CN217283504U

CN217283504U - Heat outlet structure for double-layer PCBA (printed circuit board assembly) board

Info

Publication number: CN217283504U
Application number: CN202122954501.1U
Authority: CN
Inventors: 孔强; 周梦先
Original assignee: Shenzhen Jinhong Xinghui Electronic Technology Co ltd
Current assignee: Shenzhen Jinhong Xinghui Electronic Technology Co ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2022-08-23
Anticipated expiration: 2031-11-29

Abstract

The utility model discloses a double-deck PCBA is heat conduction structure for board, including two base plates, two all be connected with the spliced pole between the base plate, and two base plate top outer walls have all seted up the installing port, two the same heat conduction mechanism of fixedly connected with between the installing port, heat conduction mechanism includes the heat pipe, and the both ends of heat pipe all are connected with the heat conduction case, two the heat conduction case evenly is cylindrical structure, the guard ring has been cup jointed to the outer wall of heat pipe, and the both sides of guard ring outer wall all set up the equidistant round hole respectively, two the air intake has all been seted up to heat conduction roof portion outer wall, and the inner wall fixedly connected with dust screen of two air intakes. The utility model discloses a set up heat conduction mechanism between two base plates, through the copper wire cooperation between heat conduction mechanism and the base plate, the heat that conveniently produces on the base plate is derived fast to improve the radiating efficiency of PCBA board, solved the poor problem of current PCBA board radiating efficiency.

Description

Heat outlet structure for double-layer PCBA (printed circuit board assembly) board

Technical Field

The utility model relates to a PCBA board technical field especially relates to a heat derivation structure for double-deck PCBA board.

Background

PCBA is short for English Printed Circuit Board Assembly, that is to say PCB blank Board through SMT upper part, or through the whole process of DIP plug-in components, short for PCBA. this is domestic commonly used writing method, Printed Circuit Board, also known as Printed Circuit Board, often uses English abbreviation PCB, is important electronic part, is the supporter of electronic component, is the provider of electronic components Circuit connection. It is called a "printed" circuit board because it is made using electronic printing techniques.

The existing double-layer PCBA board helps heat dissipation by means of a heat dissipation device additionally arranged in equipment, but the heat dissipation mode is relatively low in efficiency, and the local overheating condition of a circuit board in the actual working process often occurs, so that the heat dissipation efficiency is affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a heat leading-out structure for a double-layer PCBA plate.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat conduction structure for a double-layer PCBA comprises two substrates, connecting posts are connected between the two substrates, and the outer walls of the top parts of the two substrates are respectively provided with a mounting opening, the same heat conduction mechanism is fixedly connected between the two mounting openings and comprises a heat conduction pipe, the two ends of the heat conducting pipe are both connected with heat conducting boxes, the two heat conducting boxes are uniformly in a cylindrical structure, the outer wall of the heat conducting pipe is sleeved with a protective ring, and both sides of the outer wall of the protective ring are respectively provided with round holes at equal intervals, the outer walls of the tops of the two heat conduction boxes are respectively provided with an air inlet, and the inner walls of the two air inlets are fixedly connected with dust screens, the inner walls of the two substrates are both provided with copper wires, the interior of the heat conducting pipe is provided with a partition plate, and the inner walls of the two sides of the heat conduction pipe are provided with ventilation openings, and the inner walls of the two ventilation openings are fixedly connected with fans.

Preferably, circular grooves are formed in two sides of the inner wall of the mounting opening, and connecting mechanisms are arranged on the inner walls of the four circular grooves.

Preferably, the copper wire is connected to the two connecting mechanisms, and the inner wall of the heat conducting pipe is fixedly connected with the partition plate.

Preferably, the inner walls of the two sides of the heat conduction box are fixedly connected with heat conduction seats, and copper pipes are fixedly connected between the two heat conduction seats.

Preferably, the outer walls of the two sides of the heat conduction box are provided with fixing openings, the inner walls of the two fixing openings are fixedly connected with heat conduction sleeves, and heat conduction wires are connected between the two heat conduction sleeves and the two heat conduction seats.

Preferably, the connecting mechanism comprises an installation sleeve, the inner wall of the installation sleeve is connected with a heat conduction column in a sliding mode, the specification of the heat conduction column is matched with that of the heat conduction sleeve, and springs are connected between the heat conduction column and the installation sleeve.

Preferably, the connecting mechanism comprises an installation sleeve, the inner wall of the installation sleeve is connected with a heat conduction column in a sliding mode, the specification of the heat conduction column is matched with that of the heat conduction sleeve, and a spring rod is connected between the heat conduction column and the installation sleeve.

The utility model has the advantages that:

1. the utility model discloses a set up heat conduction mechanism between two base plates, through the copper wire cooperation between heat conduction mechanism and the base plate, the heat that conveniently produces on the base plate is derived fast to improve the radiating efficiency of PCBA board, solved the poor problem of current PCBA board radiating efficiency.

2. The utility model discloses a set up evenly distributed's copper wire on the base plate, be connected with through between the copper wire and can accelerate thermal transmission to thermal loss on the base plate accelerates.

