CN217243615U - Bedspread - Google Patents

Abstract

The utility model relates to a bedding technical field specifically provides a bedspread. The utility model discloses a bedspread includes body, coil pipe and semiconductor device, and semiconductor device includes that shell, semiconductor refrigeration heat the component, heat exchange water tank, water pipe assembly, water pump and inhales the sound component, and heat exchange water tank is close to one side setting that semiconductor refrigeration heated the component to heat the component with semiconductor refrigeration and carry out the heat exchange, the both ends of water pipe assembly communicate with heat exchange water tank and coil pipe respectively, inhale the sound component and cover on the inner wall and/or the outer wall of shell. Through such setting, can lay the body of bedspread on the bed for the bedspread not only has the heating function, still has the cooling function, and the usage is more extensive, compares the electric blanket in prior art, the utility model discloses a bedspread is safer. Further, by covering the inner wall and/or the outer wall of the housing with the sound absorbing member, noise of the semiconductor device can be reduced.

Description

Bedspread

Technical Field

The utility model relates to a bedding technical field specifically provides a bedspread.

Background

In winter or in the winter, many families can put an electric blanket on a bed, and the electric blanket is turned on before sleeping to heat the bedding. Especially in southern areas, the electric blanket is an indispensable bedding for every family because of no warm air.

However, the electric blanket is directly connected with a power supply, so that potential safety hazards exist, and fire accidents caused by the electric blanket occur.

Therefore, there is a need in the art for a new solution to the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving above-mentioned technical problem, promptly, solve among the prior art and heat the problem that has the potential safety hazard to the bed clothes through the electric blanket.

In a first aspect, the present invention provides a bed cover comprising a body, a semiconductor device and a coil located within the body, wherein the semiconductor device comprises: a housing; the semiconductor refrigerating and heating component is positioned in the shell and is connected with a power supply; the heat exchange water tank is positioned in the shell and is close to one side of the semiconductor refrigerating and heating component so as to exchange heat with the semiconductor refrigerating and heating component; the water pipe assembly is positioned in the shell, one end of the water pipe assembly is communicated with the heat exchange water tank, and the other end of the water pipe assembly is communicated with the coil pipe; a water pump located within the housing, the water pump being disposed on the water tube assembly; and a sound-absorbing member covering an inner wall and/or an outer wall of the casing.

In a preferred embodiment of the above bedspread, the sound absorbing member is a sound absorbing sponge.

In the preferable technical scheme of the bedspread, the sound-absorbing sponge is fixedly adhered to the shell.

In a preferred technical solution of the above bedspread, the semiconductor device further includes a fixing frame located in the housing, the fixing frame has a first installation space and a second installation space that are separated from each other, the semiconductor cooling and heating member and the heat exchange water tank are installed in the first installation space, and the water pump is installed in the second installation space.

In a preferred embodiment of the above bed cover, the first installation space and the second installation space are distributed along a vertical direction, and the first installation space is located above the second installation space.

In a preferred technical scheme of the above bedspread, the fixing frame includes a first fixing plate, a second fixing plate, a third fixing plate and a supporting column, the top end of the supporting column is connected with the first fixing plate, the bottom end of the supporting column is connected with the third fixing plate, the second fixing plate is located between the first fixing plate and the third fixing plate and connected with the supporting column, a first installation space is formed between the first fixing plate and the second fixing plate, and a second installation space is formed between the second fixing plate and the third fixing plate.

In a preferred technical solution of the above bedspread, the fixing frame further includes an adjusting member, the adjusting member is mounted on the supporting column, the second fixing plate is connected to the adjusting member, and the adjusting member can move up and down along the supporting column to adjust a distance between the second fixing plate and the first and third fixing plates.

In the preferable technical scheme of the bedspread, the adjusting member is an adjusting nut, the supporting column is provided with a threaded section, and the adjusting nut is in threaded connection with the threaded section.

In a preferred technical solution of the above bedspread, a ventilation structure is provided on the outer shell.

In a preferred embodiment of the above bed cover, the ventilation structure is a plurality of strip-shaped holes formed on the outer shell.

