CN217405212U

CN217405212U - SMD high-power common mode inductor

Info

Publication number: CN217405212U
Application number: CN202221321401.3U
Authority: CN
Inventors: 刘奇; 郝长武
Original assignee: Wujiang Sanding Electronics Co ltd
Current assignee: Wujiang Sanding Electronics Co ltd
Priority date: 2022-05-30
Filing date: 2022-05-30
Publication date: 2022-09-09
Anticipated expiration: 2032-05-30

Abstract

A patch type high-power common mode inductor comprises a ring-shaped magnetic core and a lead winding wound on the magnetic core; magnetic core bosses are symmetrically arranged on the bottom surface of the magnetic core, and the height of each magnetic core boss is larger than or equal to the outer diameter of each wire; notches are arranged on the magnetic core boss at intervals, and an electroplated layer is arranged on the inner wall of each notch; the lead winding comprises a first wire group and a second wire group which are different in type and provided with insulating layers, inlet and outlet wires of the first wire group and the second wire group are led out and placed in the groove, and the lead winding, an electroplated layer in the groove and an electroplated layer of the PCB are conducted in a tinning welding mode. The utility model can cancel the structure of the inductance shell, the wiring terminal and the clapboard by arranging the magnetic core boss, thereby greatly reducing the volume of the common mode inductance and reducing the volume of the finished product power supply; and the wire group I and the wire group II of different types are selected, so that the overall voltage resistance of the common mode inductor can be improved, and the requirement of safety regulations can be better met.

Description

SMD high-power common mode inductor

Technical Field

The utility model relates to an electronic component technical field, concretely relates to high-power common mode inductance of SMD.

Background

Common mode inductors, also called common mode chokes, are commonly used in switching power supplies of computers to filter common mode electromagnetic interference signals. In the design of the board card, the common mode inductor is installed on the board card to play a role in EMI (electromagnetic interference) filtering, can effectively inhibit electromagnetic waves generated by the high-speed signal line from radiating and emitting outwards, and is widely used in various electronic fields.

The common mode inductor is a common mode interference suppression device using ferrite as a magnetic core, two coils with the same wire diameter and the same turn number are symmetrically wound on the same ferrite annular magnetic core to form a four-terminal device, and the annular magnetic core is most widely applied to the common mode inductor because of high magnetic permeability and small number of turns required under the normal condition.

Currently, the existing common mode inductor has the following disadvantages: (1) the existing common mode inductor is provided with a shell for facilitating production organization, but the shell is added, so that the self scattering effect of the device is poor. (2) The existing common mode chip inductor needs to wind the lead end of a copper wire around a pin after extending out of a magnetic core before high-temperature soldering. However, because the terminal of copper line just can twine with the pin together after need buckling when stretching out the magnetic core outer end, consequently twine the foot, need artifical arrangement terminal to the manual work twines the terminal on the pin, twine the foot time longer, production efficiency is not high.

Disclosure of Invention

Aiming at the technical problems, the technical scheme provides a surface-mounted high-power common-mode inductor, wherein an inductor shell can be omitted and the heat dissipation performance of the inductor is improved by arranging a magnetic core boss which is formed at the bottom of a magnetic core and integrated with the magnetic core, and a groove and an electroplated layer on the magnetic core boss; meanwhile, the inlet and outlet wires of the wire winding are directly welded in the groove, and pins do not need to be wound, so that the pin winding process is saved, and the production efficiency is increased; the problems can be effectively solved.

The utility model discloses a following technical scheme realizes:

a patch type high-power common mode inductor comprises a ring-shaped magnetic core and a lead winding wound on the magnetic core; magnetic core bosses are symmetrically arranged on the bottom surface of the magnetic core, and the height of each magnetic core boss is larger than or equal to the outer diameter of each wire; notches are arranged on the magnetic core boss at intervals, and an electroplated layer is arranged on the inner wall of each notch; the lead winding comprises a first wire group and a second wire group which are different in type and provided with insulating layers, inlet and outlet wires of the first wire group and the second wire group are led out and placed in the groove, and the lead winding, an electroplated layer in the groove and an electroplated layer of the PCB are conducted in a tinning welding mode.

Furthermore, magnetic core boss and the magnetic core of annular form be integral structure, and the magnetic core boss is polished with magnetic core an organic whole and is moulded.

Furthermore, the depth of the notch is larger than or equal to the outer diameter of the lead, and when the incoming and outgoing lines of the lead are placed in the notch, the notch can coat the lead in the notch, or the lead can fill and level up the notch.

