CN217255469U

CN217255469U - Grinding pad

Info

Publication number: CN217255469U
Application number: CN202220789183.XU
Authority: CN
Inventors: 詹军
Original assignee: Nanjing Fukexun New Material Co ltd
Current assignee: Nanjing Fukexun New Material Co ltd
Priority date: 2022-04-07
Filing date: 2022-04-07
Publication date: 2022-08-23
Anticipated expiration: 2032-04-07

Abstract

The utility model provides a grinding pad, which comprises a grinding pad body, wherein a hole is formed in the grinding pad body, a first wire groove and a second wire groove are both arranged on the surface of the grinding pad, the first wire groove is a spiral line taking the edge of the hole as a basic starting point, the starting point of the spiral line is tangent to the edge of the hole, and the rotation direction of the spiral line is the same as that of the equipment disc surface; the second wire groove is a tangent spiral radioactive ray taking the edge of the hole as a basic starting point, and the rotation direction of the tangent spiral radioactive ray is the same as that of the surface of the equipment; the second wireway extends from the first wireway end region to the polishing pad edge. The utility model discloses carried out meticulous normal definition and design to the cutting pattern of grinding pad, ensured that this carving pattern can automatic balance in grinding process abrasive material granule in the lapping liquid and coolant liquid distribute uniformly and inlay in whole quotation, can be simultaneously again the quick emission of piece and the waste liquid that the abrasive material granule produced the work piece cutting.

Description

Grinding pad

Technical Field

The utility model relates to a grinding device technical field especially relates to a grinding pad.

Background

Firstly, processing of the existing loose abrasive:

1. the abrasive material passes through the coolant liquid and distributes freely on the abrasive disc as the carrier, because the rotation of equipment abrasive disc causes the abrasive material to splash and arouses the pollution, and reduces the rotational speed and causes machining efficiency low.

2. The grinding materials are distributed on the grinding disc randomly in uneven density in the processing process, the relative motion between the product and the grinding materials is uncontrollable, so that the grinding cutting amount is uneven and is not easy to control, and the surface precision of the product is influenced.

3. Along with the prolonging of the service time of the grinding slurry, the abrasive particles are easy to harden and agglomerate, and the surface of the product is scratched.

4. The abrasive particles cut each other during the grinding process, resulting in a reduction in the life of the abrasive.

5. The grinding disc of the equipment can not be repaired after being worn, and the replacement cost is expensive.

Secondly, the conventional polishing pad processing:

1. the concentric circle grooving pattern is used or the widths of the grooves of the upper and lower plates and the distance between the grooves are not fixed, so that the cutting amount of the upper and lower plates to a workpiece product is unequal in the processing process, the consistency of processing lines on the AB two surfaces of the workpiece is poor, and the surface smoothness is different.

2. The radial arc line grooves of the grinding pad are diverged from the circle center, so that the uniform distribution of abrasive particles and the quick discharge of waste abrasive particles are not facilitated in the machining process.

3. The processing technology has limitations, resulting in narrow application range.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is overcome the defect that prior art exists, the utility model provides a grinding pad improves on the method basis of the fine grinding processing of current grinding pad, the wire casing width and the wire casing degree of depth and the groove interval of accurate fixed upper and lower plate grinding pad, the shape and the quantity of radiation wire casing are rationally designed and distributed, further ensure abrasive particles and the coolant liquid evenly distributed in the quotation in the lapping process among the fine grinding process grinding fluid, reduce the human intervention operation in the course of working, effectual the cost that has reduced when improving product quality, processing application to original grinding pad has carried out the widening.

