CN217389316U - Heat abstractor, power module, machine controller and vehicle - Google Patents

Abstract

The embodiment of the application provides a heat dissipation device, a power module, a motor controller and a vehicle. The heat dissipation device comprises a bottom plate and a plurality of heat dissipation fin pins fixed on the surface of one side of the bottom plate, wherein the heat dissipation fin pins are distributed pairwise at intervals to form a cooling channel for accommodating a cooling medium, a part of the heat dissipation fin pins are connected with each other to form a flow guide plate, and a flow guide channel is formed in the cooling channel to guide the cooling medium to a preset position. In the embodiment of the application, the guide plate can distribute the cooling medium, distribute the cooling medium to the preset position where heat dissipation is needed most, increase the flow rate of the local cooling medium near the preset position, and achieve a good heat dissipation effect.

Description

Heat abstractor, power module, machine controller and vehicle

Technical Field

The application belongs to the technical field of vehicles, and particularly relates to a heat dissipation device, a power module, a motor controller and a vehicle.

Background

With the continuous and deep development of new energy automobiles, electric automobiles are increasingly popularized in daily life of people. The power module is a core component inside the motor controller, and the safe and reliable operation of the power module is the key for the normal operation of the whole electric automobile.

In the prior art, because a power chip of a power module has a low temperature-resistant level, an over-temperature fault occurs when the temperature exceeds a certain threshold, and the power module is damaged under a severe condition. Thus, the temperature tolerance limitations of the power module severely limit the power density of the motor controller itself. If the power density of the motor controller needs to be improved, the size of the motor controller can only be increased, but the requirements of the interior of the whole vehicle on space arrangement and power density are difficult to meet, and the improvement of the power of the vehicle is limited.

SUMMERY OF THE UTILITY MODEL

The application aims at providing a heat dissipation device, a power module, a motor controller and a vehicle so as to solve the problem that the existing power module is low in heat dissipation efficiency.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, the present application discloses a heat dissipation device, which includes a base plate and a plurality of heat dissipation fin pins fixed on a surface of one side of the base plate, wherein the plurality of heat dissipation fin pins are arranged in a spaced manner two by two, and a cooling channel for accommodating a cooling medium is formed therebetween, wherein a portion of the heat dissipation fin pins are connected with each other to form a flow guide plate, and a flow guide channel is formed in the cooling channel to guide the cooling medium to a predetermined position.

In the embodiment of the application, as the partial radiating fin pins of the radiating device are connected with each other to form the guide plate, the guide plate can distribute the cooling medium to the preset position which needs radiating most, the flow rate of the local cooling medium near the preset position is increased, and a better radiating effect is achieved. In the case where the heat dissipating device is used for a power module, the flow rate of the cooling medium in the heat dissipating device at the predetermined position can be increased due to the presence of the baffle plate. Therefore, the heat dissipation effect of the local position (such as a power chip) of the power module can be improved, and the temperature resistance of the power module is improved. Therefore, the power density of the motor controller applying the power module can be improved, and the power of the vehicle is improved.

Optionally, a concave part is arranged between two adjacent heat dissipation fin pins forming the flow guide plate to divide the cooling medium.

By the arrangement of the concave part, the cooling medium can be finely divided and distributed, the local flow velocity near the preset position is increased, and the optimal heat dissipation efficiency near the preset position is realized.

Optionally, a bending portion is arranged in the middle of the guide plate, and the bending portion corresponds to the preset position.

The flow velocity of the cooling medium reaches the maximum or the minimum at the bent part so as to obtain the best cooling effect. Since the bending part corresponds to the predetermined position, the optimal cooling effect can be obtained when the cooling medium flows through the predetermined position.

Optionally, the deflector is wavy, and the bent portion is located at a wave crest or a wave trough. So that the flow velocity of the cooling medium shows the trend of alternately increasing and decreasing, and the cooling effect of the cooling medium is further improved.

