CN217196569U

CN217196569U - Plastic gasket rapid prototyping equipment

Info

Publication number: CN217196569U
Application number: CN202220152875.3U
Authority: CN
Inventors: 杨秋文; 宋春梅
Original assignee: Qingdao Yulixin Plastic Co ltd
Current assignee: Qingdao Yulixin Plastic Co ltd
Priority date: 2022-01-20
Filing date: 2022-01-20
Publication date: 2022-08-16
Anticipated expiration: 2032-01-20

Abstract

The utility model relates to the technical field of plastic gasket processing, in particular to a plastic gasket rapid forming device, which comprises a base, wherein the upper surface of the base is fixedly connected with a device body, the surface of the top of the device body is fixedly connected with a cylinder, the lower end of the cylinder penetrates through the top of the device body, the lower end of the cylinder is fixedly connected with an upper die, both sides of the outer side surface of the device body are fixedly connected with a first electric push rod, one end of the first electric push rod penetrates through one side surface of the device body, one end of the first electric push rod is fixedly connected with a workbench, the upper surface of the workbench is fixedly connected with a lower die, and the upper surface of the workbench is provided with a groove. Effectively improving the processing efficiency.

Description

Plastic gasket rapid prototyping equipment

Technical Field

The utility model relates to a plastic gasket processing technology field specifically is a plastic gasket rapid prototyping equipment.

Background

Compared with a metal gasket, the plastic gasket has excellent insulating, corrosion-resistant, heat-insulating and non-magnetic properties, is light in weight, and can be widely applied to various fields such as semiconductors, automobiles, aerospace industry and interior decoration.

Therefore, there is a need for a rapid molding apparatus for plastic gaskets that improves upon the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a plastic gasket rapid prototyping equipment to the problem of proposing among the above-mentioned background art of solution.

In order to achieve the above object, the utility model provides a following technical scheme:

a plastic gasket rapid forming device comprises a base, wherein an equipment body is fixedly connected to the upper surface of the base, a cylinder is fixedly connected to the surface of the top of the equipment body, the lower end of the cylinder penetrates through the top of the equipment body, an upper die is fixedly connected to the lower end of the cylinder, a first electric push rod is fixedly connected to both sides of the surface of one side of the outer portion of the equipment body, one end of the first electric push rod penetrates through one side surface of the equipment body, one end of the first electric push rod is fixedly connected with a workbench, the upper surface of the workbench is fixedly connected with a lower die, a groove is formed in the upper surface of the workbench, a third electric push rod is fixedly arranged in the groove, the upper end of the third electric push rod penetrates through the bottom of the lower die, a discharging ring is fixedly connected to the upper end of the third electric push rod, a second electric push rod is fixedly connected to both sides of the upper surface of the workbench, and a second semiconductor refrigerator is fixedly connected to one end of the second electric push rod, and a second cold-conducting copper column is fixedly connected to the surface of one side of the second semiconductor refrigerator, and one end of the second cold-conducting copper column is fixedly connected with a cold-conducting semi-ring.

As the utility model discloses preferred scheme, equipment body one side fixed surface is connected with heat dissipation dryer, heat dissipation dryer both sides surface is the fixed otter board that is equipped with all that ventilates, one side the ventilation otter board side fixed surface is connected with radiator fan, fixed surface is connected with first semiconductor refrigerator under the heat dissipation dryer, fixed surface is connected with the first cold copper post of leading on the first semiconductor refrigerator, the first cold copper post of leading runs through bottom section of thick bamboo wall.

As the utility model discloses preferred scheme, the inside lift room of having seted up of base, the inside bottom fixed surface of lift room is connected with electric lift rod, electric lift rod upper end fixedly connected with backup pad, fixed surface is connected with the sealing door in the backup pad, fixed surface is connected with the stopper on the sealing door.

As the utility model discloses preferred scheme, exit has been seted up on equipment body side surface, the spacing groove has been seted up on exit top surface.

As the utility model discloses preferred scheme, the closed door corresponds the setting with importing and exporting, the stopper corresponds the setting with the spacing groove.

