CN217307989U - But circuit board embedment device is used in electronic components processing of preliminary treatment - Google Patents
But circuit board embedment device is used in electronic components processing of preliminary treatment Download PDFInfo
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- CN217307989U CN217307989U CN202220927278.3U CN202220927278U CN217307989U CN 217307989 U CN217307989 U CN 217307989U CN 202220927278 U CN202220927278 U CN 202220927278U CN 217307989 U CN217307989 U CN 217307989U
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Abstract
The utility model discloses a but circuit board embedment device is used in electronic accessories processing of preliminary treatment, including the device body, an electric telescopic handle and clean frame, the internal first motor that is provided with of device, and first motor is connected through bevel gear group and transmission shaft, transmission shaft upper end runs through the device body and the rolling disc is connected, and the rolling disc upper end is provided with the die carrier, clean frame setting is in device body upper end, and clean frame setting right side before the rolling disc, device body upper end is provided with the embedment frame, device body upper end is provided with the solidification frame. This but circuit board embedment device is used in electronic accessories processing of preliminary treatment, under the clean frame effect that sets up, the first fan of accessible and gas blow pipe blow the reason cleanness to the circuit board surface, can suck away the dust under second fan and straw effect simultaneously, improve clean effect, and accessible fourth electric telescopic handle promotes the link adjustment and adjusts suitably, through heating element to the circuit board heat setting after the encapsulating for preliminary curing effect.
Description
Technical Field
The utility model relates to a circuit board production and processing correlation technique field specifically is a but circuit board embedment device is used in electronic accessories processing of preliminary treatment.
Background
The circuit board has the properties of insulation, sealing, moisture protection, water protection, shock resistance, dust prevention and the like after being sealed by glue, the drilling tool circuit board needs to work under the conditions of high temperature and vibration and is effectively sealed by glue, so that the circuit board has stable dielectric insulation, the stress generated by impact and vibration is eliminated in a higher temperature and humidity range, the normal work of the drilling tool circuit board is ensured, the technical service quality of the drilling tool is improved, and the research shows that the circuit board encapsulating device in the prior art is typical as 201720629469.0, and the drilling tool circuit board encapsulating device comprises a body, a top cover, a bottom plate and a drawing part; the body is a rectangular cavity with supporting legs at the bottom; when the top cover covers the body, a closed rectangular cavity is formed; when the top cover is opened, the top of the body is opened; the bottom plate is freely placed in the inner cavity of the body, and the top surface of the bottom plate is an arc surface; the stripping component comprises a plurality of supporting shafts and a connecting plate, and the supporting shafts are vertically arranged on the connecting plate; the bottom of the body is provided with a plurality of through holes, and a plurality of support shafts correspondingly penetrate through the through holes at the bottom of the body and are tangent to the bottom plate or are in threaded connection with the bottom plate. The device has simple structure, and the single side of the circuit board encapsulated by the device is an arc surface which is matched with the installation position of a drilling tool; the drawing part is used for drawing the mold, the operation is convenient, and the time consumed by the circuit board pouring and sealing process is greatly shortened; the circuit board sealed by the sealing adhesive can still work normally under the conditions of underground high temperature and vibration.
To sum up, current circuit board glue filling device simple structure, the function singleness can not be clean to the circuit board preliminary treatment before the encapsulating, causes the dust to influence the use after follow-up encapsulating easily, because after preliminary solidification such as needs after the circuit board encapsulating, takes out it, and most circuit board glue filling device all waits for circuit board encapsulating back natural curing, and efficiency is lower, but the electronic components processing of a preliminary treatment is with circuit board embedment device and solve above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a but circuit board embedment device is used in electronic accessories processing of preliminary treatment to solve the current circuit board encapsulating device simple structure that provides in the above-mentioned background art, the function singleness can not be clean to the circuit board preliminary treatment before the encapsulating, causes the dust easily to influence the use after follow-up encapsulating, and most circuit board encapsulating device all waits for circuit board encapsulating back natural cure, the lower problem of efficiency.
In order to achieve the above object, the utility model provides a following technical scheme: a circuit board filling and sealing device for processing electronic accessories, which can be preprocessed, comprises a device body, a first electric telescopic rod and a cleaning frame,
a first motor is arranged in the device body and is connected with a transmission shaft through a bevel gear set, the upper end of the transmission shaft penetrates through the device body and is connected with a rotating disc, and a die carrier is arranged at the upper end of the rotating disc;
the cleaning frame is arranged at the upper end of the device body, the cleaning frame is arranged on the front right side of the rotating disc, the filling and sealing frame is arranged at the upper end of the device body, the filling and sealing frame is arranged on the right side of the rotating disc, the curing frame is arranged at the upper end of the device body, and the curing frame is arranged on the rear right side of the rotating disc.