Optionally, the cooling channel comprises a water inlet end and a water outlet end which are arranged oppositely, and the direction from the water inlet end to the water outlet end is a first direction;

the heat dissipation device comprises at least two flow deflectors, each two flow deflectors form a flow deflector group, the two flow deflectors in the flow deflector group are arranged at intervals in a direction perpendicular to the first direction, and the distance between the two flow deflectors is gradually changed along the first direction so as to guide the cooling medium to the preset position.

In the embodiment of the present application, the distance between two baffles in the baffle group is set to be gradually changed along the first direction, so that the cooling medium can be guided to the predetermined position, and the flow speed at the predetermined position is the largest, so that the cooling medium can have the best heat dissipation effect near the predetermined position.

Optionally, along the first direction, the distance between two baffles in the set of baffles repeatedly tends to decrease to an extreme position and then increase, and the extreme position corresponds to the predetermined position.

In the embodiment of the application, the preset position is arranged at the position corresponding to the limit position, so that the heat dissipation effect of the heat dissipation device near the preset position can be optimal. And the distance between the two guide plates increases after the limit position, so that the flow speed of the cooling medium can be gradually reduced after the cooling medium flows through the limit position, the integral retention time of the cooling medium in the cooling channel is prolonged, and the integral heat dissipation effect of the heat dissipation device can be improved.

Optionally, the cooling fin pins are in the shape of columns, needles or sheets.

In a second aspect, the present application also discloses a power module, comprising: the power module comprises a power module body, wherein a plurality of power chips distributed at intervals are arranged in the power module body;

the heat dissipation device according to any one of the above claims, wherein the heat dissipation device and the power module body are stacked, and the predetermined position is a position corresponding to the power chip.

In the embodiment of the application, the guide plate in the heat dissipation device can distribute the cooling medium to the preset position where heat dissipation is needed most, so that the flow speed of the local cooling medium near the preset position is increased, and a better heat dissipation effect is achieved. The heat dissipation device and the power module body are arranged in a laminated mode, and the power chip is arranged corresponding to the preset position, so that the heat dissipation effect of the heat dissipation device on the power chip can be improved, and the temperature resistance of the power module is improved. Therefore, the power density of the motor controller applying the power module can be improved, and the power of the vehicle is improved.

Optionally, the number of the heat dissipation devices is two, and the two heat dissipation devices are respectively disposed on the upper and lower sides of the power module body.

In the embodiment of the application, the heat of the power chip can be simultaneously radiated through the heat radiators on the two sides, the heat is intensively radiated aiming at the hot spot region of the heat source, the heat radiation is efficient, the electric heating fatigue of the power module is prevented from being accelerated, and the working performance of the power module is prevented from being influenced.

Optionally, the power module further comprises a water inlet jacket and a water outlet jacket, and the water inlet jacket and the water outlet jacket are respectively connected with the two heat dissipation devices; the water inlet jacket is used for introducing the cooling medium into the cooling channels of the two heat dissipation devices, and the water outlet jacket is used for guiding out the cooling medium of the cooling channels of the two heat dissipation devices. Therefore, the upper and lower heat radiating devices can share the water inlet jacket and the water outlet jacket, and the overall structure of the power module can be simplified.

In a third aspect, an embodiment of the present application further discloses a motor controller, where the motor controller includes any one of the power modules described above.

In a fourth aspect, the present application further discloses a vehicle, including: the motor controller is provided.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a power module according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of another angle configuration of the power module shown in FIG. 2;

FIG. 4 is a schematic view of a further angle configuration of the power module shown in FIG. 2;

FIG. 5 is a schematic view of a further angle configuration of the power module shown in FIG. 2;

fig. 6 is an enlarged schematic diagram of the position of the power module a shown in fig. 5.

Reference numerals: 100-a heat dissipation device, 10-a bottom plate, 11-heat dissipation fin pins, 12-a cooling channel, 13-a guide plate, 131-a concave part, 132-a bending part, an S-preset position, a B-water inlet end, a C-water outlet end, 20-a power module body, 201-a power chip, 202-an upper structure layer, 203-a lower structure layer, 21-a water inlet jacket and 22-a water outlet jacket.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1, a schematic structural diagram of a heat dissipation apparatus according to an embodiment of the present invention is shown, and as shown in fig. 1, the heat dissipation apparatus includes a base plate 10 and a plurality of heat dissipation fin pins 11 fixed on a side surface of the base plate 10, the plurality of heat dissipation fin pins 11 are arranged in a spaced manner, and a cooling channel 12 for accommodating a cooling medium is formed therebetween, wherein a portion of the heat dissipation fin pins 11 are connected to each other to form a flow guide plate 13, and a flow guide channel is formed in the cooling channel 12 to guide the cooling medium to a predetermined position S.

