CN217276576U - Temperature sampling circuit and slide processing system - Google Patents
Temperature sampling circuit and slide processing system Download PDFInfo
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- CN217276576U CN217276576U CN202221038599.4U CN202221038599U CN217276576U CN 217276576 U CN217276576 U CN 217276576U CN 202221038599 U CN202221038599 U CN 202221038599U CN 217276576 U CN217276576 U CN 217276576U
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Abstract
The application provides a temperature sampling circuit and slide processing system, temperature sampling circuit includes: the temperature sensor, the conversion unit, the amplification unit and the MCU, wherein the input end of the conversion unit is connected with the temperature sensor, the output end of the conversion unit is connected with the input end of the amplification unit, and the output end of the amplification unit is connected with the acquisition pin of the MCU; the conversion unit is used for converting the acquired signal of the temperature sensor to obtain a first voltage signal and transmitting the first voltage signal to the amplification unit; the amplifying unit is used for amplifying the first voltage signal and outputting a second voltage signal; the MCU is used for converting the second voltage signal to obtain a temperature value. Through amplifying the first voltage signal, the temperature resolution of the temperature sampling circuit is increased, and the accuracy of temperature collection is improved.
Description
Technical Field
The application relates to the field of circuits, in particular to a temperature sampling circuit and a slide processing system.
Background
A fully automated slide processing system is an automated instrument for sample processing prior to pathological analysis of cytological samples, histological samples (either punch or neutral formalin fixed paraffin embedded tissue section samples), and blood samples. The operation of the full-automatic slide processing system is temperature-related, and the temperature variation has a profound effect on the operation result.
Therefore, the full-automatic slide processing system needs to realize accurate temperature control in the working process. And when the temperature is accurately controlled, the current temperature is accurately acquired. Therefore, how to accurately acquire the current temperature becomes a problem which is continuously concerned by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
It is an object of the present application to provide a temperature sampling circuit and a slide processing system to at least partially ameliorate the above problems.
In order to achieve the above purpose, the embodiments of the present application employ the following technical solutions:
in a first aspect, an embodiment of the present application provides a temperature sampling circuit, where the temperature sampling circuit includes: the temperature sensor, the conversion unit, the amplification unit and the MCU, wherein the input end of the conversion unit is connected with the temperature sensor, the output end of the conversion unit is connected with the input end of the amplification unit, and the output end of the amplification unit is connected with the acquisition pin of the MCU;
the conversion unit is used for converting the acquired signal of the temperature sensor to obtain a first voltage signal and transmitting the first voltage signal to the amplification unit;
the amplifying unit is used for amplifying the first voltage signal and outputting a second voltage signal;
and the MCU is used for converting the second voltage signal to obtain a temperature value.
Optionally, the conversion unit includes the AD84595 chip, the positive end of input of AD84595 chip with temperature sensor's positive end is connected, the input negative terminal of AD84595 chip with temperature sensor's negative end is connected.
Optionally, the conversion unit further includes a first resistor, a second resistor, a first capacitor, and a second capacitor;
one end of the first resistor is connected to the positive input end of the AD84595 chip, the other end of the first resistor is connected to the positive end of the temperature sensor, one end of the second resistor is connected to the negative input end of the AD84595 chip, and the other end of the second resistor is connected to the negative end of the temperature sensor;
one pole of the first capacitor is connected between the first resistor and the AD84595 chip, one pole of the second capacitor is connected between the second resistor and the AD84595 chip, and the other pole of the first capacitor and the other pole of the second capacitor are both grounded.
Optionally, the conversion unit further includes a third capacitor and a fourth capacitor, one pole of the third capacitor and one pole of the fourth capacitor are both connected to the positive power supply terminal of the AD84595 chip, and the other pole of the third capacitor and the other pole of the fourth capacitor are both connected to ground.
Optionally, the amplifying unit includes an operational amplifier, a third resistor, and a fourth resistor;
the non-inverting input end of the operational amplifier is connected with the output end of the conversion unit, one end of the fourth resistor is connected with one end of the third resistor, the other end of the fourth resistor is connected with the output end of the operational amplifier, the other end of the third resistor is connected to the ground, and the inverting input end of the operational amplifier is connected between the third resistor and the fourth resistor.
