CN217258669U - Tantalum capacitor pressing die - Google Patents
Tantalum capacitor pressing die Download PDFInfo
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- CN217258669U CN217258669U CN202220719451.0U CN202220719451U CN217258669U CN 217258669 U CN217258669 U CN 217258669U CN 202220719451 U CN202220719451 U CN 202220719451U CN 217258669 U CN217258669 U CN 217258669U
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Abstract
The application relates to a tantalum capacitor pressing die, which belongs to the technical field of tantalum capacitor production and comprises a lower die body, a die core and an upper die body, wherein the die core is arranged on the lower die body, and the upper die body is arranged on the die core; the lower die body comprises a lower base and a lower die table, a first elastic buffer part is arranged between the lower base and the lower die table, the lower base is connected with the lower die table through the first elastic buffer part, the upper die body comprises an upper base and an upper die table, a die pressing rod is integrally formed on the lower end surface of the upper die body, and the die pressing rod is connected with the upper die table in a sliding mode; and a second elastic buffer part is arranged between the upper base and the upper die table. Because first springiness cushioning spare and second springiness cushioning spare's setting makes between the lower base of die body and the lower mould platform, but there is mobile stroke between upper ledge and the last mould platform, can eliminate to a certain extent and cause the inhomogeneous condition of pressure because of pressure equipment to make tantalum capacitor atress even, suppress out the even piece formula tantalum capacitor of thickness, reduce the defective rate of tantalum capacitor production.
Description
Technical Field
The application relates to the technical field of tantalum capacitor production, in particular to a tantalum capacitor pressing die.
Background
The tantalum capacitor is a tantalum electrolytic capacitor, belongs to a direct-insert type capacitor of an electrolytic capacitor, uses metal tantalum as a medium, does not use electrolyte like a common electrolytic capacitor, and does not need to use capacitor firing plated with aluminum films like the common electrolytic capacitor. The inductor has almost no inductance, and has the characteristics of large capacitance, small volume and the like.
Tantalum capacitors have various shapes, and a chip type tantalum capacitor is a common one. The chip tantalum capacitor generally comprises an outgoing line and a capacitor body, and when the capacitor is formed, a special die is needed, and then metal tantalum powder and the outgoing line are pressed into the chip tantalum capacitor under the action of a special press. After compression molding, the uniformity of the thickness of the capacitor body directly influences the performance and the service life of the tantalum capacitor. At present, most manufacturers mainly produce the die for the chip tantalum capacitor, and the die mainly comprises a lower die body 1, an upper die body 3 and a detachable die core 2, referring to fig. 1, wherein a supporting rod 14 is integrally formed on the upper end surface of the lower die body 1, a die pressing rod 31 is integrally formed on the lower end surface of the upper die body 3, capacitor forming grooves are respectively formed on the mutually close end surfaces of the supporting rod 14 and the die pressing rod 31, and a through storage hole 21 is formed in the die core 2. During capacitor pressing, the mold core 2 is sleeved on the support rod 14, then the tantalum powder is placed in the storage hole 21, the die pressing rod 31 of the upper mold body 3 is inserted into the storage hole 21, then the mold is sent into a special press machine for pressing, and the capacitor is formed in the capacitor forming groove. Due to the machining error of the press machine, part of finished tantalum capacitors are scrapped due to uneven thickness.
SUMMERY OF THE UTILITY MODEL
The application provides a tantalum capacitor pressing die to the problem that exists among the prior art, can realize through following technical scheme.
A tantalum capacitor pressing die comprises a lower die body, a die core and an upper die body, wherein the die core is arranged on the lower die body, and the upper die body is arranged on the die core;
the lower die body comprises a lower base and a lower die table, a first elastic buffer part is arranged between the lower base and the lower die table, the lower base and the lower die table are connected through the first elastic buffer part, one end of the lower base, close to the lower die table, is connected with a supporting rod, and the supporting rod is connected with the lower die table in a sliding manner;
the mold core is provided with a through material storage hole, and the mold core is sleeved on the support rod;
the upper die body is connected with a die pressing rod, and the die pressing rod is inserted into the material storage hole.
The application is further configured to: the first elastic buffer piece comprises a first guide screw and a first leveling spring;
a first step hole is formed in the lower base, the first guide screw is connected to the first step hole in a sliding mode, and the upper end of the first guide screw protrudes out of the first step hole and is in threaded connection with the lower die table;
the first leveling spring is arranged in the first stepped hole, and the upper end of the first leveling spring is in contact with the lower end of the first guide screw.