In order to solve the technical problem, the utility model discloses a technical scheme is: a grinding pad comprises a grinding pad body, a hole is arranged on the grinding pad body, a wire groove is arranged on the basis of the hole, the wire groove comprises a first wire groove and a second wire groove, the first wire groove and the second wire groove are both arranged on the surface of the grinding pad,

the first wire groove is a spiral line taking the edge of the hole as a starting point, the starting point of the spiral line is tangent to the edge of the hole, and the spiral line and the rotating direction of the equipment disk surface are in the same direction;

the second wire groove is a tangent spiral radioactive ray taking the edge of the hole as a basic starting point, and the rotation direction of the spiral radioactive ray is the same as that of the surface of the equipment;

the second wireway extends from the first wireway end region to the polishing pad edge.

Further, the second wire groove and the first wire groove are arranged in a staggered mode.

Furthermore, the front section of the second wire groove is embedded into the gap between the first wire grooves, and the embedding depth is 5-8% of the radius of the grinding pad.

Further, the interval of each second line slot is 10 degrees, and the number of the second line slots is 36.

Furthermore, the width of the first line groove and the second line groove is 0.8mm or 1.0mm, and the depth of the first line groove and the second line groove is half of the thickness of the polishing pad.

Compared with the prior art, the beneficial effects of the utility model include: the grooving pattern of the grinding pad is carefully and normatively defined and designed, the abrasive particles and the cooling liquid in the grinding liquid can be uniformly distributed and embedded in the whole disc surface in the grinding process of the engraving pattern, and meanwhile, the abrasive particles can be used for quickly discharging chips and waste liquid generated by cutting the workpiece, so that the precision of the workpiece is further ensured, the consumption of consumables such as the grinding liquid is further reduced, the batch consistency of products is improved, the application field is widened, the process adaptability is wider, and the method has good popularization and practical value.

Drawings

The disclosure of the present invention is explained with reference to the drawings. It is to be understood that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the invention. In the drawings, like reference numerals are used to refer to like parts. Wherein:

FIG. 1 schematically illustrates the structure of a first embodiment of a polishing pad;

FIG. 2 schematically illustrates the structure of a second embodiment of a polishing pad;

FIG. 3 schematically shows the structure of a third embodiment of a polishing pad;

FIG. 4 schematically shows the structure of a fourth embodiment of a polishing pad;

FIG. 5 schematically illustrates the structure of a fifth embodiment of a polishing pad;

FIG. 6 schematically shows a structure of a sixth embodiment of a polishing pad;

FIG. 7 schematically shows a structure of a seventh embodiment of a polishing pad;

fig. 8 schematically shows the structure of an eighth embodiment of the polishing pad.

1-grinding pad, 2-hole, 3-wire groove, 31-first wire groove, 32-second wire groove.

Detailed Description

It is easily understood that, according to the technical solution of the present invention, under the spirit of the present invention, a person skilled in the art can propose various alternative structural modes and implementation modes. Therefore, the following detailed description and the accompanying drawings are merely illustrative of the technical solutions of the present invention, and should not be considered as limiting or restricting the technical solutions of the present invention in their entirety or in any other way.

A grinding pad comprises a grinding pad body 1, wherein a first wire groove 31 and a second wire groove 32 are arranged on the surface of the grinding pad body 1, the first wire groove 31 is a spiral line taking the edge of a hole 2 as a basic starting point, the starting point of the spiral line is tangent to the edge of the hole 2, and the rotation direction of the spiral line is the same as that of the surface of equipment; the second grooves 32 are tangential helical radial lines starting from the edge of the hole 2, and the rotation direction of the tangential helical radial lines is the same as that of the device disk surface.

Based on the above, the present invention provides two embodiments, which are as follows:

example 1

As shown in fig. 1, in a polishing pad, a first wire groove 31 and a second wire groove 32 are both disposed on the surface of a polishing pad 1, a hole 2 is disposed at the center of the polishing pad 1, the first wire groove 31 is a spiral line that takes the edge of the hole 2 as a basic starting point, the starting point of the spiral line is tangent to the edge of the hole 2, and the rotation direction of the spiral line is the same as the rotation direction of the surface of the polishing pad; the second grooves 32 are tangential spiral radial line segments starting from the edge of the hole 2 and extending to the edge of the polishing pad 1, and the second grooves 32 and the first grooves 31 are connected end to form an S-shaped curve in the same direction as the rotation direction of the disk surface of the equipment.

