CN217259007U - Solder paste printer - Google Patents
Solder paste printer Download PDFInfo
- Publication number
- CN217259007U CN217259007U CN202220317977.6U CN202220317977U CN217259007U CN 217259007 U CN217259007 U CN 217259007U CN 202220317977 U CN202220317977 U CN 202220317977U CN 217259007 U CN217259007 U CN 217259007U
- Authority
- CN
- China
- Prior art keywords
- solder paste
- printing
- gas
- placing position
- machine table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a solder paste printing machine, including board, printing device, solder paste detection device, add device, dustcoat, printing device, solder paste detection device, add the device and locate on the board, the dustcoat cover is established at the board, detect solder paste through solder paste detection device, when solder paste is along with the extension of live time, when the solder paste state changes, can utilize and add the device and add the regulator in the solder paste, control the state of solder paste and keep unchangeable, can improve the use quality of solder paste to solve the problem of solid crystal poor quality that appears in the solid crystal process to a certain extent; keep apart tin cream and air through the dustcoat to the accessible lets in the air in the protective gas exhaust dustcoat, reduces the service environment oxygen value of tin cream, reduces the degree that the tin cream is oxidized, improves the use quality and the utilization ratio of tin cream.
Description
Technical Field
The utility model relates to a tin cream lithography apparatus technical field, concretely relates to tin cream printing machine.
Background
At present, poor tin melting, cold welding and other phenomena often occur in the die bonding process of chips. Therefore, higher requirements are required for the die bonding process to control the problem of poor die bonding quality in the die bonding process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a can solve the solid brilliant poor problem of quality's of solid crystal problem that appears to a certain extent in-process tin cream printing machine.
In order to achieve the purpose, the utility model provides a solder paste printing machine, which comprises a machine table, a printing device, a solder paste detection device and an adding device, wherein the machine table is provided with a placing position; the printing device is arranged on the machine table, corresponds to the placing position and is used for printing solder paste on a target object located at the placing position; the solder paste detection device is arranged on the machine table and used for detecting the solder paste; the adding device is arranged on the machine table and used for adding a regulator into the solder paste to adjust the solder paste.
In some embodiments, the solder paste printer further includes a control device, the control device is in communication with the solder paste detection device and the adding device, the solder paste detection device transmits the detected detection data to the control device, and the control device adds the conditioning agent to the solder paste according to the detection data.
In some embodiments, the printing device comprises a printing steel mesh and a squeegee assembly, the printing steel mesh being disposed above the placement location; the scraping and printing assembly is arranged above the printing steel mesh and used for scraping the solder paste on the printing steel mesh onto the target object positioned at the placing position.
In some embodiments, the scraping assembly includes a driving mechanism and a scraper blade disposed at an output end of the driving mechanism, the driving mechanism drives the scraper blade to move up and down relative to the printing steel mesh, and/or the driving mechanism drives the scraper blade to move horizontally relative to the printing steel mesh, so as to scrape the solder paste on the printing steel mesh onto the target.
In some embodiments, the adding means comprises an atomizing nozzle that sprays the conditioning agent into the solder paste on the printing steel web.
In some embodiments, the solder paste printer further includes an outer cover, the outer cover covers the machine table and covers the placing position and the printing device, the outer cover is provided with a gas inlet channel and a gas outlet channel so as to introduce a protective gas and discharge air in the outer cover, and the protective gas is a gas which does not react with the solder paste.
In some embodiments, the shielding gas is nitrogen, and the gas inlet passage of the housing is above the gas outlet passage.
In some embodiments, the solder paste printer further includes a gas delivery device connected to the gas inlet channel for introducing the shielding gas into the housing.
In some embodiments, the housing is provided with a plurality of said gas inlet passages, which are evenly distributed; the dustcoat is equipped with a plurality ofly the gas escape route, it is a plurality of the gas escape route evenly distributed.
