CN217363400U - Circuit board assembly and electronic device - Google Patents
Circuit board assembly and electronic device Download PDFInfo
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- CN217363400U CN217363400U CN202221295987.0U CN202221295987U CN217363400U CN 217363400 U CN217363400 U CN 217363400U CN 202221295987 U CN202221295987 U CN 202221295987U CN 217363400 U CN217363400 U CN 217363400U
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Abstract
The application discloses circuit board assembly and electronic equipment, circuit board assembly includes: a main circuit board; the heightening part is arranged on the main circuit board, the heightening part and the main circuit board are enclosed to form a containing cavity, and the containing cavity is used for containing components; the connector is arranged on the heightening piece and is electrically connected with the main circuit board through the heightening piece; and the flexible circuit board is electrically connected with the connector. The layout area of the main circuit board is effectively increased, the utilization rate of the main circuit board is improved, and on the premise that the layout area of components of the circuit board assembly is certain, the length of the main circuit board can be correspondingly shortened, so that a certain space is released for increasing the battery capacity of the electronic equipment or upgrading the configuration of the electronic equipment and the like, and the smart design of the electronic equipment is improved.
Description
Technical Field
The application relates to the technical field of terminals, in particular to a circuit board assembly and electronic equipment.
Background
At present, the BTB connector 10' has the advantages of high performance, high precision, small volume, and the like, and is widely applied to signal transmission between electronic components of a mobile phone.
Fig. 1 shows the most common function of the BTB connector 10 ', specifically, the female socket of the BTB connector 10 ' is directly attached to the main board 30 ', when the FPC20 ' of the device is longer, the BTB connector 10 ' needs to be located further inside the main board 30 ', and a part of the FPC20 ' extends to the area of the main board 30 ', which wastes a part of the board layout area of the main board 30 ' (as shown in the area a in fig. 1). Also, when the device height around the BTB connector 10 ' is higher than the BTB connector 10 ', the BTB connector 10 ' is difficult to disassemble and assemble.
Fig. 2 shows a design of a conventional BTB connector 10 'with a raised body 40', which can solve the problems of placement of a long FPC20 'and disassembly and assembly of the BTB connector 10', but the raised body 40 'needs to occupy a part of the area of the main board 30', resulting in a reduction in the board layout area of other devices.
SUMMERY OF THE UTILITY MODEL
An object of the embodiments of the present application is to provide a circuit board assembly and an electronic device, which can solve the problem that the BTB connector is difficult to disassemble and assemble and the board layout area of the main board is reduced in the related art.
In order to solve the above problems, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a circuit board assembly, which can be used for mounting components, and includes:
a main circuit board;
the heightening part is arranged on the main circuit board, the heightening part and the main circuit board are enclosed to form a containing cavity, and the containing cavity can be used for containing components;
the connector is arranged on the heightening piece and is electrically connected with the main circuit board through the heightening piece;
and the flexible circuit board is electrically connected with the connector.
In a second aspect, embodiments of the present application further provide an electronic device including the circuit board assembly as in the above first aspect.
In the embodiment of the present application, the circuit board assembly includes a main circuit board, a padding member, a connector, and a flexible circuit board, and specifically, the flexible circuit board is electrically connected to the connector, and the connector can be electrically connected to the main circuit board through the padding member, so that the flexible circuit board is electrically connected to the main circuit board through the connector and the padding member, thereby implementing signal transmission between electronic devices.
The bed hedgehopping piece sets up on main circuit board, and the connector setting is on the bed hedgehopping piece, and that is to say, carries out the bed hedgehopping design with the connector to can effectively solve among the relevant art, when flexible circuit board's length is longer, need be close to inside the mainboard with the BTB connector, make partial flexible circuit board extend to the mainboard region, and then lead to the extravagant problem of partial main circuit board cloth board area. Thereby effectively increasing the board distribution area of the main circuit board.
Moreover, the connector is designed to be raised, so that the connector can be conveniently detached and assembled, and the assembly efficiency of the circuit board assembly is improved.