Furthermore, after the wire winding is wound on the magnetic core, the top of the wire winding is fixedly connected with a flat upper cover through adhesive, and the upper cover is made of an insulating material.

Furthermore, any one of the first wire group and the second wire group adopts an enameled wire, and the other wire group adopts three layers of insulated wires; the enameled wire and the three-layer insulated wire are wound on the magnetic core in a double-wire winding or double-wire winding mode.

Furthermore, the enameled wire is wound on any side of a magnetic core boss in the magnetic core, and a certain distance is reserved between the wound and fixed enameled wires; the inlet and outlet wires of the enameled wire are respectively arranged in a notch close to one side of the enameled wire winding, are fixed by adopting soldering tin and are conducted with the electroplated layer; the three-layer insulated wire is wound on the other side of the magnetic core, and the inlet and outlet wires of the three-layer insulated wire are respectively placed in the notch close to one side of the three-layer insulated wire winding, fixed by adopting soldering tin and conducted with the electroplated layer.

Furthermore, the enameled wire and the three-layer insulated wire are wound on the magnetic core in a single-layer mode by adopting double wires in parallel, and when the enameled wire and the three-layer insulated wire meet a magnetic core boss during winding, the enameled wire and the three-layer insulated wire cross the magnetic core boss and are wound on the other side of the magnetic core boss; the inlet and outlet wires of the enameled wire are respectively welded in the notches on the left side or the right side of the two magnetic core bosses, and the inlet and outlet wires of the three layers of insulated wires are respectively welded in the notches on the other side of the two magnetic core bosses.

Advantageous effects

The utility model provides a pair of high-power common mode inductance of SMD compares with prior art, and it has following beneficial effect:

(1) according to the technical scheme, the magnetic core boss which is integrally formed with the magnetic core is arranged at the bottom of the magnetic core, and the grooves and the electroplated layers on the magnetic core boss are matched with each other, so that the structures of an inductor shell, a wiring terminal and a partition plate can be eliminated, the structure of the common-mode inductor is simplified, the volume of the common-mode inductor is greatly reduced, and the volume of a finished power supply is reduced; meanwhile, the heat dissipation of the common-mode inductor is increased without the arrangement of a shell; meanwhile, the inlet and outlet wires of the wire winding are directly welded in the notch, and pins do not need to be wound, so that the pin winding process is saved, and the production efficiency of the common-mode inductor is improved; in addition, the first wire group and the second wire group of different types are selected, so that the overall voltage resistance of the common-mode inductor can be improved, and the requirement of safety regulations can be better met.

(2) Magnetic core boss among this technical scheme and the magnetic core of annular form be the integral structure, and the magnetic core boss is polished fashioned settlement with the magnetic core is integrative for magnetic core boss and magnetic core are a whole, can increase the wholeness of magnetic core and magnetic core boss. Meanwhile, the magnetic core boss and the magnetic core are made of the same ferrite material, so that the magnetic core boss has good insulativity; the grooves arranged on the magnetic core boss at intervals have strong insulating function, and the possibility of conduction can be effectively avoided.

(3) According to the technical scheme, the first wire group and the second wire group of different models are selected, the enameled wires and the three-layer insulated wires are selected for double-wire winding, a certain distance is reserved between the enameled wires during winding, and the voltage resistance and the high temperature resistance of the common-mode inductor can be improved. Even under the condition of high power, when the insulating layer on the outer side of the enameled wire is damaged, the possibility of conduction between copper wires of the enameled wire can be reduced due to a certain distance between the enameled wires. And the resistance to pressure and the high temperature resistance performance of three-layer insulated wire are stronger, when meetting high-power, the heat resistance performance and the pressure resistance performance of three-layer insulated wire are stronger, and the outer insulating layer of three-layer insulated wire has played the effect of baffle in other words, can play the effect of insulating and separating three-layer insulated wire and enameled wire, can the holistic resistance to pressure of effectual improvement common mode inductance, can be better reach the requirement of ann rule.

(4) The arrangement of the upper cover in the technical scheme and the flat upper cover can facilitate the automatic operation when a manufacturer welds the common mode inductor on the PCB in the later period, and the flat upper cover can facilitate the adsorption of the sucker; the automatic operation in the paster production process can be facilitated, and the efficiency of a user in the production process is improved.

Drawings

Fig. 1 is a schematic view of the overall structure of embodiment 1 of the present invention.

Fig. 2 is a schematic front structural view of embodiment 1 of the present invention.

Fig. 3 is the structure schematic diagram of the magnetic core and the magnetic core boss of the present invention.

Fig. 4 is a schematic view of the overall structure of embodiment 2 of the present invention.