Under the condition of adopting above-mentioned technical scheme, the utility model discloses a bedspread includes: a body having a chamber; a coil located within the chamber; the semiconductor device comprises a shell, a semiconductor refrigerating and heating component, a heat exchange water tank, a water pipe component and a water pump, wherein the semiconductor refrigerating and heating component, the heat exchange water tank, the water pipe component and the water pump are arranged in the shell; the sound absorbing member is covered on the inner wall and/or the outer wall of the shell. By the arrangement, the body of the bed cover can be laid on a bed, and hot water can be supplied to the body of the bed cover through the semiconductor device in winter and can be heated through the bed cover; on the contrary, when having arrived summer, can provide cold water to the body of bedspread through semiconductor device, cool down through the bedspread, compare the electric blanket in prior art, the utility model discloses a bedspread is safer to the bedspread not only has the heating function, still has the cooling function, and the usage is more extensive, and user experience is better. Further, the noise of the semiconductor device can be reduced by covering the inner wall and/or the outer wall of the housing with the sound absorbing member.

Further, the utility model discloses a semiconductor device still includes the mount, and the mount has first installation space and the second installation space of spaced apart, and semiconductor refrigeration heating component and heat exchange water tank install at first installation space, and water pump and buffer tank install at second installation space. Through such setting, through setting up two independent installation spaces promptly, be favorable to carrying out reasonable arrangement to semiconductor refrigeration heating component, heat exchange water tank, water pump and buffer tank.

Further, the utility model discloses a mount still includes the adjusting part, and the adjusting part is installed on the support column, and the second fixed plate is connected with the adjusting part, and the adjusting part can reciprocate in order to adjust the distance between second fixed plate and first fixed plate and the third fixed plate along the support column. Through such setting, be convenient for adjust the height of first installation space and second installation space according to particular case, more be favorable to carrying out reasonable arrangement to semiconductor refrigeration heating component, heat exchange water tank, water pump and buffer tank.

Drawings

Preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

fig. 1 is a first schematic structural view of the bed cover of the present invention;

FIG. 2 is a second schematic structural view of the bedspread of the present invention;

FIG. 3 is an enlarged schematic view at A in FIG. 2;

fig. 4 is a third schematic structural view of the bed cover of the present invention;

fig. 5 is a schematic structural view of the semiconductor device of the present invention.

List of reference numerals:

11. a body; 12. a coil pipe; 121. a joint pipe; 1211. an annular limiting groove; 13. an elastic clamp; 2. a housing; 21. a temperature adjustment key; 22. a display screen; 23. a strip-shaped hole; 3. a semiconductor cooling and heating member; 4. a heat exchange water tank; 5. a water tube assembly; 51. a water inlet pipe; 52. a water outlet pipe; 6. a water pump; 7. a buffer water tank; 81. a first installation space; 82. a second installation space; 83. a first fixing plate; 84. a second fixing plate; 85. a third fixing plate; 86. a support column; 861. a threaded segment; 87. adjusting the nut; 9. a heat dissipating component; 91. a radiating pipe; 92. and a heat sink.

Detailed Description

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.

It should be noted that in the description of the present invention, the terms "top", "bottom", "upper", "lower", "left", "right", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Specifically, as shown in fig. 1 and fig. 2, the bed cover of the present invention comprises a body 11 and a semiconductor device, wherein the semiconductor device can provide hot water and cold water to the body 11 of the bed cover to make the bed cover radiate heat energy and cold energy.

In specific use, the body 11 of the bed cover can be laid on a bed, and hot water can be supplied to the body 11 of the bed cover through the semiconductor device to be heated through the bed cover in winter; on the contrary, in summer, cold water can be supplied to the body 11 of the bed cover through the semiconductor device, and the temperature can be reduced through the bed cover.

Compare the electric blanket among the prior art, the utility model discloses a bedspread is safer, in addition, the utility model discloses a bedspread not only has the heating function, still has the cooling function, and the usage is more extensive, and user experience is better.

As shown in fig. 1 to 5, the body 11 of the bed cover of the present invention has a chamber, a coil 12 is installed in the chamber, and the semiconductor device includes a housing 2 and a semiconductor cooling and heating member 3, a heat exchange water tank 4, a water pipe assembly 5, and a water pump 6 installed in the housing 2.

