CN217283608U - Leveling device for printed circuit board production - Google Patents

Abstract

The utility model belongs to the technical field of printed circuit board produces, a leveling device is used in printed circuit board production is provided, the power distribution box comprises a device box body, install heating element and temperature sensor in the device box body, be equipped with the flattening subassembly in the device box body and be used for pressing the lifting unit of flattening subassembly, the flattening subassembly with the connection can be dismantled to the device box body, lifting unit with device box body fixed connection, heating element, temperature sensor and lifting unit all are connected with the controller electricity. The utility model discloses a leveling device is used in production of printed circuit board not only is favorable to the temperature in the controlling means box, and after the temperature in the device box reached heating temperature moreover, controller control lifting unit dropped and presses the flattening to the flattening subassembly, is convenient for preheat printed circuit board, avoids directly pressing and leads to printed circuit board to take place to damage.

Description

Leveling device for printed circuit board production

Technical Field

The utility model relates to a printed circuit board produces technical field, concretely relates to leveling device is used in printed circuit board production.

Background

Printed wiring boards, also known as printed wiring boards, are providers of electrical connections for electronic components. Its development has been over 100 years old, its design is mainly territory design, and the main advantages of adopting circuit board are that the errors of wiring and assembling can be greatly reduced, and the automation level and production labour can be raised.

In the printed circuit board production process, bending deformation often can take place, consequently, need carry out the flattening to current printed circuit board, in the current flattening device use, unable accurate control heating temperature to the influence is to the flattening effect of printed circuit board.

SUMMERY OF THE UTILITY MODEL

To the defect among the prior art, the utility model provides a pair of leveling device is used in production of printed circuit board is favorable to the temperature in the controlling means box.

The utility model provides a leveling device is used in production of printed wiring board, includes the device box, install heating element and temperature sensor in the device box, be equipped with the flattening subassembly in the device box and be used for pressing the lifting unit of flattening subassembly, the flattening subassembly with the device box can be dismantled and be connected, lifting unit with device box fixed connection, heating element, temperature sensor and lifting unit all are connected with the controller electricity.

Further, the flattening subassembly includes the curb plate of bottom plate, two relative settings and the support column of two L types, the both ends of bottom plate respectively with two curb plate fixed connection, the upper end and the lower extreme of two curb plates respectively with roof and the diapire sliding connection of device box, two support columns respectively with two curb plate one-to-ones, the one end and the curb plate fixed connection of support column, the other end and the bottom plate fixed connection of support column are equipped with a plurality of intermediate lamella and a roof between two curb plates, the both ends of roof and a plurality of intermediate lamella overlap respectively on two support columns, lifting unit is used for pressing the roof, equal threaded connection has the threaded rod on the both sides wall of device box, the tip and the curb plate threaded connection of threaded rod.

Furthermore, the position that two support columns are located between roof and the intermediate lamella, the position between a plurality of intermediate lamellas and the position between intermediate lamella and the bottom plate all overlap and are equipped with first compression spring.

Furthermore, the upper surfaces of the bottom plate and the plurality of middle plates are provided with leveling grooves for placing the printed circuit board, the lower surfaces of the top plate and the plurality of middle plates are fixed with two cutters oppositely, and the two cutters correspond to the edges on two sides of the leveling grooves respectively.

Further, be equipped with the slurcam between two cutters, the both ends of slurcam respectively with two cutter sliding connection, the last fixed surface of slurcam is connected with a plurality of second compression springs, the other end and roof or intermediate lamella fixed connection of a plurality of second compression springs.