In the embodiment of the application, as the partial radiating fin pins 11 are connected with each other to form the guide plate 13, the guide plate 13 can distribute the cooling medium to the preset position S which needs heat radiation most, the flow velocity of the local cooling medium near the preset position S is increased, and a good heat radiation effect is achieved. In the case where the heat dissipating device is used for a power module, the flow rate of the cooling medium in the heat dissipating device at the predetermined position S can be increased due to the presence of the baffle 13. Therefore, the heat dissipation effect of the local position (such as a power chip) of the power module can be improved, and the temperature resistance of the power module is improved. Therefore, the power density of the motor controller applying the power module can be improved, and the power of the vehicle is improved.

In practical application, the plurality of heat dissipation fin pins 11 distributed in an array are arranged in the cooling channel 12, so that the residence time of the cooling medium in the cooling channel 12 can be increased, and the heat dissipation effect of the heat dissipation device is improved. And the guide plate 13 is formed by connecting part of the radiating fin pins 11 with each other, so that the structure of the guide plate 13 is simple and easy to implement.

For example, the heat dissipation fin pins 11 may be connected to the base plate 10 by bonding, welding, or the like, and the connection manner between the heat dissipation fin pins 11 and the base plate 10 is not particularly limited in the embodiments of the present application.

Alternatively, the heat dissipation fin pins 11 may have a columnar shape, a needle shape, or a sheet shape, and the specific shape of the heat dissipation fin pins 11 in the embodiments of the present application may not be limited.

In the present embodiment, only a part of the heat dissipating fin pins 11 is connected to form the baffle plate 13. In practical application, the cooling medium may be further configured to be a separate flow guide plate, a flow guide groove, and the like to guide the flow of the cooling medium, which is not limited in the embodiment of the present application.

Optionally, a concave portion 131 is provided between two adjacent heat dissipation fin pins 11 constituting the flow guide plate 13 to divide the cooling medium, so as to further realize fine division and distribution of the cooling medium. In practical application, the concave portion 131 can be used for shunting the cooling medium and shunting the cooling medium to a position where heat dissipation is most needed, and by using the combined action of the flow guide plate 13 and the concave portion 131, fine shunting and distribution of the cooling medium can be realized, the local flow velocity near the predetermined position S is increased, and the optimal heat dissipation efficiency near the predetermined position S is realized.

Optionally, a bending portion 132 is disposed in the middle of the air deflector 13, and the bending portion 132 corresponds to the predetermined position S. Due to the abrupt change of the shape of the baffle 13 at the position of the bent portion 132, when the cooling medium flows through the bent portion 132, the flow rate is greatly changed accordingly, that is, at the bent portion of the bent portion 132, the flow rate of the cooling medium reaches the maximum or minimum, so as to obtain the best cooling effect. Since the bent portion 132 corresponds to the predetermined position S, an optimal cooling effect can be obtained when the cooling medium flows through the predetermined position S. The angle degree of the bending angle of the bending part is more than 0 degree and less than 180 degrees, the bending angle is a round angle or a sharp angle, and furthermore, one bending part can also comprise a plurality of bending angles so as to further adjust the flow rate of the cooling medium of the bending part.

Optionally, the baffle 13 is wavy, and the bending portion 132 is located a wave crest or a wave trough, that is, by setting up a plurality of bending portions 132 that are alternately arranged, the wavy baffle 13 can be formed, so that the flow velocity of the cooling medium shows a trend of becoming larger and smaller alternately, and the cooling effect of the cooling medium is further improved. Furthermore, a plurality of bending angles of wave-shaped or other continuous bending shapes can be arranged at one wave crest or wave trough, so that the flow speed of the cooling medium at the wave crest or wave trough can be further finely adjusted.