Optionally, the amplifying unit further includes a fifth resistor and a fifth capacitor;
one end of the fifth resistor is connected to the output end of the conversion unit, and the other end of the fifth resistor is connected to the non-inverting input end of the operational amplifier;
one pole of the fifth capacitor is grounded, and the other pole of the fifth capacitor is connected between the fifth resistor and the non-inverting input end of the operational amplifier.
Optionally, the amplifying unit further comprises a sixth capacitor;
one pole of the sixth capacitor is connected to the positive power supply terminal of the operational amplifier, and the other pole of the sixth capacitor is connected to ground.
Optionally, the temperature sampling circuit further comprises: the filter protection unit is arranged between the amplification unit and the MCU;
the filter protection unit is used for limiting the maximum voltage input to the acquisition pin of the MCU, and the maximum voltage is smaller than the breakdown voltage of the acquisition pin of the MCU.
Optionally, the filter protection unit includes a sixth resistor, a seventh capacitor, and a diode;
one end of the sixth resistor is connected with the output end of the amplifying unit, the other end of the sixth resistor is connected with one pole of the seventh capacitor, the other pole of the seventh capacitor is grounded, the positive end of the diode is connected between the sixth resistor and the seventh capacitor, the negative end of the diode is connected to a reference power supply, and the acquisition pin of the MCU is connected between the diode and the sixth resistor.
In a second aspect, embodiments of the present application provide a slide processing system including a temperature sampling circuit as described above.
Compared with the prior art, the temperature sampling circuit and the slide glass processing system provided by the embodiment of the application comprise: the temperature sensor, the conversion unit, the amplification unit and the MCU, wherein the input end of the conversion unit is connected with the temperature sensor, the output end of the conversion unit is connected with the input end of the amplification unit, and the output end of the amplification unit is connected with the acquisition pin of the MCU; the conversion unit is used for converting the acquired signal of the temperature sensor to obtain a first voltage signal and transmitting the first voltage signal to the amplification unit; the amplifying unit is used for amplifying the first voltage signal and outputting a second voltage signal; the MCU is used for converting the second voltage signal to obtain a temperature value. Through amplifying the first voltage signal, the temperature resolution of the temperature sampling circuit is increased, and the accuracy of temperature collection is improved.
In order to make the aforementioned objects, features and advantages of the present application comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and it will be apparent to those skilled in the art that other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic connection diagram of a temperature sampling circuit according to an embodiment of the present disclosure;
fig. 2 is a schematic connection diagram of a conversion unit provided in an embodiment of the present application;
fig. 3 is a schematic connection diagram of an amplifying unit provided in an embodiment of the present application;
fig. 4 is a schematic connection diagram of a temperature sampling circuit according to an embodiment of the present disclosure;
fig. 5 is a schematic connection diagram of a filter protection unit according to an embodiment of the present application.
In the figure: 10-a temperature sensor; 20-a conversion unit; 30-an amplifying unit; 40-MCU; 50-a filter protection unit.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally found in use of products of the application, and are used only for convenience in describing the present application and for simplification of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
The target stability precision requirement of the slide processing system is +/-0.5 ℃, a K-type thermocouple can be used for temperature measurement, and a MAX6675 integrated digital conversion chip can be used as a measurement circuit. Because the MAX6675 sampling digital SPI interface, the temperature resolution is 0.25 ℃ in the full range, although the temperature resolution can meet the temperature accuracy requirement of the system, the temperature control based on the temperature resolution is difficult to achieve the required stable accuracy in the actual control. For analysis reasons, the range of the K-type thermocouple applicable to MAX6675 is very wide, and can range from-200 ℃ to +1300 ℃, and the measuring range is too wide, so that the 12-bit AD sampling is difficult to achieve very high sampling precision.
