CN217238759U

CN217238759U - Cooling system

Info

Publication number: CN217238759U
Application number: CN202220384711.3U
Authority: CN
Inventors: 张玉蓉; 郑永亮; 陈旭
Original assignee: Shanghai Wingtech Electronic Technology Co Ltd
Current assignee: Shanghai Wingtech Electronic Technology Co Ltd
Priority date: 2022-02-24
Filing date: 2022-02-24
Publication date: 2022-08-19
Anticipated expiration: 2032-02-24

Abstract

The disclosure relates to the technical field of server heat dissipation, in particular to a cooling system, which comprises a box body, a circuit board, a plurality of cooling parts and a liquid distributor, wherein the circuit board is arranged in the box body, the plurality of cooling parts are detachably arranged on the circuit board, and each cooling part is provided with a server, so that when one server is damaged, only the cooling part corresponding to the server needs to be detached; and because the liquid separator is connected with the cooling parts through the pipelines, and one pipeline corresponds to one group of cooling parts, each group of cooling parts is provided with the corresponding pipeline, when one group of cooling parts is disassembled, only the pipeline corresponding to the cooling part is required to be disconnected with the cooling part, and therefore, the whole cooling system is not required to be disassembled, the use is convenient, and the cooling effect is good.

Description

Cooling system

Technical Field

The disclosure relates to the technical field of server heat dissipation, in particular to a cooling system.

Background

Nowadays, green energy-saving data centers have become the development trend of modern data centers, and the heat dissipation problem of servers thereof is always one of the problems to be solved. The computer intelligent server belongs to precision equipment, can produce a large amount of heats during operation, if not in time distribute away the capacity that produces, then can influence the normal operating of server. At present, the heat dissipation mode of an intelligent server mainly comprises two types: air-cooled heat dissipation and liquid-cooled heat dissipation. The air-cooled heat dissipation is provided with a single detachable radiator, and a liquid cooling system for liquid-cooled heat dissipation is integrated with the heat dissipation plate.

For the air-cooling scheme module, heat generated by the server is absorbed by the heat sink, and then the heat on the heat sink is taken out by the air blown by the fan module. Although the fan is simple to manufacture and low in maintenance cost, the fan is high in noise, and the air conditioner is required to be added to the machine room for cooling, so that a large amount of extra electric energy is consumed. For the existing liquid cooling scheme module, although air cooling is changed into liquid cooling, the defects caused by an air cooling heat dissipation mechanism are avoided, the liquid cooling system is connected with all cold plates in series, and the whole liquid cooling system needs to be disassembled together when a single server is maintained, so that the normal operation of other servers is influenced, and the maintenance is inconvenient.

SUMMERY OF THE UTILITY MODEL

To solve the above technical problem or at least partially solve the above technical problem, the present disclosure provides a cooling system.

The present disclosure provides a cooling system comprising:

a box body;

a circuit board mounted inside the case;

a plurality of cooling members detachably mounted on the circuit board, and on which servers are provided;

the liquid distributor is connected with the cooling parts through pipelines, and one pipeline corresponds to one group of cooling parts.

Optionally, a connecting part is arranged between the cooling part and the pipeline, and the connecting part is adjusted to enable the cooling part to be detached.

Optionally, the coupling part comprises a quick-change coupling, and the cooling part is coupled to the pipe via the quick-change coupling.

Optionally, the quick-change connector comprises a first quick-change connector and a second quick-change connector connected with the first quick-change connector, the first quick-change connector is connected with the pipeline, and the second quick-change connector is connected with the cooling component.

Optionally, a liquid collector is arranged on the box body, and the liquid collector and the liquid distributor are distributed on two sides of the box body.

Optionally, the pipeline includes a cold pipe and a hot pipe, the cooling component is connected to the liquid distributor through the cold pipe, and the cooling component is connected to the liquid collector through the hot pipe;

one of the cold pipes corresponds to one of the cooling parts, and one of the hot pipes corresponds to one of the cooling parts.

