CN217183719U - Internet of things host with contact type heat dissipation function - Google Patents

Internet of things host with contact type heat dissipation function Download PDF

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Publication number
CN217183719U
CN217183719U CN202221029063.6U CN202221029063U CN217183719U CN 217183719 U CN217183719 U CN 217183719U CN 202221029063 U CN202221029063 U CN 202221029063U CN 217183719 U CN217183719 U CN 217183719U
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heat
internet
heat dissipation
things
host
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张标
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Jiangsu Yinrong Information Technology Co ltd
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Jiangsu Yinrong Information Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The utility model discloses an internet of things host with contact type heat dissipation function, which comprises a mounting rack, the inboard fixedly connected with host main body of the mounting rack, the inboard of host main body is provided with an internet of things mainboard, the downside of host main body is provided with a heat dissipation mechanism corresponding to the internet of things mainboard, the heat dissipation mechanism comprises a radiating fin, a heat conduction carbon fiber layer and a heat conduction graphite film, the heat conduction graphite film is laminated on the surface of the internet of things mainboard, and the heat conduction carbon fiber layer is laminated on the surface of the heat conduction graphite film; through the heat dissipation mechanism of design, the heat on the thing networking mainboard is contacted through heat conduction graphite membrane and is absorbed when using, then the effect of conducting heat through heat conduction graphite membrane level is led the heat level and is opened to avoid appearing local overheated phenomenon, then cooperate heat conduction carbon fiber layer and fin to accelerate the heat and outwards give off, can guarantee stable radiating effect when the heat dissipation.