In order to overcome the above problem, an embodiment of the present application provides a temperature sampling circuit, as shown in fig. 1, the temperature sampling circuit includes: the temperature sensor 10, the conversion unit 20, the amplification unit 30 and the MCU40, the input end of the conversion unit 20 is connected with the temperature sensor 10, the output end of the conversion unit 20 is connected with the input end of the amplification unit 30, and the output end of the amplification unit 30 is connected with the acquisition pin of the MCU 40.
The conversion unit 20 is configured to convert the collected signal of the temperature sensor 10 to obtain a first voltage signal, and transmit the first voltage signal to the amplification unit 30.
The amplifying unit 30 is configured to amplify the first voltage signal and output a second voltage signal.
The MCU40 is used to convert the second voltage signal to obtain a temperature value.
The temperature sensor in embodiments of the present application can be a type K thermocouple, which can be disposed within a reaction well of a slide processing system. Through amplifying the first voltage signal, the temperature resolution of the temperature sampling circuit is increased, the accuracy of temperature collection is improved, and accurate temperature control is realized.
To sum up, the embodiment of the present application provides a temperature sampling circuit, the temperature sampling circuit includes: the temperature sensor, the conversion unit, the amplification unit and the MCU, wherein the input end of the conversion unit is connected with the temperature sensor, the output end of the conversion unit is connected with the input end of the amplification unit, and the output end of the amplification unit is connected with the acquisition pin of the MCU; the conversion unit is used for converting the acquired signal of the temperature sensor to obtain a first voltage signal and transmitting the first voltage signal to the amplification unit; the amplifying unit is used for amplifying the first voltage signal and outputting a second voltage signal; the MCU is used for converting the second voltage signal to obtain a temperature value. Through amplifying the first voltage signal, the temperature resolution of the temperature sampling circuit is increased, and the accuracy of temperature collection is improved.
Referring to fig. 2, the conversion unit 20 includes an AD84595 chip U1, an input positive terminal of the AD84595 chip U1 is connected to the positive terminal of the temperature sensor 10, and an input negative terminal of the AD84595 chip U1 is connected to the negative terminal of the temperature sensor 10.
Optionally, the AD84595 chip U1 is configured to convert the electromotive force between the hot and cold terminals (positive and negative terminals) of the temperature sensor 10 into an analog voltage signal, i.e., a first voltage signal.
In one possible implementation, the AD84595 chip U1 may be replaced by another thermocouple regulator, which is not limited herein.
With reference to fig. 2, in a possible implementation manner, the converting unit 20 further includes a first resistor R1, a second resistor R2, a first capacitor C1, and a second capacitor C2;
one end of a first resistor R1 is connected to the input positive terminal of the AD84595 chip U1, the other end of the first resistor R11 is connected to the positive terminal of the temperature sensor 10, one end of a second resistor R2 is connected to the input negative terminal of the AD84595 chip U1, and the other end of the second resistor R2 is connected to the negative terminal of the temperature sensor 10;
one pole of the first capacitor C1 is connected between the first resistor R1 and the AD84595 chip U1, one pole of the second capacitor C2 is connected between the second resistor R2 and the AD84595 chip U1, and the other pole of the first capacitor C1 and the other pole of the second capacitor C2 are both grounded.
Alternatively, the resistances of the first resistor R1 and the second resistor R2 may be 100K, and the capacitances of the first capacitor C1 and the second capacitor C2 may be 10 nF.
It should be appreciated that the first resistor R1 and the first capacitor C1 form a low pass filter for the positive side of the thermocouple and the second resistor R2 and the second capacitor C2 form a low pass filter for the negative side of the thermocouple to filter out interfering signals.
With reference to fig. 2, in a possible implementation manner, the converting unit 20 further includes a third capacitor C3 and a fourth capacitor C4, wherein one pole of the third capacitor C3 and one pole of the fourth capacitor C4 are both connected to the positive power supply terminal of the AD84595 chip U1, and the other pole of the third capacitor C3 and the other pole of the fourth capacitor C4 are both connected to ground.
Optionally, the third capacitor has a capacitance of 10uF and the fourth capacitor has a capacitance of 100 nF. The third capacitor C3 and the fourth capacitor C4 are used for decoupling the power supply of the AD8495 chip U1.