Optionally, the liquid collector comprises a first accommodating chamber and a second accommodating chamber, the first accommodating chamber is connected with the liquid distributor, and the first accommodating chamber is provided with a liquid inlet;

the second accommodating chamber is connected with the heat pipe, and the second accommodating chamber is provided with a liquid outlet.

Optionally, a cold liquid pipe is connected between the liquid distributor and the liquid collector, the cold liquid pipe is used for conveying liquid to the liquid distributor, and the liquid distributor conveys the liquid to the cooling component through the cold pipe.

Optionally, the pipe is connected to the circuit board or integrally formed with the circuit board.

Optionally, a holding part is disposed on the circuit board.

Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:

the cooling system provided by the embodiment of the disclosure comprises a box body, a circuit board, a plurality of cooling parts and a liquid distributor, wherein the circuit board is arranged in the box body, the plurality of cooling parts are detachably arranged on the circuit board, and each cooling part is provided with a server, so that when one server is damaged, only the cooling part corresponding to the server needs to be detached; and because the liquid separator is connected with the cooling parts through the pipelines, and one pipeline corresponds to one group of cooling parts, each group of cooling parts is provided with the corresponding pipeline, when one group of cooling parts is disassembled, only the pipeline corresponding to the cooling part is required to be disconnected with the cooling part, and therefore, the whole cooling system is not required to be disassembled, the use is convenient, and the cooling effect is good.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the embodiments or technical solutions in the prior art description will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.

FIG. 1 is a schematic diagram illustrating a first perspective view of a cooling system according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram illustrating a second perspective view of a cooling system according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a cooling system according to an embodiment of the present disclosure, with a cooling component removed.

Wherein,

1. a box body; 2. a circuit board; 3. a cooling member; 4. a server; 5. a liquid separator; 6. a pipeline; 7. a connecting member; 71. a first quick connector; 72. a second quick connector; 8. a liquid collector; 81. a liquid inlet; 82. a liquid outlet; 9. cooling the pipe; 10. a heat pipe; 11. a cold liquid pipe; 12. a gripping member; 13. a connector is provided.

Detailed Description

In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.

Referring to fig. 1 to 3, the present disclosure provides a cooling system, which includes a box 1, a circuit board 2, a plurality of cooling components 3, and a liquid distributor 5, where the circuit board 2 is installed inside the box 1, the plurality of cooling components 3 are detachably installed on the circuit board 2, and each cooling component 3 is provided with a server 4, so that when one of the servers 4 is damaged, only the cooling component 3 corresponding to the server 4 needs to be detached; and because the liquid distributor 5 is connected with the cooling parts 3 through the pipelines 6, and one pipeline 6 corresponds to one group of cooling parts 3, each group of cooling parts 3 is provided with the corresponding pipeline 6, when one group of cooling parts 3 is disassembled, only the pipeline 6 corresponding to the cooling part 3 needs to be disconnected with the cooling part 3, so that the whole cooling system does not need to be disassembled, the use is convenient, and the cooling effect is good.

The server 4 may be a GPU chip, and the present application is mainly applied to heat dissipation of a high-power-consumption GPU chip. With the rapid development of the artificial intelligence industry at present, more and more AI artificial intelligence servers 4 which need high intelligence are provided, the GPU chip is used as one of the core components of the artificial intelligence server 4, the power consumption is larger and larger, but the general cooling system is difficult to maintain, and therefore a cooling system for maintaining and cooling a single GPU chip is developed. Because a GPU chip is arranged on one cooling part 3, the cooling effect of the GPU chip is good, and the problem that cold liquid is not uniformly distributed is solved.

The cooling unit 3 may be a cold plate, a high-efficiency cooling mechanism capable of heat exchange by liquid circulation, and the size of the cooling unit may be selected according to the model power consumption of the GPU. The circuit board 2 may be an intelligent server 4, and may be a basic circuit board 2 capable of carrying a GPU chip and implementing interaction of each circuit, and the size thereof may be defined according to the configuration of the specific case 1 and the implementation of the functional structure. The size of the tubing may be determined by the cold plate size and dimensions.

