CN217342647U - Automatic heating device for degumming process of quartz chip - Google Patents

Automatic heating device for degumming process of quartz chip Download PDF

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Publication number
CN217342647U
CN217342647U CN202220281032.3U CN202220281032U CN217342647U CN 217342647 U CN217342647 U CN 217342647U CN 202220281032 U CN202220281032 U CN 202220281032U CN 217342647 U CN217342647 U CN 217342647U
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China
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heating
placing table
heating device
cabinet
chips according
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CN202220281032.3U
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Chinese (zh)
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张净智
罗春
陈天学
刘辉
田慧艳
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Taijing Chongqing Electronics Co ltd
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Taijing Chongqing Electronics Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model belongs to the technical field of quartz chip degumming, and particularly discloses an automatic heating device for a quartz chip degumming procedure, which comprises a glue cabinet, a cover body and a plurality of heating barrels, wherein the cover body is used for covering the upper side of the glue boiling cabinet; a heating equipment placing table and a heating barrel placing table positioned above the heating equipment placing table are arranged in the glue boiling cabinet, the heating equipment placing table is used for placing a plurality of heaters, the heating barrel placing table is used for placing a plurality of heating barrels, a plurality of heating through holes are formed in the heating barrel placing table, and the heating through holes correspond to the heating positions of the heaters one by one; the lower part of the heating equipment placing table is provided with a water receiving groove, the heating barrel placing table is provided with a water outlet hole, and the water outlet hole is opposite to the water receiving groove. The heating device can solve the problem that the condensed liquid can drip on the heating equipment to cause the damage of the heating equipment in the heating process in the prior art.