The bed hedgehopping spare encloses with main circuit board and closes to form and holds the chamber, it can hold components and parts to hold the chamber, that is to say, the chamber that holds that can hold partial components and parts is formed between one side that will bed hedgehopping spare is close to the part that main circuit board is close to the bed hedgehopping spare and main circuit board, therefore, can put partial components and parts on the main circuit board in holding the intracavity, effectively increase the fabric board area of main circuit board, improve the utilization ratio of main circuit board, and can also effectively solve among the correlation technique, only utilize the bed hedgehopping main part to carry out the bed hedgehopping to the BTB connector, lead to the bed hedgehopping main part to occupy partial mainboard area, cause the problem of mainboard fabric board area reduction. Specifically, compare in the correlation technique only utilize the bed hedgehopping main part to carry out the bed hedgehopping to the BTB connector, this application carries out putting of partial components and parts through holding the chamber, can increase the cloth board area of main circuit board about 30mm 2 To 40mm 2 。
In addition, this application carries out putting of partial components and parts through holding the chamber, under the certain prerequisite of the components and parts floorslab area of circuit board assembly, can correspondingly shorten the length of main circuit board to release certain space and be used for the increase of electronic equipment battery capacity or the upgrading etc. of electronic equipment configuration, improve electronic equipment's extremely design.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 shows one of the structural diagrams of a circuit board assembly in the related art;
FIG. 2 is a second schematic diagram of a circuit board assembly according to the related art;
fig. 3 shows a schematic structural diagram of a circuit board assembly of an embodiment of the present application.
Wherein, the correspondence between the reference numbers and the component names in fig. 1 to 3 is:
10 'BTB connector, 20' FPC, 30 'motherboard, 40' step up body;
100 circuit board assembly, 110 main circuit board, 120 elevating part, 121 elevating main body, 122 first supporting part, 123 second supporting part, 124 first circuit board patch, 125 second circuit board patch, 130 accommodating cavity, 140 connector, 150 flexible circuit board, 200 components.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein.
The electronic devices provided in the embodiments of the present application include, but are not limited to, electronic devices such as mobile phones, tablet computers, laptop computers, mobile computers, handheld game consoles, and the like.
The circuit board assembly 100 and the electronic device according to the embodiment of the present application will be further described with reference to the drawings.
Fig. 1 shows one of the structural schematic diagrams of a circuit board assembly in the related art. Fig. 2 shows a second schematic diagram of a circuit board assembly in the related art. Fig. 3 shows a schematic structural diagram of the circuit board assembly 100 of an embodiment of the present application.
As shown in fig. 3, a circuit board assembly 100 provided in the embodiment of the present application can be used for mounting a component 200, and the circuit board assembly 100 includes a main circuit board 110, a pad-up member 120, a connector 140, and a flexible circuit board 150, where the pad-up member 120 is disposed on the main circuit board 110, the pad-up member 120 and the main circuit board 110 enclose to form a receiving cavity 130, the receiving cavity 130 is used for receiving a component 200160, the connector 140 is disposed on the pad-up member 120, and the flexible circuit board 150 is electrically connected to the connector 140.
In the embodiment of the present application, the circuit board assembly 100 includes a main circuit board 110, a step-up member 120, a connector 140, and a flexible circuit board 150, and specifically, the flexible circuit board 150 is electrically connected to the connector 140, and the connector 140 is electrically connected to the main circuit board 110 through the step-up member 120, thereby achieving signal transmission between electronic devices.
The step-up member 120 is disposed on the main circuit board 110, and the connector 140 is disposed on the step-up member 120, that is, the connector 140 is designed to be step-up, so that it is possible to effectively solve the problem in the related art (as shown in fig. 1) that when the length of the flexible circuit board 150 is long, the BTB connector 10 'is required'
Near the inside of the main board 30 ', a portion of the flexible circuit board 150 extends to the area of the main board 30 ', which results in a waste of board layout area of the main board 30 '. Thereby effectively increasing the board layout area of the main circuit board 110, for example, the area of the area a shown in fig. 1 is smaller.
Moreover, the connector 140 is designed to be raised, which facilitates the disassembly and assembly of the connector 140, thereby improving the assembly efficiency of the circuit board assembly 100.