The labels in the figures are: 1-magnetic core, 2-magnetic core boss, 21-notch, 3-electroplated layer, 4-wire winding, 41-wire group I, 42-wire group II, 5-soldering tin, 6-adhesive and 7-upper cover.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The described embodiments are only some, but not all embodiments of the invention. Under the prerequisite that does not deviate from the design concept of the utility model, the ordinary person in the art should fall into the protection scope of the utility model to the various changes and improvements that the technical scheme of the utility model made.

Example 1:

as shown in fig. 1 to 3, a chip-type high-power common mode inductor includes a ferrite ring-shaped core 1 and a wire winding 4 wound around the core 1. Magnetic core bosses 2 are symmetrically arranged on the bottom surface of the magnetic core 1; magnetic core boss 2 and the magnetic core 1 of annular form structure as an organic whole, and magnetic core boss 2 and the shaping of polishing of magnetic core 1 an organic whole. The two groups of wire windings 4 are respectively wound on two sides of the magnetic core boss 2.

The height of the magnetic core boss 2 is greater than or equal to the outer diameter of the wire, and generally, the height of the magnetic core boss 2 is slightly greater than the outer diameter of the wire. Notches 21 are arranged on the magnetic core boss 2 at intervals, and an electroplated layer 3 is arranged on the inner wall of each notch 21; the depth of the notch 21 is larger than or equal to the outer diameter of the wire, and when the inlet and outlet wires of the wire are placed in the notch 21, the notch 21 can coat the wire in the notch 21, or the wire can fill and level up the notch 21.

When the production, when the end of wire was placed in notch 21, can fill notch 21 when level, when carrying out tin-plating welded operation, then chooseed for use the mode of spot welding to carry out tin-plating welding to ensure that the wire can take place to switch on with the plating layer 3 in the notch 21, it is the best to have soldering tin to spill over outside the groove again.

When the end of the lead is placed in the notch 21, the notch 21 cannot be filled and leveled, but the end is coated by the groove, tin plating welding is carried out in a tin supplementing mode when tin plating welding is carried out, the groove is filled and leveled in a tin supplementing mode, so that the lead can be ensured to be conducted with the electroplated layer 3 in the notch 21, and meanwhile, the supplemented tin soldering, the top surface of the lead is flush with the top surface of the magnetic core boss, so that the lead can be conducted with the electroplated layer on the PCB; during the tin filling, the solder in the groove cannot overflow out of the groove, but is preferably flush with the notch 21.

The lead winding 4 comprises a first wire group 41 and a second wire group 42 which are provided with insulating layers and have different types, the inlet and outlet wires of the first wire group 41 and the second wire group 42 are led out and placed in the notch 21, and the plated layers 3 in the lead winding 4 and the notch 21 and the plated layers of the PCB are conducted in a tinning welding mode.

Any one of the first wire group 41 and the second wire group 42 adopts an enameled wire, and the other wire adopts three layers of insulated wires; the enameled wire and the three-layer insulated wire are wound on the magnetic core 1 in a double-wire split winding mode.

The enameled wires are wound on any side of the magnetic core boss 2 in the magnetic core 1, and a certain distance is reserved between the wound and fixed enameled wires; the inlet and outlet wires of the enameled wire are respectively arranged in the notch 21 close to one side of the enameled wire winding, are fixed by adopting soldering tin and are conducted with the electroplated layer 3; the three-layer insulated wire is wound on the other side of the magnetic core 1, and the inlet and outlet wires of the three-layer insulated wire are respectively placed in the notch 21 close to one side of the three-layer insulated wire winding, fixed by soldering tin and conducted with the electroplated layer 3.

After the wire winding 4 is wound on the magnetic core 1, namely the enameled wire and the three-layer insulated wire are symmetrically wound on the magnetic core 1, the top of the enameled wire and the three-layer insulated wire are fixedly connected with a flat upper cover 7 through an adhesive 6, and the upper cover 7 is made of an insulating material.

In this embodiment, the upper cover 7 is made of a PCB, and the adhesive 6 is made of an adhesive such as epoxy resin, which is conventionally used in the art.

Generally, the first wire group 41 and the second wire group 42 in example 1 are combined by using an enameled wire and a three-layer insulated wire. If the voltage resistance requirement of the customer is not high, the first winding group 41 and the second winding group 42 on the left side and the right side of the magnetic core 1 can be surrounded by enameled wires; and certain space is reserved between the enameled wires after winding and fixing. On the contrary, if the voltage resistance requirement of the customer is higher, the first wire group 41 and the second wire group 42 on the left side and the right side of the magnetic core 1 may be surrounded by three layers of insulated wires; if the size of the magnetic core 1 is not large enough to allow both winding wires to be three-layer insulated wires, it may be considered to increase the size of the magnetic core 1 appropriately.

