CN217305266U

CN217305266U - Semiconductor test probe

Info

Publication number: CN217305266U
Application number: CN202220427304.6U
Authority: CN
Inventors: 陈煜明; 何明锋
Original assignee: Shanghai M Microtech Electronics Co ltd
Current assignee: Shanghai M Microtech Electronics Co ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-08-26
Anticipated expiration: 2032-03-01

Abstract

The utility model relates to an integrated circuit technical field's a semiconductor test probe, including semiconductor probe body, first stop gear, second stop gear, adsorption apparatus structure and coupling mechanism, first stop gear is located the lower extreme of semiconductor probe body, second stop gear is located first stop gear's lower extreme, adsorption apparatus structure is located semiconductor probe body and first stop gear's outer end, coupling mechanism is located first stop gear's lower extreme. The utility model discloses a set up first stop gear, can carry on spacingly to the upper end of semiconductor probe body, can carry on spacingly to the lower extreme of semiconductor probe body through setting up second stop gear, two stop gear can carry on spacing fixedly to the lower extreme of semiconductor probe body, and do not need auxiliary part such as screw to consolidate it again, the installation is very swift, and it is also very simple to dismantle, and the compactness between semiconductor probe body and the stop gear can be strengthened to adsorption apparatus structure.

Description

Semiconductor test probe

Technical Field

The utility model relates to an integrated circuit technical field especially relates to a semiconductor test probe.

Background

The integrated circuit industry is a strategic, fundamental and pioneering industry of national economy and social development, is a core and a foundation for cultivating and developing a strategic emerging industry and promoting informatization and industrialized deep fusion, is an important support for adjusting economic development modes, adjusting industrial structures and guaranteeing national information safety, is an internal power for developing information technology industry, is a head power for industrial transformation and upgrading, is also an external pressure of market intense competition, has risen to a national strategy, and gradually steps into a mature development stage along with the global integrated circuit market in the last ten years, so that the acceleration is slowed down, but simultaneously along with the high-speed development of the economy of China, the internet of things markets such as smart phones, tablet computers, automotive electronics, industrial control, instruments and meters, intelligent illumination, smart homes and the like are rapidly developed, especially, the smart phone and tablet computer markets are growing explosively, and the demand of China on various integrated circuit products is continuously growing.

In chinese patent publication No. CN208568975U, a fixing structure of a semiconductor probe is disclosed, which solves the problem that a semiconductor test probe cannot be well fixed to a semiconductor laboratory bench or simply disassembled from the semiconductor laboratory bench, and the semiconductor test probe in the patent requires screws to fix the semiconductor probe to a base when being installed and fixed, and the steps are not simplified enough, and the installation and the disassembly cannot be completed quickly, so we propose a semiconductor test probe.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides a semiconductor test probe has.

The technical scheme of the utility model is that:

the utility model provides a semiconductor test probe, includes semiconductor probe body, first stop gear, second stop gear, adsorption apparatus and coupling mechanism, first stop gear is located the lower extreme of semiconductor probe body, second stop gear is located first stop gear's lower extreme, adsorption apparatus is located semiconductor probe body and first stop gear's outer end, coupling mechanism is located first stop gear's lower extreme.

The working principle of the technical scheme is as follows:

through setting up first stop gear, can carry on spacingly to the upper end of semiconductor probe body, can carry on spacingly to the lower extreme of semiconductor probe body through setting up second stop gear, through setting up adsorption apparatus structure, can strengthen the compactness of being connected between semiconductor probe body and the stop gear, through setting up coupling mechanism, can conveniently be in the same place stop gear and semiconductor probe body and detection device body are fixed.

In a further technical scheme, first stop gear includes base, swivel sleeve, bottom plate, spacing ring, first connecting rod, second connecting rod, limiting plate and spacing groove, the base is located the below of semiconductor probe body outer end, swivel sleeve movable mounting is in the upper end of base, bottom plate fixed mounting is in the upper end of base, spacing ring fixed mounting is in the upper end of bottom plate, first connecting rod swing joint is in the upper end of swivel sleeve, second connecting rod swing joint is in the upper end of first connecting rod.

Through setting up the swivel sleeve, when needs fix semiconductor probe body and stop gear together, rotate the swivel sleeve, can drive first connecting rod and second connecting rod motion.

In a further technical scheme, the limiting plates are movably mounted at the lower end of the second connecting rod and movably connected with the limiting rings, the number of the limiting plates is three, and the limiting grooves are formed in the inner ends of the three limiting plates.

