CN217215496U - Semiconductor laser emitter ceramic shell with heat sink - Google Patents

Abstract

The utility model discloses a semiconductor laser transmitter with heat sink ceramic shell, which comprises a shell body arranged outside a laser transmitter body, wherein the upper end and the lower end of the shell body are respectively provided with a cover plate and a heat dissipation base cover, and the lower end and the upper end of the cover plate are respectively provided with a spacing block and a symmetrically arranged wind collecting cover; heat conducting rail blocks are uniformly distributed on the front inner wall and the rear inner wall of the outer shell, a sliding sleeve block is sleeved on the heat conducting rail blocks in a sliding mode, a heat transfer attaching plate is movably arranged on the outer side of the sliding sleeve block, a heat conducting tube plate is arranged between the laser emitter body and the heat dissipation base cover, and heat radiating fins penetrating through the heat dissipation base cover are arranged on the bottom end face of the heat conducting tube plate. The heat dissipation fan bodies on two sides respectively perform heat dissipation treatment on the laser emitting part and the tail part of the laser emitter body, and the heat transfer attaching plate attached to the laser emitter body can transfer absorbed heat to the heat conducting barrel plate through the connecting plate and the heat conducting rail block, so that a good heat dissipation effect is achieved on the laser emitter body, and meanwhile, the laser emitter body is convenient to perform segmented heat dissipation treatment.

Description

Semiconductor laser emitter ceramic shell with heat sink

Technical Field

The utility model belongs to the technical field of the laser emitter shell, concretely relates to semiconductor laser emitter takes heat sink ceramic package.

Background

The traditional semiconductor laser transmitter and the traditional transmitting module are of a metal wall and ceramic insulator structure and comprise a metal ring, a heat sink ceramic insulator, a metal lead, a metal wall and a metal bottom plate, wherein the metal wall is made of metal materials, the whole laser transmitter is a box body formed by the metal wall and the metal bottom plate, and radiating fins are usually arranged outside the box body for radiating heat;

chinese patent with publication No. CN214542915U discloses a semiconductor laser emitter packaging shell for multi-optical path transmission, including bottom plate and laser emitter body, bottom plate upper surface one side welding has the fixed plate, bottom plate upper surface middle part position welding has fixture, laser emitter body lower surface mounting has the heating panel, the heating panel sets up in the fixture upper surface, through-hole has been seted up to fixed plate lateral wall middle part position, the output of laser emitter body is fixed to be worn to locate in the through-hole that the fixed plate lateral wall was seted up, fixed joint has the encapsulation lid that agrees with mutually between the inboard opposite face of bottom plate and fixed plate. Through adopting above-mentioned technical scheme, place the laser emitter body on the mounting panel, the pulling grip block to it is tensile to drive the extension spring atress, and then drives the pull rod and remove, makes the spacing joint in centre gripping groove around the heating panel, thereby loosens the grip block, and then the extension spring unloads power and drives the pull rod shrink, makes the fixed centre gripping heating panel of grip block, and then makes the mounted position of laser emitter body fixed thereupon, and the installation of being convenient for is dismantled.

However, the above scheme has the following disadvantages: setting up through the heating panel in the above-mentioned patent document is convenient for dispel the heat to semiconductor laser emitter, but heat radiation structure is comparatively single, and it is poor to lead to the radiating effect, and the heat that semiconductor laser emitter's laser emission end produced can be more than its afterbody region, but the shell that is used for placing semiconductor laser emitter among the prior art does not carry out segmentation thermal treatment, is unfavorable for dispelling the heat fast to semiconductor laser generator.

To this end, we propose a ceramic housing with heat sink for semiconductor laser emitter to solve the above mentioned problems in the background art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor laser emitter takes heat sink ceramic package to solve the problem that exists among the above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme:

a semiconductor laser transmitter ceramic shell with heat sink comprises a shell body arranged on the outer side of a laser transmitter body, wherein the upper end and the lower end of the shell body are respectively provided with a cover plate and a heat dissipation base cover;

the utility model discloses a laser emitter, including shell body, heat conduction rail piece, sliding sleeve, heat conduction cylinder cover, heat conduction rail piece, sliding sleeve piece, heat conduction attachment plate, laser emitter body, heat dissipation base cover, heat conduction rail piece, heat conduction attachment plate, heat conduction cylinder cover, heat conduction tube, radiating fin extension portion, the guide duct has been arranged to the intercommunication between heat conduction cylinder cover and the radiating cylinder cover, and radiating base cover inner wall both sides all are equipped with the heat dissipation net gape.