The semiconductor refrigerating and heating member 3 is connected to a power supply, and the heat exchange water tank 4 is disposed near the lower side of the semiconductor refrigerating and heating member 3 so as to exchange heat with the semiconductor refrigerating and heating member 3, preferably, the top surface of the heat exchange water tank 4 is attached to the bottom surface of the semiconductor refrigerating and heating member 3.

The one end and the 4 intercommunications of heat exchange water tank of water pipe assembly 5, the other end of water pipe assembly 5 and the coil pipe 12 intercommunication that is located the body 11 of bedspread, water pump 6 sets up on water pipe assembly 5, and heat exchange water tank 4, water pipe assembly 5, water pump 6 and coil pipe 12 constitute circulation water route.

In winter, make semiconductor device start the mode of heating, under the drive of water pump 6, water circulates between heat exchange water tank 4 and coil pipe 12 along water pipe assembly 5, and when water flows to heat exchange water tank 4, absorbs the heat energy of semiconductor refrigeration heating component 3, and the temperature risees, then flows into in the coil pipe 12, makes the bedspread give off heat, and the water that flows out from coil pipe 12 flows back to heat exchange water tank 4 again.

Similarly, in summer, the semiconductor device is enabled to start a refrigeration mode, water flows between the heat exchange water tank 4 and the coil 12 along the water pipe assembly 5 under the driving of the water pump 6, when the water flows to the heat exchange water tank 4, the cold energy of the semiconductor refrigeration and heating component 3 is absorbed, the water temperature is reduced, then the water flows into the coil 12, the temperature of the body 11 of the bedspread is reduced, and the water flowing out of the coil 12 flows back to the heat exchange water tank 4 again.

Illustratively, as shown in fig. 1 to 4, the water pipe assembly 5 includes a water inlet pipe 51 and a water outlet pipe 52, wherein one end of the water inlet pipe 51 is communicated with the outlet end of the water pump 6, the other end of the water inlet pipe 51 is communicated with the inlet end of the coil pipe 12, one end of the water outlet pipe 52 is communicated with the outlet end of the coil pipe 12, the other end of the water outlet pipe 52 is communicated with the inlet end of the heat exchange water tank 4, and the outlet end of the heat exchange water tank 4 is communicated with the inlet end of the water pump 6.

When the semiconductor device is operated, the water pump 6 pumps water in the heat exchange water tank 4 out and conveys the water to the water inlet pipe 51, the water flows into the coil 12 along the water inlet pipe 51, the water flowing out of the coil 12 enters the water outlet pipe 52, and then flows back to the heat exchange water tank 4 along the water outlet pipe 52.

It should be noted that, in practical applications, the semiconductor cooling and heating member 3 may be configured as a sheet structure, a plate structure or a block structure, and the adjustment and change of the specific structural shape of the semiconductor cooling and heating member 3 do not deviate from the principle and scope of the present invention, which should be limited within the protection scope of the present invention.

Of course, it is preferable to provide the semiconductor cooling and heating member 3 as a semiconductor cooling and heating sheet.

Preferably, the coil 12 is removably connected to the body 11 of the bed cover.

Through adopting detachable mode to be connected coil pipe 12 and body 11, be convenient for part the two to be convenient for wash or change the body 11 of bedspread, also be convenient for overhaul coil pipe 12.

It should be noted that, in practical application, the coil 12 may be connected to the body 11 of the bed cover by an adhesive method, for example, an adhesive strip is provided on the coil 12 and the body 11, and the coil 12 and the body 11 are adhered by the adhesive strip; or, the coil 12 may be connected to the body 11 of the bed cover by clamping, for example, a plurality of annular clamping bands are disposed on the inner wall of the body 11, and the coil 12 is inserted into the annular clamping bands to clamp the coil 12 to the body 11; still alternatively, the coil 12 may be connected to the body 11 by magnetic attraction, for example, soft magnetic strips may be disposed on the coil 12 and the body 11, and the soft magnetic strips may connect the coil 12 and the body.

