CN217217058U

CN217217058U - Cooling device for lead-free tin spraying of PCB

Info

Publication number: CN217217058U
Application number: CN202123433676.4U
Authority: CN
Inventors: 林玉娇
Original assignee: Nantong Huayu Electronic Technology Co ltd
Current assignee: Nantong Huayu Electronic Technology Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-08-16
Anticipated expiration: 2031-12-30

Abstract

The utility model discloses a belong to PCB board technical field, specifically be a cooling device for PCB leadless hot air solder leveling, including cooling bin, mounting panel and mounting bracket, the cooling bin inner chamber is provided with the cooling fan; the cooling bin inside wall symmetry is provided with the mounting panel, the mounting panel extends to the cooling bin outside wall, two the mounting panel all is provided with the curb plate near one side both ends. The utility model discloses a, through pull ring pulling slide bar compression spring, the briquetting is lifted, put into the below of the briquetting of two standing grooves with the both ends of PCB board, loosen the pull ring after, thereby the spring drives the both ends of the fixed PCB board of centre gripping that the briquetting descends, start two servo motor simultaneously and drive the screw rod and rotate, make the mounting bracket drive the PCB board and remove to cooling chamber inner chamber, cool off through the cooling fan, the user can start four cooling fans and directly cool off the lower surface of PCB board, also can start simultaneously servo motor and drive the link and cool off together with the PCB board after overturning.

Description

Cooling device for lead-free tin spraying of PCB

Technical Field

The utility model relates to a PCB board technical field specifically is a cooling device for leadless hot air solder leveling of PCB.

Background

The PCB is called a printed circuit board, also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components.

However, the existing PCB needs to be cooled after lead-free tin spraying, so that the tin liquid is solidified, and some existing PCBs need to be subjected to double-sided tin spraying, which causes difficulty in realizing double-sided rapid cooling of the PCB during cooling, so that a cooling device for lead-free tin spraying of the PCB needs to be developed.

SUMMERY OF THE UTILITY MODEL

This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.

For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:

a cooling device for lead-free tin spraying of a PCB comprises:

the cooling bin is provided with a cooling fan in an inner cavity;

the mounting plates are symmetrically arranged on the inner side wall of the cooling bin, the mounting plates extend to the outer side wall of the cooling bin, side plates are arranged at two ends, close to one side, of the two mounting plates, and the side plates on the front side are provided with screws through servo motors;

the mounting bracket, two all be provided with on the screw rod the mounting bracket, the mounting bracket quilt the screw rod spiro union is run through, two the mounting bracket all is provided with servo motor near one side, servo motor's output is provided with the link that is used for connecting PCB board both sides.

As a PCB does not have a preferred scheme of cooling device of lead hot air solder leveling, wherein: and cooling fans are symmetrically arranged on the top wall and the bottom wall of the inner cavity of the cooling bin.

As a preferred scheme of a cooling device for lead-free hot air solder leveling of a PCB, wherein: the four cooling fans face the inner cavity of the cooling bin.

As a preferred scheme of a cooling device for lead-free hot air solder leveling of a PCB, wherein: two symmetries the link is close to one side indent and has seted up the standing groove.

As a preferred scheme of a cooling device for lead-free hot air solder leveling of a PCB, wherein: the vertical direction of the top wall of the placing groove slides and penetrates through the placing groove to be provided with a sliding rod, and the bottom end of the sliding rod is provided with a pressing block in the horizontal direction.

As a preferred scheme of a cooling device for lead-free hot air solder leveling of a PCB, wherein: and a pull ring is arranged at the top end of the sliding rod.

As a preferred scheme of a cooling device for lead-free hot air solder leveling of a PCB, wherein: and a spring in the vertical direction is arranged between the top wall of the pressing block and the inner top wall of the placing groove.

As a preferred scheme of a cooling device for lead-free hot air solder leveling of a PCB, wherein: the springs are symmetrically arranged by taking the sliding rod as a symmetry axis.

Compared with the prior art, the beneficial effects of the utility model are that: through pull ring pulling slide bar compression spring, the briquetting is lifted, put into the below of the briquetting of two standing grooves with the both ends of PCB board, after loosening the pull ring, thereby the spring drives the both ends of the fixed PCB board of centre gripping that the briquetting descends, it drives the screw rod rotation to start two servo motor simultaneously, make the mounting bracket drive the PCB board and remove to cooling chamber inner chamber, cool off through the cooling fan, the user can start four cooling fans and directly cool off PCB board facial features, also can start servo motor simultaneously and drive the link and cool off after overturning together with the PCB board, because servo motor can just reverse the rotation, so after the PCB board that finishes cooling, can see the PCB board out, also can see the position behind the cooling chamber, take off the PCB board again, go into new PCB board on, send into the cooling chamber internal cooling after that follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the cooling chamber of the present invention;

