CN217386806U

CN217386806U - Wafer resistor convenient to location installation

Info

Publication number: CN217386806U
Application number: CN202220341485.0U
Authority: CN
Inventors: 傅惠维
Original assignee: Shenzhen Malingmouse Electronic Technology Co ltd
Current assignee: Shenzhen Malingmouse Electronic Technology Co ltd
Priority date: 2022-02-21
Filing date: 2022-02-21
Publication date: 2022-09-06
Anticipated expiration: 2032-02-21

Abstract

The utility model discloses a wafer resistance convenient to location installation belongs to wafer resistance field, including wafer resistance body, the outside parcel of wafer resistance body has positioner, positioner includes location box, constriction structure, closed clamp plate, places recess and glue filling chamber. A wafer resistance convenient to location installation, when wafer resistance body installation, fill glue in the glue filling chamber that sets up between from glue filling opening department toward location box and the circuit board, the firm performance that the room was filled to the mode that adopts glue to fill glue can strengthen the glue adhesion, improve the phenomenon that traditional direct glue dripping mode brought glue dispersion and glue and be stained with the hand, make things convenient for after the not hard up closed clamp plate to take out wafer resistance body from the recess of placing of location box, thereby make things convenient for the dismouting work of follow-up wafer resistance body, alleviate the phenomenon that traditional direct glue dripping location brought the dismouting difficulty.

Description

Wafer resistor convenient to location installation

Technical Field

The utility model relates to a wafer resistance field, in particular to wafer resistance convenient to location installation.

Background

The thick film chip resistor is also called as a conventional thick film chip fixed resistor or is also called as a chip resistor for short, because the thick film chip resistor has the advantages of small volume, light weight, stable electrical property, high frequency characteristic and the like, the thick film chip resistor is widely applied to the aspects of medical equipment, precision measuring instruments, electronic communication, converters and the like, is popular with wide-spread users, and certainly, in the process, a large number of beginners can use the thick film chip; at present, the chip resistor is generally installed by adopting a glue sticking mode, but the undried glue after glue dripping has a certain flowing phenomenon, the glue dripping dispersion can generate the trouble of firm and poor sticking and glue staining, and the chip resistor can bring certain inconvenience for subsequent dismounting once being fixed.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a wafer resistor convenient for location installation, which can effectively solve the problem of the prior art that the glue does not flow in the glue dripping process, and the glue dripping dispersion can cause the trouble of sticking firmly and poorly and touching with the glue, and the wafer resistor can bring certain inconvenience to the follow-up disassembly and assembly once fixed.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a wafer resistance convenient to location installation, includes wafer resistance body, the outside parcel of wafer resistance body has positioner, positioner includes location box, constriction structure, closed clamp plate, places recess and glue and fills the room, the both sides surface edge of location box all is provided with constriction structure, a side port department movable mounting of location box has closed clamp plate, the inside of location box has been seted up and has been placed the recess, the below that the inside of location box is located and places the recess is provided with glue and fills the room.

As a further improvement of the scheme, one end of the positioning box is clamped with a fixing clamp, a glue injection opening is formed in the surface of one side of the positioning box, and a sealing clamping block is fixedly mounted on the surface of the inner side of the fixing clamp.

As a further improvement of the above scheme, the surface of the wafer resistor body is provided with resistor pins, two penetrating openings are formed in the positions, located at the resistor pins, of the upper surface of the closed pressing plate, and two penetrating openings are formed in the upper end surface, located at the closed pressing plate, of the penetrating openings.

As a further improvement of the scheme, the contraction structure comprises a spring box, a return spring and a telescopic support arm, the telescopic support arm is movably mounted inside the spring box, the return spring is arranged inside the spring box, one end of the return spring is fixedly connected with the inner wall of the spring box, and the other end of the return spring is fixedly connected with the end face of the telescopic support arm.

