CN217314201U - Glue dispensing device of die bonder - Google Patents
Glue dispensing device of die bonder Download PDFInfo
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- CN217314201U CN217314201U CN202220030737.8U CN202220030737U CN217314201U CN 217314201 U CN217314201 U CN 217314201U CN 202220030737 U CN202220030737 U CN 202220030737U CN 217314201 U CN217314201 U CN 217314201U
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- glue
- packing element
- push rod
- dispensing
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Abstract
The utility model discloses a gu brilliant quick-witted adhesive deposite device, including LED support, packing element, push rod and point gum portion, the point gum portion is located the top of LED support, the point gum portion with the bottom of packing element is connected, gu crystal glue is equipped with in the packing element, packing element top surface excircle has cup jointed the packing element cap, the push rod runs through packing element cap centre of a circle with packing element internal connection, the push rod with packing element cap swing joint, push rod one end is connected with drive arrangement, the push rod other end is connected with the packing element stopper, the excircle of packing element stopper with the inner wall of packing element cup joints. The rubber cylinder plug is used for extrusion, so that no residue is left, and the replacement is convenient. When different solid crystal glues are replaced, the glue disc does not need to be cleaned. The dispensing efficiency is improved, glue is taken out from the glue tray without a glue taking needle, and the die bond glue is directly absorbed by the dispensing part. Through drive arrangement control push rod to the volume of spouting of solid crystal glue is controlled, carries out accurate control to the volume of using glue, has reduced the waste.
Description
Technical Field
The utility model relates to a solid brilliant equipment technical field of LED, concretely relates to solid brilliant quick-witted adhesive deposite device.
Background
LED (semiconductor light emitting diode) packages refer to packages of light emitting chips, which are significantly different compared to integrated circuit packages. The encapsulation of LEDs is required not only to protect the wick, but also to be transparent. The encapsulation of LEDs places special requirements on the encapsulation material. The die bonder is a key device for LED packaging, and absorbs glue (or solder paste) on the dispensing disc through the glue taking needle. And carrying out packaging work on the qualified wafer. Referring to fig. 1-2, the glue dispensing disc of the prior art is flat, the glue dispensing disc 3 rotates continuously around the central shaft 2, the scraper 1 is above the solid crystal glue 4, and the solid crystal glue 4 is scraped during the rotation of the glue dispensing disc 3, so that the glue needle 5 can be taken out to suck the glue. Finally, a glue needle 5 is taken, and the good die attach adhesive 4 is taken to package the chip placed on the LED bracket 6. The existing die bonding and dispensing device has the following defects:
1: the glue plate is continuously stirred, so that the viscosity of the glue becomes thick, and the glue needs to be continuously added to keep certain viscosity;
2: after the glue is used to the effective period, the glue needs to be replaced, and more glue is left at the bottom of the glue tray, so that greater waste is caused;
3: the LED chip has the following defects that the thrust is insufficient and the like: the glue tray needs to rotate continuously to scrape glue, so that the glue in the glue tray is ensured to be even in height, and the glue is convenient to suck. If the glue is on-line for a long time, the viscosity of the glue is increased, the glue scraping is not uniform, and the like, so that the glue dispensing part cannot take enough glue, the glue amount is insufficient, the glue is insufficient, and the conditions of insufficient chip thrust and the like are caused.
In addition, the cost of glue is high, and it is high only to reach some gluey effect to add the 1/2 of gluing height to the rubber plate height, need constantly add through the manual work and glue, guarantees that the volume of gluing is stable, for example: the original rubber plate is flat, if 5mm rubber quantity is required to meet die bonding thrust, the rubber adding height needs to reach 1/2 of the original rubber height to meet the dispensing effect. When different glues are replaced, the glue on the original glue tray needs to be cleaned, so that the glue tray is very wasted. Therefore, with the updating of LED devices, the die bonding efficiency is continuously improved, and a die bonding and dispensing device capable of reducing material loss, saving cost and improving dispensing efficiency is urgently needed.
SUMMERY OF THE UTILITY MODEL
For solving current solid brilliant quick-witted adhesive deposite device, with high costs, the material loss is big, the glue is glued inefficiency scheduling problem, the utility model provides a solid brilliant quick-witted adhesive deposite device.
