CN217217257U

CN217217257U - Electronic assembly and electronic equipment

Info

Publication number: CN217217257U
Application number: CN202220149765.1U
Authority: CN
Inventors: 孙平
Original assignee: Ruijie Networks Co Ltd
Current assignee: Ruijie Networks Co Ltd
Priority date: 2022-01-20
Filing date: 2022-01-20
Publication date: 2022-08-16
Anticipated expiration: 2032-01-20

Abstract

The utility model discloses an electronic component and electronic equipment. The electronic assembly comprises a chip, a circuit board, a radiator, a back plate and a plurality of fixing assemblies. The chip is mounted on the circuit board, the backboard is mounted on one side of the circuit board, which is far away from the chip, the radiator is mounted on one side of the chip, which is far away from the backboard, the backboard and the radiator are fixedly connected by a plurality of fixing assemblies and are located on the peripheral side of the chip, and the fixing assemblies are used for keeping the radiator and the backboard at a fixed distance. The impact force of the radiator is prevented from damaging the chip when the electronic component vibrates or falls accidentally.

Description

Electronic assembly and electronic equipment

Technical Field

The utility model relates to a computer cooling equipment technical field especially relates to an electronic component and electronic equipment.

Background

The chip generally dissipates heat by conducting heat to a heat sink through a heat-conducting medium. A heat conductive medium is applied to the chip, and then a heat sink is mounted to the chip, thereby transferring heat of the chip to the heat sink. Generally, a metal shell is encapsulated outside a chip to protect the chip to a certain extent, but as the power consumption of the chip increases, the chip without the metal shell is widely used to improve the heat dissipation efficiency. During transportation, installation and the like, the chip without the protection of the metal shell is easily damaged, for example, during transportation, the heat sink is subjected to vibration, and the chip is damaged by impact force.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of electronic component and electronic equipment for solve electronic component in the transportation, the radiator makes the problem that the chip damaged because of the vibration.

The utility model provides a pair of electronic component includes chip, circuit board, radiator, backplate and a plurality of fixed subassembly. The chip is mounted on the circuit board, the backboard is mounted on one side of the circuit board, which is far away from the chip, the radiator is mounted on one side of the chip, which is far away from the backboard, the backboard and the radiator are fixedly connected by a plurality of fixing assemblies and are located on the peripheral side of the chip, and the fixing assemblies are used for keeping the radiator and the backboard at a fixed distance.

In the above embodiment, the electronic component may vibrate due to bumping during transportation, and the heat sink contacts with the chip, and when the vibration is severe, the heat sink may generate impact force to damage the chip. The fixing component fixes the radiator on the back plate, so that the radiator and the back plate keep a fixed distance. The vibration amplitude of the radiator in the transportation process is reduced, and the situation that the chip is damaged by strong impact force generated by large-amplitude vibration of the radiator is avoided.

In an optional technical solution, the fixing assembly may include a guide post and a sleeve, the guide post is fixed to the back plate, an extending direction of the guide post is perpendicular to the back plate, the sleeve is fixed to the heat sink, and the sleeve is fixedly mounted on an outer wall of the guide post. The guide columns play a role in installing and guiding the radiator, and the guide columns are perpendicular to the back plate, so that the radiator is vertically installed on the back plate along the extending direction of the guide columns when being installed, and the phenomenon that the radiator is inclined in the installation process to cause stress concentration to damage a chip is avoided.

In an optional technical scheme, the fixing assembly can further comprise a fastener. The sleeve is provided with a cylinder wall, the cylinder wall is provided with a slot, the opening of the slot faces the radiator, and the slot extends towards one side of the back plate. The fastening piece is sleeved on the outer wall of the sleeve and used for enabling the cylinder wall to contract and compressing the guide post. When the fastener compresses the sleeve, the pressure between the inner wall of the sleeve and the outer wall of the guide post is increased, so that the friction force between the inner wall of the sleeve and the outer wall of the guide post is increased, the sleeve and the guide post are fixed, and the relative sliding is weakened. Thereby reducing the possibility of the heat sink moving in the extending direction of the guide posts.