Preferably, as shown in fig. 4, the number of the coils 12 is two, and the two sets of the coils 12 are distributed along the width direction of the body 11 of the bed cover, and the two sets of the coils 12 are distributed left and right in the view of the figure.

By arranging two sets of independent coil pipes 12 in the width direction of the bed cover, the user can conveniently select and use the coil pipes according to actual conditions. For example, when only one person has a rest in bed, can choose to make only a set of coil pipe 12 work therein, so can avoid the energy waste, in addition, even if there are two people simultaneously when having a rest in bed, the user also can be according to respective habits and customs, whether the selection makes coil pipe 12 work, has greatly made things convenient for user's use, and user's use experience is better.

It should be noted that the number of the coil pipes 12 is not limited to the two groups, for example, the number of the coil pipes 12 can be set to three or five groups, and the adjustment and change of the specific number of the coil pipes 12 are not deviated from the principle and scope of the present invention, and should be limited within the protection scope of the present invention. Of course, it is preferable to provide the number of coils 12 in two sets.

The technical solution of the present invention will be described below by taking the number of the coil pipes 12 as two groups as an example.

Preferably, as shown in fig. 2 to 5, the number of the heat exchange water tank 4, the water pipe assemblies 5, the water pump 6 and the semiconductor cooling and heating member 3 is two, wherein the heat exchange water tank 4 is communicated with the corresponding coil pipe 12 through the corresponding water pipe assembly 5, the water pump 6 is arranged on the corresponding water pipe assembly 5, and the semiconductor cooling and heating member 3 is arranged close to the corresponding heat exchange water tank 4.

That is to say, each group of coil pipes 12 corresponds to one set of heat exchange water tank 4, water pipe assembly 5, water pump 6 and semiconductor refrigerating and heating component 3, and through the arrangement, the control is more convenient.

It should be noted that, when the number of the coils 12 is increased, the number of the heat exchange water tanks 4, the water pipe assemblies 5, the water pumps 6 and the semiconductor cooling and heating members 3 is correspondingly increased, for example, when the number of the coils 12 is three, the number of the heat exchange water tanks 4, the water pipe assemblies 5, the water pumps 6 and the semiconductor cooling and heating members 3 is three; when the number of the coils 12 is five, the number of the heat exchange water tank 4, the water pipe assembly 5, the water pump 6 and the semiconductor refrigerating and heating member 3 is also five.

In addition, it should be noted that, in practical application, only one water pump 6 may be provided, and both the two water inlet pipes 51 are communicated with the outlet end of the water pump 6, in this case, a control valve may be provided on each of the two water inlet pipes 51, and when the coil 12 needs to work, the control valve on the water inlet pipe 51 communicated with the coil 12 may be opened. Of course, two water pumps 6 are preferably provided, one on each water tube assembly 5.

In addition, it should be noted that, in practical applications, the number of the semiconductor cooling and heating members 3 may be set to be one, and the two heat exchange water tanks 4 share the same semiconductor cooling and heating member 3. Of course, it is preferable to provide two semiconductor cooling and heating members 3, each of which is disposed adjacent to the corresponding heat exchange water tank 4.

Preferably, as shown in fig. 4, a temperature adjustment key 21 is provided on the housing 2 of the semiconductor device so that a user can adjust the temperature of the coil 12.

Illustratively, as shown in fig. 4, a temperature adjustment key 21 is provided on the top surface of the housing 2, and a user can adjust the temperature of the coil 12 through the temperature adjustment key 21.

In practical applications, the temperature adjustment key 21 may be touch-sensitive, press-type, or knob-type.

In addition, in practical applications, the two sets of coils 12 may be controlled by the same set of temperature adjustment keys 21, or may be controlled by two different sets of temperature adjustment keys 21.

In addition, it should be noted that, in practical applications, the temperature of the coil 12 can be adjusted by controlling the speed of the water flow or the magnitude of the current flowing into the semiconductor cooling and heating element 3.

Preferably, as shown in fig. 4, there are two sets of temperature adjustment keys 21, which are distributed left and right and respectively correspond to the two sets of coils 12, and the temperature adjustment keys 21 can adjust the temperature of the corresponding coils 12.