It should be understood that the positive power supply terminal of the AD84595 chip U1 is connected to the power supply AVCC.
With continued reference to fig. 2, in one possible approach, the converting unit 20 further includes a seventh resistor R7 and an eighth capacitor C8. One end of the seventh resistor R7 is grounded, and the other end of the seventh resistor R7 is connected between the second resistor R2 and the negative terminal of the temperature sensor 10. Two poles of the eighth capacitor C8 are respectively connected with the positive input terminal and the negative input terminal of the AD84595 chip U1.
Optionally, the switching unit 20 is further provided with a terminal T1, and a terminal T1 is used for connection with the temperature sensor 10.
As shown in fig. 2, the input negative terminal of the AD84595 chip is the 1 st pin, the 2 nd pin and the 3 rd pin of the AD84595 chip are grounded, the 4 th pin of the AD84595 chip is suspended, the 5 th pin and the sixth pin of the AD84595 chip are used as the output terminals thereof, the 7 th pin of the AD84595 chip is the positive terminal of the power supply, and the 8 th pin of the AD84595 chip is the positive terminal of the input.
Referring to fig. 3, the amplifying unit 30 includes an operational amplifier U2, a third resistor R3, and a fourth resistor R4.
The non-inverting input terminal of the operational amplifier U2 is connected to the output terminal of the switching unit 20, one terminal of the fourth resistor R4 is connected to one terminal of the third resistor R3, the other terminal of the fourth resistor R4 is connected to the output terminal of the operational amplifier U2, the other terminal of the third resistor R3 is connected to ground, and the inverting input terminal of the operational amplifier U2 is connected between the third resistor R3 and the fourth resistor.
It should be understood that the temperature range in which the slide processing system is actually used is 37 deg.C-88 deg.C, with a range of 15 deg.C-100 deg.C being expanded for 37 deg.C-88 deg.C. The temperature response curve of the AD8495 chip shows that the temperature response curve is linear output at 15-950 ℃, and the voltage output is increased by about 5mV per DEG C. Therefore, if the signal amplification is not performed, the output voltage varies from 75mV to 500mV in this interval. In order to increase the temperature resolution of the system, the voltage needs to be amplified by 5-6 times, and then the voltage is output to the end of the singlechip controller for AD sampling, so that the temperature resolution can be improved in the interval. The amplifying circuit is used for amplifying the output signal of the AD 8495.
The amplifying unit 30 is formed by combining a third resistor R3 and a fourth resistor R4 with an operational amplifier U2 (e.g., LM358) as a core. The third resistor R3 and the fourth resistor R4 form a proportional amplifier, which determines the amplification factor of the circuit. The expression for the magnification is as follows:
wherein, A V The magnification was characterized.
It should be understood that when the third resistor R3 is 10K and the voltage amplification factor is 5 times, it can be calculated that the fourth resistor R4 is 40K, and the actual resistor is 39K. Thus, the amplification of the entire circuit is: a. the V ＝1+3.9＝4.9。
With continued reference to fig. 3, in one possible implementation, the amplifying unit 30 includes a fifth resistor R5 and a fifth capacitor C5;
one end of the fifth resistor R5 is connected to the output end of the converting unit 20, and the other end of the fifth resistor R5 is connected to the non-inverting input end of the operational amplifier U2;
one pole of the fifth capacitor C5 is grounded, and the other pole of the fifth capacitor C5 is connected between the fifth resistor R5 and the non-inverting input terminal of the operational amplifier U2.
Optionally, the resistance of the fifth resistor R5 is 10K, and the capacitance of the fifth capacitor C5 is 10 nF. It should be appreciated that the fifth resistor R5 and the fifth capacitor C5 form a low pass filter that low pass filters the voltage signal.
With continued reference to fig. 3, in one possible implementation, the amplifying unit 30 further includes a sixth capacitor C6;
one pole of the sixth capacitor C6 is connected to the positive power supply terminal of the operational amplifier U2, and the other pole of the sixth capacitor C6 is connected to ground.
