CN217304646U - Micro-welding-point packaging performance testing device used in electronic packaging - Google Patents
Micro-welding-point packaging performance testing device used in electronic packaging Download PDFInfo
- Publication number
- CN217304646U CN217304646U CN202220062579.4U CN202220062579U CN217304646U CN 217304646 U CN217304646 U CN 217304646U CN 202220062579 U CN202220062579 U CN 202220062579U CN 217304646 U CN217304646 U CN 217304646U
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- China
- Prior art keywords
- fixing mechanism
- fixed
- pressure gauge
- solder joint
- micro
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000012360 testing method Methods 0.000 title claims abstract description 28
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 230000002457 bidirectional effect Effects 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
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Abstract
The utility model discloses a little solder joint encapsulation capability test device in being arranged in electronic packaging relates to electronic packaging test field. This a little solder joint packaging performance testing arrangement for among electronic packaging, the fixed welding in side of equipment support plate has the mount, and the upper surface of equipment support plate and the top lower surface of mount are equipped with first fixed establishment and second fixed establishment respectively, and the last fixed surface of mount installs the pressure gauge, and the last fixed surface of second fixed establishment welds has the connecting rod, and the top of connecting rod is equipped with adjusting screw, and adjusting screw's bottom is rotated and is connected the upper surface at N shape support frame. This a little solder joint packaging performance testing arrangement for among electronic packaging through rotating the carousel for second fixed establishment moves down, and connecting screw moves down from the inside bottom of pressure gauge simultaneously, conveniently tests the work piece of different length.
Description
Technical Field
The utility model relates to an electronic packaging tests technical field, specifically is a little solder joint packaging performance testing arrangement for among electronic packaging.
Background
The electronic packaging is just the tube of the built-in chip external use of installation integrated circuit, plays and lays fixed seal, the built-in chip of protection integrated circuit, reinforcing environmental adaptation's ability to the riveting point on the integrated circuit chip is also the contact, is the pin of welding to the encapsulation tube.
In order to test the performance of electronic packaging, usually, a tensile test is performed on the structural strength of a butt-welding joint, and a conventional method is to test through a tensile machine, when the device is used, because a welding spot of an electronic element is very small, the tested tensile bearing range is also very small, but accurate data can be obtained only through a plurality of groups of tests.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model discloses a be arranged in electron encapsulation little solder joint encapsulation capability test device to solve the problem that proposes in the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a kind of encapsulation performance testing device of micro-welding point used in electronic encapsulation, including:
the device comprises an equipment support plate, wherein a fixed frame is fixedly welded on the side surface of the equipment support plate, a first fixing mechanism and a second fixing mechanism are respectively arranged on the upper surface of the equipment support plate and the lower surface of the top end of the fixed frame, a pressure gauge is fixedly arranged on the upper surface of the fixed frame, and the bottom end of the pressure gauge is abutted against the upper surface of the second fixing mechanism;
the N-shaped support frame is fixedly installed at the top of the fixing frame, the connecting rod is fixedly welded to the upper surface of the second fixing mechanism, an adjusting screw is arranged at the top end of the connecting rod, and the bottom end of the adjusting screw is rotatably connected to the upper surface of the N-shaped support frame.
Preferably, the pressure gauge is positioned at the inner bottom of the N-shaped support frame, a connecting screw rod is movably inserted in the bottom end of the pressure gauge, and the bottom end of the connecting screw rod is fixedly connected to the top of the second fixing mechanism.
Preferably, the outer surface of the connecting screw is in threaded connection with a connecting baffle ring, and the connecting baffle ring abuts against the bottom end of the pressure gauge.
Preferably, the top fixed welding of connecting rod has the X-shaped link, adjusting screw threaded connection is in the inside of X-shaped link, adjusting screw's top fixed mounting has the carousel.
Preferably, first fixed establishment includes fixing base, activity clamp splice, spout, U-shaped connecting strip, two-way screw rod and regulation handle, the upper surface at the fixing base is seted up to the spout, two-way screw rod rotates the inside of connecting at the fixing base, activity clamp splice fixed connection is at the top of U-shaped connecting strip, U-shaped connecting strip sliding connection is in the inside of spout, two-way screw rod threaded connection is inside the bottom of U-shaped connecting strip, regulation handle fixed connection is in the one end of two-way screw rod.
Preferably, the first fixing mechanism and the second fixing mechanism have the same internal structure, and the first fixing mechanism and the second fixing mechanism are fixedly welded with the equipment support plate and the connecting rod respectively.
The utility model discloses a little solder joint packaging performance testing arrangement for among electronic packaging, its beneficial effect who possesses as follows:
1. this a be arranged in electron encapsulation solderability test device that declines, through the anticlockwise rotation carousel, make the connecting rod drive second fixed establishment downstream, make the distance between first fixed establishment and the second fixed establishment shorten, connecting screw follows the inside downstream in bottom of pressure gauge simultaneously, then place respectively the work piece both ends that await measuring at first fixed establishment and the inside clamp of second fixed establishment and press from both sides, then connect through anticlockwise rotation and keep off the ring, make to connect and keep off the ring at connecting screw's surface rebound, the final connection keeps off the ring and offsets with the bottom of pressure gauge, accomplish the device's assembly this moment, the convenience is tested the work piece of different length.