In an alternative embodiment, the fastener has a bore, which may include a first bore portion. The diameter of the first hole part is gradually increased along the direction close to the back plate. The first hole part is in a horn mouth shape, so that the sleeve can conveniently extend into the first hole part of the fastener, and the installation operation is convenient. And as the fastening piece is gradually pressed down to be close to the back plate, the diameter of the first hole part is gradually reduced, so that the pressure of the fastening piece on the cylinder wall is continuously increased until the fastening piece can not move downwards any more and is blocked with the sleeve. Therefore, the pressure between the sleeve and the guide post is larger, and the sleeve and the guide post can not slide relatively. And further, the distance between the radiator and the back plate is fixed, and the situation that the radiator is close to the chip when vibrating violently and the chip is damaged by collision is avoided.

In an optional technical solution, the hole may further include a second hole portion, the second hole portion is located on a side of the first hole portion away from the back plate, the second hole portion is columnar, and a diameter of a position where the first hole portion and the second hole portion are adjacent is equal to a diameter of the second hole portion. The connecting position of the first hole part and the second hole part is smooth, and the guide column can not be prevented from being inserted into the first hole part and the second hole part. The second hole portion can reinforce the pressure of the fastening member on the sleeve.

In an alternative embodiment, the fastener is threadedly connected to the sleeve. To facilitate mounting of the fastener to the sleeve. Meanwhile, the threaded connection structure enhances the stability of the connection between the fastener and the sleeve, and the fastener is prevented from falling off when the electronic assembly vibrates in the transportation process.

In an optional technical scheme, one end of the sleeve, which faces the back plate, is provided with a convex edge, the heat radiator is provided with a mounting hole, and the mounting hole is sleeved on the outer wall of the sleeve. The convex edge is positioned between the back plate and the radiator and fixedly connected with the radiator. Above-mentioned protruding edge can conduct the frictional force between guide post and the sleeve to giving the radiator, gives the radiator along the ascending holding power of guide post extending direction, can block that the radiator is close to above-mentioned chip, avoids electronic component vibration or unexpected falling, makes the impact force of radiator destroy the chip.

In an optional technical scheme, the plurality of fixing components are uniformly distributed on the peripheral side of the chip. The stress of the radiator is uniform.

In an optional technical scheme, the electronic assembly further comprises a pressing assembly, the pressing assembly comprises a screw and a spring, the heat radiator is fixed on the back plate through the screw, the screw comprises a head portion and a rod portion which are fixedly connected, and the spring is sleeved on the rod portion and clamped between the head portion and the heat radiator. The pressing assembly gives a downward driving force to the radiator along the extending direction of the guide post, so that the radiator has a tendency of moving towards the back plate, the radiator can be kept in a fit state with the chip, and the reliable heat contact conduction is ensured. The problem that the radiator is separated from the chip due to overlarge vibration of the electronic assembly is solved.

The utility model also provides an electronic equipment. The electronic equipment comprises the electronic assembly. When the electronic equipment vibrates in the transportation process or falls down accidentally to be impacted, the distance between the radiator and the back plate is kept fixed, and the chip is prevented from being damaged by the impact force of the radiator.

Drawings

Fig. 1 is a schematic structural diagram of an electronic component according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of the assembly of a fastener and sleeve in one embodiment of the invention;

fig. 3 is a schematic structural diagram of a sleeve according to an embodiment of the present invention.

Reference numerals:

100-chip; 200-a circuit board; 300-a heat sink; 1-a back plate; 2-a stationary component; 21-a guide post; 221-a sleeve; 22-cylinder wall; 222-a fastener; 223-slotting; 224-a first aperture portion; 225-a second bore portion; 2241-a first end; 2242-a second end; 226-convex edge; 3-a pressing component; 31-a screw; 311-a head; 312-a stem portion; 32-a spring; 301-mounting holes; 302-a via; 10-a threaded hole; 4-heat conducting material.