The blocking-up piece 120 and the main circuit board 110 are enclosed to form the accommodating cavity 130, the accommodating cavity 130 can accommodate the component 200, that is, the accommodating cavity 130 capable of accommodating part of the component 200 is formed between one side of the blocking-up piece 120 close to the main circuit board 110 and the part of the main circuit board 110 close to the blocking-up piece 120, therefore, part of the component 200 on the main circuit board 110 can be placed in the accommodating cavity 130, the board distribution area of the main circuit board 110 is effectively increased, the utilization rate of the main circuit board 110 is improved, and the problem in the related art (as shown in fig. 2) can be effectively solved, only the blocking-up body 40 ' is utilized to block up the BTB connector 10 ', the blocking-up body 40 ' occupies part of the area of the main board 30 ', and the problem of reducing the board distribution area of the main board 30 ' is caused. Specifically, compared with the related art that only the raising main body 40 'is used for raising the BTB connector 10', the arrangement of the partial components 200 in the accommodating cavity 130 can increase the board layout area of the main circuit board 110 by about 30mm 2 To 40mm 2 。
In addition, partial components 200 are placed through the accommodating cavity 130, and on the premise that the board layout area of the components 200 is constant, the length of the main circuit board 110 can be correspondingly shortened, so that a certain space is released for increasing the battery capacity of the electronic equipment or upgrading the configuration of the electronic equipment, and the ultimate design of the electronic equipment is improved.
In some embodiments, as shown in fig. 3, the receiving cavity 130 penetrates the elevation member 120 in the extending direction of the elevation member 120.
In these embodiments, along the extending direction of the padding member 120, two sides of the padding member 120 are respectively provided with an opening, and the openings are communicated with the accommodating cavity 130, so that the accommodating cavity 130 can penetrate through the padding member 120 along the extending direction of the padding member, thereby further reducing the contact area between the padding member 120 and the main circuit board 110, further increasing the board distribution area of the main circuit board 110, and improving the utilization rate of the main circuit board 110.
In addition, by making the accommodating cavity 130 penetrate through the heightening element 120, the placing space of the accommodating cavity 130 is also increased, and on the premise that the board layout area of the component 200 is fixed, the length of the main circuit board 110 can be further shortened, so that a certain space is released for increasing the battery capacity of the electronic equipment or upgrading the configuration of the electronic equipment, and the ultimate design of the electronic equipment is improved.
In some embodiments, as shown in fig. 3, the raising member 120 includes a raising main body 121, a first supporting portion 122 and a second supporting portion 123, wherein the connector 140 is provided on the raising main body 121, the first supporting portion 122 is connected to the raising main body 121, the second supporting portion 123 is disposed opposite to the first supporting portion 122, and the raising member 120 is provided on the main circuit board 110 through the first supporting portion 122 and the second supporting portion 123.
In these embodiments, the elevating member 120 includes an elevating main body 121, a first supporting part 122 and a second supporting part 123, and particularly, the connector 140 is disposed on the elevating main body 121, thereby implementing an elevating design for the connector 140, increasing a layout area of the main circuit board 110, and facilitating assembly and disassembly of the connector 140.
The first and second supporting parts 122 and 123 are connected to the step-up main body 121, and the first and second supporting parts 122 and 123 are disposed opposite to each other, and the step-up member 120 is disposed on the main circuit board 110 through the first and second supporting parts 122 and 123, thereby implementing a step-up design of the connector 140.
The first supporting portion 122 and the second supporting portion 123 are oppositely disposed, so that the stress of the padding member 120 can be uniform, the stability of the connector 140 is ensured, and the stability and reliability of the circuit board assembly 100 are improved.
It can be understood that the first supporting portion 122 and the second supporting portion 123 are respectively located at two sides of the accommodating cavity 130, that is, the first supporting portion 122 and the second supporting portion 123 together form two openings for communicating the accommodating cavity 130 with the outside, so that the board distribution area of the main circuit board 110 is further increased while the supporting effect of the padding member 120 on the connector 140 is ensured.
In some embodiments, the step-up member 120 includes: a first circuit board patch 124 disposed on a side of the body 121 facing the connector 140; the main circuit board 110 comprises at least one second circuit board patch 125, the second circuit board patch 125 is arranged on one side of the main circuit board 110 facing the heightening member 120, and the first circuit board patch 124 is electrically connected with any one second circuit board patch 125; the connector 140 is electrically connected to the main circuit board 110 through the first circuit board patch 124 and the second circuit board patch 125.