According to the above technical scheme, the beneficial effects of the utility model are that: before leveling, the printed circuit board is placed on the leveling component, in the leveling process, the controller controls the temperature sensor to detect the temperature in the device box body in real time, when the temperature in the device box body is lower than a set heating temperature, the controller controls the heating component to heat, when the temperature in the device box body reaches the set heating temperature, the controller controls the heating component to stop heating, the temperature in the device box body is favorably controlled, and after the temperature in the device box body reaches the heating temperature, the controller controls the lifting component to descend to press and level the leveling component, so that the printed circuit board is conveniently preheated, and the printed circuit board is prevented from being damaged due to direct pressing; in the cooling process, the controller controls the heating assembly to stop heating, the temperature in the device box is detected in real time through the temperature sensor, and when the temperature in the device box is lower than the set cooling temperature, the controller controls the lifting assembly to ascend to finish the leveling process.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a schematic structural diagram of the present invention.

Reference numerals:

1-device box body; 2-a heating assembly; 3-a temperature sensor; 4-a lifting assembly; 5-a threaded rod; 6-a bottom plate; 7-side plate; 8-a support column;

71-a top plate; 72-a middle plate; 73-a first compression spring; 74-leveling grooves; 75-a cutter; 76-a second compression spring; 77-pushing plate.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

Referring to fig. 1, the leveling device for printed circuit board production provided by the embodiment includes a device box, a heating assembly and a temperature sensor are installed in the device box, a leveling assembly and a lifting assembly used for pressing the leveling assembly are arranged in the device box, the leveling assembly is detachably connected with the device box, the lifting assembly is fixedly connected with the device box, and the heating assembly, the temperature sensor and the lifting assembly are all electrically connected with a controller. The controller is an STM32 singlechip or a PLC controller. The heating component is a heating resistance wire, and the lifting component is an electric telescopic rod or an electric cylinder.

In practical use, before leveling, the printed circuit board is placed on the leveling component, in the leveling process, the controller controls the temperature sensor to detect the temperature in the device box body in real time, when the temperature in the device box body is lower than a set heating temperature, the controller controls the heating component to heat, when the temperature in the device box body reaches the set heating temperature, the controller controls the heating component to stop heating, the temperature in the device box body is favorably controlled, and after the temperature in the device box body reaches the heating temperature, the controller controls the lifting component to descend to press and level the leveling component, so that the printed circuit board is preheated, and the printed circuit board is prevented from being damaged due to direct pressing; in the cooling process, the controller controls the heating assembly to stop heating, the temperature in the device box is detected in real time through the temperature sensor, and when the temperature in the device box is lower than the set cooling temperature, the controller controls the lifting assembly to ascend to finish the leveling process.

In this embodiment, the flattening subassembly includes the curb plate of bottom plate, two relative settings and the support column of two L types, the both ends of bottom plate respectively with two curb plate fixed connection, the upper end and the lower extreme of two curb plates respectively with the roof and the diapire sliding connection of device box, two support columns respectively with two curb plate one-to-ones, the one end and the curb plate fixed connection of support column, the other end and the bottom plate fixed connection of support column are equipped with a plurality of intermediate lamella and a roof between two curb plates, the both ends of roof and a plurality of intermediate lamella overlap respectively and are established on two support columns, lifting unit is used for pressing the roof, equal threaded connection has the threaded rod on the both sides wall of device box, the tip and the curb plate threaded connection of threaded rod. The top plate, the plurality of middle plates and the bottom plate are all metal plates, and the metal plates have heat conduction characteristics, so that heat transfer between the metal plates and the printed circuit board is facilitated.

In the in-service use, arrange a plurality of printed wiring board respectively in between roof, a plurality of intermediate lamella and the bottom plate, when lifting unit descends and presses the roof, roof and a plurality of intermediate lamellas descend in proper order, carry out the flattening to a plurality of printed wiring board simultaneously, improve work efficiency. The threaded rod is convenient for the installation and the disassembly between the two side plates and the device box body.

In this embodiment, the position that two support columns are located between roof and the intermediate lamella, the position between a plurality of intermediate lamellas and the position between intermediate lamella and bottom plate all overlap and are equipped with first compression spring.

In practical use, when the lifting assembly is lifted, the top plate and the plurality of intermediate plates move upwards under the elastic force of the first compression spring, the distance between the top plate and the intermediate plates, the distance between the plurality of intermediate plates and the distance between the intermediate plates and the bottom plate are increased, and the printed circuit board is convenient to take out.

