CN217183667U - Ethernet switch convenient to heat dissipation - Google Patents
Ethernet switch convenient to heat dissipation Download PDFInfo
- Publication number
- CN217183667U CN217183667U CN202123114730.9U CN202123114730U CN217183667U CN 217183667 U CN217183667 U CN 217183667U CN 202123114730 U CN202123114730 U CN 202123114730U CN 217183667 U CN217183667 U CN 217183667U
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- heat dissipation
- circuit board
- printed circuit
- shell
- heat
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Abstract
The utility model discloses an ethernet switch convenient to heat dissipation, include: the printed circuit board is provided with an integrated chip; the shell comprises an upper shell and a lower shell, the upper shell and the lower shell are connected to form a sealed square structure matched with the printed circuit board, and the printed circuit board is arranged in the sealed square structure; the upper surface of the upper shell is provided with a heat dissipation groove connected with the external space, and the bottom end of the heat dissipation groove is attached to the upper end surface of the integrated chip; the heat dissipation groove is internally provided with a heat dissipation sheet and a fan at the corresponding position of the integrated chip; the heat generated by the integrated chip is conducted to the heat conducting fins in the heat dissipation groove through the upper shell. According to the utility model discloses, its heat conduction that produces integrated chip in with the seal shell through the epitheca is to the fin in the radiating groove with the heat dissipation, and the fan in the rethread radiating groove outside is bloied in order to improve fin radiating efficiency to make the shell inner space completely isolated with external space and avoid the dust to get into the inside electronic components that causes of switch and damage and the heat dissipation is bad.
Description
Technical Field
The utility model relates to a switch field, in particular to ethernet switch convenient to heat dissipation.
Background
In life, ethernet switches are widely used, which are switches based on ethernet to transmit data, and the switches can simultaneously connect a plurality of pairs of ports, so that each pair of hosts communicating with each other can transmit data without collision as if the hosts exclusively use communication media. In the process of using the ethernet switch, the inventor finds that the ethernet switch in the prior art has at least the following problems:
the existing Ethernet switch usually adopts a shell opening mode to achieve the purpose of heat dissipation, but even if a dustproof net is laid at a heat dissipation hole, dust easily enters the interior of the Ethernet switch to cause low heat dissipation efficiency of the Ethernet switch or damage electronic components.
In view of the above, there is a need to develop an ethernet switch to solve the above problems.
SUMMERY OF THE UTILITY MODEL
To the weak point that exists among the prior art, the utility model discloses a main objective provides a be convenient for radiating ethernet switch, and its heat conduction that produces integrated chip in with the sealed shell through the epitheca is to the fin outside the epitheca in order to dispel the heat, and the fan outside the rethread casing is bloied to the fin in order to improve fin radiating efficiency to make shell inner space completely isolated with external space and avoid the dust to get into the inside electronic components that causes of switch and damage and the heat dissipation harmfully.
In order to achieve the above objects and other advantages in accordance with the present invention, there is provided an ethernet switch facilitating heat dissipation, comprising:
a printed circuit board and a housing;
the printed circuit board is provided with an integrated chip;
the shell comprises an upper shell and a lower shell, the upper shell and the lower shell are connected to form a sealed square structure matched with the printed circuit board, and the printed circuit board is installed in the sealed square structure; the upper surface of the upper shell is provided with a heat dissipation groove connected with an external space, and the bottom end of the heat dissipation groove is attached to the upper end surface of the integrated chip; the heat dissipation groove is internally provided with a heat dissipation sheet and a fan at the corresponding position of the integrated chip; the heat generated by the integrated chip is conducted to the heat conducting fins in the heat radiating grooves through the upper shell, and further the heat is radiated to the external space of the shell through the heat radiating fins by the fan.
Furthermore, the printed circuit board is further provided with an Ethernet port, an optical fiber port, an LED indicator light and a power interface, and the integrated chip, the Ethernet port, the optical fiber port, the LED indicator light and the power interface are electrically connected with the printed circuit board and are arranged on the same surface of the printed circuit board.
Furthermore, the power interface is arranged on one narrow side edge of the printed circuit board, and the power interface part extends out of the edge of the printed circuit board and faces the outer side of the printed circuit board.
Furthermore, the Ethernet interface, the LED indicator light and the optical fiber interface are arranged on the wider side edge of the printed circuit board, and the Ethernet port, the optical fiber port, the LED indicator light and the power interface partially extend out of the printed circuit board and face the outer side of the printed circuit board.
Furthermore, semiconductor heat-conducting fins are attached to the upper end faces of the integrated chips, the semiconductor heat-conducting fins are electrically connected with the printed circuit board, and the refrigerating faces of the semiconductor heat-conducting fins face the integrated chips.
Furthermore, the heat dissipation groove is arranged at the folded corner of the upper shell and is provided with an upward and lateral opening surface.
Furthermore, the radiating fins are arranged on the inner side of the radiating groove, the fan is arranged in the radiating groove, and the blowing direction of the fan faces to the radiating space of the radiating groove;
the heat dissipation fin is of a multi-sheet structure, and the heat dissipation space of the heat dissipation fin is provided with upward and lateral open faces so that the fan can conveniently enter air from the lateral direction and exit air from the lateral direction.