The purpose of the utility model is realized through the following technical scheme: the utility model provides a gu brilliant quick-witted adhesive deposite device, includes LED support, packing element, push rod and point portion of gluing, the point portion of gluing is located the top of LED support, the point portion of gluing with the bottom of packing element is connected, gu the crystal glue is equipped with in the packing element, packing element top surface excircle has cup jointed the packing element cap, the push rod runs through packing element cap centre of a circle with packing element internal connection, the push rod with packing element cap swing joint, push rod one end is connected with drive arrangement, the push rod other end is connected with the packing element stopper, the excircle of packing element stopper with the inner wall of packing element cup joints.
Specifically, the bottom of the rubber sleeve is provided with a rubber outlet, the top of the dispensing part is provided with a connecting part, and the dispensing part is connected with the outer circle of the rubber outlet in a sleeved mode through the inner wall of the connecting part.
Specifically, the dispensing part is provided with a dispensing head, and the dispensing head is located above the LED support.
Specifically, the dispensing head is conical.
Specifically, a sealing device is arranged on the inner side face of the top of the rubber cylinder cap, and the sealing device covers the top face of the rubber cylinder.
Specifically, the driving device is connected with an external power supply.
Compared with the prior art, the utility model at least has the following advantages and beneficial effects:
the utility model provides a gu brilliant quick-witted adhesive deposite device, including LED support, packing element, push rod and point gum portion, the bottom that the position is located the packing element is glued to the point, is equipped with solid brilliant glue in the packing element, and the packing element cap has been cup jointed to the excircle of packing element top surface for it is sealed. The push rod penetrates through the circle center of the rubber cylinder cap and is connected with the inside of the rubber cylinder, and the rubber cylinder is movably connected with the push rod and can do vertical mechanical motion. One end of the push rod is connected with a driving device, the other end of the push rod is connected with a rubber cylinder plug, the push rod is driven to move through the driving device, the rubber cylinder plug is driven to extrude solid crystal rubber in the rubber cylinder, so that the solid crystal rubber flows out of the glue dispensing part, the LED support is used for placing the detected LED chip, and glue dispensing is carried out through the glue dispensing part.
Compare current point mucilage binding and put, the utility model discloses cancelled the rubber disc, gu the crystal glue is inside the packing element, extrudeed through the packing element stopper, can not remain, convenient the change. When different solid crystal glues are replaced, the glue disc does not need to be cleaned. The dispensing efficiency is improved, glue is taken out from the glue tray without a glue taking needle, and the die bond glue is directly absorbed by the dispensing part. Through drive arrangement control push rod to the volume of spouting of solid crystal glue is controlled, carries out accurate control to gluing the volume, has reduced the waste.
Drawings
FIG. 1 is a diagram of a prior art glue tray;
FIG. 2 is a schematic diagram of a prior art glue fetching needle for fetching glue;
FIG. 3 is a schematic structural view of the present invention;
the reference signs are:
10 is a driving device, 20 is a push rod, 21 is a rubber cylinder plug, 30 is a rubber cylinder, 31 is a rubber cylinder cap, 40 is die bond glue, 41 is a glue outlet, 50 is a glue dispensing part, 51 is a connecting part, and 60 is an LED bracket.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a gu brilliant quick-witted adhesive deposite device, including LED support 60, packing element 30, push rod 20 and point gum portion 50, LED support 60 is located the below of point gum portion 50, and point gum portion 50 is located the bottom of packing element 30, and the top of packing element 30 is connected with packing element cap 31 for space in the sealed packing element 30. The push rod 20 penetrates through the center of the rubber cylinder cap 31 to be connected with the inside of the rubber cylinder 30, and the push rod 20 is movably connected with the rubber cylinder cap 31. The driving device 10 is connected to one end of the push rod 20. In this embodiment, the driving device 10 is connected to an external power source for supplying power, and the driving device 10 is a dispensing driving device 10 such as a silk valve for driving the push rod 20 to make the push rod 20 perform a mechanical motion in the up-down direction. The other end of the push rod 20 is connected with a rubber cylinder plug 21, and the outer circle of the rubber cylinder plug 21 is tightly attached to the inner wall of the rubber cylinder 30, so that a vacuum space is formed from the bottom of the rubber cylinder plug 21 to the bottom of the rubber cylinder 30 and used for placing the die bonding glue 40. The driving device 10 drives the push rod 20 downwards, so that the die bond glue 40 in the glue cylinder 30 is extruded to move from the glue outlet 41 to the glue outlet 41, and finally flows into the glue dispensing head for glue dispensing. The dispensing head is located above the LED support 60, and the detected LED chip is packaged by the dispensing head. Compare in current adhesive deposite device, adopt this structure not need the scraper to carry out the frictioning to the rubber disk, save time promotes efficiency.