Example 2

In this embodiment, a difference from embodiment 1 is that the second linear grooves 32 are offset from the first linear grooves 31, such that the starting points of the second linear grooves 32 are located in the gaps between adjacent first linear grooves 31 and extend the edge of the polishing pad 1. And the front section of the second grooves 32 is embedded into the gap between the first grooves 31 to a depth of 5-8% of the radius of the polishing pad 1.

In the

above embodiments

1 and 2, the second line grooves 32 are spaced at 10 ° intervals, and the number of the second line grooves 32 is 36. The widths of the first line grooves 31 and the second line grooves 32 are 0.8mm or 0.1mm, and the depths of the first line grooves 31 and the second line grooves 32 are half of the thickness of the polishing pad 1.

The following adjustment changes are made with respect to the positions of the first thread groove 31, the second thread groove 32 and the hole 2 to obtain further embodiments.

Example 3

As shown in fig. 3, in a polishing pad, a first groove 31 and a second groove 32 are both disposed on the surface of a polishing pad 1, a hole 2 is formed in the center of the polishing pad 1, the first groove 31 is a ray starting from the edge of the hole 2, and the end of the ray ends in the middle region of the polishing pad 1; the second line groove 32 is an arc line with the end of the first line groove 31 as the starting point, the end of the second line groove 32 is tangent to the edge of the polishing pad 1, and the second line groove 32 is in the same direction as the rotation direction of the disk surface of the device. The distance between the wire slots 3 is not specifically limited in the embodiment, and can be adjusted according to actual requirements.

Example 4

As shown in fig. 4, a polishing pad is different from that of embodiment 3 in that the first line grooves 31 and the second line grooves 32 are disposed in a staggered manner and the first line grooves 31 and the second line grooves 32 are not connected end to end. The distance between the wire slots 3 is not specifically limited in this embodiment, and can be adjusted according to actual requirements.

Example 5

As shown in fig. 5, in a polishing pad, a first wire groove 31 and a second wire groove 32 are both disposed on the surface of a polishing pad 1, a hole 2 is disposed at the center of the polishing pad 1, the first wire groove 31 is a ray starting from the edge of the hole 2 and ending at the edge of the polishing pad 1; the first wire groove 31 is broken in the middle, the second wire groove 32 is arranged at the breaking position of the first wire groove 31 and connected with the broken first wire groove 31 end to end, the second wire groove 32 is communicated with the broken two parts of the first wire groove 31 in a staggered mode, and the inclined direction of the second wire groove 32 is the same as the rotation direction of the disk surface of the equipment. The distance between the wire slots 3 is not specifically limited in the embodiment, and can be adjusted according to actual requirements.

Example 6

As shown in fig. 6, a hole 2 is formed in the center of a polishing pad 1, a first groove 31 is a spiral line starting from the edge of the hole 2 based on the edge of the hole 2, the starting point of the spiral line is tangent to the edge of the hole 2, the rotation direction of the spiral line is the same as the rotation direction of the device disk surface, and the first groove 31 extends from the edge of the hole 2 to the edge of the polishing pad 1. The distance between the wire slots 3 is not specifically limited in the embodiment, and can be adjusted according to actual requirements.

Example 7

As shown in fig. 7, a hole 2 is disposed at any position on a polishing pad 1, in this embodiment, a first slot 31 and a second slot 32 are not distinguished, in this embodiment, the slots 3 are a plurality of concentric slots 3 disposed around the hole 2, the distance between the concentric circles is not specifically limited, and can be adjusted according to actual requirements, and the slots 3 extend from the hole 2 to the edge of the polishing pad 1.

Example 8

As shown in fig. 8, in the present embodiment, the shape of the wire grooves 3 is different from that of the wire grooves 3 in embodiment 7, and the wire grooves 3 are snail wires starting from the edge of the hole 2 and extending to the edge of the polishing pad 1.

