CN217387097U

CN217387097U - Semiconductor wafer's detection is with clearance processing apparatus before detection

Info

Publication number: CN217387097U
Application number: CN202221206121.8U
Authority: CN
Inventors: 李晓轩
Original assignee: Suzhou Zaotianfu Intelligent Technology Co ltd
Current assignee: Suzhou Zaotianfu Intelligent Technology Co ltd
Priority date: 2022-05-18
Filing date: 2022-05-18
Publication date: 2022-09-06
Anticipated expiration: 2032-05-18

Abstract

The utility model discloses a cleaning treatment device before detection for detecting semiconductor wafers, which relates to the technical field of semiconductor wafer detection, and comprises a cleaning frame, wherein the upper surface of the cleaning frame is fixedly connected with a U-shaped frame, the lower part of the inner side surface of the U-shaped iron frame is fixedly connected with a metal mesh, two opposite side surfaces of the U-shaped iron frame are both fixedly connected with side plates, the upper surface of each side plate is fixedly connected with a lifting component, the lower surface of the upper plate of the U-shaped frame is fixedly connected with a vertical plate, the lower end of each vertical plate is fixedly connected with a drying frame, and the inner side surface of the drying frame is fixedly provided with a plurality of electric heating rods. The efficiency of cleaning the semiconductor wafer is improved.

Description

Semiconductor wafer's detection is with clearance processing apparatus before detection

Technical Field

The utility model relates to a semiconductor wafer detects technical field, specifically is a semiconductor wafer's detection is with clearance processing apparatus before detecting.

Background

The semiconductor wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the semiconductor wafer is silicon, and with the rapid development of technology, the application of the semiconductor wafer is widely divided, and the semiconductor wafer is used in the fields of mobile phones, computers and high-technology products, and the semiconductor wafer gradually develops towards smaller and smaller.

The semiconductor wafer needs to be detected after production, and needs to be cleaned before the detection, and the existing cleaning device is difficult to dry the semiconductor wafer immediately after the cleaning of the semiconductor wafer, so that the cleaning efficiency of the semiconductor wafer is reduced.

Therefore, we propose a cleaning processing device before inspection for inspecting semiconductor wafer to solve the above problems.

SUMMERY OF THE UTILITY MODEL

1. Problems to be solved

To the problem that exists among the prior art, the utility model aims to provide a semiconductor wafer's detection is with clearance processing apparatus before detecting solves the problem that mentions among the above-mentioned background art.

Technical scheme

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides a semiconductor wafer's detection is with clearance processing apparatus before detection, is including wasing the frame, the last fixed surface of wasing the frame is connected with the U-shaped frame, returns the lower part fixedly connected with metal mesh of shape chase medial surface, returns the equal fixedly connected with curb plate of two relative sides of shape chase, the last fixed surface of curb plate is connected with the lifting unit, the lower fixed surface of U-shaped frame upper plate is connected with the riser, the dry frame of lower extreme fixedly connected with of riser, the medial surface fixed mounting of dry frame has a plurality of electric heat bars.

As a further aspect of the present invention: the lifting assembly comprises a sliding rod and a top plate, the sliding rod is fixedly connected to the upper surface of the side plate, penetrates through the upper plate of the U-shaped frame and is connected with the upper plate of the U-shaped frame in a sliding mode, and the upper end of the sliding rod is fixedly connected to the lower surface of the top plate.

As a further aspect of the present invention: and the lower surface of the drying frame is fixedly connected with a magnet ring.

As a further aspect of the present invention: the two side walls of the U-shaped frame are all penetrated with an inserted bar, and the inserted bars are connected with the side walls of the U-shaped frame in a sliding mode.

As a further aspect of the present invention: one end of the inserted bar is fixedly connected with a knob.