The top inner side surface of the rubber cylinder cap 31 is provided with a sealing device which can be a silica gel sealing ring, and the sealing device covers the top surface of the rubber cylinder 30. Play sealed effect, prevent that external impurity from entering into inside the packing element 30.
The utility model discloses a theory of operation is: the glue is dispensed by the glue cylinder 30 instead of the existing glue tray. A rubber cylinder cap 31 is arranged above the rubber cylinder 30 for sealing. The push rod 20 penetrates through the center of the rubber cylinder cap 31, one end of the push rod 20 is connected with the driving device 10, the other end of the push rod 20 is connected with the rubber cylinder plug 21, the push rod 20 is driven by the driving device 10 to do downward mechanical motion, the rubber cylinder plug 21 extrudes the solid crystal glue 40 in the rubber cylinder 30 to the glue dispensing part 50, and the spraying amount of the solid crystal glue 40 can be well controlled. And finally, the chips on the LED bracket 60 are packaged by glue discharging through the glue dispensing head. When the die bond glue 40 in the glue cylinder 30 is used up, the die bond glue 40 can be aligned to the dispensing head, the driving device 10 drives the push rod 20 to make an upward mechanical motion, the glue cylinder plug 21 moves upward along the inner wall of the glue cylinder 30, and the die bond glue 40 moves to the inside of the glue cylinder 30 through the dispensing head. Compare current point mucilage binding and put, the utility model discloses cancelled the rubber disc, gu brilliant glue 40 places inside packing element 30, extrudees through packing element stopper 21, can not remain, convenient change. When different die bond glues 40 are replaced, the glue tray does not need to be cleaned. The glue dispensing efficiency is improved, glue is not required to be taken out from the glue tray by a glue taking needle, and the glue is directly taken out from the die bonding glue 40 through the glue dispensing part 50. The driving device 10 controls the push rod 20, thereby controlling the ejection amount of the die bonding glue 40, accurately controlling the glue consumption and further reducing the waste.
It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention and the technical principles applied, and any changes, modifications, substitutions, combinations, and simplifications made by those skilled in the art without departing from the spirit and principle of the present invention should be considered as equivalent replacement modes within the technical scope of the present invention.
Claims (6)
1. The utility model provides a solid brilliant quick-witted adhesive deposite device which characterized in that: the LED glue dispensing device comprises an LED support, a glue barrel, a push rod and a glue dispensing part, wherein the glue dispensing part is located above the LED support, the glue dispensing part is connected with the bottom of the glue barrel, solid crystal glue is arranged in the glue barrel, a glue barrel cap is sleeved on the excircle of the top surface of the glue barrel, the push rod penetrates through the circle center of the glue barrel cap and is connected with the inside of the glue barrel, the push rod is movably connected with the glue barrel cap, one end of the push rod is connected with a driving device, the other end of the push rod is connected with a glue barrel plug, and the excircle of the glue barrel plug is sleeved with the inner wall of the glue barrel.
2. The dispensing device of the die bonder according to claim 1, wherein: the glue dispensing device is characterized in that a glue outlet is formed in the bottom of the glue barrel, a connecting portion is arranged at the top of the glue dispensing portion, and the glue dispensing portion is sleeved with an outer circle of the glue outlet through the inner wall of the connecting portion.
3. The dispensing device of the die bonder according to claim 1, wherein: the dispensing part is provided with a dispensing head, and the dispensing head is located above the LED support.
4. The dispensing device of the die bonder of claim 3, wherein: the dispensing head is conical.
5. The dispensing device of the die bonder of claim 1, wherein: and a sealing device is arranged on the inner side surface of the top of the rubber cylinder cap and covers the top surface of the rubber cylinder.
6. The dispensing device of the die bonder of claim 1, wherein: the driving device is connected with an external power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220030737.8U CN217314201U (en) | 2022-01-07 | 2022-01-07 | Glue dispensing device of die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220030737.8U CN217314201U (en) | 2022-01-07 | 2022-01-07 | Glue dispensing device of die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217314201U true CN217314201U (en) | 2022-08-30 |
Family
ID=82991781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220030737.8U Active CN217314201U (en) | 2022-01-07 | 2022-01-07 | Glue dispensing device of die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217314201U (en) |
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2022
- 2022-01-07 CN CN202220030737.8U patent/CN217314201U/en active Active
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