In these embodiments, to achieve electrical connection of the connector 140 to the main circuit board 110 through the step-up member 120, a first circuit board patch 124 is also provided in the step-up member 120, and at least one second circuit board patch 125 is provided on the main circuit board. The first circuit board patch 124 is disposed on a side of the elevating main body 121 facing the connector 140, and the connector 140 is electrically connected to the first circuit board patch 124. The second circuit board patch 125 is disposed on one side of the main circuit board 110 facing the heightening member 120, the second circuit board patch 125 is electrically connected with the main circuit board 110, the second circuit board patch 125 is attached to the first supporting portion 122 and/or the second supporting portion 123, and connecting wires are disposed in the heightening main body 121, the first supporting portion 122 and the second supporting portion 123, so that the first circuit board patch 124 can be electrically connected with the second circuit board patch 125 through the heightening main body 121, the first supporting portion 122 and the second supporting portion 123, and the connector 140 is electrically connected with the main circuit board 110 through the heightening member 120.
By arranging the first circuit board patch 124 in the heightening element 120 and arranging at least one second circuit board patch 125 on the main circuit board 110, on one hand, the connector 140 can be electrically connected with the main circuit board 110 through the heightening element 120, and on the other hand, because the first circuit board patch 124 and the second circuit board patch 125 occupy small space, no additional occupation is performed on the board arrangement area of the main circuit board 110.
In a specific embodiment, the heightening body 121 is of an integral structure with the first supporting part 122 and the second supporting part 123.
In this embodiment, the heightening element 120, the first supporting portion 122 and the second supporting portion 123 are an integral structure, and it can be understood that the integral structure has good mechanical properties, so that the connection strength between the heightening element 120 and the first supporting portion 122 and the second supporting portion 123 can be improved, the connector 140 can be effectively supported by the heightening element 120, and the use stability and reliability of the circuit board assembly 100 can be further improved.
In addition, the integrated structure facilitates the processing and production of the padding member 120, thereby improving the production efficiency of the padding member 120 and reducing the production cost of the padding member 120 and the circuit board assembly 100.
In some embodiments, the first supporting portion 122 includes at least two first sub-supporting members, and the at least two first sub-supporting members are disposed along the extending direction of the heightening body 121, and a distance is left between any two adjacent first sub-supporting members.
In this embodiment, the first supporting portion 122 is composed of at least two first sub-supporting members, and the plurality of first sub-supporting members are disposed along the extending direction of the heightening main body 121, that is, the plurality of first sub-supporting members are disposed at one side of the heightening main body 121 along the same direction. In addition, a distance is reserved between any two adjacent first sub-supporting members, so that the contact area between the padding member 120 and the main circuit board 110 is further reduced, the board distribution area of the main circuit board 110 is increased, and the utilization rate of the main circuit board 110 is improved.
In addition, the first supporting portion 122 is formed by at least two first sub-supporting members, and a distance is reserved between any two first sub-supporting members, so that the placing space of the accommodating cavity 130 is increased, and on the premise that the board distributing area of the component 200 is fixed, the length of the main circuit board 110 can be further shortened, so that a certain space is released for increasing the battery capacity of the electronic device or upgrading the configuration of the electronic device, and the ultimate design of the electronic device is improved.
In some embodiments, the second supporting portion 123 includes at least two second sub-supporting members, and the at least two second sub-supporting members are disposed along the extending direction of the heightening body 121, and a distance is left between any two adjacent second sub-supporting members.
In this embodiment, the second supporting portion 123 is composed of at least two second sub-supporting members, and a plurality of the second sub-supporting members are disposed along the extending direction of the heightening body 121, that is, the plurality of the second sub-supporting members are disposed at one side of the heightening body 121 along the same direction. Specifically, the plurality of second sub-supporting pieces are arranged on the side opposite to the plurality of first sub-supporting pieces. In addition, a distance is reserved between any two adjacent second sub-supporting members, so that the contact area between the padding member 120 and the main circuit board 110 is further reduced, the board distribution area of the main circuit board 110 is further increased, and the utilization rate of the main circuit board 110 is improved.