Detailed Description

To avoid the chip from being damaged by impact force generated by vibration during transportation of the heat sink. An embodiment of the utility model provides an electronic component and electronic equipment. In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an electronic component according to an embodiment of the present invention. As shown in fig. 1, the present invention provides an electronic component including a chip 100, a circuit board 200, a heat sink 300, a back plate 1 and a plurality of fixing members 2. The chip 100 is mounted on the circuit board 200, the back plate 1 is mounted on a side of the circuit board 200 away from the chip 100, the heat sink 300 is mounted on a side of the chip 100 away from the back plate 1, and the fixing members 2 are fixedly connected to the back plate 1 and the heat sink 300 and located on the periphery of the chip 100. The fixing member 2 is used to keep the heat sink 300 and the back plate 1 at a fixed distance.

In the above embodiment, the electronic component may vibrate due to bumping during transportation, the heat spreader 300 contacts the chip 100, and in case of severe vibration, the heat spreader 300 may generate impact force to damage the chip 100. The fixing member 2 fixes the heat sink 300 to the rear plate 1 such that the heat sink 300 and the rear plate 1 maintain a fixed distance. The vibration amplitude of the heat sink 300 in the transportation process is reduced, and the chip 100 is prevented from being damaged by the strong impact force generated by the large vibration of the heat sink 300.

In an alternative embodiment, a plurality of the fixing members 2 may be uniformly distributed on the peripheral side of the chip 100, so that the heat spreader 300 is uniformly stressed. The phenomenon that the heat sink 300 is inclined to cause stress to the chip 100 to damage the chip 100 because the fixing component 2 is not arranged in a certain area of the heat sink 300, so that the area does not have enough supporting force during vibration.

With continued reference to fig. 1, in an alternative embodiment, the fixing assembly 2 includes a guide post 21 and a sleeve 221. The guide posts 21 are attached to the back plate 1, and the extending direction of the guide posts 21 is perpendicular to the back plate 1. After the sleeve 221 is fixedly connected to the heat sink 300, the sleeve 221 is fitted over the outer wall of the guide post 21 and fixed to the guide post 21. The guide posts 21 have an installation guiding function on the heat sink 300, and the guide posts 21 are perpendicular to the backboard 1, so that the heat sink 300 is vertically installed on the backboard 1 along the extending direction of the guide posts 21 when being installed, and the phenomenon that the chip 100 is damaged by stress concentration due to inclination of the heat sink 300 in the installation process is avoided.

Fig. 2 is a cross-sectional view of the assembly of a fastener and sleeve in an embodiment of the invention. As shown in fig. 2, in an alternative embodiment, the fixing assembly 2 may further include a fastener 222. The sleeve 221 has a cylindrical wall 22, and the cylindrical wall 22 has a slit 223, and the opening of the slit 223 is directed toward the radiator 300, and the slit 223 extends toward the back plate 1 side. When the fastener 222 is fitted on the cylindrical wall 22, the cylindrical wall of the sleeve 221 can be contracted in the axial direction to press the guide post 21. When the fastening member 222 presses the sleeve 221, the pressure between the inner wall of the sleeve 221 and the outer wall of the guide post 21 increases, so that the friction between the inner wall of the sleeve 221 and the outer wall of the guide post 21 increases, the sleeve 221 and the guide post 21 are fixed, and the relative sliding is weakened. Thereby reducing the possibility that the heat sink 300 moves in the extending direction of the guide posts 21.

Fig. 3 is a schematic structural diagram of a sleeve according to an embodiment of the present invention. In an alternative embodiment, shown in fig. 3, the barrel wall 22 has at least two slits 223. In the specific preparation of the sleeve 221, the slits 223 may be provided in two, three, or four, and the present application is not particularly limited. The plurality of slits 223 makes it easier to axially contract the cylinder wall of the sleeve 221, and makes it less time and effort for a worker to attach the fastener 222.

In an alternative embodiment, a plurality of slits 223 may be uniformly distributed along the circumference of the sleeve 221, so that the sleeve 221 is uniformly stressed when being pressed by the fastener 222.