FIG. 3 is a schematic view of the mounting plate, the mounting frame and the components connected thereto according to the present invention;

fig. 4 is an exploded view of the mounting plate, mounting bracket and components connected thereto of the present invention;

in the figure: the cooling device comprises a cooling bin 100, a cooling fan 110, a mounting plate 200, a side plate 210, a servo motor 220, a screw 230, a mounting frame 300, a servo motor 310, a connecting frame 320, a placing groove 330, a sliding rod 340, a pressing block 350 and a spring 360.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

Fig. 1-4 show a schematic structural diagram of a cooling device for lead-free tin spraying of a PCB according to the present invention, which includes:

a cooling bin 100, wherein a cooling fan 110 is arranged in the inner cavity of the cooling bin 100;

the mounting plates 200 are symmetrically arranged on the inner side wall of the cooling bin 100, the mounting plates 200 extend to the outer side wall of the cooling bin 100, two ends of each mounting plate 200 close to one side are provided with a side plate 210, and the side plate 210 on the front side is provided with a screw 230 through a servo motor 220;

the mounting bracket 300 is arranged on two of the screws 230, the mounting bracket 300 is penetrated by the screws 230 in a threaded manner, two of the mounting bracket 300 is arranged on one side close to the servo motor 310, and the output end of the servo motor 310 is provided with a connecting bracket 320 for connecting two sides of a PCB.

The equal symmetry of cooling bin 100 inner chamber roof and diapire is provided with cooling fan 110, four cooling fan 110 orientation the cooling bin 100 inner chamber can carry out cooling treatment to PCB board upper and lower two sides simultaneously.

Two symmetries link 320 is close to one side indent and has seted up standing groove 330, standing groove 330 roof vertical direction slides and runs through and is provided with slide bar 340, slide bar 340 bottom is provided with the briquetting 350 of horizontal direction, the top of slide bar 340 is provided with the pull ring, briquetting 350 roof with be provided with vertical direction's spring 360 between the roof in the standing groove 330, spring 360 with slide bar 340 sets up for symmetry axis symmetry, makes things convenient for centre gripping PCB both ends.

In the specific using process, when the utility model is needed, the sliding rod 340 is pulled by the pull ring to compress the spring 360, the pressing block 350 is lifted, the two ends of the PCB are placed under the pressing block 350 in the two placing grooves 330, after the pull ring is loosened, the spring 360 drives the pressing block 350 to descend so as to clamp and fix the two ends of the PCB, the two servo motors 220 are simultaneously started to drive the screw 230 to rotate, the mounting rack 300 drives the PCB to move to the inner cavity of the cooling bin 100, the cooling fan 110 is used for cooling, a user can start the four cooling fans 110 to directly cool the upper surface and the lower surface of the PCB, the servo motor 310 can be simultaneously started to drive the connecting rack 320 to overturn together with the PCB for cooling, the servo motor 220 can rotate in the positive and reverse directions, so that after the PCB is cooled, the PCB can be sent out, the PCB can also be sent to the position behind the cooling bin 100, the PCB is taken down, a new PCB is put in, and then sent to the cooling bin 100 to be cooled.

While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A cooling device for PCB lead-free tin spraying is characterized by comprising:

the cooling bin (100), the inner cavity of the cooling bin (100) is provided with a cooling fan (110);

the mounting plates (200) are symmetrically arranged on the inner side wall of the cooling bin (100), the mounting plates (200) extend to the outer side wall of the cooling bin (100), two ends, close to one side, of each of the two mounting plates (200) are provided with side plates (210), and the side plate (210) on the front side is provided with a screw rod (230) through a servo motor (220);

mounting bracket (300), two all be provided with on screw rod (230) mounting bracket (300), mounting bracket (300) by screw rod (230) spiro union is run through, two mounting bracket (300) are close to one side and all are provided with servo motor (310), the output of servo motor (310) is provided with link (320) that are used for connecting PCB board both sides.

2. The cooling device for PCB lead-free tin spraying according to claim 1, characterized in that: and cooling fans (110) are symmetrically arranged on the top wall and the bottom wall of the inner cavity of the cooling bin (100).

3. The cooling device for PCB lead-free tin spraying according to claim 2, characterized in that: the four cooling fans (110) face the inner cavity of the cooling bin (100).

4. The cooling device for PCB lead-free tin spraying according to claim 1, characterized in that: two symmetrical connecting frames (320) are provided with a placing groove (330) in a concave manner at one side close to the connecting frames.

5. The cooling device for PCB lead-free hot air solder leveling of claim 4, wherein: the vertical direction of the top wall of the placing groove (330) is provided with a sliding rod (340) in a sliding and penetrating mode, and the bottom end of the sliding rod (340) is provided with a pressing block (350) in the horizontal direction.

6. The cooling device for PCB lead-free tin spraying according to claim 5, characterized in that: the top end of the sliding rod (340) is provided with a pull ring.

7. The cooling device for PCB lead-free tin spraying according to claim 6, characterized in that: a spring (360) in the vertical direction is arranged between the top wall of the pressing block (350) and the inner top wall of the placing groove (330).

8. The cooling device for PCB lead-free hot air solder leveling of claim 7, wherein: the springs (360) are symmetrically arranged by taking the sliding rod (340) as a symmetry axis.