CN217241106U

CN217241106U - Appearance structure of embedded type micro-computing module

Info

Publication number: CN217241106U
Application number: CN202122901682.1U
Authority: CN
Inventors: 郎魁军; 罗庆; 刘一楠; 赵爽宇; 高荷福
Original assignee: Shenyang Aircraft Design and Research Institute Aviation Industry of China AVIC
Current assignee: Shenyang Aircraft Design and Research Institute Aviation Industry of China AVIC
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2022-08-19
Anticipated expiration: 2031-11-24

Abstract

The utility model belongs to the technical field of the design of the appearance structure of electronic equipment, in particular to an appearance structure of an embedded type micro-computing module, which comprises a box body and a box bottom; the box body comprises a rectangular shell with an opening at the bottom surface, a sunken rectangular platform is arranged on the top surface of the box body, the rectangular platform is provided with a display screen, one side edge of the box body is provided with an interface communicated with the outside, and the interface is provided with a cover covering the interface; the side of box body has non-metallic material's window, the box bottom covers and connects the bottom surface opening of box body, the box bottom has the window is made through the cooperation that adopts nonmetal and metal, has strengthened the structural strength of product own, can avoid the shielding of metal to the signal simultaneously, and the design of spill top surface can make and play structural strength's effect through the concave surface.

Description

Appearance structure of embedded type micro-computing module

Technical Field

The utility model belongs to the technical field of electronic equipment appearance structure design, especially, relate to an embedded micro-computing module's outward appearance structure.

Background

The design of the appearance and structure of embedded computing modules currently used in the field of onboard computing generally follows corresponding module design standards, such as ARINC, ASAAC, VME, etc. The design key points of the external box are emphasized on the technical aspects of weight, strength, heat dissipation and the like, and under the design standard, the overall strength, heat dissipation and signal radiation capacity of the external box are required to be further improved.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present application provides an appearance structure of an embedded type microcomputer module, which includes a box body and a box bottom;

the box body comprises a rectangular shell with an opening at the bottom surface, a sunken rectangular platform is arranged on the top surface of the box body, the rectangular platform is provided with a display screen, one side edge of the box body is provided with an interface communicated with the outside, and the interface is provided with a cover covering the interface; the side surface of the box body is provided with a window made of a non-metal material;

the box bottom covers and is connected with the bottom opening of the box body, and the box bottom is provided with the bottom window.

Preferably, the material of the case comprises an aluminium alloy.

Preferably, the outer surface of the box body is provided with an aluminum alloy sandblasting oxidation hot coating.

Preferably, one end of the cover is hinged to the box body, and the other end of the cover is connected with the box body in a threaded or buckled mode.

Preferably, the shape of the window includes a fence shape or a net shape.

Preferably, the material of the window comprises pc plastic.

Preferably, the edge of the top surface of the box body is connected with the edge of the platform through a gradient plane, and the connection between the platform and the plane is provided with a chamfer.

Preferably, the box body is internally provided with a reinforcing rib.

Preferably, the thickness of the box body is not less than 1 mm.

Preferably, the connection between the window and the box body comprises screw connection or adhesive connection.

The advantages of the present application include: through the cooperation of adopting nonmetal and metal to make, strengthened the structural strength of the product itself, can avoid the shielding of metal to the signal simultaneously, the design of spill top surface can make and play structural strength's effect through the concave surface, and simultaneously, sunken platform can protect the display screen can not be wearing and tearing or damage in the use, and the activity flap of kneck makes the flap avoid dust and damage, plays certain protection and sealed effect.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a preferred embodiment of the present application;

FIG. 2 is a top view of a preferred embodiment of the present application;

FIG. 3 is a front view of a preferred embodiment of the present application;

FIG. 4 is a rear view of a preferred embodiment of the present application;

FIG. 5 is a side view of a preferred embodiment of the present application.

Detailed Description

In order to make the implementation objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are some, but not all embodiments of the present application. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application, and should not be construed as limiting the present application. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application. Embodiments of the present application will be described in detail below with reference to the drawings.

The application provides an appearance structure of an embedded type micro-computing module, which comprises a box body and a box bottom;

the box body comprises a rectangular shell with an opening at the bottom surface, a sunken rectangular platform is arranged on the top surface of the box body, the rectangular platform is provided with a display screen, one side edge of the box body is provided with an interface communicated with the outside, and the interface is provided with a cover covering the interface; the side surface of the box body is provided with a window made of a non-metal material; as shown in FIG. 1, the overall structure of the module is designed to use aluminum alloy material as a main body of the box body; a PC plastic window is adopted to support the penetration of wireless signals; the whole design ensures that the metal box body and the plastic window body can be better integrated. The structure adopts a structure surface, wherein the frame is gray, and the panel is black; the front surface of the shell is provided with a display screen with the size of 2.2 inches, 40.3mm and 54.4 mm; adopt half hidden WIFI antenna. The main points of the overall structure design include:

(1) designing an aluminum alloy structural part: as shown in fig. 2, the center of the module is designed by 6061 aluminum alloy and a CNC machining process is adopted. The reinforcing frame is designed in the middle frame and is responsible for reinforcing the structure, supporting and installing the printed board, holes are formed in the structural part according to the requirements of electrical connection relations, the thickness of the designed structural part material is not less than 1mm for obtaining higher structural strength, and reinforcing ribs are designed.

(2) Designing a PC plastic window: as shown in fig. 1 or 5, the PC plastic window is used as a wireless signal emission window and is respectively positioned on the rear side surface and the bottom surface of the module. The PC material is adopted for design, the thickness is 1mm, the supporting force is strong, and no barrier is generated to wireless signals; the PC plastic window is embedded into the rear cover and is bonded by the UV glue, so that the connection is firm.

(3) Connector type selection of the interface: to maintain a good appearance, industry standard and civilian standard connectors, switches, LED lights, etc. are used. The connector is selected to meet the support of high speed signals while considering the appearance, and standard cables can be used as far as possible. In the figure, the third is a window opened for a D-shaped high-density connector, and the window is provided with a cover which is connected with the box body by screws.

(4) Designing a display screen: as shown in fig. 2, the display screen is a high-definition small screen, and the working condition of the computing unit can be simply simulated and displayed by receiving external display data.

(5) Opening holes on a power interface: as shown in fig. 3, the front side of the structure is perforated for power interface.

(6) And (3) designing a box cover: the bottom surface is used as a box bottom and is provided with a wireless transmission channel; a PC plastic window is embedded in the box body; the box bottom and the box body are connected by screws or can be glued.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The appearance structure of an embedded type microcomputer module is characterized by comprising a box body and a box bottom;

the box bottom covers and is connected with the bottom opening of the box body, and the box bottom is provided with a bottom window.

2. The appearance structure of an embedded microcomputer module as claimed in claim 1, wherein one end of the door is hinged to the case body, and the other end is connected to the case body by means of screw threads or a snap.

3. The appearance structure of an embedded microcomputer module as claimed in claim 1, wherein the shapes of the window and the bottom window include a fence-like or a net-like shape.

4. The appearance structure of an embedded microcomputer module as claimed in claim 1, wherein the edges of the top surface of the case and the edges of the lands are connected by a plane having a gradient, and the connection between the lands and the plane has a chamfer.

5. The external appearance structure of an embedded microcomputer module as set forth in claim 1, wherein the case body has reinforcing ribs inside.

6. The appearance structure of an embedded microcomputer module as set forth in claim 1, wherein the thickness of the case is not less than 1 mm.

7. The appearance structure of the embedded microcomputer module of claim 1, wherein the connection of the window to the case body comprises a screw connection or an adhesive connection.