CN217280728U

CN217280728U - Crystal expanding machine for LED production equipment

Info

Publication number: CN217280728U
Application number: CN202221136242.XU
Authority: CN
Inventors: 周军龙; 王党杰; 郭宝宝; 王鹏远; 张棒棒
Original assignee: Henan Insoar Semiconductor Lighting Technical Co ltd
Current assignee: Henan Insoar Semiconductor Lighting Technical Co ltd
Priority date: 2022-05-12
Filing date: 2022-05-12
Publication date: 2022-08-23
Anticipated expiration: 2032-05-12

Abstract

The utility model discloses a expand brilliant machine that LED production facility used, including workstation and fixed establishment, the workstation: its inside diapire middle part is equipped with expands brilliant electric putter, expands brilliant electric putter's flexible end top and is equipped with down the disc, the slide opening sliding connection of lower disc and workstation upper surface middle part, the upper surface of lower disc is equipped with heating mechanism, fixed establishment: set up in the upper surface of workstation, the upper surface middle part of workstation is equipped with the fixed slot of installing with the fixed establishment cooperation, wherein: still include the PLC controller, the PLC controller sets up in the front surface right-hand member of workstation, and the input electricity of PLC controller is connected in external power source, expands brilliant electric putter's input electricity and connects in the output of PLC controller, and this LED production facility is with expanding brilliant machine, makes the heating effect of wafer film more even, improves and expands brilliant effect, and the convenience is fixed the position of wafer film, reduces the input of manpower resources, improves production efficiency.

Description

Crystal expanding machine for LED production equipment

Technical Field

The utility model relates to an expand brilliant machine technical field, specifically be an expand brilliant machine that LED production facility used.

Background

The crystal expanding machine is also called as a wafer expanding machine or a wafer expanding machine, is used for producing the distance between the expanded wafers such as an LED luminous tube, a nixie tube, a backlight source and the like, and is widely applied to the crystal grain expanding process in the production of light emitting diodes, medium and small power triodes, backlight sources, LEDs, integrated circuits and some special semiconductor devices.

In the production process of the LED, the distance between the LED wafers is very small, the distance between the LED wafers needs to be enlarged through a wafer expanding machine before the LED wafers are subjected to die bonding, the distance between the LED wafers is enlarged through stretching a wafer film in a common wafer expanding mode, and after the wafer expansion is finished, the stretching state of the wafer film is maintained through a wafer ring.

However, in the process of crystal expansion of many crystal expansion machines, the position of the wafer film can be fixed by manual work, more time is consumed, the production efficiency is affected, and the crystal expansion effect is easily affected because some devices heat the wafer film unevenly before crystal expansion.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to overcome current defect, provide a LED production facility is with expanding brilliant machine, the convenience is to the rigidity of wafer membrane, reduces human resources's input, makes the heating effect of wafer membrane more even, can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model provides a following technical scheme: a wafer expanding machine for LED production equipment comprises a workbench and a fixing mechanism;

a workbench: a crystal expansion electric push rod is arranged in the middle of the inner bottom wall of the lower disc, a lower disc is arranged at the top of the telescopic end of the crystal expansion electric push rod, the lower disc is connected with a sliding hole in the middle of the upper surface of the workbench in a sliding mode, and a heating mechanism is arranged on the upper surface of the lower disc;

a fixing mechanism: the middle part of the upper surface of the workbench is provided with a fixed groove which is matched with the fixed mechanism for installation;

wherein: still include the PLC controller, the PLC controller sets up in the front surface right-hand member of workstation, the input electricity of PLC controller is connected in external power source, expand brilliant electric putter's input electricity and connect in the output of PLC controller, make the heating effect of wafer membrane more even, improve and expand brilliant effect, conveniently expand the brilliant to the wafer, improve production efficiency, the convenience is fixed the position of wafer membrane, avoid the wafer membrane to produce the position removal expanding brilliant in-process, reduce manpower resources's input, accelerate the brilliant speed of expanding to the wafer, and the production efficiency is improved.

Further, fixed establishment includes support frame, electric putter and goes up the disc, the support frame sets up in the upper surface rear end of workstation, is equipped with electric putter in the mounting hole of support frame upper end, and electric putter's flexible end lower extreme is equipped with the disc, and the lower surface middle part of going up the disc is equipped with the rubber fixed disk, and electric putter's input electricity is connected in the output of PLC controller, the convenient installation to brilliant ring.

Further, fixed establishment still includes collar, lower slide, solid fixed ring and guide post, the guide post sets up both ends about the upper surface of workstation respectively, the upper end of guide post all with the diaphragm lower fixed surface connection of support frame upper end, the equal vertical sliding connection of extrados of guide post has the lower slide, the relative intrados of two lower slides all with the extrados fixed connection of collar, the lower surface of collar be equipped with the solid fixed ring of fixed slot cooperation installation, conveniently make the fixed position of wafer membrane.