Description

Internet of things host with contact type heat dissipation function
Technical Field
The utility model belongs to the technical field of the thing networking host computer, concretely relates to thing networking host computer with contact heat dissipation function.
Background
The internet of things host is also called an internet of things terminal, an energy consumption monitoring data collector, an energy consumption monitoring wireless data collector, an intelligent auxiliary control host, an intelligent management host and an environmental data processing unit. By providing standard interfaces such as RS232/485, 4-20ma analog quantity and I/0, analog video, digital video, voltage signals, current signals and switching value signals are accessed, RFID, sensors and various electrical appliances or power equipment are networked, and centralized monitoring, linkage control and remote management of the equipment are realized.
The existing Internet of things host machine is usually fixed at a use position through screws when in use, the heat is dissipated through a heat dissipation port when in use, and the phenomenon that heat cannot be stably dissipated can occur when the host machine operates for a long time, so that the temperature in the host machine is increased, and the problem of aging of internal parts is easily accelerated.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a thing networking host computer with contact heat dissipation function to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a thing networking host computer with contact heat dissipation function, includes the mounting bracket, the inboard fixedly connected with host computer main part of mounting bracket, the inboard of host computer main part is provided with the thing networking mainboard, the downside of host computer main part corresponds the thing networking mainboard and is provided with heat dissipation mechanism, heat dissipation mechanism includes fin, heat conduction carbon fiber layer and heat conduction graphite membrane, the laminating of heat conduction graphite membrane is on the surface of thing networking mainboard, the laminating of heat conduction carbon fiber layer is on the surface of heat conduction graphite membrane, the both ends of thing networking mainboard pass heat conduction graphite membrane and heat conduction carbon fiber layer and host computer main part fixed connection through the screw, fin fixed mounting is at the lower surface of host computer main part, the upper end of fin passes the surface contact of host computer main part and heat conduction carbon fiber layer.
Preferably, the cross section of the lower end of the radiating fin is in the shape of an isosceles trapezoid, and the radiating fins are arranged on the lower side of the main body at equal intervals.
Preferably, the upside of host computer main part is provided with the access panel, the one end of access panel passes through coupling mechanism and host computer main part fixed connection.
Preferably, one end of the access panel is provided with a connecting plug board, and the inner side of the main body of the host is provided with a connecting slot corresponding to the position of one connecting plug board.
Preferably, coupling mechanism is including seting up draw-in groove, the inboard spring of fixed mounting at the draw-in groove, slidable mounting at the inboard block of host computer main part and pushing the piece in the draw-in groove one end, the knob screw has been closed soon to one side of host computer main part, the one end of knob screw with push the piece and pass through the bearing rotation and be connected, the one side of pushing the piece and one side sliding connection of block.
Preferably, one side of the clamping block and one side of the pushing block are both provided with inclined planes, and the inclined planes of the pushing block and the clamping block are connected in a sliding mode through a sliding groove and a sliding block.
Compared with the prior art, the beneficial effects of the utility model are that:
1. through the heat dissipation mechanism of design, the heat on the thing networking mainboard is contacted through heat conduction graphite membrane and is absorbed when using, then the effect of conducting heat through heat conduction graphite membrane level is led the heat level and is opened to avoid appearing local overheated phenomenon, then cooperate heat conduction carbon fiber layer and fin to accelerate the heat and outwards give off, can guarantee stable radiating effect when the heat dissipation.
2. Through the access panel and the coupling mechanism of design, when using to the access panel dismantles and overhauls the interior component of host computer main part, only need manual rotatory knob screw to the drive promotes the piece and moves away from the block, promotes the block through the spring and moves away to withdraw in the host computer main part, then can be to tearing down the access panel overhaul in to the host computer main part.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the heat dissipation mechanism of the present invention;
FIG. 3 is a schematic view of the connecting mechanism of the present invention;
in the figure: 1. a mounting frame; 2. a host body; 3. a heat dissipation mechanism; 4. an access panel; 5. a connecting mechanism; 6. a heat sink; 7. a heat conductive carbon fiber layer; 8. a thermally conductive graphite film; 9. an Internet of things mainboard; 10. connecting the slots; 11. connecting the plugboards; 12. a knob screw; 13. a pushing block; 14. a clamping block; 15. a spring; 16. a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1 to 3, the present invention provides a technical solution: an Internet of things host with a contact type heat dissipation function comprises a mounting frame 1, a host main body 2 is fixedly connected to the inner side of the mounting frame 1, an Internet of things mainboard 9 is arranged on the inner side of the host main body 2, a heat dissipation mechanism 3 is arranged on the lower side of the host main body 2 corresponding to the Internet of things mainboard 9, the heat dissipation mechanism 3 comprises a heat dissipation fin 6, a heat conduction carbon fiber layer 7 and a heat conduction graphite film 8, the heat conduction graphite film 8 is attached to the surface of the Internet of things mainboard 9, the heat conduction carbon fiber layer 7 is attached to the surface of the heat conduction graphite film 8, two ends of the Internet of things mainboard 9 penetrate through the heat conduction graphite film 8 and the heat conduction carbon fiber layer 7 to be fixedly connected with the host main body 2 through screws, the heat conduction graphite film 8 and the heat conduction carbon fiber layer 7 are pressed on the lower side when the Internet of things mainboard 9 is fixed, heat is dissipated from the Internet of things mainboard 9, and the heat on the Internet of things mainboard 9 is absorbed through the heat conduction graphite film 8, then, heat is horizontally dispersed on the heat-conducting graphite film 8, the heat is guided and dissipated through the heat-conducting carbon fiber layer 7, the radiating fin 6 is fixedly arranged on the lower surface of the main body 2, the upper end of the radiating fin 6 penetrates through the main body 2 to be in contact with the surface of the heat-conducting carbon fiber layer 7, the heat is guided to the radiating fin 6 through the heat-conducting carbon fiber layer 7, and the heat is rapidly dissipated outwards in cooperation with the radiating fin 6; the cross-sectional shape of the lower end of each radiating fin 6 is an isosceles trapezoid, and the radiating fins 6 are arranged on the lower side of the main body 2 at equal intervals, so that ventilation and heat dissipation of gaps among the radiating fins 6 are facilitated when the cooling fan is used.
As can be seen from the above description, the present invention has the following advantages: when the heat radiating device is used, the heat on the internet of things mainboard 9 is contacted and absorbed through the heat conducting graphite film 8, then the heat level is conducted away through the horizontal heat conducting effect of the heat conducting graphite film 8, so that the phenomenon of local overheating is avoided, then the heat conducting carbon fiber layer 7 and the radiating fins 6 are matched to accelerate the heat to be radiated outwards, and the stable heat radiating effect can be ensured when the heat is radiated.
Example two:
referring to fig. 1 to 3, based on the first embodiment, the present invention provides a technical solution: an access panel 4 is arranged on the upper side of the main body 2, one end of the access panel 4 is fixedly connected with the main body 2 through a connecting mechanism 5, and the access panel 4 is fixed through the connecting mechanism 5 when in use; one end of the access panel 4 is provided with a connecting plug board 11, the inner side of the main body 2 is provided with a connecting slot 10 opposite to the position of one connecting plug board 11, and when the access panel 4 is installed, the connecting plug board 11 at one end of the access panel 4 is inserted into the connecting slot 10 for limiting; the connecting mechanism 5 comprises a clamping groove 16 formed at one end of the overhaul board 4, a spring 15 fixedly installed on the inner side of the clamping groove 16, a clamping block 14 and a pushing block 13 which are installed on the inner side of the main machine body 2 in a sliding mode, a knob screw 12 is screwed on one side of the main machine body 2, one end of the knob screw 12 is rotatably connected with the pushing block 13 through a bearing, one side of the pushing block 13 is connected with one side of the clamping block 14 in a sliding mode, the pushing block 13 is driven to slide by rotating the knob screw 12, and the pushing block 13 pushes the clamping block 14 to be clamped in the clamping groove 16 in a sliding mode; one side of the clamping block 14 and one side of the pushing block 13 are both provided with inclined surfaces, and the inclined surfaces of the pushing block 13 and the clamping block 14 are in sliding connection through a sliding groove and a sliding block, so that the pushing block 13 can conveniently push the clamping block 14 to slide when the clamping device is used.
By adopting the maintenance board 4 and the connecting mechanism 5, when the maintenance board 4 is disassembled to maintain the elements in the main body 2 during use, only the knob screw 12 needs to be manually rotated, so that the pushing block 13 is driven to move away from the clamping block 14, the spring 15 pushes the clamping block 14 to move away to withdraw the main body 2, and then the maintenance board 4 can be disassembled to maintain the main body 2.
The utility model discloses a theory of operation and use flow: fix host computer main part 2 in the position of use through mounting bracket 1 when using, give off the heat on thing networking mainboard 9 when using, absorb the heat on thing networking mainboard 9 through heat conduction graphite membrane 8, then the heat horizontally scatters on heat conduction graphite membrane 8, make heat direction fin 6 through heat conduction carbon fiber layer 7, cooperation fin 6 gives off outwards fast, the laminating contact through heat conduction graphite membrane 8 makes things convenient for the heat to transmit fast when using, thereby give off the heat fast, the component breaks down in host computer main part 2 when using, only need rotatory knob screw 12 to remove, thereby it promotes piece 13 and slides on block 14 to drive, block 14 makes one side of block 14 slide from spring 15 in spring 15 is moved in the top to spring 15 simultaneously, then can open access panel 4 from host computer main part 2, it is more convenient when dismantling.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.