In some embodiments, the solder paste printer further includes a feeding and discharging device, the feeding and discharging device is disposed on the machine table and used for bearing the target object to move to the placing position or bearing the target object to move out of the housing, and the housing is provided with a feeding and discharging channel through which the feeding and discharging device passes.
The utility model provides a solder paste printing machine is equipped with solder paste detection device, interpolation device at the bench, through the state that solder paste detection device detected the solder paste, when the solder paste along with live time's extension, when the solder paste state changes, can utilize and add the device toward adding the regulator in the solder paste, the state of control solder paste keeps unchangeable, can improve the use quality of solder paste to solve the solid brilliant poor problem of quality that the solid brilliant in-process appears to a certain extent.
Drawings
FIG. 1 is a schematic plan view of a solder paste printer according to an embodiment of the present invention;
FIG. 2 is another angle of the solder paste printer of FIG. 1;
fig. 3 is a block diagram of an electric control system of a solder paste printer according to an embodiment of the present invention.
Detailed Description
To explain the contents, structural features, objects and effects of the present invention in detail, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it should be understood that the terms "upper", "lower", "horizontal", "vertical", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and thus, are not to be construed as limiting the protection of the present invention.
The utility model provides a solder paste printing machine for with solder paste printing on the object, for example, on the PCB board, fix electronic device such as LED chip on the PCB board with further realization, and simultaneously, also can prevent solder paste to lead to solder paste quality to change along with the extension of live time, solvent evaporation wherein leads to the decline of quality and solder paste by air oxidation in the use, thereby can improve solder paste's use quality and utilization ratio, also can solve the solid brilliant poor problem of quality of solid crystal that the solid brilliant in-process appears to a certain extent.
The technical solution of the embodiments of the present invention is described in detail below with reference to the accompanying drawings:
referring to fig. 1 to 3, the solder paste printing machine of the present invention includes a machine table 1, a printing device 2, a solder paste detecting device 3, an adding device 4, a feeding and discharging device 5, an outer cover 6 and a control device 7. Wherein, the machine 1 is provided with a placing position. The printing device 2 is arranged on the machine table 1, corresponds to the placing position and is used for printing solder paste on a target object located at the placing position. Solder paste detection device 3, add device 4 and controlling means 7 communication connection, wherein, solder paste detection device 3 locates on board 1, be used for detecting the solder paste, for example can be the viscosity that detects the solder paste, detection data such as temperature, humidity, and convey the detection data that detect to controlling means 7, controlling means 7 adds the regulator in the solder paste according to detection data, for example, controlling means 7 can compare the big or small relation of the detection viscosity number in the detection data and standard viscosity number, and the relation of solder paste viscosity and solder paste solvent volume confirms the solvent volume that needs to add. The adding device 4 is disposed on the machine platform 1, and is configured to add a conditioning agent to the solder paste according to a control instruction of the control device 7, and adjust the detection data to a standard data value to keep the state of the solder paste unchanged, for example, adjust the viscosity of the solder paste to a standard viscosity value. The cover 6 covers the machine table 1, and covers the placing position and the printing device 2 to isolate solder paste from air. The feeding and discharging device 5 is arranged on the machine table 1 and used for bearing a target object to move to the placing position or bearing the target object to move out of the outer cover 6, and the outer cover 6 is provided with a feeding and discharging channel 61 for the feeding and discharging device 5 to pass through.
Specifically, the standard data value may be a range value, the control device 7 determines whether the detected data value falls within the standard data value range, and if the detected data value does not fall within the standard data value range, the control device 7 determines the amount of the conditioning agent to be added according to the detected data value, and the amount of the conditioning agent may be the volume/mass of the conditioning agent.
Specifically, in an embodiment, the standard viscosity value may be a range value, the control device 7 determines whether the detected viscosity value falls within the standard viscosity value range, and if the detected viscosity value does not fall within the standard viscosity value range and is smaller than the minimum value of the standard viscosity value range, the control device 7 determines the amount of the regulator to be added according to the relationship between the viscosity of the solder paste and the amount of the regulator, where the amount of the regulator may be the volume/mass of the regulator, and the amount of the regulator may also be a physical parameter representing the regulator related to the viscosity of the solder paste, such as the concentration of the regulator. The regulator is a solvent component used in the solder paste, such as water or ethanol.