The above-described group of cooling members 3 may be one cooling member 3 or a plurality of cooling members 3. When one cooling component 3 corresponds to one pipeline 6, when the cooling component 3 needs to be disassembled, only the pipeline 6 needs to be disconnected, and other cooling components 3 can normally operate.

In some embodiments, a connecting part 7 is arranged between the cooling part 3 and the pipe 6, and the connecting part 7 is adjusted to enable the cooling part 3 to be disassembled, so that the disassembly is convenient.

Wherein, adapting unit 7 includes quick change coupler, and cooling part 3 passes through quick change coupler and is connected with pipeline 6, can in time block rivers and absorb and spill over liquid when realizing quick assembly disassembly through quick change coupler's setting.

In addition, the quick change coupling comprises a first quick coupling 71 and a second quick coupling 72 connected to the first quick coupling 71, the first quick coupling 71 being connected to the pipe 6, the second quick coupling 72 being connected to the cooling element 3. When the first quick connector 71 is detached, the second quick connector 72 only needs to be detached from the first quick connector 71, and the detachment is convenient.

The quick-change connector is arranged to penetrate through the circuit board 2 and to be routed from the bottom of the circuit board 2, and the design can reduce the surface area of the whole cooling system.

The quick-change coupling is an existing coupling, and the size of the quick-change coupling can be selected according to the size of the pipeline 6 and the heat dissipation function.

In some embodiments, the tank 1 is provided with a liquid collector 8, and the liquid collector 8 and the liquid separator 5 are distributed on both sides of the tank 1, thereby providing a sufficient distribution space for the pipes 6.

The pipeline 6 comprises a cold pipe 9 and a heat pipe 10, the cooling part 3 is connected with the liquid distributor 5 through the cold pipe 9, and the cooling part 3 is connected with the liquid collector 8 through the heat pipe 10; one cold pipe 9 corresponds to one cooling part 3 and one hot pipe 10 corresponds to one cooling part 3. During the use, cold liquid in the liquid collector 8 is firstly conveyed to the liquid distributor 5, the liquid distributor 5 divides the liquid into multiple paths of liquid and then conveys the liquid to the cooling part 3 through the cold pipe 9, the liquid can cool the server 4, the heat emitted by the server 4 is mainly taken away through the cold liquid, and then the liquid taking away the heat flows to the heat pipe 10, so that the heat dissipation is completed.

In addition, liquid trap 8 includes first room and the second room of holding, and first room of holding is connected with knockout 5, and first room of holding has inlet 81, and cold liquid gets into first room of holding from inlet 81, and the liquid in the first room of holding flows into earlier and shunts in knockout 5, then carries to cool down server 4 to cooling part 3 by cold pipe 9 again. The second receiving chamber is connected to the heat pipe 10 and has a liquid outlet 82, and the hot liquid in the cooling part 3 flows through the heat pipe 10 to the second receiving chamber and then is discharged through the second receiving chamber.

A cold liquid pipe 11 is connected between the liquid separator 5 and the liquid collector 8, the cold liquid pipe 11 is used for conveying liquid to the liquid separator 5, the liquid separator 5 conveys the liquid to the cooling part 3 through the cold pipe 9, and the cold liquid pipe 11 is also distributed on the circuit board 2.

The hot liquid is discharged and then cooled in the cooling chamber, and the cooled liquid is then transferred to the first accommodating chamber through the liquid inlet 81, thereby realizing the circulation cooling.

Foretell liquid trap 8 and knockout 5 can distribute and set up two, and two liang of correspondences, and cooling part 3 can set up eight, and a knockout 5 and a liquid trap 8 can correspond four cooling part 3 promptly.