Through setting up the limiting plate, during the motion of second connecting rod, can drive the limiting plate outwards diffusion to in the inside of base is put into to the seat of will surveying, then the rotatory cover of antiport can drive the limiting plate and inwards contract, will survey the seat chucking finally.

In a further technical scheme, the second limiting mechanism comprises a supporting rod, a supporting plate, a threaded column, a knob and a limiting block, the supporting rod is fixedly installed on the lower side of the inner end of the base, and the supporting plate is fixedly installed at the outer end of the supporting rod.

Through setting up bracing piece and backup pad, the backup pad can provide a supporting role for the screw thread post.

In a further technical scheme, the threaded column is movably connected with the supporting plate, the threaded column penetrates through the supporting plate and is in threaded connection with the supporting plate, the knob is fixedly installed at the lower end of the threaded column, the limiting block is fixedly installed at the upper end of the threaded column, and the limiting block is matched with the base.

Through setting up the screw thread post, rotate the knob and drive the screw thread post and rotate, the screw thread post can also drive stopper up-and-down motion when rotating, and the stopper supports the lower extreme of detecting the seat tightly to further spacing and fixed to the semiconductor probe body.

In a further technical scheme, adsorption apparatus constructs including detection seat, first magnetic sheet and second magnetic sheet, detection seat fixed mounting is at the lower extreme of semiconductor probe body, first magnetic sheet fixed mounting is in the upper end of detection seat, second magnetic sheet fixed mounting is at the lower extreme of limiting plate, first magnetic sheet sets up with second magnetic sheet heteropolarity relatively.

Through setting up first magnetic sheet and second magnetic sheet, the fastness and the compactness of being connected between probe seat and the base can be increased to suction between the two.

In a further technical scheme, the connecting mechanism comprises a connecting sheet and a positioning hole, the connecting sheet is fixedly arranged below the outer end of the base, and the positioning hole is formed in the outer end of the connecting sheet.

Through setting up connection piece and locating hole, can conveniently be in the same place this device is fixed with detection device to detect the semiconductor.

The utility model has the advantages that:

1. the upper end of the semiconductor probe body can be limited by arranging the first limiting mechanism, the lower end of the semiconductor probe body can be limited by arranging the second limiting mechanism, the lower ends of the semiconductor probe body can be limited and fixed by the two limiting mechanisms, and are not required to be reinforced by auxiliary parts such as screws and the like, the semiconductor probe is very quick to mount and very simple to dismount, the tightness of connection between the semiconductor probe body and the limiting mechanisms can be enhanced by arranging the adsorption mechanism, and the limiting mechanisms and the semiconductor probe body can be conveniently fixed with the detection device body by arranging the connecting mechanism;

2. when the semiconductor probe body and the limiting mechanism are required to be fixed together, the rotating sleeve is rotated to drive the first connecting rod and the second connecting rod to move, the limiting plate can be driven to diffuse outwards when the second connecting rod moves, so that the diameter of the limiting groove is enlarged, the detection seat can be placed in the base, then the rotating sleeve is rotated reversely, the limiting plate can be driven to contract inwards, and finally the detection seat is clamped to perform primary limiting and fixing on the semiconductor probe body;

3. the knob is rotated to drive the threaded column to rotate, and the threaded column is in threaded connection with the supporting plate, so that the threaded column can move up and down when rotating, the limiting block is driven to move up and down, the limiting block supports the lower end of the detection seat tightly, and the semiconductor probe body is further limited and fixed.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of the present invention;

fig. 2 is a schematic view of a three-dimensional structure of a base according to an embodiment of the present invention;

fig. 3 is a schematic perspective view of a second limiting mechanism according to an embodiment of the present invention;

fig. 4 is a schematic sectional structure view of a first limiting mechanism according to an embodiment of the present invention;

fig. 5 is a schematic perspective view of a detection seat according to an embodiment of the present invention.

Description of reference numerals:

1. a semiconductor probe body; 2. a first limit mechanism; 201. a base; 202. a rotating sleeve; 203. a base plate; 204. a limiting ring; 205. a first link; 206. a second link; 207. a limiting plate; 208. a limiting groove; 3. a second limiting mechanism; 301. a support bar; 302. a support plate; 303. a threaded post; 304. a knob; 305. a limiting block; 4. an adsorption mechanism; 401. a probe seat; 402. a first magnetic plate; 403. a second magnetic plate; 5. a connecting mechanism; 501. connecting sheets; 502. and (7) positioning the holes.