Further, fixed establishment still includes slide and spring, the slide sets up both ends about the extrados of last disc respectively, and the slide is respectively through the slide opening and the vertical sliding connection of adjacent guide post that its outer end set up, and the spring overlaps respectively and locates the extrados upper end of guide post, the upper end of spring all with slide fixed connection, the lower extreme of spring all with lower slide fixed connection, provide the space for the secondary of last disc moves down.

Further, heating mechanism includes mounting groove, heating pipe and heat conduction dish, the mounting groove sets up in the upper surface of lower disc, and the inside of mounting groove is equipped with the heating pipe, and the heat conduction dish sets up in the upper surface of lower disc, and the input electricity of heating pipe is connected in the output of PLC controller, heats the wafer membrane.

Furthermore, the heating pipe is of a plane thread structure, so that the heating effect of the wafer film is more uniform.

Furthermore, a temperature sensor is arranged in the mounting groove at the front end of the upper surface of the lower disc, and the output end of the temperature sensor is electrically connected to the input end of the PLC controller to detect the heated temperature.

Compared with the prior art, the beneficial effects of the utility model are that: this expand brilliant machine that LED production facility used has following benefit:

1. the heating pipe is started by the PLC controller, the heat generated by the heating pipe is conducted to the surface of the heat conducting disc, the temperature sensor can detect the temperature of the surface of the heat conducting disc, the detected result is transmitted to the PLC controller, the temperature of the surface of the heat conducting disc reaches a set value through the regulation and control of the PLC controller, then the inner crystal ring is sleeved in the mounting groove at the upper end of the lower disc, the outer crystal ring is sleeved on the rubber fixing disc at the lower surface of the upper disc, the crystal wafer film with the crystal wafer is placed on the upper surface of the heat conducting disc, the crystal wafer film shrinks when being heated, the crystal wafer film is tightly attached to the surface of the heat conducting disc, then the position of the crystal wafer film is fixed, the crystal expansion electric push rod is started, the expansion end of the crystal expansion electric push rod pushes the lower disc to move upwards, the middle part of the crystal wafer film is stretched, the distance between the crystal wafers on the crystal wafer film is increased, and the crystal wafer is expanded, the heating pipe of plane screw thread shape can make the heating effect of wafer membrane more even, improves and expands brilliant effect, conveniently expands the brilliant to the wafer, improves production efficiency.

2. Start electric putter, electric putter's flexible end promotes disc and upper slide downstream, because be connected through the spring between upper slide and the lower slide, so make lower slide plate slip collar and solid fixed ring downstream, insert inside the fixed slot until solid fixed ring's lower extreme, conveniently fix the position of wafer film, avoid the wafer film to produce the position removal at expanding brilliant in-process, reduce human resources's input for expand brilliant speed to the wafer, improve production efficiency.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the fixing mechanism of the present invention;

fig. 3 is a schematic structural diagram of the heating mechanism of the present invention.

In the figure: 1 workbench, 2 temperature sensors, 3 fixing grooves, 4PLC controllers, 5 lower discs, 6 crystal expansion electric push rods, 7 heating mechanisms, 71 mounting grooves, 72 heating pipes, 73 heat conducting discs, 8 fixing mechanisms, 81 upper sliding plates, 82 springs, 83 mounting rings, 84 lower sliding plates, 85 fixing rings, 86 guide columns, 87 supporting frames, 88 electric push rods, 89 upper discs and 9 rubber fixing discs.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present embodiment provides a technical solution: a wafer expanding machine for LED production equipment comprises a workbench 1 and a fixing mechanism 8;

a workbench 1: the middle part of the bottom wall of the wafer expanding electric push rod 6 is provided with a wafer expanding electric push rod 6, the top of the telescopic end of the wafer expanding electric push rod 6 is provided with a lower disc 5, the lower disc 5 is connected with a sliding hole in the middle part of the upper surface of the workbench 1 in a sliding way, the wafer expanding electric push rod 6 is started, the telescopic end of the wafer expanding electric push rod 6 pushes the lower disc 5 to move upwards, the middle position of a wafer film is stretched, the distance between wafers is expanded, the upper surface of the lower disc 5 is provided with a heating mechanism 7, the heating mechanism 7 comprises a mounting groove 71, a heating pipe 72 and a heat conducting disc 73, the mounting groove 71 is arranged on the upper surface of the lower disc 5, the heating pipe 72 is arranged inside the mounting groove 71, the heat conducting disc 73 is arranged on the upper surface of the lower disc 5, the input end of the heating pipe 72 is electrically connected with the output end of the PLC 4, the heating pipe 72 is started, the heat generated by the heating pipe 72 is conducted to the surface of the heat conducting disc 73 to heat the wafer film, the wafer film is contracted when being heated, so that the wafer film is tightly attached to the surface of the heat conducting disc 73, the heating pipe 72 is of a plane thread structure, the heating effect is more uniform, the temperature sensor 2 is arranged in the mounting groove at the front end of the upper surface of the lower disc 5, the output end of the temperature sensor 2 is electrically connected to the input end of the PLC 4, the temperature on the surface of the heat conducting disc 73 is detected, and the accuracy of the heating temperature is ensured;