The application is further configured to: the upper die body comprises an upper base and an upper die table, the die pressing rod is arranged on the lower end face of the upper base, and the die pressing rod is connected with the upper die table in a sliding mode;
a second elastic buffer piece is arranged between the upper base and the upper die table and comprises a second guide screw and a second leveling spring;
a second step hole is formed in the upper base, the second guide screw is connected to the second step hole in a sliding mode, and the lower end of the second guide screw protrudes out of the second step hole and is in threaded connection with the upper die table;
the second leveling spring is arranged in the second stepped hole, and the lower end of the second leveling spring is in contact with the upper end of the second guide screw.
The application is further configured to: one end, far away from the mold core, of the lower base is fixedly connected with a first sealing cover through a screw, and one end, far away from the first guide screw, of the first leveling spring is in contact with the first sealing cover.
The application is further configured to: one end, far away from the mold core, of the upper base is fixedly connected with a second sealing cover through a screw, and one end, far away from the second guide screw, of the second leveling spring is in contact with the second sealing cover.
The application is further configured to: the first elastic buffer parts are provided with three groups or four groups, and the first step holes are correspondingly provided with three groups or four groups.
The application is further configured to: the second elastic buffer parts are provided with three groups or four groups, and the second stepped holes are correspondingly provided with three groups or four groups.
The application is further configured to: the die pressing rod and the upper die table are integrally formed, and the supporting rod and the lower die table are integrally formed.
The application is further configured to: the two ends of the mold core are arranged in a conical shape, and a first conical groove matched with the mold core is formed in the end surface, close to the mold core, of the lower mold table;
and a second conical groove matched with the mold core is formed in the end surface, close to the mold core, of the upper mold table.
The application is further configured to: the mold cores comprise a male mold core and a female mold core;
the side wall of the male mold core close to the female mold core is fixedly connected with a guide pin;
and the side wall of the female mold core close to the male mold core is provided with a guide hole matched with the guide pin, and the male mold core is assembled with the female mold core through the guide pin.
Compared with the prior art, the beneficial effect of this application is:
because the first elastic buffer part and the second elastic buffer part are arranged, a movable stroke exists between the lower base and the lower die table, between the upper base and the upper die table, the condition that pressure is uneven due to pressure equipment can be eliminated to a certain extent, so that the stress of the tantalum capacitor is even, the chip tantalum capacitor with even thickness is pressed, and the reject ratio of the production of the tantalum capacitor is reduced.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.
FIG. 1 is a schematic diagram of a tantalum capacitor pressing die in the prior art;
FIG. 2 is a schematic diagram of a tantalum capacitor compaction mold charge according to an embodiment of the present application;
fig. 3 is a schematic diagram of a tantalum capacitor pressing mold according to an embodiment of the present disclosure after pressing;
FIG. 4 is an exploded view of a bottom mold body according to an embodiment of the present disclosure;
FIG. 5 is an exploded view of an upper mold body according to an embodiment of the present disclosure;
fig. 6 is an exploded schematic view of a mold core provided in an embodiment of the present application.
Reference numerals: 1. a lower die body; 11. a lower base; 111. a first stepped bore; 12. a lower die table; 121. a first tapered recess; 13. a first elastic buffer member; 131. a first lead screw; 132. a first leveling spring; 14. a support bar; 15. a first cover; 2. a mold core; 21. a material storage hole; 22. a male mold core; 221. a guide pin; 23. a female mold core; 231. a guide hole; 3. feeding a mold body; 31. a mold pressing rod; 32. an upper base; 321. a second stepped bore; 33. feeding a die table; 331. a second tapered recess; 34. a second elastic buffer member; 341. a second lead screw; 342. a second leveling spring; 35. and a second cover.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
It should be noted that, the descriptions of "first", "second", etc. in this document are used for distinguishing different messages, devices, modules, etc., and do not represent a sequential order, nor limit the types of "first" and "second" to be different.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In order to eliminate the processing error of the press machine and reduce the reject ratio of tantalum capacitor pressing, refer to fig. 2, which is a schematic diagram of the tantalum capacitor pressing mold provided in the embodiment of the present application when charging; fig. 3 is a schematic diagram of a tantalum capacitor pressing mold according to an embodiment of the present disclosure after pressing; the die comprises a lower die body 1, a die core 2 and an upper die body 3, wherein the die core 2 is arranged on the lower die body 1, and the upper die body 3 is arranged on the die core 2.
The lower die body 1 comprises a lower base 11 and a lower die table 12, a first elastic buffer part 13 is arranged between the lower base 11 and the lower die table 12, the lower base 11 and the lower die table 12 are connected through the first elastic buffer part 13, a supporting rod 14 is integrally formed at one end, close to the lower die table 12, of the lower base 11, the supporting rod 14 is connected with the lower die table 12 in a sliding mode, and a capacitor forming groove is formed in the upper end face of the supporting rod 14.