For example, the wave-shaped deflector 13 may be disposed at an edge of the bottom plate 10, and the wave shape may be a circular arc, a triangular sawtooth, a combination of a circular arc and a straight line, or other structures. Because the guide plate 13 is arranged close to the edge of the bottom plate 10, the cooling medium can be prevented from flowing away from the position close to the wall surface of the cooling channel 11 because the flow resistance of the position close to the wall surface is small, and the effective utilization of the flow of the cooling medium is ensured. Moreover, the wavy guide plate can also enhance the strength of the heat dissipation device, bear stronger mechanical vibration and ensure the safe and reliable operation of the heat dissipation device under severe working conditions.

Alternatively, the cooling channel 12 may include a water inlet end B and a water outlet end C arranged oppositely, and the direction from the water inlet end B to the water outlet end C is a first direction (the direction indicated by the arrow in fig. 1); the heat dissipation device may include at least two flow deflectors 13, each two flow deflectors 13 form a flow deflector group, two flow deflectors 13 in the flow deflector group are arranged at an interval in a direction perpendicular to the first direction, and a distance between the two flow deflectors 13 gradually changes along the first direction, so as to guide the cooling medium to a predetermined position S.

In the embodiment of the present application, because the two guide plates 13 in the guide plate group are disposed in the first direction and are arranged at an interval relatively, the purpose of adjusting the flow velocity of the cooling medium can be achieved by adjusting the distance between the two guide plates 13 arranged at an interval relatively.

Specifically, since the distance between two baffles 13 in the baffle group gradually changes along the first direction, the flow speed of the cooling medium in the cooling channel 11 can be adjusted, thereby achieving the purpose of adjusting the cooling effect. Specifically, the smaller the distance between the two baffles 13, the higher the flow speed of the cooling medium, and accordingly, the better the cooling effect. Therefore, in practical applications, the distance between the two baffles 13 may be set to be gradually changed along the first direction to guide the cooling medium to the predetermined position S where the flow rate is maximum, so that the heat dissipation effect of the cooling medium near the predetermined position S can be maximized.

Optionally, along the first direction, the distance between two baffles 13 in the set of baffles repeatedly decreases to an extreme position and then increases again, and the extreme position corresponds to the predetermined position.

In practice, in the first direction, the cooling medium can be guided to the extreme position, and the flow velocity at the extreme position is the greatest, so that the cooling efficiency at the extreme position is the highest, because the distance between two baffles 13 in the baffle group repeatedly tends to decrease to the extreme position and then increase again. By arranging the predetermined position S at a position corresponding to the limit position, the heat dissipation effect of the heat dissipation device near the predetermined position S can be optimized. And the distance between the two guide plates 13 increases after the limit position, so that the flow speed of the cooling medium can be gradually reduced after the cooling medium flows through the limit position, so as to increase the overall residence time of the cooling medium in the cooling channel 11, and thus, the overall heat dissipation effect of the heat dissipation device can be improved.

In summary, the heat dissipation device according to the embodiment of the present application may include at least the following advantages:

in the embodiment of the application, as the partial radiating fin pins of the radiating device are connected with each other to form the guide plate, the guide plate can distribute the cooling medium, the cooling medium is distributed to the preset position where the heat radiation is most needed, the flow rate of the local cooling medium near the preset position is increased, and the better radiating effect is achieved. In the case where the heat dissipating device is used for a power module, the flow rate of the cooling medium in the heat dissipating device at the predetermined position can be increased due to the presence of the baffle. Therefore, the heat dissipation effect of the local position (such as a power chip) of the power module can be improved, and the temperature resistance of the power module is improved. Therefore, the power density of the motor controller applying the power module can be improved, and the power of the vehicle is improved.

Referring to fig. 2, a schematic structural diagram of a power module according to an embodiment of the present application at a certain angle is shown, referring to fig. 3, a schematic structural diagram of the power module shown in fig. 2 at another angle is shown, referring to fig. 4, a schematic structural diagram of the power module shown in fig. 2 at yet another angle is shown, referring to fig. 5, a schematic structural diagram of the power module shown in fig. 2 at yet another angle is shown, and referring to fig. 6, an enlarged schematic structural diagram of a position of the power module a shown in fig. 5 is shown.