In this embodiment, the flattening groove that is used for placing printed wiring board is all seted up to the upper surface of bottom plate and a plurality of intermediate lamella, the lower surface of roof and a plurality of intermediate lamella is fixed with two cutters relatively, and two cutters correspond with the both sides edge in flattening groove respectively.

In actual use, the printed circuit board is placed in the leveling groove, the size of the leveling groove is matched with the printed circuit board, when the top plate or the plurality of middle plates descend, the two cutters respectively cut off burrs on two sides of the printed circuit board until the cutting ends of the cutters contact with the bottom of the leveling groove, and the thickness of the cutters can be set according to actual requirements.

In this embodiment, be equipped with the slurcam between two cutters, the both ends of slurcam respectively with two cutter sliding connection, the last fixed surface of slurcam is connected with a plurality of second compression springs, the other end and roof or intermediate lamella fixed connection of a plurality of second compression springs.

In the in-service use, when the cutting end of cutter contacted with the bottom in flattening groove, a plurality of second compression springs were in compression state, and the slurcam was pressed the printed wiring board, and when the cutting end of cutter separated with the bottom in flattening groove, the slurcam moved down under the thrust effect of a plurality of second compression springs to make the slurcam promote printed wiring board, be favorable to the separation between printed wiring board and the cutter.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims (5)

1. The utility model provides a flattening device is used in production of printed wiring board, includes device box (1), its characterized in that: install heating element (2) and temperature sensor (3) in device box (1), be equipped with leveling assembly in device box (1) and be used for pressing lifting unit (4) of leveling assembly, leveling assembly with device box (1) can be dismantled and be connected, lifting unit (4) with device box (1) fixed connection, heating element (2), temperature sensor (3) and lifting unit (4) all are connected with the controller electricity.

2. The flattening apparatus for producing a printed wiring board according to claim 1, wherein: the leveling component comprises a bottom plate (6), two side plates (7) which are oppositely arranged and two L-shaped supporting columns (8), wherein the two ends of the bottom plate (6) are fixedly connected with the two side plates (7) respectively, the upper ends and the lower ends of the two side plates (7) are connected with the top wall and the bottom wall of the device box body (1) in a sliding manner respectively, the two supporting columns (8) correspond to the two side plates (7) one by one respectively, one ends of the supporting columns (8) are fixedly connected with the side plates (7), the other ends of the supporting columns (8) are fixedly connected with the bottom plate (6), a plurality of middle plates (72) and a top plate (71) are arranged between the two side plates (7), the two ends of the top plate (71) and the plurality of middle plates (72) are sleeved on the two supporting columns (8) respectively, the lifting component (4) is used for pressing the top plate (71), threaded rods (5) are in threaded connection with the two side walls of the device box body (1) uniformly, the end part of the threaded rod (5) is in threaded connection with the side plate (7).

3. The flattening apparatus for producing a printed wiring board according to claim 2, wherein: the two supporting columns (8) are respectively sleeved with a first compression spring (73) at the position between the top plate (71) and the middle plate (72), at the position between the middle plates (72) and at the position between the middle plate (72) and the bottom plate (6).

4. The flattening apparatus for producing a printed wiring board according to claim 2, wherein: the upper surfaces of the bottom plate (6) and the plurality of middle plates (72) are provided with leveling grooves (74) for placing printed circuit boards, the lower surfaces of the top plate (71) and the plurality of middle plates (72) are relatively fixed with two cutters (75), and the two cutters (75) correspond to the two side edges of the leveling grooves (74) respectively.

5. The flattening device for printed circuit board production according to claim 4, characterized in that: be equipped with between two cutters (75) slurcam (77), the both ends of slurcam (77) respectively with two cutters (75) sliding connection, the last fixed surface of slurcam (77) is connected with a plurality of second compression springs (76), the other end and roof (71) or intermediate lamella (72) fixed connection of a plurality of second compression springs (76).

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