The upper die body 3 comprises an upper base 32 and an upper die table 33, a die pressing rod 31 is integrally formed on the lower end surface of the upper die body 3, and the die pressing rod 31 is connected with the upper die table 33 in a sliding manner; a second elastic buffer 34 is provided between the upper base 32 and the upper die table 33, and a capacitor forming groove is also formed in the lower end surface of the die rod 31.
The mold core 2 is provided with a through storage hole 21, the support rod 14 is sleeved with the mold core 2, and the die pressing rod 31 is inserted into the storage hole 21.
During tantalum capacitor press forming, because first elastic buffer 13 and second elastic buffer 34's setting, make between lower base 11 and the lower mould platform 12 of lower mould body 1, there is movable stroke between upper base 32 and the last mould platform 33, can eliminate to a certain extent and cause the inhomogeneous condition of pressure because of pressure equipment to make tantalum capacitor atress even, suppress out the even piece formula tantalum capacitor of thickness, reduce the defective rate of tantalum capacitor production.
Referring to fig. 4, the first elastic buffer 13 includes a first lead screw 131 and a first leveling spring 132; a first step hole 111 is formed in the lower base 11, the first guide screw 131 is connected to the first step hole 111 in a sliding manner, and the upper end of the first guide screw 131 protrudes out of the first step hole 111 and is in threaded connection with the lower mold base 12; the first leveling spring 132 is disposed in the first stepped hole 111 and has an upper end contacting a lower end of the first lead screw 131.
Referring to fig. 5, the second elastic buffer 34 includes a second lead screw 341 and a second leveling spring 342; a second stepped hole 321 is formed in the upper base 32, the second guide screw 341 is slidably connected to the second stepped hole 321, and the lower end of the second guide screw 341 protrudes out of the second stepped hole 321 and is in threaded connection with the upper die table 33; the second leveling spring 342 is disposed in the second stepped hole 321 and has a lower end contacting an upper end of the second lead screw 341.
Referring to fig. 2 to 3, in order to facilitate the movement of the lower mold body 1 and the upper mold body 3, one end of the lower base 11, which is far away from the mold core 2, is fixedly connected with a first sealing cover 15 through a screw, one end of the first leveling spring 132, which is far away from the first guide screw 131, is in contact with the first sealing cover 15, and the first sealing cover 15 can prevent the first leveling spring 132 from falling off from the first stepped hole 111 during the movement of the mold.
One end of the upper base 32, which is far away from the mold core 2, is fixedly connected with a second cover 35 through a screw, one end of the second leveling spring 342, which is far away from the second guide screw 341, is in contact with the second cover 35, and the second cover 35 can prevent the second leveling spring 342 from falling off from the second stepped hole 321 in the mold moving process.
The first elastic buffer 13 and the second elastic buffer 34 may be provided in three or four sets according to the requirement of actual production, and the first stepped hole 111 and the second stepped hole 321 are correspondingly provided according to the requirement.
The two ends of the mold core 2 are arranged in a conical manner, a first conical groove 121 matched with the mold core 2 is formed in the end face, close to the mold core 2, of the lower mold table 12, and a second conical groove 331 matched with the mold core 2 is formed in the end face, close to the mold core 2, of the upper mold table 33. The two ends of the mold core 2 are respectively arranged in the first conical groove 121 and the second conical groove 331, so that when the mold is moved, the lateral pressure generated by the mold core 2 on the mold pressing rod 31 of the support rod 14 can be reduced, and the risk of fracture of the mold pressing rod 31 is reduced.
Referring to fig. 6, the mold core 2 comprises a male mold core 22 and a female mold core 23, the mold core 2 is of a split structure, so that the side wall of the second through hole of the mold core 2 is conveniently cleaned, the attachment of impurities is avoided, and the influence on the compression molding of the tantalum capacitor is generated.
The side wall of the male mold core 22 close to the female mold core 23 is fixedly connected with a guide pin 221; the side wall of the female mold core 23 close to the male mold core 22 is provided with a guide hole 231 matched with the guide pin 221, when the male mold core 22 and the female mold core 23 are assembled, the guide pin 221 on the male mold core 22 is aligned with the guide hole 231 on the female mold core 23, and then the guide pin 221 is inserted into the guide hole 231.
The above embodiments are only for illustrating the embodiments of the present invention and are not to be construed as limiting the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made on the basis of the embodiments of the present invention shall be included in the scope of the present invention.