Grinding pad 1 is prior to software design and the pattern of drawing surface wire casing 3 to the graphic file edit who will draw the completion is input CNC, and the graphic file that uses CNC to carry out wire casing 3 pattern processing according to drawing in advance to grinding pad 1 and is obtained the utility model provides a grinding pad 1, the carving tool that the CNC sculpture used are single-blade levogyration and dextrorotation carving tool, and the cutting edge diameter is 0.8mm and 1.0 mm.

And (3) fine grinding processing:

1. attaching a grinding pad 1 with patterns of wire grooves 3 carved by CNC to an upper disc and a lower disc of a grinding machine, wherein the upper disc is attached with a pad with a distance of 4mm wire grooves 3, and the lower disc is attached with a pad with a distance of 6mm wire grooves 3;

2. selecting carriers which are thinner than the thickness of a workpiece to be processed, placing the carriers on the surface of the lower disc grinding pad 1, adjusting the corresponding positions between the carriers and the outer gear ring and the sun gear of the grinding machine, and enabling the carrier spacing to be equal;

3. placing a sliced and roughly ground brittle and hard artificial crystal material, a ceramic wafer or a metal sheet in a corresponding cavity of a carrier;

4. lowering the upper disc of the grinding machine to be matched with the lower disc, selecting a grinding processing program of a prefabricated corresponding material in a grinding machine control computer, and then starting the grinding machine to grind;

in the above process, carrier is a fixture for grinding, which is called as a planetary plate or a dental plate by the name of chinese.

According to the direction of rotation of customer grinding machine quotation size and abrasive disc, the grooving pattern to grinding pad 1 has carried out meticulous normal definition and design, it can automatic balance in grinding the course of working to have guaranteed this engraving pattern abrasive material granule in the lapping liquid and coolant liquid evenly distribute and inlay in whole quotation, can be simultaneously again the quick emission of piece and the waste liquid that the abrasive material granule produced the work piece cutting, thereby the precision of work piece has further been guaranteed, consumptive material use amounts such as lapping liquid further reduce, the product is uniformity in batches can improve, and the application has been widened, make technology adaptability more extensive, and has fine popularization and practical value.

The technical scope of the present invention is not limited to the content in the above description, and those skilled in the art can make various modifications and changes to the above embodiments without departing from the technical spirit of the present invention, and these modifications and changes should fall within the protection scope of the present invention.

Claims

1. The grinding pad is characterized by comprising a grinding pad (1) body, a hole (2) is formed in the grinding pad (1) body, a wire groove (3) is arranged on the basis of the hole (2), the wire groove (3) comprises a first wire groove (31) and a second wire groove (32), the first wire groove (31) and the second wire groove (32) are arranged on the surface of the grinding pad (1),

the first wire groove (31) is a spiral line with the edge of the hole (2) as a basic starting point, the starting point of the spiral line is tangent to the edge of the hole (2), and the rotating direction of the spiral line is the same as that of the surface of the equipment;

the second wire groove (32) is a tangent spiral radioactive ray taking the edge of the hole (2) as a basic starting point, and the rotation direction of the tangent spiral radioactive ray is the same as that of the surface of the equipment;

the second groove (32) extends from the end region of the first groove (31) to the edge of the polishing pad (1).

2. The polishing pad according to claim 1, wherein the second wire groove (32) is offset from the first wire groove (31).

3. The polishing pad of claim 1, wherein each of the second wire grooves (32) is spaced 10 ° apart, and the second wire grooves (32) are 36 in number.

4. The polishing pad of claim 2, wherein the front section of the second wire grooves (32) is embedded in the gap between the first wire grooves (31) to a depth of 5-8% of the radius of the polishing pad (1).

5. The polishing pad according to claim 1, wherein the first (31) and second (32) grooves have a width of 0.8mm or 1.0mm and the first (31) and second (32) grooves have a depth of half the thickness of the polishing pad (1).