3. The utility model discloses a two base plates of heat conduction mechanism cooperation, through the cooperation between the copper pipe that sets up on the heat pipe and the fan, the heat that conveniently transmits the copper wire out is derived fast to improve the efficiency of heat conduction.

Drawings

Fig. 1 is a schematic structural view of a heat-conducting structure for a double-layer PCBA board according to the present invention;

fig. 2 is a schematic view of a heat conduction mechanism of a heat conduction structure for a double-layer PCBA plate according to the present invention;

fig. 3 is a schematic cross-sectional structural view of a heat conduction mechanism of a heat conduction structure for a double-layered PCBA board according to the present invention;

fig. 4 is a schematic cross-sectional structural view of a substrate according to an embodiment of the heat conduction structure for a double-layer PCBA board of the present invention;

fig. 5 is a schematic diagram of a cross-sectional structure of a substrate according to an embodiment of the heat-conducting structure for a double-layer PCBA board of the present invention.

In the figure: 1. a substrate; 2. a heat conducting mechanism; 3. connecting columns; 4. a heat conducting pipe; 5. a heat conducting box; 6. a dust screen; 7. a guard ring; 8. a heat conducting seat; 9. a copper pipe; 10. a heat conducting sleeve; 11. A fan; 12. a partition plate; 13. a fixed port; 14. a copper wire; 15. installing a sleeve; 16. a heat-conducting column; 17. a spring; 18. a spring rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Example one

Referring to fig. 1-4, a heat conduction structure for a double-layer PCBA board, comprising two base plates 1, a connecting column 3 connected between the two base plates 1, and mounting ports 13 formed on the outer walls of the tops of the two base plates 1, a same heat conduction mechanism 2 fixedly connected between the two mounting ports 13, the heat conduction mechanism 2 comprising a heat conduction pipe 4, and heat conduction boxes 5 connected to the two ends of the heat conduction pipe 4, the two heat conduction boxes 5 being of a uniform cylindrical structure, a protection ring 7 sleeved on the outer wall of the heat conduction pipe 4, and round holes formed on the two sides of the outer wall of the protection ring 7, air inlets formed on the outer walls of the tops of the two heat conduction boxes 5, and a dust screen 6 fixedly connected to the inner walls of the two air inlets, copper wires 14 provided on the inner walls of the two base plates 1, partition plates 12 provided inside the air inlets 4, and vents formed on the inner walls of the two sides of the heat conduction pipe 4, and fans 11 fixedly connected to the inner walls of the two air inlets, circular slots have all been seted up to the both sides of two installing port 13 inner walls, and the inner wall of four circular slots is provided with coupling mechanism, copper wire 14 is connected on two coupling mechanism, the inner wall fixedly connected with baffle 12 of heat pipe 4, the equal fixedly connected with heat conduction seat 8 of the both sides inner wall of heat conduction case 5, and equal fixedly connected with copper pipe 9 between two heat conduction seats 8, the fixed port has all been seted up to the both sides outer wall of heat conduction case 5, and the inner wall fixedly connected with heat conduction cover 10 of two fixed ports, all be connected with the conducting wire between two heat conduction covers 10 and two heat conduction seats 8, coupling mechanism includes installation cover 15, and the inner wall sliding connection of installation cover 15 has heat conduction post 16, the specification of heat conduction post 16 and the specification phase-match of heat conduction cover 10, all be connected with spring 17 between heat conduction post 16 and the installation cover 15.

The working principle is as follows: during the use, when the electric elements on base plate 1 during operation, can produce a large amount of heats, these heats are transmitted to copper pipe 9 on the heat conduction case 5 by copper wire 14 in the base plate 1 on, fan 11 starts the air that drives in the heat pipe 4 and flows simultaneously, thereby work as and take the heat on the copper pipe 9 out, separate two fan 11 through baffle 12 simultaneously, can effectively avoid the mutual interference between fan 11, the heat conduction efficiency of heat conduction mechanism 2 has further been improved, through the cooperation between heat conduction seat 8 and the heat conduction cover 10, conveniently with the heat transfer on the copper wire 14 to copper pipe 9, cooperation through dust screen 6, can effectively avoid the dust to get into in the heat pipe 4, start the joint of heat conduction post 16 on heat conduction case 5 through spring 17, the efficiency of heat conduction has been improved.