Preferably, the isolation block can be attached to the outer ring surface of the middle of the laser emitter body, the isolation block is arranged below the space between the air collecting covers on the two sides, and the air guide blocks are symmetrically arranged on the inner walls of the air collecting covers.

Preferably, the sliding sleeve block is provided with a connecting plate on the outer side, the heat transfer attaching plate is provided with a movable groove on the side wall, the connecting plate is slidably inserted into the movable groove, and an outward pushing spring is arranged between the insertion end of the connecting plate and the inner wall of the movable groove.

Preferably, the opening part of the radiating cylindrical plate faces the radiating net opening, and the extending part of the air guide pipe is arranged between the radiating fins.

Preferably, a branch air port is distributed at the bottom end of the inner wall of the radiating cylinder plate, a plurality of induced draft cone blocks are distributed on the bottom end face of the radiating base cover, the induced draft cone blocks are located between the adjacent radiating fins, and the branch air port is located right above the induced draft cone blocks.

Compared with the prior art, the beneficial effects of the utility model are that: the heat radiation fans on the two sides respectively perform heat radiation treatment on the laser emission part and the tail part of the laser emitter body under the separation of the isolation block, the heat transfer attaching plate attached on the laser emitter body can transfer the absorbed heat to the heat conduction barrel plate through the connecting plate and the heat conduction rail block, meanwhile, the heat conducting rail block also transfers the absorbed heat to the end of the outer shell for heat dissipation, the hot air discharged into the heat conducting rail block enters the heat dissipation cylinder plate through the air guide pipe, the radiating fin fixed with heat conduction tube sheet and heat dissipation tube sheet contact gives off heat transfer to heat dissipation base cover end, and the setting up of induced air awl piece can make the runner air in the heat dissipation tube sheet arrange into the radiating fin through a wind gap, has accelerated the heat dissipation of radiating fin, and the hot-air that absorbs the heat is discharged through the heat dissipation net gape at last, has and plays better radiating effect to the laser emitter body, is convenient for carry out segmentation heat dissipation to the laser emitter body simultaneously.

Drawings

Fig. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a schematic cross-sectional view of FIG. 1;

FIG. 3 is a partial cross-sectional view from the left of FIG. 1;

FIG. 4 is a partial schematic view of the mating region of the connection plate and the heat transfer engaging plate of FIG. 3;

FIG. 5 is a partial schematic view of the heat sink region of FIG. 2;

fig. 6 is a schematic view of the structure of the heat transfer attachment plate, the heat conduction rail block, the heat conduction tube plate and the heat dissipation tube plate of the present invention;

FIG. 7 is a partial schematic view of the mating region of the connection plate and the heat transfer engagement plate of FIG. 6;

fig. 8 is a schematic diagram of the spacer structure of the present invention.

In the figure: 1. an outer housing; 2. a laser emitter body; 3. a cover plate; 4. a heat dissipation base cover; 5. an isolation block; 6. a wind collecting cover; 7. a heat radiation fan body; 8. an air outlet; 9. a heat conducting rail block; 10. a sliding sleeve block; 11. a heat transfer pasting plate; 12. a heat conductive cylinder plate; 13. a heat sink; 14. a heat-dissipating cylindrical plate; 15. an air guide pipe; 16. a heat dissipation net port; 17. a wind guide block; 18. a connecting plate; 19. a movable groove; 20. an outward pushing spring; 21. a branch air port; 22. an air inducing conical block.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.