Optionally, the capacitance value of the sixth capacitance C6 is 100 nF. It should be understood that the sixth capacitor C6 is a decoupling capacitor.
Optionally, in the embodiment of the present application, the operational amplifier U2 is a patch packaged by SOP8, and the other resistors and capacitors are all packaged by 0603.
On the basis of fig. 1, regarding the structure of the temperature sampling circuit, the embodiment of the present application further provides a possible implementation manner, please refer to fig. 4, the temperature sampling circuit further includes: the filter protection unit 50, the filter protection unit 50 is arranged between the amplifying unit 30 and the MCU 40;
the filter protection unit 50 is configured to limit a maximum voltage input to the acquisition pin of the MCU40, where the maximum voltage is less than a breakdown voltage of the acquisition pin of the MCU 40.
In a possible implementation mode, due to unexpected reasons, the temperature value of the sensor is too high, so that the value output of the AD8495 chip exceeds 500mV, for example, 700mV, and after amplification, the output voltage can reach 3.5V at most, which exceeds the normal value of the acquisition range of the MCU pin, and may cause breakdown damage of the MCU pin. In order to avoid the above situation, the embodiment of the present application further provides the filtering protection unit 50 for limiting the maximum voltage input to the acquisition pin of the MCU40, where the maximum voltage is less than the breakdown voltage of the acquisition pin of the MCU 40.
Referring to fig. 5, the filter protection unit 50 includes a sixth resistor R6, a seventh capacitor C7, and a diode D1;
one end of a sixth resistor R6 is connected to the output end of the amplifying unit 30, the other end of the sixth resistor R6 is connected to one pole of a seventh capacitor C7, the other pole of the seventh capacitor C7 is grounded, the positive terminal of a diode D1 is connected between the sixth resistor R6 and the seventh capacitor C7, the negative terminal of the diode D1 is connected to a reference power supply, and the acquisition pin of the MCU40 is connected between the diode D1 and the sixth resistor R6.
The filter protection unit 50 is composed of a sixth resistor R6, a seventh capacitor C7 and a capacitor C. The sixth resistor R6 and the seventh capacitor C7 form a low-pass filter circuit for filtering the amplified signal. The problem that the output value of the AD8495 exceeds the normal value of the MCU pin acquisition range due to overhigh temperature value of the sensor caused by unexpected reasons is avoided.
Referring to fig. 5, one end of the diode D1 is connected to the signal output terminal ADO, and the other end is connected to the +3.3V reference power supply, in order to protect the pin of the MCU controller, the maximum voltage connected to the pin AD is 3.3V-VD, where VD is the voltage drop of the diode D1.
It should be understood that the output voltage is 367.5-2450mV after an output voltage signal is 75-500mV and amplified by 4.9 times in a temperature range suitable for measurement, for a 12-bit AD converter of STM32, the digital value change mapped to internal sampling is 24.5 x (4095/3300) mV (30.4) when the temperature changes by 1 ℃, and the change is mapped back to the change of 30 binary numbers, so that the change of the internal acquisition value of the STM32 controller is changed by one digital quantity, which can correspond to 1/6 ℃, and the resolution is greatly improved compared with a digital sensor. It can be seen that if the applicable temperature range is further compressed and the voltage amplification factor of the amplifying circuit is increased, the resolution can be further increased.
The temperature sampling circuit that this application embodiment provided passes through K type thermocouple + sampling chip AD8495+ amplifier circuit + protection circuit, enlargies temperature resolution ratio to the temperature interval of key application to on the basis of the digit that does not increase rear end AD chip, promoted temperature sampling precision. This is an effect that is not achieved by the commonly used digital sample MAX 6675. The amplifying and protecting circuit is simple and reliable in design, and can amplify signals to the maximum extent and protect the MCU controller on the basis of avoiding cost increase.