Example two

Referring to fig. 1-3 and 5, a heat conduction structure for a double-layer PCBA plate comprises two base plates 1, a connecting column 3 is connected between the two base plates 1, mounting ports 13 are formed on the outer walls of the tops of the two base plates 1, the same heat conduction mechanism 2 is fixedly connected between the two mounting ports 13, the heat conduction mechanism 2 comprises a heat conduction pipe 4, two ends of the heat conduction pipe 4 are connected with heat conduction boxes 5, the two heat conduction boxes 5 are uniformly cylindrical, the outer wall of the heat conduction pipe 4 is sleeved with a protection ring 7, round holes are formed on two sides of the outer wall of the protection ring 7 at equal intervals, air inlets are formed on the outer walls of the tops of the two heat conduction boxes 5, dustproof nets 6 are fixedly connected to the inner walls of the two air inlets, copper wires 14 are arranged on the inner walls of the two base plates 1, partition plates 12 are arranged inside the heat conduction pipe 4, ventilation ports are formed on the inner walls of two sides of the heat conduction pipe 4, and fans 11 are fixedly connected to the inner walls of the two ventilation ports, the circular slot has all been seted up to the both sides of two installing port 13 inner walls, and the inner wall of four circular slots is provided with coupling mechanism, copper wire 14 is connected on two coupling mechanism, the inner wall fixedly connected with baffle 12 of heat pipe 4, the equal fixedly connected with heat conduction seat 8 of the both sides inner wall of heat conduction case 5, and equal fixedly connected with copper pipe 9 between two heat conduction seats 8, the fixed port has all been seted up to the both sides outer wall of heat conduction case 5, and the inner wall fixedly connected with heat conduction cover 10 of two fixed ports, all be connected with the conducting wire between two heat conduction covers 10 and two heat conduction seats 8, coupling mechanism includes installation cover 15, and the inner wall sliding connection of installation cover 15 has heat conduction post 16, the specification of heat conduction post 16 and the specification phase-match of heat conduction cover 10, be connected with 18 spring levers between heat conduction post 16 and the installation cover 15, and the interior wall of installation cover is provided with

The working principle is as follows: during the use, when the electric elements on base plate 1 during operation, can produce a large amount of heats, these heats are transmitted to the copper pipe 9 on the heat conduction case 5 by copper wire 14 in the base plate 1 on, fan 11 starts the air that drives in the heat pipe 4 and flows simultaneously, thereby work as take the heat on the copper pipe 9 out, separate two fan 11 through baffle 12 simultaneously, can effectively avoid the mutual interference between fan 11, the heat conduction efficiency of heat conduction mechanism 2 has further been improved, through the cooperation between heat conduction seat 8 and the heat conduction cover 10, conveniently with the heat transfer on the copper wire 14 to the copper pipe 9, cooperation through dust screen 6, can effectively avoid the dust to get into in the heat pipe 4, start on the heat conduction case 5 of joint through spring beam 18, the efficiency of heat conduction has been improved.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A heat conduction structure for a double-layer PCBA board comprises two base plates (1) and is characterized in that a connecting column (3) is connected between the two base plates (1), mounting ports (13) are formed in the outer walls of the tops of the two base plates (1), the same heat conduction mechanism (2) is fixedly connected between the two mounting ports (13), the heat conduction mechanism (2) comprises a heat conduction pipe (4), heat conduction boxes (5) are connected to the two ends of the heat conduction pipe (4), the two heat conduction boxes (5) are of even cylindrical structures, a protection ring (7) is sleeved on the outer wall of the heat conduction pipe (4), round holes are formed in the two sides of the outer wall of the protection ring (7) respectively at equal intervals, air inlets are formed in the outer walls of the tops of the two heat conduction boxes (5), dust screens (6) are fixedly connected to the inner walls of the two air inlets, copper wires (14) are arranged on the inner walls of the two base plates (1), the heat conduction pipe (4) is internally provided with a partition plate (12), the inner walls of two sides of the heat conduction pipe (4) are provided with vents, and the inner walls of the vents are fixedly connected with fans (11).

2. The heat conduction structure for the double-layer PCBA plate as recited in claim 1, wherein two sides of the inner walls of the two mounting ports (13) are provided with circular grooves, and the inner walls of the four circular grooves are provided with connecting mechanisms.

3. A heat extraction structure for a double-layer PCBA board according to claim 2, wherein the copper wires (14) are connected to the two connection means, and the inner wall of the heat pipe (4) is fixedly connected with the partition plate (12).

4. A heat lead-out structure for a double-layered PCBA board according to claim 3, wherein heat conduction seats (8) are fixedly connected to both inner walls of the heat conduction box (5), and a copper pipe (9) is fixedly connected between both heat conduction seats (8).

5. The heat leading-out structure for the double-layer PCBA board as recited in claim 4, wherein fixing openings are formed on the outer walls of both sides of the heat conducting box (5), heat conducting sleeves (10) are fixedly connected to the inner walls of the two fixing openings, and heat conducting wires are connected between the two heat conducting sleeves (10) and the two heat conducting bases (8).

6. A heat extraction structure for a double-layer PCBA board as claimed in claim 5, wherein the connection mechanism comprises a mounting sleeve (15), and the inner wall of the mounting sleeve (15) is slidably connected with a heat conduction column (16), the specification of the heat conduction column (16) is matched with that of the heat conduction sleeve (10), and a spring (17) is connected between the heat conduction column (16) and the mounting sleeve (15).

7. A heat extraction structure for a double-layer PCBA board as claimed in claim 5, wherein the connection means comprises a mounting sleeve (15), and the inner wall of the mounting sleeve (15) is slidably connected with a heat conduction column (16), the size of the heat conduction column (16) is matched with that of the heat conduction sleeve (10), and a spring rod (18) is connected between the heat conduction column (16) and the mounting sleeve (15).