CN217389121U

CN217389121U - Processing structure for improving uniformity of resistance value after etching

Info

Publication number: CN217389121U
Application number: CN202220365247.3U
Authority: CN
Inventors: 郑海平; 徐承升; 廖发盆; 李亮
Original assignee: Dongguan Cojoin Circuits Co ltd
Current assignee: Dongguan Cojoin Circuits Co ltd
Priority date: 2022-02-22
Filing date: 2022-02-22
Publication date: 2022-09-06
Anticipated expiration: 2032-02-22

Abstract

The utility model belongs to the technical field of the PCB processing, concretely relates to promote processing structure of etching back resistance value homogeneity, the package rubbing board body is provided with a plurality of PCB modules on the plate body, is provided with between per two adjacent PCB modules and all is provided with the clearance of cutting, all is provided with the resistance layer in the PCB module, is provided with dry rete on the plate body, and dry rete is located the top of PCB module. The utility model has the advantages that: the utility model discloses novel structure, design benefit set up a plurality of PCB modules simultaneously on the plate body, when carrying out the press mold, to a plurality of PCB module press mold simultaneously, make each PCB module press mold effect in the plate body even. After exposure and development, pressing a developed product in a pressure balance mode of a rapid press, and etching after a dry film is flattened, so that the line width uniformity of the resistor is improved, the uniformity of the resistance value in the PCB module is improved, and the PCB module is cut along a cutting gap after the processing technology is finished.

Description

Processing structure for improving uniformity of resistance value after etching

Technical Field

The utility model belongs to the technical field of the PCB processing, concretely relates to promote processing structure of resistance value homogeneity after etching.

Background

Pcb (printed circuit board), also called printed circuit board, is an important electronic component, is a support for electronic components, is a carrier for electrical connection of electronic components, and along with rapid progress of science and technology, electronic products are increasingly sophisticated, and mobile phones, computers, televisions, etc. used by people have more and more functions, and product structures are increasingly miniaturized. These electronic products have demanded high quality, miniaturization, and high integration for printed wiring boards.

At present, before a PCB product with a buried resistor is etched with the resistor, a film pressing process needs to be carried out firstly, the product is exposed and developed after the film pressing process, and then etching is carried out.

SUMMERY OF THE UTILITY MODEL

The utility model discloses problem to prior art provides a processing structure who promotes resistance value homogeneity behind the etching, and the PCB product resistance value that processes out is even.

In order to solve the technical problem, the utility model discloses a following technical scheme:

the utility model provides a promote processing structure of etching back resistance value homogeneity, the package rubbing board body, be provided with a plurality of PCB modules on the plate body, be provided with between per two adjacent PCB modules and all be provided with the clearance of cutting, all be provided with the resistance layer on the PCB module, be provided with dry rete on the plate body, dry rete is located the top of PCB module.

Wherein, all be provided with two resistances in the PCB module, two resistances parallel arrangement each other, two resistances all are located the border department of PCB module.

The PCB modules are distributed in an array.

Wherein, be provided with a plurality of first branch on cutting the clearance and cut the mark, first branch is cut the mark and is shown including horizontal mark line and vertical mark line, horizontal mark line with vertical mark line mutually perpendicular.

The plurality of first slitting marks are distributed in an array, the two ends of the plate body are provided with second slitting marks, and the first slitting marks and the second slitting marks are located on the same straight line respectively.

Wherein, the border department of plate body is provided with a plurality of pressfitting counterpoint marks.

The utility model has the advantages that: the utility model discloses novel structure, design benefit set up a plurality of PCB modules simultaneously on the plate body, when carrying out the press mold, to a plurality of PCB module press mold simultaneously, make each PCB module press mold effect in the plate body even. And after exposure and development, pressing the developed product in a pressure balance mode of a rapid press, and etching after a dry film is flattened, so that the uniformity of the line width of the resistor is improved, the uniformity of the resistance value in the PCB module is improved, and after the processing technology is finished, the PCB module is cut along the cutting gap due to the fact that the cutting gap is formed.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is an enlarged view of a portion a in fig. 1.

The reference numerals are respectively: 1. the plate body, 2, PCB module, 3, cut the clearance, 4, resistance, 5, first cutting mark, 6, horizontal mark line, 7, vertical mark line, 8, second are cut and are marked, 9, pressfitting counterpoint mark.

Detailed Description

In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention will be described in detail with reference to the accompanying drawings.