2. This a little solder joint packaging performance testing arrangement for among electronic packaging, through the clockwise rotation carousel, make X-shaped link pass through the connecting rod and drive second fixed establishment rebound, make connecting screw pass through the bottom of connecting and keep off ring extrusion pressure gauge, the pressure gauge begins to show pressure numerical value this moment, this pressure numerical value is the pulling force numerical value when this work piece tests simultaneously, along with the continuous rebound of second fixed establishment, finally when work piece solder joint department fracture, the reading of this pressure gauge is the pulling force bearing limit of this work piece solder joint this moment, with this atress ability that can slowly and accurately test out the work piece.
Drawings
FIG. 1 is a schematic view of the overall front structure of the present invention;
FIG. 2 is a schematic view of the overall back structure of the present invention;
fig. 3 is a schematic view of the outer surface structure of the second fixing mechanism of the present invention;
fig. 4 is a sectional view of the internal structure of the first fixing mechanism of the present invention.
In the figure: 1. an equipment carrier plate; 2. a fixed mount; 3. a first fixing mechanism; 301. a fixed seat; 302. a movable clamping block; 303. a chute; 304. a U-shaped connecting strip; 305. a bidirectional screw; 306. adjusting the handle; 4. a second fixing mechanism; 5. a pressure gauge; 6. a connecting rod; 7. an N-shaped support frame; 8. an X-shaped connecting frame; 9. adjusting the screw rod; 10. connecting a screw rod; 11. and connecting the baffle ring.
Detailed Description
The embodiment of the utility model discloses a little solder joint packaging performance testing arrangement for among electronic packaging, as shown in fig. 1-4, including equipment support plate 1, the fixed welding of side of equipment support plate 1 has mount 2, and the upper surface of equipment support plate 1 and the top lower surface of mount 2 are equipped with first fixed establishment 3 and second fixed establishment 4 respectively, and the upper surface fixed mounting of mount 2 has pressure gauge 5, and the bottom of pressure gauge 5 offsets with the upper surface of second fixed establishment 4;
meanwhile, the device further comprises an N-shaped support frame 7, the N-shaped support frame 7 is fixedly installed at the top of the fixing frame 2, a connecting rod 6 is fixedly welded on the upper surface of the second fixing mechanism 4, an adjusting screw rod 9 is arranged at the top end of the connecting rod 6, and the bottom end of the adjusting screw rod 9 is rotatably connected to the upper surface of the N-shaped support frame 7.
Referring to the attached drawings 2-3, the pressure gauge 5 is located the interior bottom of the N-shaped support frame 7, the connecting screw rod 10 is inserted in the bottom of the pressure gauge 5 in the inner movable mode, the bottom end of the connecting screw rod 10 is fixedly connected to the top of the second fixing mechanism 4, the outer surface of the connecting screw rod 10 is connected with the connecting baffle ring 11 in a threaded mode, the connecting baffle ring 11 abuts against the bottom end of the pressure gauge 5, the baffle ring 11 is connected through rotation, the connecting baffle ring 11 moves upwards on the outer surface of the connecting screw rod 10 to abut against the bottom end of the pressure gauge 5, the pressure gauge is adaptive to workpieces with different lengths, and the display numerical value of the pressure gauge 5 before testing is guaranteed to be zero.
Referring to fig. 3, the top of the connecting rod 6 is fixedly welded with an X-shaped connecting frame 8, an adjusting screw 9 is in threaded connection with the inside of the X-shaped connecting frame 8, a turntable is fixedly mounted at the top of the adjusting screw 9, and the turntable rotates anticlockwise to enable the X-shaped connecting frame 8 to move downwards on the outer surface of the adjusting screw 9, and the connecting rod 6 drives the second fixing mechanism 4 to move downwards at the moment.
Referring to fig. 4, the first fixing mechanism 3 includes a fixing base 301, a movable clamping block 302, a sliding groove 303, a U-shaped connecting strip 304, a bidirectional screw 305 and an adjusting handle 306, the sliding groove 303 is opened on the upper surface of the fixing base 301, the bidirectional screw 305 is rotatably connected inside the fixing base 301, the movable clamping block 302 is fixedly connected at the top of the U-shaped connecting strip 304, the U-shaped connecting strip 304 is slidably connected inside the sliding groove 303, the bidirectional screw 305 is threadedly connected inside the bottom end of the U-shaped connecting strip 304, and the adjusting handle 306 is fixedly connected at one end of the bidirectional screw 305.
Referring to fig. 1 and 4, the internal structures of the first fixing mechanism 3 and the second fixing mechanism 4 are the same, and the first fixing mechanism 3 and the second fixing mechanism 4 are respectively fixedly welded with the equipment carrier plate 1 and the connecting rod 6.