Preferably, the first motor, the bevel gear set, the transmission shaft and the rotating disc form a rotating mechanism, and five die carriers are distributed on the rotating disc in an annular array shape.
Through adopting above-mentioned technical scheme, first motor passes through bevel gear group and transmission shaft and drives the rolling disc rotation.
Preferably, the first electric telescopic rod is arranged in the die carrier, and the upper end of the first electric telescopic rod is connected with the top plate.
Through adopting above-mentioned technical scheme, through the adjustment of first electronic telescopic link to roof is flexible.
Preferably, the cleaning frame comprises a second electric telescopic rod, a connecting plate, a first fan, an air blowing pipe, a suction pipe, a second fan and a collecting box, the second electric telescopic rod is arranged at the top end in the cleaning frame, the lower end of the second electric telescopic rod is connected with the connecting plate, the first fan is arranged on the connecting plate, the first fan is connected with the air blowing pipe, the suction pipe penetrates through the connecting plate, one end of the suction pipe penetrates through the cleaning frame and is connected with the second fan, the second fan is connected with the collecting box, and the collecting box is arranged at the upper end of the cleaning frame.
Through adopting above-mentioned technical scheme, can blow the clearance to the circuit board surface under first fan and gas blow pipe effect.
Preferably, the embedment frame is including workbin, puddler, second motor, embedment pipe, lid and third electric telescopic handle, and embedment frame upper end is provided with the workbin, the workbin inner wall rotates and is connected with the puddler, and puddler one end runs through the workbin and the second motor is connected, the workbin is connected with the embedment pipe, and embedment pipe one end runs through embedment frame and lid, the lid upper end is connected with third electric telescopic handle, and third electric telescopic handle sets up on the top in the embedment frame.
Through adopting above-mentioned technical scheme, drive the puddler through the second motor and rotate, can stir the casting glue, keep its mobility.
Preferably, the curing frame comprises a fourth electric telescopic rod, a connecting frame and a heating element, the fourth electric telescopic rod is arranged at the top end in the curing frame, the lower end of the fourth electric telescopic rod is connected with the connecting frame, and the heating element is arranged on the inner wall of the connecting frame.
Through adopting above-mentioned technical scheme, promote the link to its altitude mixture control through fourth electric telescopic handle.
Compared with the prior art, the beneficial effects of the utility model are that: the circuit board encapsulating device for processing the electronic fittings,
(1) under the action of the arranged cleaning frame, the surface of the circuit board can be cleaned by blowing through the first fan and the air blowing pipe, meanwhile, dust can be sucked away under the action of the second fan and the suction pipe, the cleaning effect is improved, the connecting frame can be pushed to be properly adjusted through the fourth electric telescopic rod, and the circuit board after glue pouring is heated and cured through the heating element, so that the primary curing effect is accelerated;
(2) drive the puddler and rotate and to mix in the workbin under the second motor effect for the casting glue keeps flowing, is difficult to solidify in inside, and five die carriers that set up on the rolling disc can be used to circuit board material loading, cleanness, embedment, solidification and unloading continuous processing, push the roof under the effect of first electric telescopic handle, make things convenient for the circuit board drawing of patterns after the encapsulation.
Drawings
FIG. 1 is a schematic view of the front cross-sectional structure of the device body of the present invention;
FIG. 2 is a schematic top view of the rotary plate of the present invention;
fig. 3 is a schematic view of the three-dimensional structure of the rotating disc and the mold frame of the present invention;
FIG. 4 is a schematic view of the front section structure of the material box of the present invention;
fig. 5 is a schematic structural view of a fourth electric telescopic rod, a connecting frame and a heating element of the present invention;
figure 6 is the utility model discloses a second electric telescopic handle and connecting plate structure sketch map.
In the figure: 1. the device body, 2, first motor, 3, bevel gear group, 4, transmission shaft, 5, rolling disc, 6, die carrier, 7, first electric telescopic handle, 8, roof, 9, clean frame, 901, second electric telescopic handle, 902, the connecting plate, 903, first fan, 904, gas blow pipe, 905, straw, 906, second fan, 907, the collecting box, 10, the embedment frame, 1001, the workbin, 1002, the puddler, 1003, the second motor, 1004, the encapsulating pipe, 1005, the lid, 1006, third electric telescopic handle, 11, the solidification frame, 1101, fourth electric telescopic handle, 1102, the connecting frame, 1103, heating element.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a circuit board filling and sealing device capable of being preprocessed and used for processing electronic accessories is shown in figure 1, a first motor 2 is arranged in a device body 1, the first motor 2 is connected with a transmission shaft 4 through a bevel gear set 3, the first motor 2, the bevel gear set 3, the transmission shaft 4 and a rotating disc 5 form a rotating mechanism, five die carriers 6 are distributed on the rotating disc 5 in an annular array mode, the five die carriers 6 can keep continuous feeding, cleaning, filling and sealing, curing and blanking processing of a circuit board, and the circuit board filling and sealing device can rotate under the action of the first motor 2, the bevel gear set 3 and the transmission shaft 4 through the rotating disc 5.
