CN217230973U - Partial electroplating device for lead frame - Google Patents
Partial electroplating device for lead frame Download PDFInfo
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- CN217230973U CN217230973U CN202220383591.5U CN202220383591U CN217230973U CN 217230973 U CN217230973 U CN 217230973U CN 202220383591 U CN202220383591 U CN 202220383591U CN 217230973 U CN217230973 U CN 217230973U
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- push rod
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Abstract
The utility model belongs to the field of lead frame electroplating, in particular to a lead frame local electroplating device, which comprises a fixed frame, wherein the bottom of the fixed frame is provided with a clamping mechanism, the bottom of the fixed frame is provided with a workbench, the top of the workbench is provided with an electroplating device body, the bottom of the workbench is provided with a lifting mechanism, the bottom of the lifting mechanism is provided with a fixing screw, and the bottom of the lifting mechanism is provided with a base; through all having effectual promotion to the local electroplating effect and the stability of lead frame when using, place the lead frame in fixture's bottom when using, then fixture fixes the lead frame on the workstation, and elevating system moves when then needing the height of adjusting the workstation, goes up and down the workstation, and the lift in-process is adjusted the lead frame and is electroplated the interval of device body, lets running state and the security of equipment all have more effective guarantee when using.
Description
Technical Field
The utility model relates to a lead frame electroplates the field, specifically is lead frame local electroplating device.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. The outer layer of many coins is also plated.
The existing lead frame local electroplating device has no effective improvement on the adjusting effect when in use, has no effective height adjusting effect on lead frames with different specifications when in use, is easy to have the condition of non-adaption in the electroplating process, and influences the electroplating effect;
therefore, a lead frame partial plating apparatus has been proposed to address the above problems.
SUMMERY OF THE UTILITY MODEL
In order to compensate prior art's not enough, solve current lead frame local electroplating device and do not have effectual promotion to the regulation effect when using, do not have effectual altitude mixture control effect to the lead frame of different specifications when using, the condition of not adaptation appears in electroplating the in-process easily, lets the problem that the electroplating effect influences, the utility model provides a lead frame local electroplating device.
The utility model provides a technical scheme that its technical problem adopted is: lead frame local electroplating device, including the mount, the bottom of mount is provided with fixture, the bottom of mount is provided with the workstation, the top of workstation is provided with electroplates the device body.
The bottom of workstation is provided with elevating system, elevating system's bottom is provided with the set screw, elevating system's bottom is provided with the base.
Preferably, the front of electroplating device body is provided with the access cover, and through welded connection between workstation and the electroplating device body, lets the connection stability and the intensity of equipment all have effectual promotion through welded connection, also has effectual guarantee to equipment structure security when using.
Preferably, the front of access cover is provided with the maintenance screw, and the thermovent is seted up in the front of access cover, and the access cover is connected with electroplating device body through the maintenance screw, connects through the maintenance screw and lets the installation of equipment and dismantle efficiency all have effectual promotion, also has more effective promotion to the structural stability and the security of equipment when using.
Preferably, elevating system includes first fixed plate, screw and electric putter, and the screw is seted up at the top of first fixed plate, and the bottom of first fixed plate sets up electric putter, and through welded connection between first fixed plate and the electric putter, through welded connection can effectual guarantee equipment the stability of being connected, also has effectual promotion to the structural safety nature of equipment when using.
Preferably, electric putter's bottom sets up the sleeve, and telescopic bottom sets up the second fixed plate, and the axis coincidence setting of telescopic axis and second fixed plate, sets up the structural stability that can effectual guarantee equipment through the axis coincidence, all has effectual guarantee to the balanced state and the security of equipment when using.
Preferably, fixture includes roof and hydraulic push rod, and the bottom of roof sets up hydraulic push rod, and through welded connection between roof and the hydraulic push rod, through welded connection can effectual guarantee equipment's welding stability and joint strength, all has stable guarantee to centre gripping effect and stability when using.
Preferably, the bottom of hydraulic push rod sets up the bottom plate, and hydraulic push rod's axis and the axis coincidence setting of bottom plate let clamping stability and centre gripping atress equilibrium all have effectual guarantee through the axis coincidence setting.
Preferably, the mount includes support body and vertical plate, and the bottom of support body sets up the vertical plate, and through welded connection between support body and the vertical plate, let stability and the security in the clamping process all have effectual guarantee through welded connection, avoid electroplating the in-process displacement phenomenon to appear.