Referring to fig. 1-8, the present invention provides a technical solution:

the first embodiment is as follows:

a semiconductor laser transmitter with heat sink ceramic shell comprises a shell body 1 arranged at the outer side of a laser transmitter body 2, a heat sink ceramic insulator is fixed on the inner side wall of the shell body 1, a hole is formed in the side surface of a metal box body stated in the background technology, the heat sink ceramic insulator is welded in the hole, a metal lead is welded on the heat sink ceramic insulator, a metal ring is arranged in the ceramic and is electrically communicated with the metal lead, a metal bottom plate is made of metal with high thermal conductivity and transmits heat generated when the semiconductor laser transmitter body and a transmitting module work to a radiating fin outside the shell body 1, the prior art is arranged, no redundancy is provided, a cover plate 3 and a radiating base cover 4 are respectively detachably arranged at the upper end and the lower end of the shell body 1 in a screwing mode, an isolation block 5 and a symmetrically arranged air collecting cover 6 are respectively arranged at the lower end of the cover plate 3, the isolation block 5 is made of glass fiber heat insulation cotton with heat insulation function, the isolation block 5 can divide the interior of the outer shell 1 into two chambers, a heat dissipation fan body 7 is fixed in the air collection cover 6 through a support in a threaded manner, the heat dissipation fan body 7 can be selected from a 6025 type heat dissipation fan produced by an electronic strength supplier in the morning of Tianchang city, the specification of the heat dissipation fan body 7 can be adjusted adaptively according to the size of the air collection cover 6, an air outlet 8 is arranged on the upper end surface of the cover plate 3 in the air collection cover 6, cooling air sucked by the heat dissipation fan body 7 is conveniently discharged into the outer shell 1 through the arrangement of the air outlet 8, a dust filter screen is arranged in advance at the air inlet end of the air collection cover 6, effective dust filtration is carried out on the cooling air sucked by the heat dissipation fan body 7, and the air collection cover 6 is of a horn-shaped structure which has a wider air discharge area;

the heat conducting rail blocks 9 are uniformly arranged on the front inner wall and the rear inner wall of the outer shell 1, the heat conducting rail blocks 9 are made of aluminum alloy materials with good heat conducting property, the sliding sleeve blocks 10 are sleeved on the heat conducting rail blocks 9 in a sliding mode, heat conducting attaching plates 11 are movably arranged on the outer sides of the sliding sleeve blocks 10, the heat conducting attaching plates 11 are arranged conveniently to be installed and removed, the heat conducting attaching plates 11 are made of aluminum alloy materials with good heat conducting property, the shapes of the heat conducting attaching plates 11 are adjusted adaptively according to the shape of a contact surface of a laser emitter body 2, the heat conducting attaching plates 11 are arranged in contact with the outer surface of the laser emitter body 2 so as to facilitate heat conduction of heat generated by the laser emitter body 2 during working, a heat conducting cylindrical plate 12 is arranged between the laser emitter body 2 and the heat radiating base cover 4, holes are formed in the side wall of the heat conducting cylindrical plate 12, the heat conducting cylindrical plate 12 is also made of aluminum alloy materials with good heat conducting property, and the bottom ends of the heat conducting rail blocks 9 are fixedly arranged on the heat conducting cylindrical plate 12, and heat-conducting silicone grease is filled between the contact surfaces of the heat-conducting rail block 9 and the heat-conducting cylinder plate 12 to play a role in insulation and heat conduction, the bottom end surface of the heat-conducting cylinder plate 12 is provided with a heat radiating fin 13 penetrating through the heat-radiating base cover 4, the heat radiating fin 13 is of an aluminum fin structure, the extending part of the heat radiating fin 13 penetrates through the heat-radiating cylinder plate 14, the heat-radiating cylinder plate 14 is also made of an aluminum alloy material with good heat conducting property, an air guide pipe 15 is communicated between the heat-conducting cylinder plate 12 and the heat-radiating cylinder plate 14, air discharged into the outer shell 1 can be conveniently discharged through the heat-conducting cylinder plate 12, the air guide pipe 15 and the heat-radiating cylinder plate 14 through the air guide pipe 15, the two sides of the inner wall of the heat-radiating base cover 4 are respectively provided with a heat-radiating net opening 16, and hot air in the heat-radiating base cover 4 can be discharged through the heat-radiating net openings 16.