Detailed Description

The embodiments of the present invention will be further explained with reference to the drawings.

Example 1:

as shown in fig. 1-5, a semiconductor test probe comprises a semiconductor probe body 1, a first limiting mechanism 2, a second limiting mechanism 3, an adsorption mechanism 4 and a connection mechanism 5, wherein the first limiting mechanism 2 is located at the lower end of the semiconductor probe body 1, the second limiting mechanism 3 is located at the lower end of the first limiting mechanism 2, the adsorption mechanism 4 is located at the outer ends of the semiconductor probe body 1 and the first limiting mechanism 2, and the connection mechanism 5 is located at the lower end of the first limiting mechanism 2.

The working principle of the technical scheme is as follows:

through setting up first stop gear 2, can carry on spacingly to the upper end of semiconductor probe body 1, can carry on spacingly to the lower extreme of semiconductor probe body 1 through setting up second stop gear 3, two stop gear can carry on spacingly fixedly to the lower extreme of semiconductor probe body 1, and do not need auxiliary part such as screw to consolidate it again, through setting up adsorption apparatus 4, can strengthen the compactness of being connected between semiconductor probe body 1 and the stop gear, through setting up coupling mechanism 5, can conveniently be in the same place stop gear and semiconductor probe body 1 are fixed with the detection device body.

In another embodiment, as shown in fig. 1 and 4, the first position-limiting mechanism 2 includes a base 201, a rotary sleeve 202, a bottom plate 203, a position-limiting ring 204, a first connecting rod 205, a second connecting rod 206, a position-limiting plate 207 and a position-limiting groove 208, the base 201 is located below the outer end of the semiconductor probe body 1, the rotary sleeve 202 is movably mounted at the upper end of the base 201, the bottom plate 203 is fixedly mounted at the upper end of the base 201, the position-limiting ring 204 is fixedly mounted at the upper end of the bottom plate 203, the first connecting rod 205 is movably connected to the upper end of the rotary sleeve 202, and the second connecting rod 206 is movably connected to the upper end of the first connecting rod 205.

Through the arrangement of the rotary sleeve 202, when the semiconductor probe body 1 and the limiting mechanism need to be fixed together, the rotary sleeve 202 is rotated, and the first connecting rod 205 and the second connecting rod 206 can be driven to move.

In another embodiment, as shown in fig. 1 and 4, the limiting plates 207 are movably installed at the lower end of the second connecting rod 206, the limiting plates 207 are movably connected with the limiting ring 204, the number of the limiting plates 207 is three, and the limiting grooves 208 are disposed at the inner ends of the three limiting plates 207.

Through setting up limiting plate 207, during the motion of second connecting rod 206, can drive limiting plate 207 outdiffusion to enlarge the diameter of spacing groove 208, so that put into the inside of base 201 with detecting seat 401, then the rotatory cover 202 of antiport can drive limiting plate 207 and inwards contract, finally will detect seat 401 chucking, carry out preliminary spacing fixed to semiconductor probe body 1.

Example 2:

as shown in fig. 2 and 3, the second limiting mechanism 3 includes a supporting rod 301, a supporting plate 302, a threaded column 303, a knob 304 and a limiting block 305, the supporting rod 301 is fixedly mounted at the lower side of the inner end of the base 201, and the supporting plate 302 is fixedly mounted at the outer end of the supporting rod 301.

By providing support rods 301 and support plates 302, the support plates 302 can provide a support for the threaded posts 303.

In another embodiment, as shown in fig. 2 and 3, the threaded column 303 is movably connected to the supporting plate 302, the threaded column 303 penetrates through the supporting plate 302 and is in threaded connection with the supporting plate 302, the knob 304 is fixedly mounted at the lower end of the threaded column 303, the limiting block 305 is fixedly mounted at the upper end of the threaded column 303, and the limiting block 305 is adapted to the base 201.

Through setting up screw thread post 303, rotate knob 304 and drive screw thread post 303 and rotate, because screw thread post 303 and backup pad 302 threaded connection, consequently screw thread post 303 can also the up-and-down motion when rotating to drive stopper 305 up-and-down motion, stopper 305 supports the lower extreme of detecting seat 401 tightly, thereby carries out further spacing and fixed to semiconductor probe body 1.