Description

Automatic heating device for degumming process of quartz chip
Technical Field
The utility model belongs to the technical field of quartz chip comes unstuck, especially, relate to an automatic heating device for quartz chip process of coming unstuck.
Background
In the cutting process of the quartz chip, the complete quartz chip falls off or part of the quartz chip is broken, bright edges and the like due to various reasons, however, the quartz chip with better quality can be obtained by coating with glue, then cutting, and then degumming and cleaning.
At present, degumming agent and quartz chips are heated together, and the degumming agent can be used after reaching a certain temperature to complete the degumming process. At present, heating equipment is generally used for heating in sealed equipment, but gas volatilized in the heating process is condensed and then becomes liquid, and the liquid drips on the heating equipment again, so that the heating equipment is damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an automatic heating device for quartz chip process of coming unstuck to solve prior art and can drip the liquid of condensation and cause the problem that firing equipment damaged on firing equipment in the heating process.
In order to achieve the above purpose, the technical scheme of the utility model is that: the automatic heating device for the quartz chip degumming procedure comprises a glue boiling cabinet, a cover body and a plurality of heating barrels, wherein the cover body is used for covering the upper side of the glue boiling cabinet; a heating equipment placing table and a heating barrel placing table positioned above the heating equipment placing table are arranged in the glue boiling cabinet, the heating equipment placing table is used for placing a plurality of heaters, the heating barrel placing table is used for placing a plurality of heating barrels, a plurality of heating through holes are formed in the heating barrel placing table, and the heating through holes correspond to the heating positions of the heaters one by one; the lower part of the heating equipment placing table is provided with a water receiving groove, the heating barrel placing table is provided with a water outlet hole, and the water outlet hole is opposite to the water receiving groove.
Further, a plurality of waterproof heat insulation pads are arranged on the heating barrel placing table and correspond to the heating through holes one to one, and the waterproof heat insulation pads are fixed on the heating barrel placing table.
Further, the cover body is provided with an air suction opening, and the air suction opening is connected with air suction equipment.
Furthermore, one side of the glue boiling cabinet is provided with an opening for taking the heating barrel, and the opening is provided with a sliding glass window for opening and closing the opening.
Furthermore, the cover body and the glue boiling cabinet are locked by a buckle.
Furthermore, water outlets are arranged on two sides of the water receiving tank.
Furthermore, a temperature control cabinet is arranged in the glue boiling cabinet and is connected with the heater.
Furthermore, a sealing layer is arranged around the sliding glass window.
Further, the heater adopts an induction cooker.
The working principle of the technical scheme is as follows: and opening the sliding glass window, putting the heating barrels on the waterproof heat insulation pad one by one, putting the quartz chips and the degumming agent in the heating barrels, then closing the sliding glass window, opening the heater by controlling the temperature control cabinet, and heating the heating barrels by the heater until the set temperature is reached. The air extraction equipment extracts the volatile gas in the glue boiling cabinet through an air extraction opening. After partial gas is condensed, the condensed gas becomes liquid which falls on the heating equipment placing table, and the liquid flows into the water receiving tank through the water outlet hole.
The beneficial effects of this technical scheme lie in: this scheme is through setting up water receiving tank, heating through-hole and waterproof heat insulating mattress, and the liquid after the condensation can not directly drip on the heater to reduce the fault rate and the damage rate of heater. And secondly, the volatile gas is pumped out by arranging an air pumping device and an air pumping port, so that the condensation of the gas is reduced. And thirdly, a temperature control cabinet is arranged, so that the heating temperature of the heater can be accurately controlled.
Drawings
Fig. 1 is a schematic view of an external structure of an automatic heating device for a quartz chip degumming process according to the present invention;
fig. 2 is an internal explosion diagram of the automatic heating device for the degumming process of the quartz chip according to the present invention.
Detailed Description
The following is further detailed by way of specific embodiments:
reference numerals in the drawings of the specification include: glue boiling cabinet 1, cover body 2, suction opening 3, buckle 4, slip glass window 5, water receiving tank 6, heating barrel place platform 7, waterproof heat insulating mattress 8, temperature control cabinet 9, apopore 10, heating equipment place platform 11.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment is basically as shown in the attached figures 1-2: the automatic heating device for the quartz chip degumming procedure comprises a glue boiling cabinet 1, a cover body 2 and a plurality of heating barrels, wherein the cover body 2 is used for covering the upper side of the glue boiling cabinet 1; a heating equipment placing table 11 and a heating barrel placing table 7 positioned above the heating equipment placing table 11 are arranged in the glue boiling cabinet 1, the heating equipment placing table 11 is used for placing a plurality of heaters, in the embodiment, the heaters adopt induction cookers, the heating barrel placing table 7 is used for placing a plurality of heating barrels, a plurality of heating through holes are formed in the heating barrel placing table 7, and the heating through holes correspond to the heating positions of the heaters one by one; the heating barrel placing table 7 is provided with a plurality of annular waterproof heat insulation pads 8, the waterproof heat insulation pads 8 correspond to the heating through holes one by one, the waterproof heat insulation pads 8 are fixed on the heating barrel placing table 7, the heating position of the heater is located at the center of the waterproof heat insulation pads 8, and the waterproof heat insulation pads 8 support the heating barrel. The lower part that platform 11 was placed to the firing equipment is equipped with water receiving tank 6, and the heating barrel is placed and is equipped with apopore 10 on the platform 7, and apopore 10 is just right with water receiving tank 6, and platform 11 is placed to the firing equipment does not interfere apopore 10 and water receiving tank 6, and as shown in fig. 2, apopore 10 is located one side that platform 7 was placed to the heating barrel, and platform 11 is placed to the firing equipment to be narrower than heating barrel in the width direction and place platform 7. Water outlets are arranged at two sides of the water receiving tank 6. An air suction opening 3 is arranged on the cover body 2, and the air suction opening 3 is connected with air suction equipment. An opening for taking the heating barrel is formed in one side of the glue boiling cabinet 1, a sliding glass window 5 for opening and closing the opening is arranged on the opening, and a sealing layer is arranged on the periphery of the sliding glass window 5. The cover body 2 and the glue boiling cabinet 1 are locked by a buckle 4. A temperature control cabinet 9 is arranged in the glue boiling cabinet 1, and the temperature control cabinet 9 is connected with a heater.
Through setting up water receiving tank 6, heating through-hole, waterproof heat insulating mattress 8 and air extraction equipment, the liquid after the condensation can not directly drip on the heater to reduce the fault rate and the damage rate of heater, the fault rate is from original 58%, has reduced to 10%.
The specific implementation process is as follows:
the sliding glass window 5 is opened, the heating barrels are placed on the waterproof heat insulation pad 8 one by one, quartz chips and degumming agents are placed in the heating barrels, then the sliding glass window 5 is closed, the heater is opened by controlling the temperature control cabinet 9, and the heater heats the heating barrels until the set temperature is reached. The air extraction equipment extracts the volatile gas in the glue boiling cabinet 1 through the air extraction opening 3. After condensing, part of the gas becomes liquid and falls on the heating equipment placing table 11, and the liquid flows into the water receiving tank 6 through the water outlet hole 10.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only for the embodiments of the present invention, and the common general knowledge of the known specific structures and characteristics in the schemes is not described herein too much, and those skilled in the art will know all the common technical knowledge in the technical field of the present invention before the application date or the priority date, can know all the prior art in this field, and have the ability to apply the conventional experimental means before this date, and those skilled in the art can combine their own ability to perfect and implement the schemes, and some typical known structures or known methods should not become obstacles for those skilled in the art to implement the present application. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be defined by the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims (9)