It should be noted that when the number of the coils 12 is increased, the number of the temperature adjustment keys 21 is correspondingly increased, for example, when the number of the coils 12 is three, the number of the temperature adjustment keys 21 is also set to be three; when the number of the coils 12 is five, the number of the temperature adjustment keys 21 is also set to five.

Preferably, as shown in fig. 4, a display screen 22 is also provided on the housing 2 of the semiconductor device so that the user knows the temperature of the coil 12.

Illustratively, a display screen 22 is provided on the top surface of the housing 2, adjacent to the temperature adjustment key 21, the display screen 22 displaying the temperature of the coil 12.

Preferably, as shown in fig. 2 and 3, the coil pipe 12 has a connector tube 121, the connector tube 121 is located outside the chamber, and the water pipe assembly 5 is detachably and fixedly connected with the connector tube 121.

Illustratively, two ends of the coil 12 are respectively provided with a joint pipe 121, and the water inlet pipe 51 and the water outlet pipe 52 are respectively detachably and fixedly connected with the corresponding joint pipe 121.

It should be noted that, in practical application, can adopt the grafting mode to be connected inlet tube 51, outlet pipe 52 and joint pipe 121, perhaps, also can adopt the spiro union mode to be connected inlet tube 51, outlet pipe 52 and joint pipe 121, and so on, this kind is not skew to the adjustment and the change of inlet tube 51, outlet pipe 52 and the concrete connection mode of joint pipe 121 the utility model discloses a principle and scope all should be injectd within the protection scope of the utility model.

Preferably, as shown in fig. 2 and 3, the water pipe assembly 5 is connected with the connector pipe 121 in a plugging manner. The water pipe assembly 5 is connected with the connector pipe 121 in an inserting mode, and the disassembly is more convenient.

It should be noted that, in practical applications, the water inlet pipe 51 and the water outlet pipe 52 may be inserted into the corresponding joint pipes 121, or two joint pipes 121 may be inserted into the water inlet pipe 51 and the water outlet pipe 52, respectively, or the water inlet pipe 51 may be inserted into the corresponding joint pipe 121, and another joint pipe 121 may be inserted into the water outlet pipe 52.

Preferably, as shown in fig. 2 and 3, the bedspread of the present invention further comprises an elastic clamp 13, in the installed state, the end of the water pipe assembly 5 is inserted into the joint pipe 121, and the elastic clamp 13 is clamped on the outer wall of the joint pipe 121 to prevent the water pipe assembly 5 from being separated from the joint pipe 121.

After the installation is completed, the end parts of the water inlet pipe 51 and the water outlet pipe 52 are inserted into the corresponding joint pipes 121 and are clamped by the elastic clamping hoop 13, so that the connection stability of the water inlet pipe 51, the water outlet pipe 52 and the joint pipes 121 can be improved. When the connector is disassembled, the elastic clamp 13 is firstly taken down from the connector pipe 121, so that the water inlet pipe 51 and the water outlet pipe 52 can be conveniently pulled out from the corresponding connector pipe 121.

Preferably, as shown in fig. 2 and 3, an annular stopper groove 1211 is formed on an outer wall of the joint pipe 121, and the elastic band 13 is seated in the annular stopper groove 1211 to prevent the elastic band 13 from moving in a length direction of the joint pipe 121.

The elastic clamp 13 is limited by the annular limiting groove 1211 formed in the outer wall of the joint pipe 121, so that the connection stability between the water pipe assembly 5 and the joint pipe 121 can be further improved.

Preferably, the bed cover of the present invention further comprises an inflatable member (not shown in the figures) located within the chamber of the body 11 of the bed cover, the inflatable member being capable of being inflated and deflated to adjust the softness of the bed cover.

In practical applications, if the user feels that the bed cover is relatively hard, a portion of the air in the inflatable member can be discharged to improve the softness of the bed cover; conversely, if the user feels that the bed cover is relatively soft, the inflatable member may be inflated to reduce the softness of the bed cover and increase the hardness of the bed cover.

It should be noted that, in practical application, can adopt manual mode to aerify and exit the component of aerifing, perhaps, also can set up an air pump and aerify the component intercommunication, aerify and exit the component of aerifing through the air pump, etc. this kind of nimble adjustment and change do not deviate from the utility model discloses a principle and scope all should be injectd within the protection scope.