the fixing mechanism 8: set up in the upper surface of workstation 1, the upper surface middle part of workstation 1 is equipped with the fixed slot 3 of the cooperation installation with fixed establishment 8, fixed establishment 8 includes support frame 87, electric putter 88 and last disc 89, support frame 87 sets up in the upper surface rear end of workstation 1, be equipped with electric putter 88 in the mounting hole of support frame 87 upper end, the flexible end lower extreme of electric putter 88 is equipped with last disc 89, the lower surface middle part of last disc 89 is equipped with rubber fixed disk 9, outer brilliant ring cover is established on rubber fixed disk 9, start electric putter 88, the flexible end of electric putter 88 promotes last disc 89 and moves down, until pressing outer brilliant ring to the inside of inner brilliant ring, the rigidity between inner brilliant ring and the outer brilliant ring, make the wafer film keep the state after expanding brilliant, the input electricity of electric putter 88 is connected in the output of PLC controller 4, fixed establishment 8 still includes collar 83, fixed establishment 8, The lower sliding plate 84, the fixing ring 85 and the guide posts 86, the guide posts 86 are respectively arranged at the left and right ends of the upper surface of the workbench 1, the upper ends of the guide posts 86 are all fixedly connected with the lower surface of the transverse plate at the upper end of the supporting frame 87, the outer cambered surfaces of the guide posts 86 are all vertically and slidably connected with the lower sliding plate 84, the opposite inner cambered surfaces of the two lower sliding plates 84 are all fixedly connected with the outer cambered surface of the mounting ring 83, the lower surface of the mounting ring 83 is provided with the fixing ring 85 which is matched and installed with the fixing groove 3, because the upper sliding plate 81 is connected with the lower sliding plate 84 through the spring 82, the upper sliding plate 81 moves to drive the lower sliding plate 84, the mounting ring 83 and the fixing ring 85 to move downwards until the lower end of the fixing ring 85 is inserted into the fixing groove 3 to fix the position of the wafer film, the fixing mechanism 8 further comprises the upper sliding plate 81 and the spring 82, the upper sliding plates 81 are respectively arranged at the left and right ends of the outer cambered surfaces of the upper circular disc 89, the upper sliding plate 81 is respectively vertically and slidably connected with the adjacent guide posts 86 through the sliding holes arranged at the outer ends, the springs 82 are respectively sleeved at the upper ends of the outer cambered surfaces of the guide posts 86, the upper ends of the springs 82 are fixedly connected with the upper sliding plate 81, and the lower ends of the springs 82 are fixedly connected with the lower sliding plate 84 to provide space for the secondary downward movement of the upper disc 89;

wherein: still include PLC controller 4, PLC controller 4 sets up in the front surface right-hand member of workstation 1, and the input electricity of PLC controller 4 is connected in external power source, expands brilliant electric putter 6's input electricity and connects in PLC controller 4's output, controls whole device's start-up and stop.

The utility model provides a pair of LED production facility is with expanding brilliant machine's theory of operation as follows: when the heating tube 72 is started by the PLC 4, the heat generated by the heating tube 72 is conducted to the surface of the heat conducting disc 73, the temperature sensor 2 can detect the temperature of the surface of the heat conducting disc 73 and transmit the detected result to the PLC 4, the temperature of the surface of the heat conducting disc 73 reaches a set value through the regulation and control of the PLC 4, then the inner wafer ring is sleeved in the mounting groove at the upper end of the lower disc 5, the outer wafer ring is sleeved on the rubber fixing disc 9 at the lower surface of the upper disc 89, the wafer film with the wafer is placed on the upper surface of the heat conducting disc 73 and shrinks under heat to enable the wafer film to be tightly attached to the surface of the heat conducting disc 73, then the electric push rod 88 is started, the telescopic end of the electric push rod 88 pushes the upper disc 89 and the upper sliding plate 81 to move downwards, because the upper sliding plate 81 is connected with the lower sliding plate 84 through the spring 82, the lower sliding plate 84 drives the mounting ring 83 and the fixing ring 85 to move downwards, until the lower end of the fixing ring 85 is inserted into the fixing groove 3, the position of the wafer film is fixed, the wafer expanding electric push rod 6 is started, the telescopic end of the wafer expanding electric push rod 6 pushes the lower disc 5 to move upwards, the middle part of the wafer film is stretched, the distance between wafers on the wafer film is increased, the wafer is expanded, after the wafer expansion is completed, the electric push rod 88 is started again, the upper disc 89 drives the upper sliding plate 81 to continue to move downwards, the spring 82 contracts until the outer wafer ring is pressed into the inner wafer ring, the position between the inner wafer ring and the outer wafer ring is fixed, the wafer film is kept in a state after the wafer expansion, then the electric push rod 88 and the wafer expanding electric push rod 6 reset, and the wafer film after the wafer expansion is taken out.