The utility model discloses an useful part lies in:
the utility model discloses a mount, fixture, the workstation, elevating system, the fixed screw, cooperation work between base and the electroplating device body lets the running state and the regulation effect of equipment all have more comprehensive promotion, the lead frame of the different specifications of effectual adaptation when using, effect and stability are all had effectual promotion to the local electroplating of lead frame when using, place the lead frame in fixture's bottom when using, then fixture fixes the lead frame on the workstation, then elevating system moves when needing the height of adjusting the workstation, go up and down the workstation, the interval of lift in-process regulation lead frame and electroplating device body, can more effectual adaptation of carrying on in electroplating process, the running state and the security that let equipment all have more effective guarantee when using.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic view of the structure of the present invention;
fig. 2 is a schematic structural view of the lifting mechanism of the present invention;
FIG. 3 is a schematic view of the structure of the clamping mechanism of the present invention;
FIG. 4 is a schematic view of the fixing frame of the present invention;
fig. 5 is an enlarged view of the structure at a in fig. 1 of the present invention.
In the figure: 1. a fixed mount; 101. a frame body; 102. a vertical plate; 2. a clamping mechanism; 201. a top plate; 202. a hydraulic push rod; 203. a base plate; 3. a work table; 4. a lifting mechanism; 401. a first fixing plate; 402. a screw hole; 403. an electric push rod; 404. a sleeve; 405. a second fixing plate; 5. fixing screws; 6. a base; 7. an electroplating device body; 8. an access cover; 9. a heat dissipation port; 10. and (6) overhauling the screws.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-5, the lead frame local electroplating device includes a fixing frame 1, a clamping mechanism 2 disposed at the bottom of the fixing frame 1, a worktable 3 disposed at the bottom of the fixing frame 1, and an electroplating device body 7 disposed at the top of the worktable 3.
The bottom of the workbench 3 is provided with a lifting mechanism 4, the bottom of the lifting mechanism 4 is provided with a fixing screw 5, and the bottom of the lifting mechanism 4 is provided with a base 6.
In this embodiment, the front surface of the electroplating device body 7 is provided with an access cover 8, and the workbench 3 is connected with the electroplating device body 7 by welding; during operation, the structural stability of the equipment can be effectively guaranteed, and the maintenance efficiency and the stability of the equipment are effectively improved when the equipment is used.
In this embodiment, an access screw 10 is disposed on the front surface of the access cover 8, a heat dissipation port 9 is disposed on the front surface of the access cover 8, and the access cover 8 is connected to the electroplating apparatus body 7 through the access screw 10; during operation, the disassembly and assembly efficiency of the access cover 8 can be effectively improved, and the structural stability and the structural safety of equipment can be effectively guaranteed when the access cover is used.
In this embodiment, the lifting mechanism 4 includes a first fixing plate 401, a screw hole 402 and an electric push rod 403, the screw hole 402 is formed at the top of the first fixing plate 401, the electric push rod 403 is arranged at the bottom of the first fixing plate 401, and the first fixing plate 401 and the electric push rod 403 are connected by welding; during operation, the lifting stability of the equipment can be effectively guaranteed, the running state of the equipment is effectively guaranteed during use, and the height adjusting effect and the height adjusting state of the equipment can be effectively guaranteed during use.
In this embodiment, a sleeve 404 is disposed at the bottom of the electric push rod 403, a second fixing plate 405 is disposed at the bottom of the sleeve 404, and a central axis of the sleeve 404 and a central axis of the second fixing plate 405 are overlapped; during operation, the stress balance of the equipment can be effectively guaranteed, the running state and the safety of the equipment can be effectively improved when the equipment is used, and the running state of the equipment can be effectively guaranteed when the equipment is used.
In this embodiment, the clamping mechanism 2 includes a top plate 201 and a hydraulic push rod 202, the hydraulic push rod 202 is disposed at the bottom of the top plate 201, and the top plate 201 is connected to the hydraulic push rod 202 by welding; during operation, the clamping stability of the equipment can be effectively guaranteed, and the structural stability and the electroplating stability of the equipment are effectively improved when the device is used.