The working principle is as follows: when the device is used, the X-shaped connecting frame 8 moves downwards on the outer surface of the adjusting screw 9 by rotating the rotary table anticlockwise, the connecting rod 6 drives the second fixing mechanism 4 to move downwards at the moment, so that the distance between the first fixing mechanism 3 and the second fixing mechanism 4 is shortened, meanwhile, in the process, the connecting screw 10 moves downwards from the inside of the bottom end of the pressure gauge 5, then two ends of a workpiece to be tested are respectively placed inside the first fixing mechanism 3 and the second fixing mechanism 4, and two groups of U-shaped connecting strips 304 drive two groups of movable clamping blocks 302 to move towards the middle part along the sliding groove 303 by rotating the adjusting handle 306 to clamp the two ends of the workpiece, at the moment, the bottom end of the pressure gauge 5 does not bear any pressure, and the numerical value is displayed as zero;
then keep off ring 11 through anticlockwise rotation connection, make to connect and keep off ring 11 at the surface rebound of connecting screw 10, the final bottom of connecting and keeping off ring 11 and pressure gauge 5 offsets, accomplish the device's assembly this moment, then through the clockwise rotation carousel, make X shape link 8 drive second fixed establishment 4 rebound through connecting rod 6, make connecting screw 10 through connecting the bottom that keeps off ring 11 extrusion pressure gauge 5, pressure gauge 5 begins to show pressure value this moment, this pressure value is the tensile force value when this work piece tests promptly simultaneously, along with the continuous rebound of second fixed establishment 4, finally when work piece welding point department fracture, the reading of this pressure gauge 5 is the tensile force bearing limit of this work piece solder joint this moment promptly.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A device for testing the performance of micro-solder joint packaging in electronic packaging is characterized by comprising:
the device comprises an equipment support plate (1), wherein a fixed frame (2) is fixedly welded on the side surface of the equipment support plate (1), a first fixing mechanism (3) and a second fixing mechanism (4) are respectively arranged on the upper surface of the equipment support plate (1) and the lower surface of the top end of the fixed frame (2), a pressure gauge (5) is fixedly installed on the upper surface of the fixed frame (2), and the bottom end of the pressure gauge (5) is abutted to the upper surface of the second fixing mechanism (4);
n shape support frame (7), N shape support frame (7) fixed mounting is at the top of mount (2), the last fixed surface welding of second fixed establishment (4) has connecting rod (6), the top of connecting rod (6) is equipped with adjusting screw (9), the bottom of adjusting screw (9) is rotated and is connected the upper surface at N shape support frame (7).
2. The device for testing the performance of the micro-solder joint package in the electronic package according to claim 1, wherein: the pressure gauge (5) is arranged at the inner bottom of the N-shaped support frame (7), a connecting screw rod (10) is movably inserted into the bottom end of the pressure gauge (5), and the bottom end of the connecting screw rod (10) is fixedly connected to the top of the second fixing mechanism (4).
3. The device for testing the performance of the micro-solder joint package in the electronic package according to claim 2, wherein: the outer surface of the connecting screw rod (10) is in threaded connection with a connecting baffle ring (11), and the connecting baffle ring (11) is abutted to the bottom end of the pressure gauge (5).
4. The device for testing the performance of the micro-solder joint package in the electronic package according to claim 2, wherein: the top fixed welding of connecting rod (6) has X shape link (8), adjusting screw (9) threaded connection is in the inside of X shape link (8), the top fixed mounting of adjusting screw (9) has the carousel.
5. The device for testing the performance of the micro-solder joint package in the electronic package according to claim 1, wherein: first fixed establishment (3) are including fixing base (301), activity clamp splice (302), spout (303), U-shaped connecting strip (304), two-way screw rod (305) and regulation handle (306), the upper surface in fixing base (301) is seted up in spout (303), two-way screw rod (305) are rotated and are connected in the inside of fixing base (301), activity clamp splice (302) fixed connection is at the top of U-shaped connecting strip (304), U-shaped connecting strip (304) sliding connection is in the inside of spout (303), two-way screw rod (305) threaded connection is inside the bottom of U-shaped connecting strip (304), adjust handle (306) fixed connection in the one end of two-way screw rod (305).
6. The device for testing the performance of the micro-solder joint package in the electronic package according to claim 1, wherein: the internal structures of the first fixing mechanism (3) and the second fixing mechanism (4) are the same, and the first fixing mechanism (3) and the second fixing mechanism (4) are fixedly welded with the equipment carrier plate (1) and the connecting rod (6) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220062579.4U CN217304646U (en) | 2022-01-11 | 2022-01-11 | Micro-welding-point packaging performance testing device used in electronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220062579.4U CN217304646U (en) | 2022-01-11 | 2022-01-11 | Micro-welding-point packaging performance testing device used in electronic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217304646U true CN217304646U (en) | 2022-08-26 |
Family
ID=82924665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220062579.4U Expired - Fee Related CN217304646U (en) | 2022-01-11 | 2022-01-11 | Micro-welding-point packaging performance testing device used in electronic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217304646U (en) |
-
2022
- 2022-01-11 CN CN202220062579.4U patent/CN217304646U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220826 |