The liquid collector 8 is fixed on the front panel of the box body 1, and the liquid distributor 5 is fixed on the base of the case.

The dimensions of the liquid collector 8 and the liquid distributor 5 described above are selected according to the respective water supply function required.

In some embodiments, the conduit 6 is attached to the circuit board 2, and the conduit 6 may be separately machined and then attached to the circuit board 2.

Alternatively, the duct 6 may be integrally formed with the circuit board 2, that is, may be integrally die-cast during processing.

In some embodiments, a connector 13 is disposed on the circuit board 2, and the connector 13 is used for connecting with other electrical connectors outside.

Wherein, be provided with gripping part 12 on the circuit board 2, can conveniently take whole cooling system through the setting of gripping part 12.

In summary, the cooling component 3 of the cooling system provided by the embodiment of the present disclosure is detachably mounted on the circuit board 2, and each cooling component 3 is provided with a server 4, so when one of the servers 4 is damaged, only the cooling component 3 corresponding to the server 4 needs to be detached, and when one of the cooling components 3 is detached, only the pipeline 6 corresponding to the cooling component 3 needs to be disconnected from the cooling component 3, and the whole cooling system does not need to be detached, so that the single cooling component 3 can be detached separately, and the single server 4 can be maintained. Simultaneously, the air conditioner runs quieter, the cooling efficiency is higher, the power consumption is lower, and the investment of the air conditioner can be reduced after the liquid cooling technology is adopted.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling system, comprising:

a box body (1);

the circuit board (2), the said circuit board (2) is installed inside the said container body (1);

a plurality of cooling members (3), wherein the plurality of cooling members (3) are detachably mounted on the circuit board (2), and a server (4) is arranged on the cooling members (3);

the liquid distributor (5) is connected with the cooling part (3) through a pipeline (6), and the pipeline (6) corresponds to one group of the cooling part (3).

2. A cooling system according to claim 1, characterised in that a connecting part (7) is arranged between the cooling member (3) and the pipe (6), the connecting part (7) being adjusted to enable disassembly of the cooling member (3).

3. A cooling system according to claim 2, characterised in that the coupling part (7) comprises a quick-change coupling, by means of which the cooling part (3) is connected with the pipe (6).

4. A cooling system according to claim 3, characterised in that the quick-change coupling comprises a first quick-change coupling (71) and a second quick-change coupling (72) connected to the first quick-change coupling (71), the first quick-change coupling (71) being connected to the pipe (6), the second quick-change coupling (72) being connected to the cooling element (3).

5. Cooling system according to claim 1, characterized in that a liquid collector (8) is arranged on the tank (1), the liquid collector (8) and the liquid separator (5) being distributed on both sides of the tank (1).

6. Cooling system according to claim 5, characterized in that the conduit (6) comprises a cold pipe (9) and a hot pipe (10), the cooling component (3) being connected to the liquid distributor (5) via the cold pipe (9), the cooling component (3) being connected to the liquid collector (8) via the hot pipe (10);

one cold pipe (9) corresponds to one cooling part (3), and one hot pipe (10) corresponds to one cooling part (3).

7. A cooling system according to claim 6, wherein the liquid trap (8) comprises a first receiving chamber and a second receiving chamber, the first receiving chamber being connected to the liquid separator (5) and the first receiving chamber having an inlet opening (81);

the second accommodating chamber is connected with the heat pipe (10), and the second accommodating chamber is provided with a liquid outlet (82).

8. A cooling system according to claim 6, characterized in that a cold liquid pipe (11) is connected between the liquid distributor (5) and the liquid collector (8), which cold liquid pipe (11) is adapted to conveying liquid to the liquid distributor (5), which liquid distributor (5) conveys the liquid to the cooling component (3) via the cold pipe (9).

9. Cooling system according to claim 1, characterized in that the duct (6) is connected to the circuit board (2) or is integrated with the circuit board (2).

10. Cooling system according to claim 1, characterized in that a holding part (12) is provided on the circuit board (2).