As the utility model discloses preferred scheme, fixed surface is connected with the control box on the base, fixed surface is connected with spacing frame on the base.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in, third electric push rod through setting up, discharge ring, second semiconductor refrigerator and lead cold semi-ring, after the punching press was accomplished, restart electric lift pole opens and seals the door, start first electric push rod and release the workstation and get into in the spacing frame, start second electric push rod and further drive second semiconductor refrigerator and lead cold semi-ring and move to the lower mould, further drive and lead cold semi-ring and bed die contact, it leads cold copper post through the second and cools down the bed die to start second semiconductor refrigerator, further carry out the rapid cooling shaping to the material, restart third electric push rod drives discharge ring and releases fashioned gasket, can carry out the rapid cooling shaping to mould and material, and conveniently take out, effectively improve machining efficiency.

2. The utility model discloses in, through the first semiconductor cooler and the radiator fan that set up, start first semiconductor cooler and further cool down first cold copper post of leading, rethread heat transfer cools down its air on every side, start the radiator fan and blow to inside the equipment body through the air after the cooling, further cool down to inside the equipment body, can cool down inside the equipment fast, effectively prolong the life of equipment.

Drawings

Fig. 1 is a perspective view of the present invention;

fig. 2 is a schematic front sectional view of the present invention;

fig. 3 is a schematic side sectional view of the present invention;

fig. 4 is a schematic cross-sectional structure of the present invention.

In the figure: 1. a base; 2. a first electric push rod; 3. a control box; 4. a cylinder; 5. an apparatus body; 6. a limiting frame; 7. a closing door; 8. an inlet and an outlet; 9. a lifting chamber; 10. an electric lifting rod; 11. a support plate; 12. a work table; 13. a discharge ring; 14. a lower die; 15. a first semiconductor refrigerator; 16. a heat radiation wind barrel; 17. a heat radiation fan; 18. a first cold-conducting copper column; 19. a ventilation screen plate; 20. an upper die; 21. a limiting groove; 22. a limiting block; 23. a second electric push rod; 24. a second semiconductor refrigerator; 25. a second cold-conducting copper column; 26. a cold guide semi-ring; 27. a third electric push rod; 28. and (4) a groove.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the scope of the present invention based on the embodiments of the present invention.

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the present invention are presented. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-4, the present invention provides a technical solution:

example 1, please refer to fig. 1, 2, 3 and 4, a plastic gasket rapid molding apparatus includes a base 1, a device body 5 is fixedly connected to an upper surface of the base 1, a cylinder 4 is fixedly connected to a top surface of the device body 5, a lower end of the cylinder 4 penetrates through the top of the device body 5, an upper mold 20 is fixedly connected to a lower end of the cylinder 4, a first electric push rod 2 is fixedly connected to both sides of an outer side surface of the device body 5, one end of the first electric push rod 2 penetrates through a side surface of the device body 5, one end of the first electric push rod 2 is fixedly connected to a working table 12, a lower mold 14 is fixedly connected to an upper surface of the working table 12, a groove 28 is formed on an upper surface of the working table 12, a third electric push rod 27 is fixedly disposed inside the groove 28, an upper end of the third electric push rod 27 penetrates through a bottom of the lower mold 14, a discharge ring 13 is fixedly connected to an upper end of the third electric push rod 27, a second electric push rod 23 is fixedly connected to both sides of an upper surface of the working table 12, one end of the second electric push rod 23 is fixedly connected with a second semiconductor refrigerator 24, one side surface of the second semiconductor refrigerator 24 is fixedly connected with a second cold-conducting copper column 25, and one end of the second cold-conducting copper column 25 is fixedly connected with a cold-conducting semi-ring 26; placing the material into a lower die 14, starting a first electric push rod 2 to further move a workbench 12 into an equipment body 5, further enabling the lower die 14 and an upper die 20 to be arranged correspondingly, starting an electric lifting rod 10 to further drive a supporting plate 11 to move upwards, further driving a limiting block 22 to enter a limiting groove 21, further driving a sealing door 7 to seal an inlet and an outlet 8, starting an air cylinder 4 to further drive the upper die 20 to punch the material in the lower die 14, starting the electric lifting rod 10 to open the sealing door 7 after punching is completed, starting the first electric push rod 2 to push the workbench 12 out to enter a limiting frame 6, starting a second electric push rod 23 to further drive a second semiconductor refrigerator 24 and a cold-guiding half ring 26 to move towards the lower die 14, further driving the cold-guiding half ring 26 to contact with the lower die 14, starting the second semiconductor refrigerator 24 to cool the lower die 14 through a second cold-guiding copper column 25, and further carrying out rapid cooling forming on the material.