In this embodiment, the bottom of the hydraulic push rod 202 is provided with a bottom plate 203, and the central axis of the hydraulic push rod 202 is overlapped with the central axis of the bottom plate 203; the during operation, structural stability and the security that can effectual guarantee equipment all have effectual promotion to the lift straightness that hangs down and the centre gripping security of equipment when using, and the equilibrium has more effective guarantee.
In this embodiment, the fixing frame 1 includes a frame body 101 and a vertical plate 102, the vertical plate 102 is disposed at the bottom of the frame body 101, and the frame body 101 and the vertical plate 102 are connected by welding; during operation, the structural stability of the equipment can be effectively guaranteed, and the clamping effect can be effectively guaranteed during use.
The theory of operation, through place the lead frame in fixture 2's bottom when using, then fixture 2 fixes the lead frame on workstation 3, elevating system 4 moves when then need adjusting the height of workstation 3, goes up and down workstation 3, the lift in-process is adjusted the lead frame and is electroplated the interval of device body 7, can more effectual adaptation of carrying on electroplating the in-process, the running state and the security that let equipment all have more effective guarantee when using.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.
Claims (8)
1. Lead frame local plating device, its characterized in that: the electroplating device comprises a fixed frame (1), wherein a clamping mechanism (2) is arranged at the bottom of the fixed frame (1), a workbench (3) is arranged at the bottom of the fixed frame (1), and an electroplating device body (7) is arranged at the top of the workbench (3);
the bottom of workstation (3) is provided with elevating system (4), the bottom of elevating system (4) is provided with set screw (5), the bottom of elevating system (4) is provided with base (6).
2. The lead frame localized plating device of claim 1, wherein: the front surface of the electroplating device body (7) is provided with an access cover (8), and the workbench (3) is connected with the electroplating device body (7) through welding.
3. The lead frame partial plating apparatus of claim 2, wherein: the front of the access cover (8) is provided with an access screw (10), the front of the access cover (8) is provided with a heat dissipation opening (9), and the access cover (8) is connected with the electroplating device body (7) through the access screw (10).
4. The lead frame partial plating apparatus of claim 1, wherein: the lifting mechanism (4) comprises a first fixing plate (401), a screw hole (402) and an electric push rod (403), the screw hole (402) is formed in the top of the first fixing plate (401), the electric push rod (403) is arranged at the bottom of the first fixing plate (401), and the first fixing plate (401) is connected with the electric push rod (403) in a welding mode.
5. The lead frame localized plating device of claim 4, wherein: the bottom of electric putter (403) sets up sleeve (404), and the bottom of sleeve (404) sets up second fixed plate (405), and the axis of sleeve (404) and the axis coincidence of second fixed plate (405) set up.
6. The lead frame partial plating apparatus of claim 1, wherein: the clamping mechanism (2) comprises a top plate (201) and a hydraulic push rod (202), the hydraulic push rod (202) is arranged at the bottom of the top plate (201), and the top plate (201) is connected with the hydraulic push rod (202) in a welding mode.
7. The lead frame partial plating apparatus of claim 6, wherein: the bottom of the hydraulic push rod (202) is provided with a bottom plate (203), and the central axis of the hydraulic push rod (202) is superposed with the central axis of the bottom plate (203).
8. The lead frame localized plating device of claim 1, wherein: the fixing frame (1) comprises a frame body (101) and a vertical plate (102), the vertical plate (102) is arranged at the bottom of the frame body (101), and the frame body (101) is connected with the vertical plate (102) in a welding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220383591.5U CN217230973U (en) | 2022-02-24 | 2022-02-24 | Partial electroplating device for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220383591.5U CN217230973U (en) | 2022-02-24 | 2022-02-24 | Partial electroplating device for lead frame |
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| CN217230973U true CN217230973U (en) | 2022-08-19 |
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| CN202220383591.5U Active CN217230973U (en) | 2022-02-24 | 2022-02-24 | Partial electroplating device for lead frame |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116479485A (en) * | 2023-05-04 | 2023-07-25 | 泰州东田电子有限公司 | High-reliability lead frame and preparation method thereof |
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2022
- 2022-02-24 CN CN202220383591.5U patent/CN217230973U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116479485A (en) * | 2023-05-04 | 2023-07-25 | 泰州东田电子有限公司 | High-reliability lead frame and preparation method thereof |
| CN116479485B (en) * | 2023-05-04 | 2023-10-20 | 泰州东田电子有限公司 | High-reliability lead frame and preparation method thereof |
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