Specifically, the power module may include: the power module comprises a power module body 20, wherein a plurality of power chips 201 distributed at intervals are arranged in the power module body 20; in the heat dissipation device 100 according to any of the embodiments, the heat dissipation device 100 and the power module body 20 are stacked, and the predetermined position S is a position corresponding to the power chip 201.

Specifically, the power module body 20 may be a main structure body for implementing the functions of the power module. The power module body 20 may specifically include a power chip 201, an upper structural layer 202 disposed above the power chip 201, and a lower structural layer 203 disposed below the power chip 201. The upper structure layer 202 and the lower structure layer 203 may include an insulating substrate, a metal layer, and a pad.

In the embodiment of the present application, the flow guide plate 13 in the heat dissipation device 100 may distribute the cooling medium, so as to distribute the cooling medium to the predetermined position S where heat dissipation is most needed, increase the flow rate of the local cooling medium near the predetermined position S, and achieve a better heat dissipation effect. By arranging the heat dissipation device 100 and the power module body 20 in a stacked manner and correspondingly arranging the power chip 201 at the preset position S, the heat dissipation effect of the heat dissipation device 100 on the power chip 201 can be improved, and the temperature resistance of the power module is improved. Therefore, the power density of the motor controller applying the power module can be improved, and the power of the vehicle is improved.

Specifically, the heat sink 100 may be stacked above or below the power module body 20, or may be disposed above and below the power module body 20. The heat sink 100 may be laid outside the entire power module body 20 to cool the power module body 20, thereby achieving heat dissipation of the power module. In this embodiment, since the plurality of flow guiding plates 13 are disposed in the cooling channel 11, the flow guiding plates 13 may be configured to guide the cooling medium to the predetermined position S corresponding to the power chip 201, and increase the flow rate of the cooling medium at the predetermined position S corresponding to the power chip 101. Through the arrangement of the flow guide plate 13, the heat dissipation effect of the heat dissipation device 100 on the power chip 201 can be improved.

Optionally, the number of the heat dissipation devices 100 is two, and the two heat dissipation devices 100 are disposed on the upper and lower sides of the power module body 20. In specific application, the power chip 201 can be welded or sintered at low temperature in the middle in an interlayer mode, heat of the power chip 201 can be simultaneously dissipated through the heat dissipation devices 100 on the two sides, heat dissipation is concentrated on hot spot regions of a heat source, heat dissipation is efficient, and the phenomenon that the working performance of the power module is affected due to accelerated electric heating fatigue of the power module is avoided. The utility model discloses a cooling method has improved power module's radiating efficiency breaks through the design upper limit under the existing condition, improves the heat from power chip 201 to the vertical heat-conduction ability of base plate to reduce power module's the highest temperature, promote power module's life.

Optionally, the power module may further include a water inlet jacket 21 and a water outlet jacket 22, where the water inlet jacket 21 and the water outlet jacket 22 are respectively connected to the two heat sinks 100; the water inlet jacket 21 may be configured to introduce the cooling medium into the cooling channels 11 of the two heat sinks 100, and the water outlet jacket 22 may be configured to lead out the cooling medium from the cooling channels 11 of the two heat sinks 100. Thus, the upper and lower heat dissipation devices 100 can share the water inlet jacket 21 and the water outlet jacket 22, and the overall structure of the power module can be simplified.

In summary, the power module according to the embodiment of the present application may include at least the following advantages:

in the embodiment of the application, the guide plate in the heat dissipation device can distribute the cooling medium to the preset position where heat dissipation is needed most, so that the flow speed of the local cooling medium near the preset position is increased, and a better heat dissipation effect is achieved. The heat dissipation device and the power module body are arranged in a laminated mode, and the power chip is arranged corresponding to the preset position, so that the heat dissipation effect of the heat dissipation device on the power chip can be improved, and the temperature resistance of the power module is improved. Therefore, the power density of the motor controller applying the power module can be improved, and the power of the vehicle is improved.