Example 2, referring to fig. 1, 2, 3 and 4, a plastic gasket rapid prototyping apparatus comprises a base 1, a device body 5 is fixedly connected to the upper surface of the base 1, a cylinder 4 is fixedly connected to the top surface of the device body 5, the lower end of the cylinder 4 penetrates the top of the device body 5, an upper mold 20 is fixedly connected to the lower end of the cylinder 4, first electric push rods 2 are fixedly connected to both sides of the outer side surface of the device body 5, one end of each first electric push rod 2 penetrates one side surface of the device body 5, one end of each first electric push rod 2 is fixedly connected to a working table 12, a lower mold 14 is fixedly connected to the upper surface of the working table 12, a groove 28 is formed on the upper surface of the working table 12, a third electric push rod 27 is fixedly arranged inside the groove 28, the upper end of the third electric push rod 27 penetrates the bottom of the lower mold 14, a discharge ring 13 is fixedly connected to the upper end of the third electric push rod 27, and second electric push rods 23 are fixedly connected to both sides of the upper surface of the working table 12, one end of the second electric push rod 23 is fixedly connected with a second semiconductor refrigerator 24, one side surface of the second semiconductor refrigerator 24 is fixedly connected with a second cold-conducting copper column 25, and one end of the second cold-conducting copper column 25 is fixedly connected with a cold-conducting semi-ring 26; a heat dissipation air duct 16 is fixedly connected to the surface of one side of the equipment body 5, ventilation screen plates 19 are fixedly arranged on the surfaces of two sides of the heat dissipation air duct 16, a heat dissipation fan 17 is fixedly connected to the surface of one side of the ventilation screen plate 19, a first semiconductor refrigerator 15 is fixedly connected to the lower surface of the heat dissipation air duct 16, a first cold guiding copper column 18 is fixedly connected to the upper surface of the first semiconductor refrigerator 15, and the first cold guiding copper column 18 penetrates through the wall of the bottom cylinder; a lifting chamber 9 is formed in the base 1, the surface of the bottom in the lifting chamber 9 is fixedly connected with an electric lifting rod 10, the upper end of the electric lifting rod 10 is fixedly connected with a supporting plate 11, the upper surface of the supporting plate 11 is fixedly connected with a sealing door 7, and the upper surface of the sealing door 7 is fixedly connected with a limiting block 22; after the work is finished, the first semiconductor refrigerator 15 is started to further cool the first cold guiding copper column 18, the air around the first cold guiding copper column is cooled through heat transfer, the cooling fan 17 is started to blow the cooled air to the inside of the equipment body 5, and the inside of the equipment body 5 is further cooled.

In embodiment 3, referring to fig. 1, 2, 3, and 4, an inlet and outlet 8 is formed on a surface of one side of an apparatus body 5, and a limiting groove 21 is formed on a surface of a top of the inlet and outlet 8; the closing door 7 is arranged corresponding to the inlet and outlet 8, and the limiting block 22 is arranged corresponding to the limiting groove 21; the fixed surface is connected with control box 3 on base 1, and fixed surface is connected with spacing frame 6 on base 1.