Of course, it is preferable to provide an air pump which communicates with the inflating member to inflate and deflate the inflating member.

In addition, in practical applications, the coil 12 may be installed inside the inflatable member, or the coil 12 may be installed outside the inflatable member. Of course, it is preferred to have the coil 12 inside the inflatable member.

In addition, it should be noted that, in practical application, the inflation member may be an inflatable cushion, and a receiving space is formed inside the inflatable cushion, and the coil 12 may be placed in the receiving space; or, also can set up the inflatable component into the gas tube, can wrap up the outside at coil pipe 12 with the gas tube, etc. this kind of adjustment and change to the concrete structural style of inflatable component do not deviate from the utility model discloses a principle and scope all should be injectd within the protection scope of the utility model.

Preferably, as shown in fig. 5, the semiconductor device of the present invention further includes a buffer water tank 7 connected in series between the heat exchange water tank 4 and the coil pipe 12 through a water pipe assembly 5.

By providing the buffer tank 7, frequent start-up and stop of the semiconductor device can be avoided, so that the service life of the semiconductor device can be improved.

Illustratively, as shown in fig. 5, the buffer water tank 7 may be installed between the heat exchange water tank 4 and the water pump 6, specifically, the inlet end of the buffer water tank 7 is communicated with the outlet end of the heat exchange water tank 4, and the outlet end of the buffer water pipe is communicated with the inlet end of the water pump 6.

It should be noted that, in the case that the number of the heat exchange water tanks 4 is two, the number of the buffer water tanks 7 is also two, and the two buffer water tanks correspond to the two heat exchange water tanks 4, respectively.

Preferably, as shown in fig. 5, the semiconductor device of the present invention further includes a fixing frame having a first installation space 81 and a second installation space 82 which are separated from each other, the semiconductor cooling and heating member 3 and the heat exchange water tank 4 are installed in the first installation space 81, and the water pump 6 and the buffer tank 7 are installed in the second installation space 82.

Through setting up two independent installation spaces, be favorable to carrying out reasonable arrangement to semiconductor refrigeration and heating component 3, heat exchange water tank 4, water pump 6 and buffer tank 7.

Preferably, as shown in fig. 5, the first installation space 81 and the second installation space 82 are distributed in a vertical direction, and the first installation space 81 is located above the second installation space 82.

Preferably, as shown in fig. 5, the fixing frame of the present invention includes a first fixing plate 83, a second fixing plate 84, a third fixing plate 85 and a supporting column 86, the top end of the supporting column 86 is connected to the first fixing plate 83, the bottom end of the supporting column 86 is connected to the third fixing plate 85, the second fixing plate 84 is located between the first fixing plate 83 and the third fixing plate 85 and is connected to the supporting column 86, a first installation space 81 is formed between the first fixing plate 83 and the second fixing plate 84, and a second installation space 82 is formed between the second fixing plate 84 and the third fixing plate 85.

Exemplarily, as shown in fig. 5, the number of the supporting columns 86 is four, each of the first fixing plate 83, the second fixing plate 84, and the third fixing plate 85 is square, top ends of the four supporting columns 86 are fixedly connected to four corners of the first fixing plate 83, respectively, and bottom ends of the four supporting columns 86 are fixedly connected to four corners of the third fixing plate 85, respectively.

The shapes of the first fixing plate 83, the second fixing plate 84, and the third fixing plate 85 are not limited to the square shape, and for example, the first fixing plate 83, the second fixing plate 84, and the third fixing plate 85 may be rectangular or circular; in addition, the number of the supporting columns 86 is not limited to four, for example, the number of the supporting columns 86 can be set to three or five, and the like, and such adjustment and change to the specific shapes of the first fixing plate 83, the second fixing plate 84, and the third fixing plate 85 and the specific number of the supporting columns 86 do not depart from the principle and scope of the present invention, and should be limited within the protection scope of the present invention.

Preferably, as shown in fig. 5, the fixing frame of the present invention further includes an adjusting member, the adjusting member is installed on the supporting column 86, the second fixing plate 84 is connected with the adjusting member, and the adjusting member can move up and down along the supporting column 86 to adjust a short distance between the second fixing plate 84 and the first fixing plate 83 and a distance between the second fixing plate 84 and the third fixing plate 85.