In some embodiments, the concentration of the modifier may be controlled to a set value when the slope of the viscosity change is close to 1 by testing the relationship between the concentration of the modifier and the viscosity change of the solder paste.
The solder paste detection device 3 may include a detection probe, a calculation processor, and the like. It is understood that the number of the solder paste detecting devices 3 may be one, in some embodiments, the number of the solder paste detecting devices 3 may be more than one, and in an embodiment with a plurality of solder paste detecting devices 3, the control device 7 may perform an average calculation on the same kind of detected data of the plurality of solder paste detecting devices 3 to obtain a final detected data value of the detected data, and then determine the amount of the conditioning agent to be added.
In some embodiments, a stirring device may be further disposed on the machine platform 1, and the added conditioning agent and the solder paste on the printing steel mesh are stirred by the stirring device, so that the conditioning agent and the solder paste are uniformly mixed. For example, a stirring device is set to be in communication connection with the control device 7, after the adding device 4 adds the required amount of the adjusting agent to the solder paste according to the control command of the control device 7, the control device 7 controls the stirring device to stir, and after the stirring is performed for a preset time, the stirring device is controlled to stop stirring. For another example, after the preset time of stirring, the solder paste detection device 3 is used to detect the stirred solder paste, the control device 7 confirms again whether the detection data value falls within the standard data value range, and when the detection data value falls within the standard data value range, the control device sends a control command to make the printing device 2 perform printing.
In some embodiments, the adding device 4 includes an atomizing nozzle 41, and the conditioning agent is sprayed to the solder paste on the printing steel mesh 22 of the printing device 2 through the atomizing nozzle 41, and the conditioning agent sprayed to the solder paste is atomized conditioning agent, which helps the conditioning agent and the solder paste to be uniformly mixed. In some embodiments, the adding device 4 may also include a drip nozzle through which the conditioner is dripped into the solder paste on the printing steel mesh 22.
It can be understood that the adding device 4 may further include other structures to meet the requirement that the regulator is conveyed to the atomizing nozzle 41 and is sprayed out through the atomizing nozzle 41, and these structures may be integrally provided with the machine table 1 or separately provided with the machine table 1, and when it is needed to use, these structures are assembled.
As shown in fig. 1 and 2, the printing apparatus 2 includes a printing steel net 21 and a squeegee assembly 22. Wherein, the printing steel net 21 is fixed above the placing position of the machine table 1 through the steel net fixing piece 23. The scraping and printing assembly 22 is disposed above the printing steel net 21, and is used for scraping solder paste on the printing steel net 21 onto an object located at a placing position.
Specifically, the squeegee assembly 22 includes a drive mechanism 221 and a squeegee blade 222 disposed at an output end of the drive mechanism 221. The number of the scrapers 222 may be one or more. Also, the number of the driving mechanisms 221 may be one or more. One scraper 222 may be provided at the output end of one driving mechanism 221, or more than one scraper 222 may be connected to the output end of one driving mechanism 221.
In some embodiments, the driving mechanism 221 may include a lifting driving element and/or a horizontal driving element, the lifting driving element may be installed on the horizontal driving element, and the scraper 222 is installed at an output end of the lifting driving element, the lifting driving element drives the scraper 222 to move vertically relative to the printing steel mesh 21, when the scraper 222 descends onto the printing steel mesh 21, the horizontal driving element drives the lifting driving element to link the scraper 222 to move horizontally relative to the printing steel mesh 21, so that the solder paste on the printing steel mesh 21 is covered on the target located at the placement position of the machine platform 1 through the meshes of the printing steel mesh 21, and after the printing of the current target is completed, the lifting driving element drives the scraper 222 to ascend. The horizontal drive may be capable of driving the blade 222 to move in only one direction in the horizontal direction, for example, only the blade 222 may be driven to move along the length of the printing steel web 21; it is also possible to drive the blade 222 to move in two mutually perpendicular directions in the horizontal direction, for example, to drive the blade 222 to move along the length direction and the width direction of the printing steel net 21, and for example, to drive the blade 222 to move along two diagonal directions of the printing steel net 21. In some embodiments, a rotary drive may even be provided, with which the scraper 222 is driven to rotate to change the direction of movement of the scraper 222 in the horizontal direction. It can be understood that, how to specifically set the driving mechanism 221 and the scraper 222 to scrape the solder paste on the printing steel mesh 21 onto the target object located at the placing position is a flexible setting that can be flexibly set by a person skilled in the art according to actual requirements, and details are not described herein.