In addition, the second supporting portion 123 is configured to be composed of at least two second sub-supporting members, and a distance is reserved between any two second sub-supporting members, so that the placing space of the accommodating cavity 130 is increased, and on the premise that the board layout area of the component 200 is fixed, the length of the main circuit board 110 can be further shortened, so that a certain space is released for increasing the battery capacity of the electronic device or upgrading the configuration of the electronic device, and the ultimate design of the electronic device is improved.
In these embodiments, the number of the connectors 140 is multiple, each connector 140 is electrically connected to the main circuit board 110, and the heightening elements 120 and the connectors 140 are arranged in a one-to-one correspondence manner, that is, each connector 140 is designed to be heightened, so that the problem in the related art (as shown in fig. 1) that when the length of the flexible circuit board 150 is long, the BTB connector needs to be close to the inside of the main board, so that a part of the flexible circuit board 150 extends to the main board area, and thus the board layout area of a part of the main circuit board 110 is wasted can be effectively solved. Thereby effectively increasing the board distribution area of the main circuit board 110.
Moreover, the design of the raised height of each connector 140 can facilitate the disassembly and assembly of the plurality of connectors 140, thereby further improving the assembly efficiency of the circuit board assembly 100.
In addition, the height of each connector 140 is designed by using the height-increasing member 120, so that the board distribution area of the main circuit board 110 can be further increased, and the utilization rate of the main circuit board 110 can be improved. On the premise that the board layout area of the components 200 of the circuit board assembly 100 is fixed, the length of the main circuit board 110 can be further shortened, so that a certain space is released for increasing the battery capacity of the electronic equipment or upgrading the configuration of the electronic equipment, and the ultimate design of the electronic equipment is improved.
In some embodiments, the step-up member 120 and the connector 140 are located near the edge of the main circuit board 110.
In these embodiments, the step-up member 120 and the connector 140 are disposed at positions close to the edge of the main circuit board 110. Since the connector 140 is disposed on the main circuit board 110 by the elevation member 120, the elevation member 120 raises the connector 140, thereby increasing the extended length of the flexible circuit board 150, and even in the case where the length of the flexible circuit board 150 is long, the extendable length of the flexible circuit board 150 can be increased by the increased height of the elevation member 120. In this case, the connector 140 and the step-up member 120 do not need to be disposed at positions close to the inside of the main circuit board 110, but the connector 140 and the step-up member 120 need to be disposed at positions close to the edge of the main circuit board 110, thereby effectively increasing the board layout area of the main circuit board 110.
In a specific embodiment, the step-up member 120 and the connector 140 may be disposed at an edge of the main circuit board 110.
In some embodiments, the step-up member 120 is coupled to the connector 140 by surface mount technology; and/or the step-up member 120 is connected to the main circuit board 110 by a surface mounting technique.
In these embodiments, the raised elements 120 are connected to the connectors 140 by Surface Mount Technology (SMT), which improves the reliability of the circuit board assembly 100 and improves the space utilization of the circuit board assembly 100.
The raised member 120 is connected to the main circuit board 110 by a Surface Mount Technology (SMT), so that the space utilization of the circuit board assembly 100 is further improved while the reliability of the circuit board assembly 100 is improved. In some embodiments, the circuit board assembly 100 further includes a connection line disposed in the padding member 120, and the connector 140 is electrically connected to the main circuit board 110 through the connection line.
In these embodiments, the circuit board assembly 100 further includes a connecting line, specifically, the connecting line is disposed inside the raised element 120, and the connector 140 is electrically connected to the main circuit board 110 through the connecting line, that is, when the connector 140 is electrically connected to the main circuit board 110, the connecting line is routed through the raised element 120, so that the problem that the connecting line is exposed out of the main circuit board 110 to electrically connect the connector 140 and occupy the space of the circuit board assembly 100 can be effectively solved, and the space utilization of the circuit board assembly 100 is improved. In addition, routing the wires inside the raised element 120 can prevent the problem that the reliability of the circuit board assembly 100 is reduced due to the winding interference between the connecting wires and other devices.
Some embodiments of the present application further provide an electronic device, including the circuit board assembly 100 as described in the first aspect of the embodiments above.
In an embodiment of the present application, the electronic device includes the circuit board assembly 100 according to the embodiment of the first aspect, and thus has all the advantages of the circuit board assembly 100, which is not described in detail herein.
