CN217394661U - Soft abrasive grinding wheel for ultra-precise low-damage grinding of silicon wafers - Google Patents

Abstract

The utility model discloses a soft abrasive grinding wheel of ultra-precise low damage grinding silicon chip, including connection pad A, one side of connection pad A bottom is equipped with connection pad B, the inside of connection pad B is equipped with the inserted bar, the top of inserted bar is rotated and is connected with the inner loop pole, the bottom cover of inner loop pole is equipped with the spring, the top cover of spring is equipped with the outer tube, the bottom of outer tube one side is equipped with the locking piece, the top of connection pad B is equipped with the connecting cylinder; the utility model discloses an under the effect of swash plate, at the in-process that the abrasive disc polished to the silicon chip, can improve the air flow rate on emery wheel surface for the abrasive disc is at the in-process of polishing, and its temperature is difficult for rising, and then the temperature of control abrasive disc prevents to influence polishing of silicon chip, through outer tube, inner loop pole, spring, spacing groove, locking piece under the cooperation, after the damage appears in the emery wheel, can be quick change it, guarantee that follow-up equipment can move once more with fastest speed.

Description

Soft abrasive grinding wheel for ultra-precise low-damage grinding of silicon wafers

Technical Field

The utility model relates to a emery wheel technical field specifically is a soft abrasive grinding wheel of ultra-precise low damage grinding silicon chip.

Background

The grinding wheel is also called a consolidation grinding tool, the grinding wheel is a consolidation grinding tool which is formed by consolidating common grinding materials into a certain shape by a binding agent and has certain strength, the consolidation grinding tool generally comprises the grinding materials, the binding agent and air holes, the three parts are usually called as three elements of the consolidation grinding tool, the three elements are classified according to different binding agents, the three elements are usually ceramic grinding wheels, resin grinding wheels and rubber grinding wheels, the grinding wheel is one of the grinding tools with the largest use amount and the widest use surface, and the grinding wheel rotates at high speed when in use and can perform rough grinding, semi-finish grinding and finish grinding, slotting, cutting and the like on an excircle, an inner circle, a plane, various molded surfaces and the like of a metal or non-metal workpiece;

the existing soft abrasive grinding wheel has the following inconveniences:

the emery wheel is at the in-process that lasts to polish, and its temperature can rise gradually, and the emery wheel temperature can influence polishing of silicon chip too high to lead to the silicon chip to appear damaging, the emery wheel is at long-time polishing in-process simultaneously, can appear wearing and tearing, needs to change the emery wheel this moment, and current change mode is all comparatively loaded down with trivial details, along the efficiency that influences the change.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a soft abrasive grinding wheel of ultra-precision low damage grinding silicon chip to the problem of the inefficiency that the in-process that proposes to polish can't cool down and change in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a soft abrasive grinding wheel of ultra-precision low damage grinding silicon chip, includes connection pad A, one side of connection pad A bottom is equipped with connection pad B, connection pad B's inside is equipped with the inserted bar, the top of inserted bar is rotated and is connected with interior loop bar, the bottom cover of interior loop bar is equipped with the spring, the top cover of spring is equipped with the outer tube, the bottom of outer tube one side is equipped with the locking piece, connection pad B's top is equipped with the connecting cylinder, the inboard of connecting cylinder is equipped with the spacing groove, the inside one side of connection pad B is equipped with the spout, the spout communicates with each other with the spacing groove, the bottom of inserted bar is equipped with the mounting disc, the bottom of mounting disc evenly is equipped with the multiunit abrasive disc, and is two sets of be equipped with the swash plate between the abrasive disc.

Preferably, the inside of connection pad B is equipped with the dovetail groove, and the inserted bar cross-section is trapezoidal, inserted bar and dovetail groove mutual adaptation.

Preferably, the top of inserted bar is equipped with the bearing, and the bottom of inner loop pole is located the inside of bearing.

Preferably, the inclined plate is obliquely arranged at the bottom of the mounting disc.

Preferably, a sleeve is arranged at the top of the connecting disc A, and a locking hole is formed in one end of the sleeve.

Preferably, the locking piece is made of an L-shaped structure.

Compared with the prior art, the beneficial effects of the utility model are that: the soft abrasive grinding wheel for ultra-precise low-damage grinding of the silicon wafer;

under the effect through the swash plate, at the in-process that the abrasive disc polished to the silicon chip, can improve the air flow rate on emery wheel surface for the abrasive disc is at the in-process of polishing, and its temperature is difficult for rising, and then the temperature of control abrasive disc prevents to influence polishing of silicon chip, through outer tube, inner loop pole, spring, spacing groove, under the cooperation of locking piece, after damage appears in the emery wheel, can be quick change it, guarantee that follow-up equipment can move once more with fastest speed.

Drawings

Fig. 1 is a front view of the present invention;

fig. 2 is a front sectional view of the connection pad B of the present invention;

fig. 3 is an enlarged view of the point a of fig. 2 according to the present invention;

fig. 4 is a bottom view of the mounting plate of the present invention;

fig. 5 is a perspective view of the connecting cylinder of the present invention.