As shown in fig. 1 and 2, the outer cover 6 covers the atomizing nozzle 41, the printing device 2, the viscosity detection probe, and the feeding and discharging device 5, the outer cover 6 covers only a partial region of the machine table 1, and in some examples, the outer cover 6 may cover the entire machine table 1.
In the embodiment shown in fig. 1 and 2, the housing 6 is provided with a gas inlet channel 62 and a gas outlet channel 63 for introducing protective gas and for discharging air from the housing 6. The gas inlet passage 62 and the gas outlet passage 63 may be openings formed in the housing 6 itself, or may be ventilation ducts for communicating the inside and the outside of the housing 6.
In some embodiments, the gas inlet channel 62 of the housing 6 is above the gas outlet channel 63, and the shielding gas may be a gas with a relative molecular mass greater than that of air, and since the relative molecular mass of the shielding gas is greater than that of air, the shielding gas introduced into the housing 6 from the gas inlet channel 62 is heavier than air, and the shielding gas naturally sinks downward, so that the gas inlet channel 62 is disposed on the upper side of the housing 6, and the gas outlet channel 63 is disposed on the lower side of the housing 6, so that the air in the housing 6 can be conveniently discharged. Of course, in some embodiments, the shielding gas may be a gas having a smaller relative molecular mass than air, and in this case, the positions of the gas inlet channel 62 and the gas outlet channel 63 may be changed accordingly, and the gas outlet channel 63 may be above the gas inlet channel 62, so as to facilitate the air in the housing 6 to be discharged.
It is understood that the relative molecular mass of air refers to the average relative molecular mass of all substances contained in the air.
In some embodiments, the shielding gas is an inert gas, such as nitrogen, but should not be limited thereto.
In some embodiments, the housing 6 is provided with a plurality of gas inlet channels 62, the plurality of gas inlet channels 62 being evenly distributed to enable even introduction of the shielding gas. Also, the housing 6 is provided with a plurality of gas discharge passages 63, and the plurality of gas discharge passages 63 are uniformly distributed.
In some embodiments, the solder paste printer further comprises a gas delivery device 8, the gas delivery device 8 is connected to the gas inlet channel 62, and the gas delivery device 8 is used for introducing the shielding gas into the housing 6. These gas conveying devices 8 may be provided integrally with the machine base 1 or may be provided separately from the machine base 1, and when necessary, the gas conveying devices 8 are assembled. The gas delivery device 8 may include a gas source, a gas delivery line, a gas nozzle, etc. and the protective gas is provided by the gas source, delivered to the gas nozzle by the gas delivery line, and finally delivered into the housing 6 through the gas nozzle via the gas inlet channel 62.
In some embodiments, the gas delivery device 8 may be in communication with the control device 7, and the control device 7 outputs a control command to control whether the gas delivery device 8 injects the shielding gas into the housing 6.
In some embodiments, the solder paste printer may further include an oxygen detection device (not shown) disposed within the housing 6, with the oxygen detection device detecting oxygen within the housing 6. In some embodiments, the oxygen detection device and the gas delivery device 8 are further communicatively connected to the control device 7, the oxygen detection device transmits the oxygen concentration value to the control device 7, and the control device 7 further controls whether the gas delivery device 8 introduces the shielding gas into the housing 6 according to a relationship between the oxygen concentration value and the concentration threshold.