As shown in fig. 1, 2 and 3, the upper end of the transmission shaft 4 penetrates through the device body 1 and is connected with the rotating disc 5, the upper end of the rotating disc 5 is provided with the die set 6, the first electric telescopic rod 7 is arranged in the die set 6, the upper end of the first electric telescopic rod 7 is connected with the top plate 8, and the top plate 8 can be pushed by the first electric telescopic rod 7 to help the demoulding of the circuit board.
As shown in fig. 2 and fig. 6, a cleaning frame 9 is arranged at the upper end of the device body 1, and the cleaning frame 9 is arranged at the front right side of the rotary disc 5, the cleaning frame 9 comprises a second electric telescopic rod 901, a connecting plate 902, a first fan 903, an air blowing pipe 904, a suction pipe 905, a second fan 906 and a collection box 907, the second electric telescopic rod 901 is arranged at the top end in the cleaning frame 9, the connecting plate 902 is connected to the lower end of the second electric telescopic rod 901, the first fan 903 is arranged on the connecting plate 902, the first fan 903 is connected to the air blowing pipe 904, the suction pipe 905 is arranged on the connecting plate 902, one end of the suction pipe 905 penetrates through the cleaning frame 9 and the second fan 906, the second fan 906 is connected to the collection box 907, the collection box 907 is arranged at the upper end of the cleaning frame 9, the height of the connecting plate 902 is properly adjusted by the second electric telescopic rod 901, the first fan 903 and the air blowing pipe 904 can pre-process the circuit board to be cleaned, dust and impurities can be sucked into the collection box 907 under the action of the suction pipe 905 and the second fan 906, and the cleaning effect is improved.
As shown in fig. 1, 2 and 4, a potting frame 10 is disposed at the upper end of the device body 1, the potting frame 10 is disposed at the right side of the rotary disc 5, the potting frame 10 includes a bin 1001, a stirring rod 1002, a second motor 1003, a glue filling pipe 1004, a cover 1005 and a third electric telescopic rod 1006, a feed box 1001 is arranged at the upper end of the filling and sealing frame 10, the inner wall of the feed box 1001 is rotationally connected with a stirring rod 1002, one end of the stirring rod 1002 penetrates through the material box 1001 to be connected with the second motor 1003, the material box 1001 is connected with a glue filling pipe 1004, one end of the glue filling pipe 1004 penetrates through the filling and sealing frame 10 and the cover body 1005, the upper end of the cover body 1005 is connected with the third electric telescopic rod 1006, and the third electric telescopic rod 1006 is arranged on the top end in the encapsulating frame 10, the encapsulating glue in the material box 1001 can be stirred under the action of the stirring rod 1002 and the second motor 1003 to keep fluidity, and pushing the cover body 1005 to cover the corresponding mould frame 6 through the third electric telescopic rod 1006, and pouring glue through the glue pouring pipe 1004.
As shown in fig. 2 and 5, the upper end of the device body 1 is provided with a curing frame 11, and the curing frame 11 is arranged on the rear right side of the rotating disc 5, the curing frame 11 comprises a fourth electric telescopic rod 1101, a connecting frame 1102 and a heating element 1103, the fourth electric telescopic rod 1101 is arranged at the top end in the curing frame 11, the connecting frame 1102 is connected to the lower end of the fourth electric telescopic rod 1101, the heating element 1103 is arranged on the inner wall of the connecting frame 1102, the height of the connecting frame 1102 is adjusted under the action of the fourth electric telescopic rod 1101, the circuit board after glue pouring is heated and cured by the heating element 1103, and the primary curing efficiency is improved.
The circuit board is placed in the die set 6 after the power is switched on, the rotating disc 5 is driven to rotate under the action of the first motor 2, the bevel gear set 3 and the transmission shaft 4, the circuit board is rotated to the position below the cleaning frame 9 to be cleaned, meanwhile, the subsequent die set 6 can be loaded and cleaned, then the circuit board is rotated to the position below the encapsulation frame 10 to be encapsulated after being cleaned, and by analogy, the subsequent circuit board is loaded and cleaned, then the circuit board is rotated to the curing frame 11 to be heated and cured after being encapsulated, the circuit board is rotated to be discharged after being cured, the top plate 8 is pushed under the action of the first electric telescopic rod 7 to help demolding, and the content which is not described in detail in the specification belongs to the prior art which is known by professional technicians in the field.