Through set up adjusting part on support column 86, be convenient for adjust the height of first installation space 81 and second installation space 82 according to particular case, more be favorable to carrying out reasonable the arranging to semiconductor refrigeration and heating component 3, heat exchange water tank 4, water pump 6 and buffer tank 7.

It should be noted that, in practical application, the adjusting member may be configured as a supporting plate, the supporting plate is provided with a bayonet, the supporting column 86 is provided with a plurality of snap rings, the plurality of snap rings are distributed at intervals along the height direction of the supporting column 86, the bayonet has an opening, the size of the opening is slightly smaller than the outer diameter of the supporting column 86, the inner diameter of the bayonet is equal to or slightly larger than the outer diameter of the supporting column 86, when the adjusting member is installed, the supporting column 86 enters the bayonet through the opening of the bayonet, the snap rings abut against the bottom side of the supporting plate to prevent the supporting plate from sliding downwards along the supporting column 86, the bottom surface of the second fixing plate 84 abuts against the top surface of the supporting plate, the mounting height of the second fixing plate 84 can be adjusted by matching the supporting plate with the snap rings at different positions, or the adjusting member may be configured as a nut, the supporting column 86 is provided with a threaded structure, and the nut is in threaded fit with the threaded structure, and the like, such adjustments and changes to the specific structural form of the adjusting member do not depart from the principle and scope of the present invention, and should be limited within the protection scope of the present invention.

Preferably, as shown in fig. 5, the adjustment member is provided as an adjustment nut 87, and the support column 86 is provided with a threaded section 861, and the adjustment nut 87 is threadedly engaged with the threaded section 861.

Illustratively, as shown in fig. 5, the second fixing plate 84 is provided with a through hole structure (not shown in the figure) at a position corresponding to the supporting column 86, in the case of completing the installation, the supporting column 86 is located in the through hole structure on the second fixing plate 84, the inner diameter of the through hole structure is slightly larger than the outer diameter of the supporting column 86, so that the second fixing plate 84 can slide up and down relative to the supporting column 86, the bottom surface of the second fixing plate 84 abuts against the top surface of the adjusting nut 87, when the adjusting nut 87 is rotated, the adjusting nut 87 can move up and down along the threaded section 861, and the installation height of the second fixing plate 84 is adjusted by rotating the adjusting nut 87.

Preferably, as shown in fig. 5, the semiconductor device of the present invention further includes a heat dissipation assembly 9, wherein the heat dissipation assembly 9 is disposed near the upper side of the semiconductor cooling and heating component 3.

Illustratively, as shown in fig. 5, the heat dissipating assembly 9 is also installed in the first installation space 81, and when the semiconductor device is turned on for heating, the cooling energy generated at the upper side of the semiconductor cooling and heating means 3 is dissipated through the heat dissipating assembly 9; when the semiconductor device starts the cooling function, the heat energy on the upper side of the semiconductor cooling and heating component 3 is also radiated through the heat radiation component 9.

Preferably, as shown in fig. 5, the heat dissipation assembly 9 of the present invention includes a plurality of heat dissipation pipes 91, the bottom end of the heat dissipation pipe 91 is connected to the semiconductor cooling and heating member 3, the heat dissipation pipes 91 are divided into two groups, the two groups of heat dissipation pipes 91 are disposed relatively and are connected to the two ends of the semiconductor cooling and heating member 3, and the heat dissipation pipes 91 are spaced apart from each other in each group.

Illustratively, as shown in fig. 5, the number of the radiating pipes 91 is eight, and the radiating pipes 91 are divided into two groups, each group having four radiating pipes 91, one group of the radiating pipes 91 is connected to the left end of the semiconductor cooling and heating member 3, the other group of the radiating pipes 91 is connected to the right end of the semiconductor cooling and heating member 3, and the four radiating pipes 91 in each group of the radiating pipes 91 are spaced apart along the length direction of the semiconductor cooling and heating member 3.