In some embodiments, an air extraction system or the like may also be provided to better effect the extraction of air within the enclosure 6.
In some embodiments, the solder paste printer includes an electronic control system, which may include a display 91, an input device 92, an alarm device 93, etc. in addition to the aforementioned control device 7, for example, the display 91 may display the printing condition, the input device 92 may set the printing condition, such as setting the standard viscosity value range, setting the oxygen concentration threshold value, etc., and the alarm device 93 may remind the operator of the viscosity condition, the oxygen concentration condition, and the fault condition of the solder paste, and the alarm device 93 may be an alarm lamp, a buzzer, etc. The control device 7 may be any electronic device comprising computational processing capabilities.
In the above embodiments, the solder paste printer includes the solder paste detecting device 3, the adding device 4, the feeding and discharging device 5, the housing 6, the control device 7, etc., and it is understood that in some embodiments, some or some of the devices may not be included.
The operation of the solder paste printer of the present invention is described below by taking an embodiment as an example:
firstly, introducing protective gas into the outer cover 6 through the gas conveying device 8, and reducing the oxygen concentration in the outer cover 6 to a preset concentration threshold value so that the solder paste can operate in an environment with relatively low oxygen concentration and is prevented from being oxidized; then, adding solder paste into the printing steel mesh 21, and scraping the solder paste on the printing steel mesh 21 to a target object positioned at a placing position through the scraping and printing assembly 22, in the process, detecting the viscosity of the solder paste by using the solder paste detection device 3, and if the detected viscosity value does not fall within the range of the standard viscosity value, determining the amount of the solvent to be added by the control device 7 according to the size relationship between the detected viscosity value and the standard viscosity value and the relationship between the viscosity of the solder paste and the amount of the solvent of the solder paste; then, the control device 7 issues a control command to cause the adding device 4 to add the solvent in the amount of the solvent to be added to the solder paste so that the viscosity of the solder paste is within the range of the standard viscosity value.
To sum up, the utility model discloses a solder paste printing machine is equipped with solder paste detection device 3 on board 1, adds device 4, through the viscosity that solder paste detection device 3 detected the solder paste, along with live time's extension when the solder paste, wherein when solvent evaporation leads to viscosity to reduce, can utilize and add device 4 toward adding the solvent in the solder paste, the viscosity of control solder paste is all the time in certain within range, can improve the use quality of solder paste, prolongs the live time of solder paste simultaneously, improves the utilization ratio of solder paste. Moreover, the utility model provides a solder paste printing machine still is equipped with the cover and establishes at dustcoat 6 of board 1, keeps apart solder paste and air through dustcoat 6 to the accessible lets in the air in the protective gas exhaust dustcoat 6, reduces the service environment oxygen value of solder paste, reduces the degree that the solder paste oxidized, thereby further improves the use quality and the utilization ratio of solder paste.
The above disclosure is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and the equivalent changes made by the claims of the present invention are all covered by the present invention.
Claims (10)
1. A solder paste printer, comprising:
the machine table is provided with a placing position;
the printing device is arranged on the machine table, corresponds to the placing position and is used for printing solder paste on a target object positioned at the placing position;
the solder paste detection device is arranged on the machine table and used for detecting the solder paste; and
and the adding device is arranged on the machine table and used for adding a regulator into the solder paste so as to adjust the solder paste.
2. The solder paste printer of claim 1, further comprising:
and the control device is in communication connection with the solder paste detection device and the adding device, the solder paste detection device transmits detected detection data to the control device, and the control device adds the conditioning agent into the solder paste according to the detection data.
3. The solder paste printer according to claim 1, wherein the printing device comprises:
the printing steel mesh is arranged above the placing position;
and the scraping and printing assembly is arranged above the printing steel mesh and is used for scraping the solder paste on the printing steel mesh onto the target object positioned at the placing position.