In another embodiment, as shown in fig. 4 and 5, the adsorption mechanism 4 includes a probe socket 401, a first magnetic plate 402 and a second magnetic plate 403, the probe socket 401 is fixedly mounted at the lower end of the semiconductor probe body 1, the first magnetic plate 402 is fixedly mounted at the upper end of the probe socket 401, the second magnetic plate 403 is fixedly mounted at the lower end of the position limiting plate 207, and the first magnetic plate 402 and the second magnetic plate 403 are oppositely arranged.

By arranging the first magnetic plate 402 and the second magnetic plate 403, when the limiting plate 207 is overlapped with the probe socket 401, the first magnetic plate 402 is aligned with the second magnetic plate 403, and the attractive force therebetween can increase the firmness and tightness of the connection between the probe socket 401 and the base 201.

In another embodiment, as shown in fig. 1 and 2, the connecting mechanism 5 comprises a connecting piece 501 and a positioning hole 502, the connecting piece 501 is fixedly installed below the outer end of the base 201, and the positioning hole 502 is disposed at the outer end of the connecting piece 501.

By arranging the connecting sheet 501 and the positioning hole 502, the device and the detection device can be conveniently fixed together, so that the semiconductor is detected.

The above embodiments only express the specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention.

Claims

1. The utility model provides a semiconductor test probe, includes semiconductor probe body (1), first stop gear (2), second stop gear (3), adsorption apparatus structure (4) and coupling mechanism (5), its characterized in that: the semiconductor probe structure is characterized in that the first limiting mechanism (2) is located at the lower end of the semiconductor probe body (1), the second limiting mechanism (3) is located at the lower end of the first limiting mechanism (2), the adsorption mechanism (4) is located at the outer ends of the semiconductor probe body (1) and the first limiting mechanism (2), and the connection mechanism (5) is located at the lower end of the first limiting mechanism (2).

2. The semiconductor test probe of claim 1, wherein: first stop gear (2) include base (201), swivel sleeve (202), bottom plate (203), spacing ring (204), first connecting rod (205), second connecting rod (206), limiting plate (207) and spacing groove (208), base (201) are located the below of semiconductor probe body (1) outer end, swivel sleeve (202) movable mounting is in the upper end of base (201), bottom plate (203) fixed mounting is in the upper end of base (201), spacing ring (204) fixed mounting is in the upper end of bottom plate (203), first connecting rod (205) swing joint is in the upper end of swivel sleeve (202), second connecting rod (206) swing joint is in the upper end of first connecting rod (205).

3. A semiconductor test probe as recited in claim 2, wherein: the limiting plates (207) are movably mounted at the lower end of the second connecting rod (206), the limiting plates (207) are movably connected with the limiting ring (204), the number of the limiting plates (207) is three, and the limiting grooves (208) are formed in the inner ends of the three limiting plates (207).

4. A semiconductor test probe according to claim 3, wherein: the second limiting mechanism (3) comprises a supporting rod (301), a supporting plate (302), a threaded column (303), a knob (304) and a limiting block (305), the supporting rod (301) is fixedly installed on the lower side of the inner end of the base (201), and the supporting plate (302) is fixedly installed on the outer end of the supporting rod (301).

5. The semiconductor test probe of claim 4, wherein: the screw thread post (303) and backup pad (302) swing joint, screw thread post (303) run through backup pad (302) and with backup pad (302) threaded connection, knob (304) fixed mounting is at the lower extreme of screw thread post (303), stopper (305) fixed mounting is in the upper end of screw thread post (303), stopper (305) and base (201) looks adaptation.

6. The semiconductor test probe of claim 5, wherein: adsorption equipment constructs (4) including detecting seat (401), first magnetic sheet (402) and second magnetic sheet (403), detect the lower extreme of seat (401) fixed mounting at semiconductor probe body (1), first magnetic sheet (402) fixed mounting is in the upper end of detecting seat (401), second magnetic sheet (403) fixed mounting is at the lower extreme of limiting plate (207), first magnetic sheet (402) and second magnetic sheet (403) heteropolarity set up relatively.

7. The semiconductor test probe of claim 6, wherein: the connecting mechanism (5) comprises a connecting piece (501) and a positioning hole (502), the connecting piece (501) is fixedly installed below the outer end of the base (201), and the positioning hole (502) is formed in the outer end of the connecting piece (501).