The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for ease of description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the scope of the invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a but circuit board embedment device is used in electronic components processing of preliminary treatment, includes the device body (1), first electric telescopic handle (7) and clean frame (9), its characterized in that:
a first motor (2) is arranged in the device body (1), the first motor (2) is connected with a transmission shaft (4) through a bevel gear set (3), the upper end of the transmission shaft (4) penetrates through the device body (1) to be connected with a rotating disc (5), and a die carrier (6) is arranged at the upper end of the rotating disc (5);
clean frame (9) set up in device body (1) upper end, and clean frame (9) set up right side before rolling disc (5), device body (1) upper end is provided with embedment frame (10), and embedment frame (10) set up on rolling disc (5) right side, device body (1) upper end is provided with solidification frame (11), and solidification frame (11) set up the back right side at rolling disc (5).
2. The apparatus for encapsulating a pre-processed circuit board for electronic parts processing as claimed in claim 1, wherein: the first motor (2), the bevel gear set (3), the transmission shaft (4) and the rotating disc (5) form a rotating mechanism, and five die carriers (6) are distributed on the rotating disc (5) in an annular array shape.
3. The apparatus of claim 1, wherein the apparatus comprises: first electric telescopic handle (7) set up in die carrier (6), and first electric telescopic handle (7) upper end is connected with roof (8).
4. The apparatus of claim 1, wherein the apparatus comprises: the cleaning rack (9) comprises a second electric telescopic rod (901), a connecting plate (902), a first fan (903), an air blowing pipe (904), a suction pipe (905), a second fan (906) and a collecting box (907), the second electric telescopic rod (901) is arranged at the inner top end of the cleaning rack (9), the lower end of the second electric telescopic rod (901) is connected with the connecting plate (902), the first fan (903) is arranged on the connecting plate (902), the first fan (903) is connected with the air blowing pipe (904), the suction pipe (905) penetrates through the connecting plate (902), one end of the suction pipe (905) penetrates through the cleaning rack (9) and the second fan (906) to be connected, the second fan (906) is connected with the collecting box (907), and the collecting box (907) is arranged at the upper end of the cleaning rack (9).
5. The apparatus of claim 1, wherein the apparatus comprises: embedment frame (10) is including workbin (1001), puddler (1002), second motor (1003), encapsulating pipe (1004), lid (1005) and third electric telescopic handle (1006), and embedment frame (10) upper end is provided with workbin (1001), workbin (1001) inner wall rotates and is connected with puddler (1002), and puddler (1002) one end runs through workbin (1001) and second motor (1003) and is connected, workbin (1001) are connected with encapsulating pipe (1004), and encapsulating pipe (1004) one end runs through embedment frame (10) and lid (1005), lid (1005) upper end is connected with third electric telescopic handle (1006), and third electric telescopic handle (1006) set up in embedment frame (10) on the top.
6. The apparatus of claim 1, wherein the apparatus comprises: the curing frame (11) comprises a fourth electric telescopic rod (1101), a connecting frame (1102) and a heating element (1103), the fourth electric telescopic rod (1101) is arranged at the top end in the curing frame (11), the connecting frame (1102) is connected to the lower end of the fourth electric telescopic rod (1101), and the heating element (1103) is arranged on the inner wall of the connecting frame (1102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220927278.3U CN217307989U (en) | 2022-04-21 | 2022-04-21 | But circuit board embedment device is used in electronic components processing of preliminary treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220927278.3U CN217307989U (en) | 2022-04-21 | 2022-04-21 | But circuit board embedment device is used in electronic components processing of preliminary treatment |
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| Publication Number | Publication Date |
|---|---|
| CN217307989U true CN217307989U (en) | 2022-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220927278.3U Active CN217307989U (en) | 2022-04-21 | 2022-04-21 | But circuit board embedment device is used in electronic components processing of preliminary treatment |
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| CN (1) | CN217307989U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117771749A (en) * | 2024-02-27 | 2024-03-29 | 山西佳邦科技有限公司 | High heat dissipation power equipment test detection equipment |
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2022
- 2022-04-21 CN CN202220927278.3U patent/CN217307989U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117771749A (en) * | 2024-02-27 | 2024-03-29 | 山西佳邦科技有限公司 | High heat dissipation power equipment test detection equipment |
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