The embodiment of the application also provides a motor controller, and the motor controller can specifically comprise the power module.

In the embodiment of the application, the guide plate in the heat dissipation device can distribute the cooling medium to the preset position where heat dissipation is needed most, so that the flow speed of the local cooling medium near the preset position is increased, and a better heat dissipation effect is achieved. The heat dissipation device and the power module body are arranged in a laminated mode, and the power chip is arranged corresponding to the preset position, so that the heat dissipation effect of the heat dissipation device on the power chip can be improved, and the temperature resistance of the power module is improved. Therefore, the power density of the motor controller applying the power module can be improved, and the power of a vehicle is improved.

The utility model discloses a cooling method of power module has improved the radiating efficiency, breaks through the design upper limit under the existing condition, improves the heat from the vertical heat-conduction ability of power chip to base plate to reduce power module's the highest temperature, promote power module's life. In concrete application, guarantee stable output capacity under the motor controller under the high switching frequency condition and the low output current fundamental wave frequency condition, power module itself can use under higher switching frequency like this, in the operating mode of low output current fundamental wave frequency such as motor start, steady operation for motor controller exports higher power, is suitable for wider working range, has then improved whole motor drive system's power density, has reduced the volume of system simultaneously.

The embodiment of the application also provides a vehicle which specifically comprises the motor controller.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (12)

1. A heat dissipation device comprises a bottom plate and a plurality of heat dissipation fin pins fixed on one side surface of the bottom plate, and is characterized in that the heat dissipation fin pins are distributed pairwise at intervals, a cooling channel for containing a cooling medium is formed between the heat dissipation fin pins, a part of the heat dissipation fin pins are connected with each other to form a flow guide plate, and a flow guide channel is formed in the cooling channel so as to guide the cooling medium to a preset position.

2. The heat dissipating device according to claim 1, wherein a concave portion is provided between adjacent two of the heat dissipating fin pins constituting the flow guide plate to divide the cooling medium.

3. The heat dissipation device as claimed in claim 1, wherein a bent portion is disposed in the middle of the air deflector, and the bent portion corresponds to the predetermined position.

4. The heat dissipating device of claim 3, wherein the baffles are wavy, and the bends are located at the peaks or valleys.

5. The heat dissipating device of claim 3, wherein the cooling channel comprises a water inlet end and a water outlet end disposed opposite to each other, and a direction from the water inlet end to the water outlet end is a first direction;

the heat dissipation device comprises at least two flow deflectors, each two flow deflectors form a flow deflector group, the two flow deflectors in the flow deflector group are arranged at intervals in a direction perpendicular to the first direction, and the distance between the two flow deflectors is gradually changed along the first direction so as to guide the cooling medium to the preset position.

6. The heat dissipating device of claim 5, wherein in the first direction, the spacing between two baffles in the set of baffles repeatedly decreases to an extreme position and increases again, the extreme position corresponding to the predetermined position.

7. The heat dissipating device of any of claims 1-6, wherein the heat dissipating pins are in the shape of columns, needles, or plates.

8. A power module, comprising: the power module comprises a power module body, wherein a plurality of power chips distributed at intervals are arranged in the power module body;

the heat dissipating device according to any one of claims 1 to 7, which is stacked on the power module body, wherein the predetermined position is a position corresponding to the power chip.

9. The power module of claim 7, wherein the number of the heat dissipation devices is two, and the two heat dissipation devices are respectively disposed on the upper and lower sides of the power module body.

10. The power module of claim 9, further comprising a water inlet jacket and a water outlet jacket, the water inlet jacket and the water outlet jacket being connected to the two heat sinks, respectively; the water inlet jacket is used for introducing the cooling medium into the cooling channels of the two heat dissipation devices, and the water outlet jacket is used for guiding out the cooling medium of the cooling channels of the two heat dissipation devices.

11. A motor controller, characterized in that the motor controller comprises: the power module of any one of claims 1 to 10.

12. A vehicle, characterized in that the vehicle comprises: the motor controller of claim 10.

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