As a further improvement of the scheme, one side surface of the spring box is fixedly connected with the surface of the positioning box, the closing pressing plate moves at one side port of the positioning box through the telescopic support arm and the spring box, and one side surface of the closing pressing plate, which is close to the wafer resistor body, is attached to the end face of the wafer resistor body.

As a further improvement of the scheme, the sealing fixture block is matched with a glue injection opening of the positioning box, and the wafer resistor body is matched with the placing groove of the positioning box.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses in, positioner through setting up, when the installation of wafer resistance body, fill glue in the glue filling chamber that sets up between locating box and the circuit board from the glue filling mouth, the firm performance that the room was filled to the mode that adopts glue to fill glue can strengthen the glue adhesion, improve the phenomenon that the direct glue dripping mode of tradition brought glue dispersion and glue to be stained with, through the closed clamp plate that sets up, make things convenient for after the not hard up closed clamp plate to take out the wafer resistance body from the recess of placing of locating box, thereby make things convenient for the dismouting work of follow-up wafer resistance body, alleviate the phenomenon that the direct glue dripping location of tradition brought the dismouting difficulty.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall split structure of the present invention;

fig. 3 is a bottom view of the positioning box of the present invention;

fig. 4 is a sectional view of the spring case of the present invention.

In the figure: 1. a chip resistor body; 2. a positioning device; 3. a resistor pin; 4. a positioning box; 5. a contracted configuration; 6. closing the pressure plate; 7. a fixing clip; 8. sealing the clamping block; 9. placing a groove; 10. penetrating out of the gap; 11. a glue filling chamber; 12. injecting glue; 13. a spring case; 14. a return spring; 15. a telescopic support arm.

Detailed Description

To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are part of the embodiments of the present invention, rather than all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

As shown in FIGS. 1-4, a chip resistor convenient for positioning and installation comprises a chip resistor body 1, a positioning device 2 is wrapped outside the chip resistor body 1, the positioning device 2 comprises a positioning box 4, a contraction structure 5, a closed pressing plate 6, a placing groove 9 and a glue filling chamber 11, the contraction structure 5 is arranged on the edge of the surface of each of two sides of the positioning box 4, the closed pressing plate 6 is movably installed at one side port of the positioning box 4, the placing groove 9 is arranged inside the positioning box 4, the glue filling chamber 11 is arranged inside the positioning box 4 below the placing groove 9, when the wafer resistor body 1 is installed, glue is filled into the glue filling chamber 11 arranged between the positioning box 4 and the circuit board from the glue filling opening 12, the firmness of glue adhesion can be enhanced by adopting a mode of filling the glue filling chamber 11 with glue, and the phenomena of glue dispersion and glue contamination caused by a traditional direct glue dripping mode are improved.

One end card of location box 4 is equipped with fixation clamp 7, and glue filling opening 12 has been seted up to one side surface of location box 4, and the inboard fixed surface of fixation clamp 7 installs sealed fixture block 8.

In this embodiment, the surface of wafer resistor body 1 is provided with resistance pin 3, and the upper surface of closed clamp plate 6 is located resistance pin 3 and has been seted up and has worn out opening 10, and the up end that wears out opening 10 and is located closed clamp plate 6 has been seted up two, conveniently takes out wafer resistor body 1 from the recess 9 of placing of locating box 4 behind the not hard up closed clamp plate 6 to make things convenient for follow-up wafer resistor body 1's dismouting work, alleviate the phenomenon that traditional direct glue dripping location brought the dismouting difficulty.

The contraction structure 5 comprises a spring box 13, a return spring 14 and a telescopic support arm 15, the telescopic support arm 15 is movably mounted inside the spring box 13, the return spring 14 is arranged inside the spring box 13, one end of the return spring 14 is fixedly connected with the inner wall of the spring box 13, and the other end of the return spring 14 is fixedly connected with the end face of the telescopic support arm 15.

One side surface of the spring box 13 is fixedly connected with the surface of the positioning box 4, the closing pressure plate 6 moves at one side port of the positioning box 4 through the telescopic support arm 15 and the spring box 13, and one side surface of the closing pressure plate 6 close to the wafer resistor body 1 is attached to the end face of the wafer resistor body 1.