In the figure: 1. a connecting disc A; 2. a connecting disc B; 3. grinding; 4. a sloping plate; 5. mounting a disc; 6. a connecting cylinder; 7. a chute; 8. a limiting groove; 9. an outer sleeve; 10. an inner loop bar; 11. a spring; 12. inserting a rod; 13. and (6) locking the block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides an embodiment: the utility model provides a soft abrasive grinding wheel of ultra-precision low damage grinding silicon chip, including connection pad A1, one side of connection pad A1 bottom is equipped with connection pad B2, connection pad B2's inside is equipped with inserted bar 12, inserted bar 12's top is rotated and is connected with interior loop bar 10, the bottom cover of interior loop bar 10 is equipped with spring 11, spring 11's top cover is equipped with outer tube 9, the bottom of outer tube 9 one side is equipped with locking piece 13, connection pad B2's top is equipped with connecting cylinder 6, the inboard of connecting cylinder 6 is equipped with spacing groove 8, the inside one side of connection pad B2 is equipped with spout 7, spout 7 communicates with each other with spacing groove 8, the bottom of inserted bar 12 is equipped with mounting disc 5, the bottom of mounting disc 5 evenly is equipped with multiunit abrasive disc 3, can polish and be equipped with swash plate 4 between two sets of abrasive disc 3, play certain cooling effect.

Furthermore, the inside of connection pad B2 is equipped with the dovetail groove, and the inserted bar 12 cross-section is trapezoidal, and the mutual adaptation of inserted bar 12 and dovetail groove is convenient for install, improves the effect of connecting.

Further, the top of the inserted link 12 is provided with a bearing, and the bottom of the inner loop bar 10 is located inside the bearing, so that the inner loop bar 10 can rotate conveniently.

Further, the inclined plate 4 is obliquely arranged at the bottom of the mounting disc 5, and can blow out certain wind in the rotating process of the inclined plate 4.

Furthermore, the top of connection pad A1 is equipped with the sleeve pipe, and the one end of sleeve pipe is equipped with the lockhole, conveniently is connected with equipment.

Further, the locking piece 13 is made of an L-shaped structure to facilitate connection.

The working principle is as follows: in the grinding process, equipment drives the connecting disc A1 to rotate, the connecting disc A1 drives the connecting disc B2 to rotate, the connecting disc B2 grinds a silicon wafer, the inclined plate 4 accelerates the air flow rate at the bottom of the mounting disc 5 in the grinding process, certain wind is generated, the surface of the grinding disc 3 is cooled, and overheating of the grinding disc is prevented;

when the grinding wheel needs to be replaced, the outer sleeve 9 is firstly rotated, the inner sleeve rod 10 is further driven to rotate, after the locking block 13 is overlapped with the sliding groove 7, the limiting state of the outer sleeve 9 is released, at the moment, the mounting disc 5 is pulled downwards, and the mounting disc 5 can be integrally taken out for replacement.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, rather than to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, for example, as either a fixed connection or a detachable connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Claims (6)

1. The utility model provides a soft abrasive grinding wheel of ultra-precision low damage grinding silicon chip, includes connection pad A (1), its characterized in that: a connecting disc B (2) is arranged on one side of the bottom of the connecting disc A (1), an inserted rod (12) is arranged inside the connecting disc B (2), the top of the inserted bar (12) is rotatably connected with an inner loop bar (10), the bottom of the inner loop bar (10) is sleeved with a spring (11), the top of the spring (11) is sleeved with an outer sleeve (9), the bottom of one side of the outer sleeve (9) is provided with a locking block (13), the top of the connecting disc B (2) is provided with a connecting cylinder (6), the inner side of the connecting cylinder (6) is provided with a limit groove (8), one side in the connecting disc B (2) is provided with a sliding groove (7), the sliding groove (7) is communicated with a limiting groove (8), the bottom of inserted bar (12) is equipped with mounting disc (5), the bottom of mounting disc (5) evenly is equipped with multiunit abrasive disc (3), and is two sets of be equipped with swash plate (4) between abrasive disc (3).

2. The soft abrasive grinding wheel for ultra-precise low-damage grinding of silicon wafers as claimed in claim 1, wherein: the inside of connection pad B (2) is equipped with the dovetail groove, and inserted bar (12) cross-section is trapezoidal, inserted bar (12) and dovetail groove mutual adaptation.

3. The soft abrasive grinding wheel for ultra-precise low-damage grinding of silicon wafers as claimed in claim 1, wherein: the top of inserted bar (12) is equipped with the bearing, and the bottom of interior loop bar (10) is located the inside of bearing.

4. The soft abrasive grinding wheel for ultra-precise low-damage grinding of silicon wafers as claimed in claim 1, wherein: the inclined plate (4) is obliquely arranged at the bottom of the mounting disc (5).

5. The ultra-precise soft abrasive grinding wheel for grinding silicon wafers with low damage according to claim 1, wherein: the top of the connecting disc A (1) is provided with a sleeve, and one end of the sleeve is provided with a lock hole.

6. The soft abrasive grinding wheel for ultra-precise low-damage grinding of silicon wafers as claimed in claim 1, wherein: the locking piece (13) is made of an L-shaped structure.

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