Claims (6)

1. The utility model provides a thing networking host computer with contact heat dissipation function, includes mounting bracket (1), its characterized in that: the inner side of the mounting rack (1) is fixedly connected with a main machine body (2), the inner side of the main machine body (2) is provided with an Internet of things main board (9), the lower side of the main machine body (2) is provided with a heat dissipation mechanism (3) corresponding to the main board (9) of the Internet of things, the heat dissipation mechanism (3) comprises a heat dissipation fin (6), a heat conduction carbon fiber layer (7) and a heat conduction graphite film (8), the heat-conducting graphite film (8) is attached to the surface of the Internet of things mainboard (9), the heat-conducting carbon fiber layer (7) is attached to the surface of the heat-conducting graphite film (8), two ends of the internet of things mainboard (9) penetrate through the heat-conducting graphite film (8) and the heat-conducting carbon fiber layer (7) through screws to be fixedly connected with the main machine body (2), the radiating fin (6) is fixedly arranged on the lower surface of the main body (2), the upper end of the radiating fin (6) penetrates through the main machine body (2) to be in contact with the surface of the heat-conducting carbon fiber layer (7).
2. The internet of things host with contact heat dissipation function of claim 1, wherein: the cross-sectional shape of the lower end of the radiating fin (6) is an isosceles trapezoid, and the radiating fins (6) are arranged on the lower side of the main body (2) at equal intervals.
3. The internet of things host with contact type heat dissipation function of claim 1, wherein: the upside of host computer main part (2) is provided with access panel (4), the one end of access panel (4) passes through coupling mechanism (5) and host computer main part (2) fixed connection.
4. The internet of things host with contact heat dissipation function of claim 3, wherein: one end of the access panel (4) is provided with a connecting plug board (11), and the inner side of the main body (2) is provided with a connecting slot (10) at the position of one connecting plug board (11).
5. The internet of things host with contact heat dissipation function of claim 3, wherein: coupling mechanism (5) including offer draw-in groove (16), the inboard spring (15) of draw-in groove (16), the slidable mounting in draw-in groove (16) of fixed mounting in host computer main part (2) and promote piece (13), one side of host computer main part (2) is revolved and is closed knob screw (12), the one end of knob screw (12) with promote piece (13) and pass through the bearing and rotate and be connected, promote one side sliding connection of one side and the block (14) of piece (13).
6. The internet of things host with contact heat dissipation function of claim 5, wherein: one side of each of the clamping block (14) and the pushing block (13) is provided with an inclined surface, and the inclined surfaces of the pushing block (13) and the clamping block (14) are connected in a sliding mode through sliding grooves and sliding blocks.
CN202221029063.6U 2022-04-29 2022-04-29 Internet of things host with contact type heat dissipation function Active CN217183719U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221029063.6U CN217183719U (en) 2022-04-29 2022-04-29 Internet of things host with contact type heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221029063.6U CN217183719U (en) 2022-04-29 2022-04-29 Internet of things host with contact type heat dissipation function

Publications (1)

Publication Number Publication Date
CN217183719U true CN217183719U (en) 2022-08-12

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ID=82710947

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221029063.6U Active CN217183719U (en) 2022-04-29 2022-04-29 Internet of things host with contact type heat dissipation function

Country Status (1)

Country Link
CN (1) CN217183719U (en)

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