In some embodiments, as shown in fig. 3, the electronic device further includes a plurality of components 200, the plurality of components 200 are electrically connected to the main circuit board 110, and at least one component 200 is located in the receiving cavity 130.
In these embodiments, the electronic device further includes a plurality of components 200, specifically, the plurality of components 200 are electrically connected to the main circuit board 110 in the circuit board assembly 100, at least one component 200 is located in the accommodating cavity 130 in the circuit board assembly 100, that is, at least one component 200 in the plurality of components 200 is placed in the accommodating cavity 130, which effectively increases the board layout area of the main circuit board 110, improves the utilization rate of the main circuit board 110, and can also effectively solve the problem in the related art (as shown in fig. 2) that the board layout area of the main board 30 ' is reduced because the board height body 40 ' is only used for raising the BTB connector 10 ', which results in the board height body 40 ' occupying part of the area of the main board 30 '.
Specifically, compared with the related art that only the raising main body 40 'is used for raising the BTB connector 10', the arrangement of the partial components 200 in the accommodating cavity 130 can be increased by arranging the main circuit board 110Area of about 30mm 2 To 40mm 2 。
In addition, partial components 200 are placed in the accommodating cavity 130 in the circuit board assembly 100, and on the premise that the layout area of the components 200 is fixed, the length of the main circuit board 110 can be correspondingly shortened, so that a certain space is released for increasing the battery capacity of the electronic equipment or upgrading the configuration of the electronic equipment, and the ultimate design of the electronic equipment is improved.
It should be noted that in the description of the present specification, reference to the description of the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In this application, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. In this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A circuit board assembly for mounting components, the circuit board assembly comprising:
a main circuit board;
the heightening part is arranged on the main circuit board, the heightening part and the main circuit board are enclosed to form a containing cavity, and the containing cavity can be used for containing the component;
the connector is arranged on the heightening piece and is electrically connected with the main circuit board through the heightening piece;
a flexible circuit board electrically connected with the connector.
2. The circuit board assembly of claim 1,
the accommodating cavity penetrates through the heightening piece along the extending direction of the heightening piece.
3. The circuit board assembly of claim 1, wherein the standoff comprises:
the elevating main body is provided with the connector;
the first supporting part is connected with the heightening main body;
the second supporting part is connected with the heightening main body and is arranged opposite to the first supporting part, and the heightening part is arranged on the main circuit board through the first supporting part and the second supporting part.
4. The circuit board assembly of claim 3, wherein the step-up member comprises:
the first circuit board patch is arranged on one side, facing the connector, of the heightening main body;
the main circuit board includes:
the second circuit board patch is arranged on one side, facing the heightening part, of the main circuit board, and the first circuit board patch is electrically connected with any one second circuit board patch;
the connector is electrically connected with the main circuit board through the first circuit board patch and the second circuit board patch.
5. The circuit board assembly of claim 3, wherein the booster body is a unitary structure with the first and second support portions.
6. The circuit board assembly of claim 3, wherein the first support portion comprises:
the at least two first sub-supporting pieces are arranged along the extending direction of the heightening main body, and a distance is reserved between any two adjacent first sub-supporting pieces.
7. Circuit board assembly according to one of the claims 1 to 6,
the step-up member and the connector are located near an edge of the main circuit board.
8. Circuit board assembly according to one of the claims 1 to 6,
the heightening piece is connected with the connector through a surface assembly technology; and/or
The heightening part is connected with the main circuit board through a surface assembly technology.
9. The circuit board assembly of any one of claims 1-6, further comprising:
the connecting wire is arranged in the heightening piece, and the connector is electrically connected with the main circuit board through the connecting wire.
10. An electronic device, comprising a circuit board assembly according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221295987.0U CN217363400U (en) | 2022-05-27 | 2022-05-27 | Circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221295987.0U CN217363400U (en) | 2022-05-27 | 2022-05-27 | Circuit board assembly and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217363400U true CN217363400U (en) | 2022-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221295987.0U Active CN217363400U (en) | 2022-05-27 | 2022-05-27 | Circuit board assembly and electronic device |
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| Country | Link |
|---|---|
| CN (1) | CN217363400U (en) |
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2022
- 2022-05-27 CN CN202221295987.0U patent/CN217363400U/en active Active
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