The sealing fixture block 8 is matched with a glue filling opening 12 of the positioning box 4, and the wafer resistor body 1 is matched with the placing groove 9 of the positioning box 4.

It should be noted that the utility model relates to a wafer resistor convenient for positioning and installation, before using, the wafer resistor body 1 is placed into the placing groove 9 of the positioning box 4, when the wafer resistor body 1 is installed, the wafer resistor body 1 is placed at a specified position on the circuit board through the positioning box 4, then glue is filled into the glue filling chamber 11 arranged between the positioning box 4 and the circuit board from the glue filling opening 12, finally, the sealing fixture block 8 is embedded into the glue filling opening 12 of the positioning box 4 to complete closing, the glue filling chamber 11 is filled with glue to enhance the firmness of glue adhesion, the phenomena of glue dispersion and glue contamination caused by the traditional direct glue dripping mode are improved, in the using process, the closing pressing plate 6 is pulled outwards to enlarge the distance between the closing pressing plate 6 and the positioning box 4, the wafer resistor body 1 is convenient to be taken out from the placing groove 9 of the positioning box 4, thereby facilitating the subsequent disassembly and assembly work of the wafer resistor body 1 and relieving the phenomenon of difficult disassembly and assembly caused by the traditional direct glue dripping positioning.

The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. Although embodiments of the present invention have been shown and described, it is not intended to limit the scope of the invention, and all equivalent structures or equivalent flow changes made by using the contents of the specification and drawings or applied directly or indirectly to other related technical fields are also encompassed by the scope of the present invention.

Claims

1. A wafer resistor convenient to location installation which characterized in that: including wafer resistance body (1), the outside parcel of wafer resistance body (1) has positioner (2), positioner (2) are including location box (4), constriction structure (5), closed clamp plate (6), place recess (9) and glue and fill room (11), the both sides surface edge of location box (4) all is provided with constriction structure (5), a side port department movable mounting of location box (4) has closed clamp plate (6), the inside of location box (4) has been seted up and has been placed recess (9), the inside of location box (4) is located the below of placing recess (9) and is provided with glue and fills room (11).

2. A die resistor for facilitating location mounting as recited in claim 1, wherein: one end card of location box (4) is equipped with fixation clamp (7), glue filling opening (12) have been seted up to one side surface of location box (4), the inboard fixed surface of fixation clamp (7) installs sealed fixture block (8).

3. A die resistor for facilitating location mounting as recited in claim 2, wherein: the chip resistor is characterized in that resistor pins (3) are arranged on the surface of the chip resistor body (1), penetrating openings (10) are formed in the positions, located on the resistor pins (3), of the upper surface of the closed pressing plate (6), and two penetrating openings (10) are formed in the upper end face, located on the closed pressing plate (6).

4. A die resistor for facilitating location mounting as recited in claim 3, wherein: the retractable structure (5) comprises a spring box (13), a reset spring (14) and a retractable support arm (15), the retractable support arm (15) is movably mounted inside the spring box (13), the reset spring (14) is arranged inside the spring box (13), one end of the reset spring (14) is fixedly connected with the inner wall of the spring box (13), and the other end of the reset spring (14) is fixedly connected with the end face of the retractable support arm (15).

5. A chip resistor for facilitating positioning and installation according to claim 4, wherein: the surface of one side of spring box (13) is connected with the fixed surface of location box (4), closed clamp plate (6) are through flexible support arm (15) and spring box (13) at the side port department of location box (4) removal, closed clamp plate (6) are close to the terminal surface laminating of one side surface and wafer resistance body (1) of wafer resistance body (1).

6. A chip resistor for facilitating positioning and installation according to claim 5, wherein: the sealing fixture block (8) is matched with a glue injection port (12) of the positioning box (4), and the wafer resistor body (1) is matched with the placing groove (9) of the positioning box (4).