Claims (10)
1. A tantalum capacitor pressing die comprises a lower die body (1), a die core (2) and an upper die body (3), wherein the die core (2) is installed on the lower die body (1), and the upper die body (3) is installed on the die core (2);
the method is characterized in that: the lower die body (1) comprises a lower base (11) and a lower die table (12), a first elastic buffer part (13) is arranged between the lower base (11) and the lower die table (12), the lower base (11) is connected with the lower die table (12) through the first elastic buffer part (13), one end, close to the lower die table (12), of the lower base (11) is connected with a supporting rod (14), and the supporting rod (14) is connected with the lower die table (12) in a sliding mode;
the mold core (2) is provided with a through storage hole (21), and the mold core (2) is sleeved on the support rod (14);
the upper die body (3) is connected with a die pressing rod (31), and the die pressing rod (31) is inserted into the material storage hole (21).
2. The tantalum capacitor compaction die of claim 1, wherein the first elastomeric buffer (13) comprises a first lead screw (131) and a first leveling spring (132);
a first step hole (111) is formed in the lower base (11), the first guide screw (131) is connected in the first step hole (111) in a sliding manner, and the upper end of the first guide screw (131) protrudes out of the first step hole (111) and is in threaded connection with the lower die table (12);
the first leveling spring (132) is disposed in the first stepped hole (111) and has an upper end contacting a lower end of the first lead screw (131).
3. The tantalum capacitor pressing die according to claim 2, wherein the upper die body (3) comprises an upper base (32) and an upper die table (33), the pressing die rod (31) is arranged on the lower end face of the upper base (32), and the pressing die rod (31) is connected with the upper die table (33) in a sliding mode;
a second elastic buffer piece (34) is arranged between the upper base (32) and the upper die table (33), and the second elastic buffer piece (34) comprises a second guide screw (341) and a second leveling spring (342);
a second stepped hole (321) is formed in the upper base (32), the second guide screw (341) is connected in the second stepped hole (321) in a sliding manner, and the lower end of the second guide screw (341) protrudes out of the second stepped hole (321) and is in threaded connection with the upper die table (33);
the second leveling spring (342) is disposed in the second stepped hole (321) and has a lower end contacting an upper end of the second lead screw (341).
4. The tantalum capacitor pressing die as claimed in claim 2, wherein a first cover (15) is fixedly connected to one end of the lower base (11) far away from the die core (2) through a screw, and one end of the first leveling spring (132) far away from the first lead screw (131) is in contact with the first cover (15).
5. The tantalum capacitor pressing die as claimed in claim 3, wherein a second cover (35) is fixedly connected to one end of the upper base (32) far away from the die core (2) through a screw, and one end of the second leveling spring (342) far away from the second lead screw (341) is in contact with the second cover (35).
6. The tantalum capacitor pressing die as claimed in claim 2, wherein the first elastic buffer member (13) is provided with three or four sets, and the first stepped holes (111) are correspondingly provided with three or four sets.
7. The tantalum capacitor pressing die as claimed in claim 3, wherein the second elastic buffer member (34) is provided with three or four sets, and the second stepped holes (321) are correspondingly provided with three or four sets.
8. The tantalum capacitor pressing die according to claim 3, wherein the die pressing rod (31) is integrally formed with the upper die table (33), and the supporting rod (14) is integrally formed with the lower die table (12).
9. The tantalum capacitor pressing die as claimed in claim 3, wherein two ends of the die core (2) are arranged in a conical shape, and a first conical groove (121) matched with the die core (2) is formed in the end face, close to the die core (2), of the lower die table (12);
and a second conical groove (331) matched with the mold core (2) is formed in the end face, close to the mold core (2), of the upper mold table (33).
10. The tantalum capacitor pressing die of claim 9, wherein the die core (2) comprises a male die core (22) and a female die core (23);
the side wall of the male mold core (22) close to the female mold core (23) is fixedly connected with a guide pin (221);
the side wall of the female mold core (23) close to the male mold core (22) is provided with a guide hole (231) matched with the guide pin (221), and the male mold core (22) is assembled with the female mold core (23) through the guide pin (221).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220719451.0U CN217258669U (en) | 2022-03-30 | 2022-03-30 | Tantalum capacitor pressing die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220719451.0U CN217258669U (en) | 2022-03-30 | 2022-03-30 | Tantalum capacitor pressing die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217258669U true CN217258669U (en) | 2022-08-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220719451.0U Active CN217258669U (en) | 2022-03-30 | 2022-03-30 | Tantalum capacitor pressing die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217258669U (en) |
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2022
- 2022-03-30 CN CN202220719451.0U patent/CN217258669U/en active Active
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