Referring to fig. 1 and 2, in an alternative embodiment, the fastener 222 has holes. The holes include a first hole portion 224, and the diameter of the first hole portion 224 is gradually increased in a direction approaching the back plate 1. The larger diameter end of the first bore section 224 is a first end 2241, and the smaller diameter end is a second end 2242. The first end 2241 has a diameter greater than or equal to the outside diameter of the sleeve 221 when not collapsed, and the second end 2242 has a diameter less than the outside diameter of the sleeve 221 when not collapsed. The fastening member 222 is sleeved on the sleeve 221, and the wall of the sleeve is contracted to press the guide post 21. The first hole 224 is flared to facilitate insertion of the bushing 221 into the first hole of the fastener 222 for ease of installation. And as the fastening member 222 is gradually pressed down to approach the back plate 1, the diameter of the first hole portion 224 is gradually reduced, so that the pressure of the fastening member 222 on the cylinder wall 22 is continuously increased until the fastening member 222 can not move downwards any more and is locked with the sleeve 221. Therefore, the pressure between the bushing 221 and the guide post 21 is increased, and the bushing 221 and the guide post 21 cannot slide relatively. Further, the distance between the heat sink 300 and the back plate 1 is fixed, so that the heat sink 300 is prevented from approaching the chip 100 and crashing the chip 100 when vibrating violently.

With reference to fig. 1, in an alternative embodiment, the hole further includes a second hole portion 225, the second hole portion 225 is located on a side of the first hole portion 224 away from the back plate 1, the second hole portion 225 is a cylindrical shape, and a diameter of a portion of the first hole portion 224 adjacent to the second hole portion 225 is equal to a diameter of the second hole portion 225, so that a connecting portion between the first hole portion 224 and the second hole portion 225 is smooth, and the guide post 21 is not prevented from being inserted into the first hole portion 224 and the second hole portion 225. The second hole portion 225 can reinforce the pressure of the fastening member 222 against the sleeve 221.

In an alternative embodiment, the fastener 222 may be threadably coupled to the sleeve 221 to facilitate mounting the fastener 222 to the sleeve 221. Meanwhile, the threaded connection structure enhances the connection stability of the fastening piece 222 and the sleeve 221, and avoids the fastening piece 222 from falling off due to vibration generated in the transportation process of the electronic assembly. In an alternative embodiment, the fastener 222 may have a certain clearance from the heat sink 300 when tightened, so as to avoid the fastener 222 contacting the heat sink 300 when the fastener 222 is not tightened to the tightest state, and to easily loosen the fastener 222.

With continued reference to fig. 3, in an alternative embodiment, the sleeve 221 has a protruding edge 226 at an end facing the back plate 1, and the heat sink 300 has a mounting hole 301. The mounting hole 301 is disposed on the sleeve 221, and the protruding edge 226 is located between the back plate 1 and the heat sink 300. The bottom of heat sink 300 is fixedly attached to the upper surface of ledge 226. Taking the mounting hole 301 as a circular mounting hole and the outer contour of the protruding edge 226 as a circle, the diameter of the mounting hole 301 is smaller than the diameter of the protruding edge 226. In summary, when the heat sink 300 is fixedly connected to the protruding edge 226, the protruding edge 226 is engaged with the heat sink 300, and the protruding edge 226 does not pass through the mounting hole 301. The specific fixing manner may be a welding manner, which welds the heat sink 300 and the flange 226 together, and prevents the heat sink 300 from separating from the sleeve 221. Of course, other ways to fix the sleeve 221 and the heat sink 300 may be adopted, and the application is not limited thereto. The protruding edge 226 can transmit the friction force between the guiding post 21 and the sleeve 221 to the heat sink 300, convert the friction force into a supporting force, support the heat sink 300 upwards along the extending direction of the guiding post 21, block the heat sink 300 from approaching the chip 100, and prevent the electronic component from vibrating or falling off accidentally, so that the impact force of the heat sink 300 damages the chip 100.