Example 2:

in general, the commercial product that was put on the market was produced with the structure in example 1; in special situations (such as special use environments), or in situations where the customer has special needs; the enameled wire and the three-layer insulated wire can also be wound on the magnetic core in a double-wire parallel winding mode. When the enameled wire and the three-layer insulated wire are wound around the magnetic core in a double-wire and parallel manner, a specific embodiment is shown in fig. 4.

The enameled wire and the three-layer insulated wire are wound on the magnetic core 1 in a double-wire parallel single-layer mode, and when the enameled wire and the three-layer insulated wire meet the magnetic core boss 2 during winding, the enameled wire and the three-layer insulated wire cross the magnetic core boss 2 and are wound on the other side of the magnetic core boss 2; the inlet and outlet wires of the enameled wire are respectively welded in the notches 21 on the right side in the two magnetic core bosses 2, and the inlet and outlet wires of the three layers of insulated wires are respectively welded in the notches 21 on the left side in the two magnetic core bosses 2.

Other structures in this embodiment, and the positional relationship and the connection relationship between the structures are the same as those in embodiment 1, and will not be described in detail.

Claims

1. A patch type high-power common mode inductor comprises a ring-shaped magnetic core (1) and a lead winding (4) wound on the magnetic core (1); the method is characterized in that: magnetic core bosses (2) are symmetrically arranged on the bottom surface of the magnetic core (1), and the height of each magnetic core boss (2) is more than or equal to the outer diameter of each wire; notches (21) are arranged on the magnetic core boss (2) at intervals, and an electroplated layer (3) is arranged on the inner wall of each notch (21); the lead winding (4) comprises a first wire group (41) and a second wire group (42) which are different in type and provided with insulating layers, the inlet and outlet wires of the first wire group (41) and the second wire group (42) are led out and placed in the notch (21), and the lead winding (4), the electroplated layer (3) in the notch (21) and the electroplated layer of the PCB are conducted in a tinning welding mode.

2. The chip type high-power common mode inductor according to claim 1, wherein: magnetic core boss (2) and the magnetic core (1) of annular form structure as an organic whole, and magnetic core boss (2) and magnetic core (1) integrated into one piece of polishing shaping.

3. The chip type high-power common mode inductor according to claim 1, wherein: the degree of depth more than or equal to the external diameter of wire of notch (21), when the business turn over line of wire was placed in notch (21), notch (21) can be with the inside of wire cladding notch (21), or the wire can be with notch (21) fill and level up.

4. The chip type high-power common mode inductor according to claim 1, wherein: wire winding (4) encircle on magnetic core (1) back, its top is through viscose (6) fixedly connected with smooth upper cover (7), upper cover (7) adopt insulating material to make.

5. The chip type high-power common mode inductor according to any one of claims 1 to 4, wherein: any one group of wires in the first wire group (41) and the second wire group (42) adopts enameled wires, and the other group of wires adopts three layers of insulated wires; the enameled wire and the three-layer insulated wire are wound on the magnetic core (1) in a double-wire split winding or double-wire parallel winding mode.

6. The chip high-power common-mode inductor according to claim 5, wherein: the enameled wires are wound on any side of a magnetic core boss (2) in the magnetic core (1), and a certain distance is reserved between the wound and fixed enameled wires; the inlet and outlet wires of the enameled wire are respectively arranged in a notch (21) close to one side of the enameled wire winding, are fixed by adopting soldering tin (5) and are communicated with the electroplated layer (3); the three-layer insulated wire is wound on the other side of the magnetic core (1), and the wire inlet and outlet of the three-layer insulated wire are respectively placed in a notch (21) close to one side of the three-layer insulated wire winding, fixed by soldering tin (5) and conducted with the electroplated layer (3).

7. The chip high-power common-mode inductor according to claim 5, wherein: the enameled wire and the three-layer insulated wire are wound on the magnetic core (1) in a single-layer mode by adopting double wires in parallel, and when the enameled wire and the three-layer insulated wire meet the magnetic core boss (2) during winding, the enameled wire and the three-layer insulated wire pass through the magnetic core boss (2) and are wound on the other side of the magnetic core boss (2); the inlet and outlet wires of the enameled wires are respectively welded in notches (21) on the left side or the right side of the two magnetic core bosses (2), and the inlet and outlet wires of the three layers of insulated wires are respectively welded in notches (21) on the other side of the two magnetic core bosses (2).