Example two:

further explaining the isolating block 5 and the heat transfer attaching plate 11 on the basis of the first embodiment, the isolating block 5 can be attached to the outer ring surface of the middle part of the laser emitter body 2, the shape of the isolating block 5 can be adaptively adjusted according to the contact part with the outer ring surface of the middle part of the laser emitter body 2, so that the isolating block 5 can separate the laser emitter body 2 into two parts for heat dissipation in the outer shell 1, the isolating block 5 is arranged below the air collectors 6 at two sides, specifically, the laser emitting part and the tail part of the laser emitter body 2 are separated, air guide blocks 17 are symmetrically welded on the inner wall of the air collector 6, the air guide blocks 17 can divide cooling air discharged from the air collector 6, so that the cooling air can uniformly enter the outer shell 1 from the air outlet 8, connecting plates 18 are welded on the outer sides of the sliding sleeve blocks 10, and the connecting plates 18 are made of aluminum alloy with good heat conduction performance, the lateral wall of the heat transfer attaching plate 11 is provided with a movable groove 19, the connecting plate 18 is slidably inserted into the movable groove 19, the arrangement is convenient for adjusting the horizontal displacement of the heat transfer attaching plate 11, meanwhile, heat-conducting silicone grease is injected into the movable groove 19, so that the connecting plate 18 is in insulated heat-conducting contact with the heat transfer attaching plate 11, an outward pushing spring 20 is arranged between the insertion end of the connecting plate 18 and the inner wall of the movable groove 19, the outward pushing spring 20 can generate outward pushing force on the heat transfer attaching plate 11, further, the heat transfer attaching plate 11 can be tightly attached to the lateral surface of the laser emitter body 2, and meanwhile, the laser emitter body 2 placed in the outer shell 1 can be clamped and fixed conveniently.

Example three:

further explaining the area of the heat dissipation fins 13 on the basis of the first embodiment, the open part of the heat dissipation cylinder plate 14 faces the heat dissipation mesh opening 16, so that hot air exhausted from the heat dissipation cylinder plate 14 is directly exhausted through the heat dissipation mesh opening 16, the extended part of the air guide pipe 15 is arranged between the heat dissipation fins 13, the bottom end of the inner wall of the heat dissipation cylinder plate 14 is provided with the branch air opening 21, eighteen air inducing conical blocks 22 are arranged on the bottom end surface of the heat dissipation base cover 4, the air inducing conical blocks 22 are positioned between the adjacent heat dissipation fins 13, the branch air opening 21 is arranged right above the air inducing conical blocks 22, air exhausted from the branch air opening 21 can be shunted to two sides through the air inducing conical blocks 22, and the air shunted by the air inducing conical blocks 22 can be blown to the lower parts of the heat dissipation fins 13, so that the heat dissipation effect on the heat dissipation fins 13 is further improved.

The working principle is as follows: when the outer shell 1 of the semiconductor laser emitter body 2 is installed, an operator firstly puts the laser emitter body 2 on the upper end face of the heat conducting tube plate 12 and fixes the laser emitter body 2 in a bolt mode, heat conducting silicone grease can be coated on the contact part of the laser emitter body 2 and the heat conducting tube plate 12 to achieve better insulating and heat conducting performance, then the sliding sleeve block 10 is sleeved on the heat conducting rail block 9 in a sliding mode, the sliding amount of the heat conducting attaching plate 11 and the connecting plate 18 is controlled, the heat conducting attaching plate 11 is attached to the side surface of the laser emitter body 2 in a contact mode, then the cover plate 3 is inserted into the open end of the upper part of the outer shell 1 to be fixed in a threaded mode, the isolation block 5 positioned at the lower end of the cover plate 3 is sleeved on the outer ring face of the middle part of the laser emitter body 2, the laser emitting part and the tail part of the laser emitter body 2 are separated in a heat insulation mode, and the power end of the heat radiating fan body 7 is connected with an external corresponding power supply;