As a further aspect of the present invention: one side of the lower surface of the side plate is fixedly connected with a side plate, and the side plate is provided with a jack matched with the inserted link.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in, wash the completion back, the slide bar that upwards slides for return shape chase rebound, and make the upper surface of returning shape chase adsorb on the magnet ring, the heat that the electrical bar produced this moment just gets into back in the shape chase, thereby carry out quick drying to semiconductor wafer, thereby conveniently dry at once after wasing semiconductor wafer, and then make things convenient for semiconductor wafer to carry out the detection that connects the lining fast, improved the efficiency of semiconductor wafer clearance.

2. After the drying is finished, the clip iron frame slides downwards to enable the inserting rod to be aligned to the jack, then the inserting rod is inserted into the jack, the clip iron frame can be fixed, a user can take down a semiconductor wafer conveniently, the semiconductor wafer can be cleaned and taken down conveniently, the efficiency of cleaning the semiconductor wafer is improved, and the inserting rod can be cleaned next time after being pulled out of the jack.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of the structure of FIG. 1;

fig. 3 is a schematic structural diagram of the interior of the middle drying frame of the present invention.

In the figure: 1. cleaning the frame; 2. a U-shaped frame; 3. a slide bar; 4. a side plate; 5. a clip-shaped iron frame; 6. a metal mesh; 7. drying the frame; 8. a vertical plate; 9. a top plate; 10. inserting a rod; 11. a knob; 12. a side plate; 13. a jack; 14. an electric heating rod; 15. a magnetic ring.

Detailed Description

Please refer to fig. 1-3, in the embodiment of the present invention, a semiconductor wafer detection is with clearance processing apparatus before detection, including wasing frame 1, wash frame 1's last fixed surface is connected with U-shaped frame 2, returns lower part fixedly connected with metal mesh 6 of 5 medial surfaces of shape chase, returns two equal fixedly connected with curb plates 4 of the relative side of shape chase 5, the last fixed surface of curb plate 4 is connected with lifting unit, the lower fixed surface of 2 upper plates of U-shaped frame is connected with riser 8, the dry frame 7 of lower extreme fixedly connected with of riser 8, the medial surface fixed mounting of dry frame 7 has a plurality of electric heat bars 14.

Referring to fig. 1, the lifting assembly includes a sliding rod 3 and a top plate 9, the sliding rod 3 is fixedly connected to the upper surfaces of the two side plates 4, the sliding rod 3 penetrates through the upper plate of the U-shaped frame 2, the sliding rod 3 is slidably connected to the upper plate of the U-shaped frame 2, and the upper end of the sliding rod 3 is fixedly connected to the lower surface of the top plate 9.

Referring to fig. 3, a magnet ring 15 for adsorbing the clip 5 is fixedly connected to the lower surface of the drying frame 7.

The purpose is as follows: when the device is used for cleaning a semiconductor wafer, firstly, the electric heating rod 14 is started, a proper amount of cleaning acid liquor for cleaning the semiconductor wafer is added into the cleaning frame 1, then the semiconductor wafer is placed on the metal net 6, the sliding rod 3 is downwards slid, the clip-shaped iron frame 5 enters the cleaning frame 1, and the clip-shaped iron frame 5 is immersed in the cleaning acid liquor, so that the cleaning acid liquor can dissolve stains on the semiconductor wafer;

after the cleaning is finished, the sliding rod 3 slides upwards to enable the clip frame 5 to move upwards, the upper surface of the clip frame 5 is adsorbed on the magnet ring 15, the heat generated by the electric heating rod 14 enters the clip frame 5 at the moment, and therefore the semiconductor wafer is dried quickly, the semiconductor wafer is dried immediately after being cleaned conveniently, the semiconductor wafer is detected after being connected quickly, and the efficiency of cleaning the semiconductor wafer is improved.

Referring to fig. 1 and 2, two side walls of the U-shaped frame 2 are respectively penetrated with an insertion rod 10, and the insertion rods 10 are slidably connected with the side walls of the U-shaped frame 2.

Referring to fig. 2, a knob 11 for facilitating the insertion and removal of the plunger 10 is fixedly connected to one end of the plunger 10.

Referring to fig. 2, one side of the lower surface of the side plate 4 is fixedly connected with a side plate 12, and the side plate 12 is provided with an insertion hole 13 matched with the insertion rod 10.