It should be noted that the PLC controller 4 disclosed in the above embodiment may be a PLC controller of a TPC8-8TD model, the die-expanding electric push rod 6, the electric push rod 88, the heating tube 72, and the temperature sensor 2 may be freely configured according to an actual application scenario, both the die-expanding electric push rod 6 and the electric push rod 88 may be an ANT-52 model electric push rod, the heating tube 72 may be a spiral heating tube of a thickened stainless steel 220V3KW model, the temperature sensor 2 may be a temperature sensor of an IMG-5449 model, and the PLC controller 4 controls the die-expanding electric push rod 6, the electric push rod 88, the heating tube 72, and the temperature sensor 2 to work by using a method commonly used in the prior art.

The above is only the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention can be used in other related technical fields, directly or indirectly, or in the same way as the present invention.

Claims

1. The utility model provides a expand brilliant machine that LED production facility used which characterized in that: comprises a workbench (1) and a fixing mechanism (8);

stage (1): a crystal expansion electric push rod (6) is arranged in the middle of the inner bottom wall of the lower disc, a lower disc (5) is arranged at the top of the telescopic end of the crystal expansion electric push rod (6), the lower disc (5) is connected with a sliding hole in the middle of the upper surface of the workbench (1) in a sliding mode, and a heating mechanism (7) is arranged on the upper surface of the lower disc (5);

fixing mechanism (8): the fixing groove (3) is arranged on the upper surface of the workbench (1), and the middle part of the upper surface of the workbench (1) is provided with the fixing groove (3) which is matched with the fixing mechanism (8);

wherein: still include PLC controller (4), PLC controller (4) set up in the front surface right-hand member of workstation (1), and the input electricity of PLC controller (4) is connected in external power source, and the input electricity of expanding brilliant electric putter (6) is connected in the output of PLC controller (4).

2. The wafer expander for LED production equipment according to claim 1, characterized in that: fixing mechanism (8) are including support frame (87), electric putter (88) and last disc (89), support frame (87) set up in the upper surface rear end of workstation (1), are equipped with electric putter (88) in the mounting hole of support frame (87) upper end, and the flexible end lower extreme of electric putter (88) is equipped with disc (89), and the lower surface middle part of going up disc (89) is equipped with rubber fixed disk (9), and the input electricity of electric putter (88) is connected in the output of PLC controller (4).

3. The wafer expander for LED production equipment according to claim 2, wherein: fixed establishment (8) still include collar (83), lower slide (84), solid fixed ring (85) and guide post (86), both ends about the upper surface of workstation (1) are set up respectively in guide post (86), the upper end of guide post (86) all with the diaphragm lower fixed surface of support frame (87) upper end be connected, the equal vertical sliding connection of extrados of guide post (86) has slide (84) down, the relative intrados of two slide (84) all with the extrados fixed connection of collar (83), the lower surface of collar (83) is equipped with solid fixed ring (85) of installing with fixed slot (3) cooperation.

4. The wafer expander for LED production equipment according to claim 3, wherein: fixed establishment (8) still include top slide (81) and spring (82), top slide (81) set up both ends about the extrados of last disc (89) respectively, and top slide (81) are respectively through the slide opening and the vertical sliding connection of adjacent guide post (86) that its outer end set up, and the extrados upper end of guide post (86) is located in cover respectively in spring (82), the upper end of spring (82) all with top slide (81) fixed connection, the lower extreme of spring (82) all with lower slide (84) fixed connection.

5. The wafer expanding machine for LED production equipment according to claim 1, wherein the wafer expanding machine comprises: the heating mechanism (7) comprises a mounting groove (71), a heating pipe (72) and a heat conducting disc (73), the mounting groove (71) is formed in the upper surface of the lower disc (5), the heating pipe (72) is arranged inside the mounting groove (71), the heat conducting disc (73) is arranged on the upper surface of the lower disc (5), and the input end of the heating pipe (72) is electrically connected to the output end of the PLC (4).

6. The wafer expander for LED production equipment according to claim 5, wherein: the heating pipe (72) is of a plane thread type structure.

7. The wafer expander for LED production equipment according to claim 1, characterized in that: and a temperature sensor (2) is arranged in the mounting groove at the front end of the upper surface of the lower disc (5), and the output end of the temperature sensor (2) is electrically connected with the input end of the PLC (4).