when the heat dissipation fan body 7 is started, external cooling air is uniformly discharged into the outer shell body 1 from the air outlet 8 end through the diversion of the air guide block 17, the heat dissipation fan bodies 7 on the two sides respectively carry out heat dissipation treatment on the laser emission part and the tail part of the laser emitter body 2 under the separation of the isolation block 5, the heat transfer attaching plate 11 attached to the laser emitter body 2 can transfer absorbed heat to the heat conduction cylinder plate 12 through the connecting plate 18 and the heat conduction rail block 9, meanwhile, the heat conduction rail block 9 also well transfers the absorbed heat to the outer shell body 1 end for heat dissipation, hot air discharged into the heat conduction rail block 9 can enter the heat dissipation cylinder plate 14 through the air guide pipe 15, the heat dissipation fins 13 fixed in contact with the heat conduction cylinder plate 12 and the heat dissipation cylinder plate 14 transfer the heat to the heat dissipation base cover 4 end for heat dissipation, and the air guide cone block 22 can enable the flow channel air in the heat dissipation cylinder plate 14 to be discharged onto the heat dissipation fins 13 through the branch air inlets 21, the heat dissipation of the heat dissipation fins 13 is accelerated, and the hot air absorbing heat is finally discharged through the heat dissipation mesh openings 16, so that the laser emitter body 2 has a good heat dissipation effect, and meanwhile, the sectional heat dissipation treatment of the laser emitter body 2 is facilitated.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a semiconductor laser emitter takes heat sink ceramic package, is including setting up shell body (1) in the laser emitter body (2) outside, its characterized in that: the upper end and the lower end of the outer shell (1) are respectively provided with a cover plate (3) and a heat dissipation base cover (4), the lower upper end of the cover plate (3) is respectively provided with an isolation block (5) and a symmetrically arranged wind collection cover (6), a heat dissipation fan body (7) is arranged in the wind collection cover (6), and the upper end surface of the cover plate (3) is positioned in the wind collection cover (6) and is distributed with an air outlet (8);

the heat conducting rail blocks (9) are uniformly arranged on the front inner wall and the rear inner wall of the outer shell (1), the heat conducting rail blocks (9) are sleeved with sliding sleeve blocks (10) in a sliding manner, heat transfer attaching plates (11) are movably arranged on the outer sides of the sliding sleeve blocks (10), the heat transfer attaching plates (11) are arranged in contact with the outer surface of the laser emitter body (2), a heat conducting cylinder plate (12) is arranged between the laser emitter body (2) and the heat dissipation base cover (4), the bottom end of the heat conducting rail block (9) is fixedly arranged on the heat conducting cylinder plate (12), the bottom end surface of the heat conducting cylinder plate (12) is provided with a heat radiating fin (13) which penetrates through the heat radiating base cover (4), the extending part of the heat radiating fin (13) penetrates through the heat radiating cylinder plate (14), an air guide pipe (15) is communicated between the heat conduction cylindrical plate (12) and the heat dissipation cylindrical plate (14), and heat dissipation net openings (16) are arranged on two sides of the inner wall of the heat dissipation base cover (4).

2. The semiconductor laser emitter ceramic package with heat sink of claim 1, wherein: the isolation block (5) can be attached to the outer ring surface of the middle of the laser emitter body (2), the isolation block (5) is arranged below the space between the air collecting covers (6) on the two sides, and the air guide blocks (17) are symmetrically arranged on the inner wall of each air collecting cover (6).

3. The semiconductor laser emitter ceramic package with heat sink of claim 1, wherein: the outer side of the sliding sleeve block (10) is provided with a connecting plate (18), the side wall of the heat transfer laminating plate (11) is provided with a movable groove (19), the connecting plate (18) is slidably inserted into the movable groove (19), and an outward pushing spring (20) is arranged between the insertion end of the connecting plate (18) and the inner wall of the movable groove (19).

4. The semiconductor laser emitter ceramic package with heat sink of claim 1, wherein: the opening part of the heat radiation cylindrical plate (14) faces the heat radiation net opening (16), and the extending part of the air guide pipe (15) is arranged between the heat radiation fins (13).

5. The semiconductor laser emitter ceramic package with heat sink of claim 1, wherein: a branch air port (21) is arranged at the bottom end of the inner wall of the heat dissipation barrel plate (14), a plurality of induced draft cone blocks (22) are arranged on the bottom end face of the heat dissipation base cover (4), the induced draft cone blocks (22) are located between the adjacent heat dissipation fins (13), and the branch air port (21) is located right above the induced draft cone blocks (22).

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