With continued reference to fig. 1, in an alternative embodiment, the electronic assembly may further include a compression assembly 3. The pressing assembly 3 may include a screw 31 and a spring 32, the back plate 1 has a threaded hole 10, and the screw 31 is mounted in the threaded hole 10 to fix the heat sink 300 to the back plate 1. In one embodiment, the screw 31 includes a head portion 311 and a shaft portion 312 fixedly connected, the heat sink 300 has a through hole 302, the spring 32 is a compression spring, when the heat sink 300 and the backboard 1 are completely assembled, the spring 32 is under compression, and the spring 32 is sleeved on the shaft portion 312 and clamped between the head portion 311 and the heat sink 300. The pressing component 3 gives a downward driving force to the heat sink 300 along the extending direction of the guide posts 21, so that the heat sink 300 tends to move towards the backboard 1, the heat sink 300 can be kept in a fit state with the chip 100, and reliable thermal contact conduction is ensured. The problem that the electronic assembly is separated from the chip 100 due to excessive vibration is solved.

Please continue to refer to fig. 1. In an alternative embodiment, the specific assembly process of the electronic component is as follows: first, the chip 100 is mounted on the circuit board 200, and the heat conductive material 4 is attached to the side of the chip 100 away from the circuit board 200. After the guide posts 21 are fixedly mounted on the back plate 1, the back plate 1 is assembled with the circuit board 200. Then, after the sleeve 221 and the heat sink 300 are welded together, the heat sink 300 is mounted on the backplate 1 so that the sleeve 221 is fitted over the outer wall of the guide post 21. The heat spreader 300 is fixed to the rear plate 1 using the hold-down members 3. Finally, the fastener 222 is pressed against the sleeve 221 and tightened, completing the assembly of the electronic assembly.

The embodiment of the utility model provides an electronic equipment is still provided. The electronic equipment comprises the electronic assembly. When the electronic device vibrates during transportation or is impacted due to accidental falling, the distance between the heat sink 300 and the back plate 1 is kept fixed, so that the chip 100 is prevented from being damaged by the impact force of the heat sink 300.

In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. An electronic assembly, comprising a chip, a circuit board, a heat sink, a back plate and a plurality of fixed components;

the chip install in the circuit board, the backplate install in the circuit board deviates from one side of chip, the radiator install in the chip deviates from one side of backplate, it is a plurality of fixed subassembly fixed connection the backplate with the radiator, and be located week side of chip, fixed subassembly is used for making the radiator with the backplate keeps fixed distance.

2. The electronic assembly of claim 1, wherein the fixing assembly comprises a guiding post and a sleeve, the guiding post is fixed to the back plate, the guiding post extends in a direction perpendicular to the back plate, the sleeve is fixed to the heat sink, and the sleeve is fixedly mounted on an outer wall of the guiding post.

3. The electronic assembly of claim 2, wherein the securing assembly further comprises a fastener; the sleeve is provided with a cylinder wall, the cylinder wall is provided with a slot, the opening of the slot faces the radiator, and the slot extends towards one side of the back plate; the fastening piece is sleeved on the outer wall of the sleeve and used for enabling the cylinder wall to contract and compressing the guide column.

4. The electronic assembly of claim 3, wherein the fastener has an aperture, the aperture comprising a first aperture portion, the first aperture portion having a diameter that increases in a direction toward the back plate.

5. The electronic assembly of claim 4, wherein the aperture further comprises a second aperture portion located on a side of the first aperture portion remote from the back plate, the second aperture portion being cylindrical, a diameter of the first aperture portion adjacent the second aperture portion being equal to a diameter of the second aperture portion.

6. The electronic assembly of claim 4, wherein the fastener is threadably coupled to the sleeve.

7. The electronic assembly of claim 3, wherein the end of the sleeve facing the back plate has a protruding edge, the heat sink has a mounting hole, the mounting hole is sleeved on the outer wall of the sleeve, the protruding edge is located between the back plate and the heat sink, and the protruding edge is fixedly connected with the heat sink.

8. The electronic component of claim 1, wherein the plurality of fixing members are uniformly distributed on the peripheral side of the chip.

9. The electronic assembly of claim 1, further comprising a compression assembly, wherein the compression assembly comprises a screw and a spring, the screw connects the heat sink and the back plate, the screw comprises a head portion and a rod portion, the head portion and the rod portion are fixedly connected, and the spring is sleeved on the rod portion and clamped between the head portion and the heat sink.

10. An electronic device comprising an electronic component according to any one of claims 1 to 9.