After the drying is finished, the clip iron frame 5 slides downwards, so that the inserting rod 10 is aligned to the jack 13, then the inserting rod 10 is inserted into the jack 13, the clip iron frame 5 can be fixed, a user can take down a semiconductor wafer conveniently, the semiconductor wafer can be cleaned and taken down conveniently, the efficiency of cleaning the semiconductor wafer is improved, and the inserting rod 10 can be cleaned next time after being pulled out from the jack 13.

The utility model discloses a theory of operation does: when the device is used for cleaning a semiconductor wafer, firstly, the electric heating rod 14 is started, a proper amount of cleaning acid liquor for cleaning the semiconductor wafer is added into the cleaning frame 1, then the semiconductor wafer is placed on the metal mesh 6, the slide rod 3 is slid downwards, the clip-shaped iron frame 5 enters the cleaning frame 1, the clip-shaped iron frame 5 is immersed in the cleaning acid liquor, the cleaning acid liquor can dissolve stains on the semiconductor wafer, after the cleaning is finished, the slide rod 3 is slid upwards, the clip-shaped iron frame 5 is moved upwards, the upper surface of the clip-shaped iron frame 5 is adsorbed on the magnet ring 15, heat generated by the electric heating rod 14 enters the clip-shaped iron frame 5, and therefore the semiconductor wafer is dried quickly, the semiconductor wafer is dried immediately after being cleaned, and then the semiconductor wafer is detected next to next interior quickly, the efficiency of cleaning the semiconductor wafer is improved;

The utility model discloses well electric bar 14 is prior art's equipment commonly used, and the model of adoption etc. all can be customized according to the in-service use demand, just the utility model provides a power supply interface of consumer passes through switch (not drawn in the picture) and wire (not drawn in the picture) connects power supply system to the realization is to its control, and the circuit and the control that wherein relate to are prior art, and for current field technical known, do not carry out too much the repeated description here.

The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.

Claims

1. The utility model provides a semiconductor wafer's detection is with clearance processing apparatus before detection, including wasing frame (1), a serial communication port, the last fixed surface who washs frame (1) is connected with U-shaped frame (2), return lower part fixedly connected with metal mesh (6) of shape iron frame (5) medial surface, return equal fixedly connected with curb plate (4) of two relative sides of shape iron frame (5), the last fixed surface of curb plate (4) is connected with lifting unit, the lower fixed surface of U-shaped frame (2) upper plate is connected with riser (8), the dry frame (7) of lower extreme fixedly connected with of riser (8), the medial surface fixed mounting of dry frame (7) has a plurality of electric heat stick (14).

2. The device for cleaning and processing the semiconductor wafer before detection as recited in claim 1, wherein the lifting assembly comprises a sliding rod (3) and a top plate (9), the sliding rod (3) is fixedly connected to the upper surfaces of the two side plates (4), the sliding rod (3) penetrates through the upper plate of the U-shaped frame (2), the sliding rod (3) is slidably connected to the upper plate of the U-shaped frame (2), and the upper end of the sliding rod (3) is fixedly connected to the lower surface of the top plate (9).

3. The pre-inspection cleaning apparatus for inspecting a semiconductor wafer according to claim 1, wherein a magnet ring (15) is fixedly attached to a lower surface of the drying frame (7).

4. The pre-inspection cleaning apparatus for inspecting semiconductor wafers as claimed in claim 1, wherein the two sidewalls of the U-shaped frame (2) are respectively penetrated with an insertion rod (10), and the insertion rods (10) are slidably connected with the sidewalls of the U-shaped frame (2).

5. The pre-inspection cleaning apparatus for inspecting semiconductor wafers as claimed in claim 4, wherein a knob (11) is fixedly connected to one end of the insertion rod (10).

6. The pre-detection cleaning device for detecting the semiconductor wafer as claimed in claim 1, wherein one side of the lower surface of the side plate (4) is fixedly connected with an edge plate (12), and the edge plate (12) is provided with a jack (13) matched with the inserted link (10).