The working principle is as follows: when the semi-ring cooling device is used, a material is placed into the lower die 14, the first electric push rod 2 is started to further move the workbench 12 to the inside of the device body 5, the lower die 14 is further arranged corresponding to the upper die 20, the electric lifting rod 10 is started to further drive the supporting plate 11 to move upwards, the limiting block 22 is further driven to enter the limiting groove 21, the sealing door 7 is further driven to seal the inlet and the outlet 8, the air cylinder 4 is started to further drive the upper die 20 to punch the material in the lower die 14, after the punching is finished, the electric lifting rod 10 is started to open the sealing door 7, the first electric push rod 2 is started to push the workbench 12 out to enter the limiting frame 6, the second electric push rod 23 is started to further drive the second semiconductor refrigerator semi-ring 24 and the cold-guiding semi-ring 26 to move towards the lower die 14, the cold-guiding semi-ring 26 is further driven to contact with the lower die 14, the second semiconductor refrigerator semi-ring 24 is started to cool the lower die 14 through the second cold-guiding copper column 25, further cool off the shaping fast to the material, restart third electric putter 27 drives discharge ring 13 and releases fashioned gasket, and after the work was accomplished, start first semiconductor refrigerator 15 and further cool down first cold copper post 18 of leading, the rethread heat transfer cools down its air on every side, starts radiator fan 17 and blows inside 5 to equipment body through the air after the cooling, further cools down inside 5 to equipment body.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a plastic gasket rapid prototyping equipment, includes base (1), its characterized in that: the upper surface of the base (1) is fixedly connected with an equipment body (5), the surface of the top of the equipment body (5) is fixedly connected with an air cylinder (4), the lower end of the air cylinder (4) penetrates through the top of the equipment body (5), the lower end of the air cylinder (4) is fixedly connected with an upper die (20), two sides of the outer side surface of the equipment body (5) are fixedly connected with a first electric push rod (2), one end of the first electric push rod (2) penetrates through one side surface of the equipment body (5), one end of the first electric push rod (2) is fixedly connected with a workbench (12), the upper surface of the workbench (12) is fixedly connected with a lower die (14), the upper surface of the workbench (12) is provided with a groove (28), a third electric push rod (27) is fixedly arranged in the groove (28), the upper end of the third electric push rod (27) penetrates through the bottom of the lower die (14), third electric push rod (27) upper end fixedly connected with discharge ring (13), the equal fixedly connected with second electric push rod (23) in workstation (12) upper surface both sides, second electric push rod (23) one end fixedly connected with second semiconductor cooler (24), second semiconductor cooler (24) one side fixed surface is connected with the second and leads cold copper post (25), cold copper post (25) one end fixedly connected with leads cold semi-ring (26) is led to the second.

2. The apparatus for rapid prototyping plastic gaskets as set forth in claim 1, wherein: the equipment comprises an equipment body (5), wherein a heat dissipation air duct (16) is fixedly connected to the surface of one side of the equipment body (5), ventilation screen plates (19) are fixedly arranged on the surfaces of the two sides of the heat dissipation air duct (16), one side of each ventilation screen plate (19) is fixedly connected with a heat dissipation fan (17), a first semiconductor refrigerator (15) is fixedly connected to the lower surface of the heat dissipation air duct (16), a first cold guiding copper column (18) is fixedly connected to the upper surface of the first semiconductor refrigerator (15), and the first cold guiding copper column (18) penetrates through the wall of the bottom of the equipment body.

3. The apparatus for rapid prototyping plastic gaskets as set forth in claim 1, wherein: base (1) inside has been seted up elevator chamber (9), elevator chamber (9) inside bottom fixed surface is connected with electric lift pole (10), electric lift pole (10) upper end fixedly connected with backup pad (11), fixed surface is connected with and seals door (7) on backup pad (11), fixed surface is connected with stopper (22) on sealing door (7).

4. The apparatus for rapid molding of plastic gaskets as claimed in claim 1, wherein: an inlet and an outlet (8) are formed in the surface of one side of the equipment body (5), and a limiting groove (21) is formed in the surface of the top of the inlet and the outlet (8).

5. The apparatus for rapid prototyping plastic gaskets as set forth in claim 3, wherein: the sealing door (7) is arranged corresponding to the inlet and the outlet (8), and the limiting block (22) is arranged corresponding to the limiting groove (21).

6. The apparatus for rapid prototyping plastic gaskets as set forth in claim 1, wherein: fixed surface is connected with control box (3) on base (1), fixed surface is connected with spacing frame (6) on base (1).