Embodiments of the present application also provide a slide processing system including the temperature sampling circuit in the above embodiments.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. A temperature sampling circuit, comprising: the temperature sensor, the conversion unit, the amplification unit and the MCU, wherein the input end of the conversion unit is connected with the temperature sensor, the output end of the conversion unit is connected with the input end of the amplification unit, and the output end of the amplification unit is connected with the acquisition pin of the MCU;
the conversion unit is used for converting the acquired signal of the temperature sensor to obtain a first voltage signal and transmitting the first voltage signal to the amplification unit;
the amplifying unit is used for amplifying the first voltage signal and outputting a second voltage signal;
and the MCU is used for converting the second voltage signal to obtain a temperature value.
2. The temperature sampling circuit according to claim 1, wherein the conversion unit comprises an AD84595 chip, wherein an input positive terminal of the AD84595 chip is connected with a positive terminal of the temperature sensor, and an input negative terminal of the AD84595 chip is connected with a negative terminal of the temperature sensor.
3. The temperature sampling circuit of claim 2, wherein the conversion unit further comprises a first resistor, a second resistor, a first capacitor, and a second capacitor;
one end of the first resistor is connected to the positive input end of the AD84595 chip, the other end of the first resistor is connected to the positive end of the temperature sensor, one end of the second resistor is connected to the negative input end of the AD84595 chip, and the other end of the second resistor is connected to the negative end of the temperature sensor;
one pole of the first capacitor is connected between the first resistor and the AD84595 chip, one pole of the second capacitor is connected between the second resistor and the AD84595 chip, and the other pole of the first capacitor and the other pole of the second capacitor are both grounded.
4. The temperature sampling circuit according to claim 2, wherein the conversion unit further comprises a third capacitor and a fourth capacitor, one pole of the third capacitor and one pole of the fourth capacitor are both connected to the positive power supply terminal of the AD84595 chip, and the other pole of the third capacitor and the other pole of the fourth capacitor are both connected to ground.
5. The temperature sampling circuit of claim 1, wherein the amplification unit comprises an operational amplifier, a third resistor, and a fourth resistor;
the non-inverting input end of the operational amplifier is connected with the output end of the conversion unit, one end of the fourth resistor is connected with one end of the third resistor, the other end of the fourth resistor is connected with the output end of the operational amplifier, the other end of the third resistor is connected to the ground, and the inverting input end of the operational amplifier is connected between the third resistor and the fourth resistor.
6. The temperature sampling circuit of claim 5, wherein the amplification unit further comprises a fifth resistor and a fifth capacitor;
one end of the fifth resistor is connected to the output end of the conversion unit, and the other end of the fifth resistor is connected to the non-inverting input end of the operational amplifier;
one pole of the fifth capacitor is grounded, and the other pole of the fifth capacitor is connected between the fifth resistor and the non-inverting input end of the operational amplifier.
7. The temperature sampling circuit of claim 5, wherein the amplification unit further comprises a sixth capacitor;
one pole of the sixth capacitor is connected to the positive power supply terminal of the operational amplifier, and the other pole of the sixth capacitor is connected to the ground.
8. The temperature sampling circuit of claim 1, wherein the temperature sampling circuit further comprises: the filter protection unit is arranged between the amplification unit and the MCU;
the filter protection unit is used for limiting the maximum voltage input to the acquisition pin of the MCU, and the maximum voltage is smaller than the breakdown voltage of the acquisition pin of the MCU.
9. The temperature sampling circuit of claim 8, wherein the filter protection unit comprises a sixth resistor, a seventh capacitor, and a diode;
one end of the sixth resistor is connected with the output end of the amplifying unit, the other end of the sixth resistor is connected with one pole of the seventh capacitor, the other pole of the seventh capacitor is grounded, the positive end of the diode is connected between the sixth resistor and the seventh capacitor, the negative end of the diode is connected to a reference power supply, and the acquisition pin of the MCU is connected between the diode and the sixth resistor.
10. A slide processing system comprising the temperature sampling circuit of any of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202221038599.4U CN217276576U (en) | 2022-04-27 | 2022-04-27 | Temperature sampling circuit and slide processing system |
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| CN202221038599.4U CN217276576U (en) | 2022-04-27 | 2022-04-27 | Temperature sampling circuit and slide processing system |
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