The utility model provides a promote processing structure of etching back resistance value homogeneity, as shown in fig. 1-2, the package rubbing board body 1, be provided with a plurality of PCB modules 2 on the plate body 1, be provided with between per two adjacent PCB modules 2 and all be provided with between the clearance 3 of cutting, all be provided with resistive layer (not shown in the figure) on the PCB module 2, be provided with dry rete (not shown in the figure) on the plate body 1, dry rete is located the top of PCB module 2. Specifically, set up a plurality of PCB modules 2 simultaneously on the plate body 1, when carrying out the press mold, press mold to a plurality of PCB modules 2 simultaneously for each 2 press mold effects of PCB module in the plate body 1 are even. And after exposure and development, pressing the developed product in a pressure balance mode of a rapid press, and etching after a dry film is flattened, so that the line width uniformity of the resistors 4 is improved, the uniformity of the value of the resistors 4 in the PCB module 2 is improved, and after the processing technology is finished, the cutting gap 3 is arranged, and the products can be cut along the cutting gap 3.

This example promote processing structure of resistance value homogeneity after etching, all be provided with two resistance 4 on the PCB module 2, two resistance 4 parallel arrangement each other, two resistance 4 all are located the border department of PCB module 2. Specifically, the resistor 4 is arranged at a uniform position, so that the embedded resistor can be conveniently windowed subsequently.

In the processing structure for improving uniformity of resistance after etching described in this embodiment, the PCB modules 2 are distributed in an array. Specifically, the arrangement greatly improves the slitting convenience.

This example promote processing structure of resistance value homogeneity after etching, it marks 5 to cut to be provided with a plurality of first divisions on clearance 3, first division marks including horizontal mark line 6 and vertical mark line 7, horizontal mark line 6 with vertical mark line 7 mutually perpendicular. Specifically, set up first mark 5 of cutting and make follow-up can follow horizontal mark line 6 and vertical mark line 7 of cutting when cutting, each PCB module 2's after cutting uniformity is good.

This example promote processing structure of etching back resistance value homogeneity, a plurality of first branch marks 5 are the permutation and distribute, the both ends of plate body 1 all are provided with second branch and cut mark 8, first respectively mark with the second is cut and is marked 8 and be located collinear. Specifically, when above-mentioned setting makes PCB module 2 cut, can follow the second from both ends and mark respectively and cut, it is more convenient.

In the processing structure for improving uniformity of resistance after etching described in this embodiment, the edge of the plate body 1 is provided with a plurality of pressing alignment marks 9. Specifically, after exposure development, the developed product is pressed in a pressure balance mode of the rapid press, and pressing alignment marks 9 facilitate the rapid press to identify and position the plate body 1.

The above description is only for the preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention is disclosed in the preferred embodiment, it is not limited to the above description, and any person skilled in the art can make some changes or modifications to equivalent embodiments without departing from the scope of the present invention, but all the technical solutions of the present invention are within the scope of the present invention.

Claims

1. The utility model provides a promote processing structure of etching back resistance value homogeneity which characterized in that: the PCB comprises a plate body, be provided with a plurality of PCB modules on the plate body, be provided with between per two adjacent PCB modules and all be provided with and cut the clearance, all be provided with the resistance layer on the PCB module, be provided with dry rete on the plate body, dry rete is located the top of PCB module.

2. The processing structure of claim 1, wherein the resistance value uniformity after etching is improved by: all be provided with two resistances on the PCB module, two resistances parallel arrangement each other, two resistances all are located the border department of PCB module.

3. The processing structure of claim 1, wherein the resistance value uniformity after etching is improved by: the PCB modules are distributed in an array.

4. The processing structure of claim 3, wherein the post-etch resistance uniformity is improved by: the cutting device is characterized in that a plurality of first cutting marks are arranged on the cutting gap, each first cutting mark comprises a transverse marking line and a longitudinal marking line, and the transverse marking lines are perpendicular to the longitudinal marking lines.

5. The processing structure of claim 4, wherein the resistance value uniformity after etching is improved by: the plurality of first slitting marks are distributed in an array, second slitting marks are arranged at two ends of the plate body, and the first slitting marks and the second slitting marks are located on the same straight line respectively.

6. The processing structure of claim 1, wherein the post-etch resistance uniformity is improved by: the border department of plate body is provided with a plurality of pressfitting counterpoint marks.