Preferably, as shown in fig. 5, the heat dissipation assembly 9 of the present invention further comprises a plurality of heat dissipation fins 92, wherein the heat dissipation fins 92 are connected to the heat dissipation pipe 91, and the heat dissipation fins 92 are distributed at intervals along the length direction of the heat dissipation pipe 91.

By providing the plurality of heat radiating fins 92 on the heat radiating pipe 91, it is more advantageous to radiate the heat energy or the cold energy generated by the semiconductor cooling and heating member 3.

Preferably, as shown in fig. 1, a ventilation structure is provided on the housing 2 of the semiconductor device. When the semiconductor device is in operation, heat energy and cold energy within the enclosure 2 can be dissipated to the outside of the enclosure 2 through the ventilation structure.

Preferably, as shown in fig. 1, the ventilation structure is a plurality of bar-shaped holes 23 formed on the outer case 2.

Preferably, the semiconductor device of the present invention further includes a sound absorbing member (not shown) covering the inner wall and/or the outer wall of the housing 2.

By covering the sound absorbing member on the casing 2, the noise of the semiconductor device can be reduced, and the user experience can be improved.

In actual use, the sound absorbing member may be covered only on the inner wall of the casing 2, or the sound absorbing member may be covered only on the outer wall of the casing 2, or both the inner wall and the outer wall of the casing 2 may be covered with the sound absorbing member.

In addition, in practical applications, the sound absorbing member may be configured as a sound absorbing sponge or a sound absorbing plate, and the operation noise of the semiconductor device may be reduced by the sound absorbing member.

Preferably, the sound-absorbing member is a sound-absorbing sponge, and the sound-absorbing sponge is fixedly adhered to the housing 2.

So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, a person skilled in the art can make equivalent changes or substitutions to the related technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims (10)

1. A bed cover, comprising a body, a semiconducting device, and a coiled tube within the body, wherein the semiconducting device comprises:

a housing;

the semiconductor refrigerating and heating component is positioned in the shell and is connected with a power supply;

the heat exchange water tank is positioned in the shell and is close to one side of the semiconductor refrigerating and heating component so as to exchange heat with the semiconductor refrigerating and heating component;

the water pipe assembly is positioned in the shell, one end of the water pipe assembly is communicated with the heat exchange water tank, and the other end of the water pipe assembly is communicated with the coil pipe;

a water pump located within the housing, the water pump being disposed on the water tube assembly; and

a sound-absorbing member covering an inner wall and/or an outer wall of the casing.

2. The coverlet of claim 1, wherein the sound absorbing member is a sound absorbing sponge.

3. The coverlet of claim 2, wherein the sound absorbing sponge is adhesively secured to the housing.

4. The bedspread according to claim 1, wherein the semiconductor device further comprises a fixing frame located in the housing, the fixing frame having a first installation space and a second installation space which are separated, the semiconductor cooling and heating member and the heat exchange water tank being installed in the first installation space, and the water pump being installed in the second installation space.

5. The coverlet of claim 4, wherein the first installation space and the second installation space are distributed in a vertical direction and the first installation space is located above the second installation space.

6. The bedspread according to claim 5, wherein the fixing frame comprises a first fixing plate, a second fixing plate, a third fixing plate and a supporting column, the top end of the supporting column is connected with the first fixing plate, the bottom end of the supporting column is connected with the third fixing plate, the second fixing plate is located between the first fixing plate and the third fixing plate and connected with the supporting column, the first fixing plate and the second fixing plate form the first installation space therebetween, and the second fixing plate and the third fixing plate form the second installation space therebetween.

7. The coverlet of claim 6, wherein the mount further comprises an adjustment member mounted on the support column, the second fixing plate being connected with the adjustment member, the adjustment member being movable up and down along the support column to adjust the distance between the second fixing plate and the first and third fixing plates.

8. The coverlet of claim 7, wherein the adjustment member is an adjustment nut, and the support post is provided with a threaded section, and the adjustment nut is in threaded engagement with the threaded section.

9. A coverlet according to any one of claims 1 to 8, wherein a ventilation structure is provided on the housing.

10. The coverlet of claim 9, wherein the ventilation structure is a plurality of strip-shaped apertures formed in the shell.

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