1. A self-heating device for quartz chip process of coming unstuck, its characterized in that: the glue boiling cabinet comprises a glue boiling cabinet (1), a cover body (2) and a plurality of heating barrels, wherein the cover body (2) is used for covering the upper side of the glue boiling cabinet (1); a heating equipment placing table (11) and a heating barrel placing table (7) located above the heating equipment placing table (11) are arranged in the glue boiling cabinet (1), the heating equipment placing table (11) is used for placing a plurality of heaters, the heating barrel placing table (7) is used for placing a plurality of heating barrels, a plurality of heating through holes are formed in the heating barrel placing table (7), and the heating through holes correspond to the heating positions of the heaters one to one; the lower part of the heating equipment placing table (11) is provided with a water receiving groove (6), the heating barrel placing table (7) is provided with a water outlet hole (10), and the water outlet hole (10) is right opposite to the water receiving groove (6).
2. The automatic heating device for the degumming procedure of quartz chips according to claim 1, characterized in that: the heating barrel placing table is characterized in that a plurality of waterproof heat insulation pads (8) are arranged on the heating barrel placing table (7), the waterproof heat insulation pads (8) correspond to the heating through holes one to one, and the waterproof heat insulation pads (8) are fixed on the heating barrel placing table (7).
3. The automatic heating device for the degumming procedure of quartz chips according to claim 1, characterized in that: the wind power generation cover is characterized in that a wind suction opening (3) is formed in the cover body (2), and the wind suction opening (3) is connected with wind suction equipment.
4. The automatic heating device for the degumming procedure of quartz chips according to claim 1, characterized in that: an opening for taking the heating barrel is formed in one side of the glue boiling cabinet (1), and a sliding glass window (5) for opening and closing the opening is formed in the opening.
5. The automatic heating device for the degumming procedure of quartz chips according to claim 1, characterized in that: the cover body (2) and the glue boiling cabinet (1) are locked by a buckle (4).
6. The automatic heating device for the degumming procedure of quartz chips according to claim 1, characterized in that: and water outlets are arranged on two sides of the water receiving tank (6).
7. The automatic heating device for the degumming procedure of quartz chips according to claim 1, characterized in that: a temperature control cabinet (9) is arranged in the glue boiling cabinet (1), and the temperature control cabinet (9) is connected with the heater.
8. The automatic heating device for the degumming procedure of quartz chips according to claim 4, characterized in that: and sealing layers are arranged around the sliding glass window (5).
9. The automatic heating device for the degumming procedure of quartz chips according to claim 1, characterized in that: the heater adopts an induction cooker.
CN202220281032.3U 2022-02-11 2022-02-11 Automatic heating device for degumming process of quartz chip Active CN217342647U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220281032.3U CN217342647U (en) 2022-02-11 2022-02-11 Automatic heating device for degumming process of quartz chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220281032.3U CN217342647U (en) 2022-02-11 2022-02-11 Automatic heating device for degumming process of quartz chip

Publications (1)

Publication Number Publication Date
CN217342647U true CN217342647U (en) 2022-09-02

Family

ID=83046528

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220281032.3U Active CN217342647U (en) 2022-02-11 2022-02-11 Automatic heating device for degumming process of quartz chip

Country Status (1)

Country Link
CN (1) CN217342647U (en)

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