4. The solder paste printer of claim 3, wherein the squeegee assembly includes a drive mechanism and a squeegee blade disposed at an output end of the drive mechanism, the drive mechanism driving the squeegee blade to move up and down relative to the printing mesh, and/or the drive mechanism driving the squeegee blade to move horizontally relative to the printing mesh to squeegee the solder paste on the printing mesh onto the target.
5. The solder paste printer of claim 3, wherein the adding device includes an atomizing nozzle that sprays the conditioner into the solder paste on the printing steel web.
6. The solder paste printer according to any one of claims 1 to 5, further comprising:
the outer cover is covered on the machine table, the outer cover is covered on the placing position and the outside of the printing device, the outer cover is provided with a gas inlet channel and a gas outlet channel so as to introduce protective gas and discharge the air in the outer cover, and the protective gas is gas which does not react with the solder paste.
7. The solder paste printer according to claim 6, wherein the protective gas is nitrogen gas, and the gas inlet passage of the housing is above the gas outlet passage.
8. The solder paste printer according to claim 6, further comprising a gas delivery device connected to said gas inlet passage for introducing said shielding gas into said housing.
9. The solder paste printer according to claim 6, wherein said housing is provided with a plurality of said gas inlet passages, said plurality of gas inlet passages being uniformly distributed; the dustcoat is equipped with a plurality ofly the gas escape route, it is a plurality of the gas escape route evenly distributed.
10. The solder paste printer of claim 6, further comprising:
and the feeding and discharging device is arranged on the machine table and is used for bearing the movement of the target object to the placing position or the movement of the target object to the outside of the outer cover, and the outer cover is provided with a feeding and discharging channel for the feeding and discharging device to pass through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220317977.6U CN217259007U (en) | 2022-02-16 | 2022-02-16 | Solder paste printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220317977.6U CN217259007U (en) | 2022-02-16 | 2022-02-16 | Solder paste printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217259007U true CN217259007U (en) | 2022-08-23 |
Family
ID=82855369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220317977.6U Active CN217259007U (en) | 2022-02-16 | 2022-02-16 | Solder paste printer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217259007U (en) |
-
2022
- 2022-02-16 CN CN202220317977.6U patent/CN217259007U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217259007U (en) | Solder paste printer | |
| US20020020346A1 (en) | Dual track stenciling system with solder gathering head | |
| CN100541750C (en) | Heater, reflow soldering apparatus, heating means and bump formation method | |
| US4709846A (en) | Apparatus for the continuous hot tinning of printed circuit boards | |
| US4412641A (en) | Desoldering apparatus | |
| EP2932809B1 (en) | Portable equipment for monitoring and controlling the level of oxygen in reflow oven atmosphere | |
| CN102144435A (en) | Electronic part mounting device and work method using electronic part mounting device | |
| US20100243718A1 (en) | Selective soldering apparatus with jet wave solder jet and nitrogen preheat | |
| KR20100058538A (en) | Method and device for electrochemical machining | |
| US20110139855A1 (en) | Residual oxygen measurement and control in wave soldering process | |
| KR101475253B1 (en) | Gantry work apparatus | |
| US6431431B2 (en) | Apparatus and methods for wave soldering | |
| KR102493272B1 (en) | Paint control system with automated paint stirrer device and control method thereof | |
| CN208164539U (en) | Stencil printer precision printing control system | |
| WO2000025971A1 (en) | Apparatus and method for inerting a wave soldering installation | |
| CN209363786U (en) | Automation selective crest welder | |
| CN211427167U (en) | Automatic solution pH value adjusting system | |
| CN109365939A (en) | Automation selective crest welder | |
| CN112599458A (en) | Silicon wafer etching device and method | |
| KR101949807B1 (en) | Automatic control device for pointer soldering | |
| KR101917431B1 (en) | Apparatus for feeding powder | |
| CN216631353U (en) | Be used for foundry goods processing to use hot spraying device | |
| CN218251055U (en) | Ink spraying equipment for improving conducting wire back-etching of long and short golden finger products | |
| KR101787491B1 (en) | Work device for printed substrate | |
| JP2005014073A (en) | Soldering apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |