced the volume of hazardous waste, reduces unnecessary expenditure, but also retrieval and utilization partial material, reduces manufacturing cost.
The perovskite formula that can be removed by the apparatus of this embodiment is ABX 3 A can be one or more of MA, FA, Cs and Bi, but is not limited to the above; b can be one or more of Pb and Sn, but is not limited to the Pb and the Sn;x can be one or more of Cl, Br and I, but is not limited to the above; the washable conductive substrate material includes glass or plastic substrates and the like.
The organic solvent used in the perovskite removing device of the present embodiment may be one or more of N, N-dimethylformamide, dimethyl sulfoxide, γ -butyrolactone, N-methylpyrrolidone, and the like, but is not limited thereto.
In the implementation process, the cleaning cavity 1 can be made of stainless steel, aluminum alloy and the like, and the size of the cavity can be customized according to the length and width of the component glass (the size is 2.2 × 1.2 × 0.25m generally).
The working process of the perovskite layer removing device on the surface of the perovskite component substrate of the embodiment is as follows: arranging 4 cleaning containers 1 from left to right, adding a cleaning solvent from a cleaning liquid inlet 4 (the first three are added with an organic solvent, and the fourth is added with tap water), fixing a perovskite component substrate 8 (a conductive substrate or back plate glass) on a substrate fixing frame 9, slowly immersing the perovskite component substrate into the cleaning cavity 1, opening an ultrasonic module 10 after the perovskite component substrate is completely immersed, ultrasonically cleaning for 10-30 seconds, slowly taking out the perovskite component substrate, blowing air through a slit air port 62 at the moment, and blowing the solvent attached to the surface of the substrate back to the cleaning cavity 1; the perovskite component substrate 8 is sequentially washed by the organic solvent for three times and the tap water for one time from left to right, the perovskite on the surface of the component glass can be completely removed, and the substrate is not lost.
After a plurality of times of cleaning, the solution in the cavity reaches a certain concentration and is discharged from the cleaning solution outlet 2, and the solution forms entrusted treatment by hazardous waste. Because of the low perovskite content in the component and the high solubility of the solvent, each chamber solution can process a large number of poor or inefficient components, while the weight of the solution after cleaning is less than 1% of the weight of the processed components. The yield of hazardous waste can be greatly reduced, the utilization rate of the component substrate is improved, and the aim of reducing the manufacturing cost is fulfilled.
The perovskite component substrate surface perovskite layer removing device of the embodiment can be used for cleaning perovskite solar cell module substrates, but is not limited to cleaning perovskite solar cell module substrates.
In addition, the utility model discloses a still refer to the aforesaid embodiment, have tested with other raw materials, process operation, process conditions mentioned in this specification to all obtain comparatively ideal result.
While the invention has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated any use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
Claims (10)
1. A perovskite component substrate surface perovskite layer remove device which characterized in that includes at least one cleaning unit, each cleaning unit includes:
the cleaning container is provided with a cleaning cavity and an opening part communicated with the cleaning cavity, and the opening part can be used for allowing at least one perovskite component substrate to freely enter and exit the cleaning cavity along a set direction;
the substrate fixing frame is used for fixing the perovskite component substrate and is in transmission connection with a driving mechanism, and the driving mechanism can drive the substrate fixing frame fixed with the perovskite component substrate to move along the set direction;
and the drying mechanism is matched with the opening part and is used for drying the cleaned perovskite component substrate.
2. The perovskite component substrate surface perovskite layer removal device of claim 1, wherein: and the cleaning container is provided with a cleaning liquid inlet and a cleaning liquid outlet which are respectively communicated with the cleaning cavity.
3. The perovskite component substrate surface perovskite layer removal device of claim 2, wherein: the cleaning liquid inlet and the cleaning liquid outlet are respectively arranged at the upper part and the lower part of the cleaning container.
4. The perovskite component substrate surface perovskite layer removal device of claim 1, wherein: the opening portion is arranged at the top of the cleaning container, and the set direction is a vertical direction.
5. The perovskite component substrate surface perovskite layer removal device of any one of claims 1 to 4, wherein: the cleaning device also comprises an ultrasonic module which is arranged outside or inside the cleaning cavity.
6. The perovskite component substrate surface perovskite layer removal device of claim 5, wherein: the ultrasonic module is mounted on a wall of the cleaning vessel.
7. The perovskite component substrate surface perovskite layer removal device of claim 1, wherein: the drying mechanism comprises two oppositely-arranged slit air openings, the two slit air openings are distributed on two sides of the opening portion, and the air outlet direction of each slit air opening points to the surface of one corresponding side of the perovskite component substrate passing through the opening portion.
8. The perovskite component substrate surface perovskite layer removal device of claim 7, wherein: the air outlet direction of each slit air port and the surface of the corresponding side of the perovskite component substrate passing through the opening part form an included angle of 30-60 degrees.
9. The perovskite component substrate surface perovskite layer removal device of claim 8, wherein: each slit air port is formed on one side surface of an air inlet substrate, an air inlet is further formed in the air inlet substrate, and the air inlet is communicated with the slit air ports.
10. The perovskite component substrate surface perovskite layer removal device of claim 1, comprising a plurality of the cleaning units, wherein the plurality of the cleaning units are arranged in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221085255.9U CN217411715U (en) | 2022-05-07 | 2022-05-07 | Perovskite component substrate surface perovskite layer remove device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202221085255.9U CN217411715U (en) | 2022-05-07 | 2022-05-07 | Perovskite component substrate surface perovskite layer remove device |
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| CN217411715U true CN217411715U (en) | 2022-09-13 |
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| CN202221085255.9U Active CN217411715U (en) | 2022-05-07 | 2022-05-07 | Perovskite component substrate surface perovskite layer remove device |
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