Furthermore, the upper shell is provided with a power supply port matched with the power supply interface, and the power supply interface extends out of the part of the printed circuit board and is accommodated in the power supply port;
the lower shell is provided with a through hole matched with the Ethernet interface, the optical fiber interface and the LED indicator lamp, and the Ethernet interface, the optical fiber interface and the LED indicator lamp extend out of the printed circuit board and are partially accommodated in the through hole.
Furthermore, a circle of elastic ring is arranged on the edges of the through hole and the power supply port, and the elastic ring tightly fills gaps among the through hole, the power supply port and each electronic component.
Furthermore, the printed circuit board is provided with a plurality of mounting holes, a mounting seat is arranged on the inner side of the lower shell at a position corresponding to the mounting holes, screw holes are formed in the top end of the mounting seat, and the printed circuit board penetrates through the mounting holes through screws to be meshed with the screw holes and is mounted on the inner side of the lower shell.
One of the above technical solutions has the following advantages or beneficial effects: this application is through establishing the circuit board in with external isolated seal shell completely, with the laminating of integrated chip and the outside radiating groove bottom of epitheca, directly pass through the radiating fin of epitheca heat conduction to the radiating groove with the produced heat of integrated chip, with shell inner space and exterior space keep apart completely in order to avoid the dust to get into the damage and the bad while of heat dissipation that lead to electronic components, through semiconductor conducting strip, radiating fin and fan improvement radiating efficiency.
Drawings
Fig. 1 is a three-dimensional block diagram of an angle of an ethernet switch for facilitating heat dissipation according to one embodiment of the present invention;
fig. 2 is an exploded view of an ethernet switch that facilitates heat dissipation according to one embodiment of the present invention;
fig. 3 is a three-dimensional block diagram of another angle of an ethernet switch for facilitating heat dissipation according to an embodiment of the present invention;
fig. 4 is a three-dimensional structural view of an upper case of an ethernet switch for facilitating heat dissipation according to an embodiment of the present invention;
in the figure: 10-a printed circuit board; 11-an integrated chip; 12-a semiconductor thermally conductive sheet; 13-a charging base; 14-a power interface; 15-ethernet interface; 16-an optical fiber interface; 17-LED indicator light; 18-mounting holes; 20-upper shell; 21-power port; 22-a first connection hole; 23-a heat sink; 24-a charging dock; 30-a lower shell; 31-a mounting seat; 32-flange configuration; 33-second connection hole; 34-a through hole; 41-a fan; 42-heat sink.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the drawings, the shape and size may be exaggerated for clarity, and the same reference numerals will be used throughout the drawings to designate the same or similar components.
In the following description, terms such as center, thickness, height, length, front, back, rear, left, right, top, bottom, upper, lower, etc., are defined with respect to the configurations shown in the respective drawings, and in particular, "height" corresponds to a dimension from top to bottom, "width" corresponds to a dimension from left to right, "depth" corresponds to a dimension from front to rear, which are relative concepts, and thus may be varied accordingly depending on the position in which it is used, and thus these or other orientations should not be construed as limiting terms.
Terms concerning attachments, coupling and the like (e.g., "connected" and "attached") refer to a relationship wherein structures are secured or attached, either directly or indirectly, to one another through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.
According to an embodiment of the present invention, in combination with the illustration of fig. 1 and fig. 2, it can be seen that the ethernet switch facilitating heat dissipation includes:
a printed circuit board 10 and a housing;
the printed circuit board 10 is provided with a power interface 14, an Ethernet interface 15, an optical fiber interface 16, an LED indicator lamp 17 and an Ethernet chip; the power interface 14, the ethernet interface 15, the optical fiber interface 16, the LED indicator 17 and the ethernet chip are electrically connected to the printed circuit board 10 and are disposed on the same surface of the printed circuit board 10.
The power interface 14 is a four-hole 485 power port; the power interface 14 is arranged at the edge of one end of the printed circuit board 10 with a narrow side length, part of the power interface 14 extends out of the edge of the printed circuit board 10, and the power interface 14 faces the outer edge of the printed circuit board 10; the power interface 14 is used for accessing direct current or alternating current to provide direct current (10-36V) or alternating current (8-24V) power for electronic components on the printed circuit board 10; the printed circuit board 10 is provided with an Ethernet interface 15, the Ethernet interface 15 is a six-interface combined interface, each interface is arranged on the Ethernet interface 15 in a row of three and two columns, the Ethernet interface 15 is used for inputting and outputting Ethernet data, the Ethernet interface 15 is arranged at one side edge of the printed circuit board 10 with a wider side length, the Ethernet interface 15 faces the outer edge of the printed circuit board 10, and part of the Ethernet interface 15 extends out of the edge of the printed circuit board 10; each interface of the ethernet interface 15 is an RJ45 interface, which has an auto-negotiation function and can perform half-duplex and duplex mode selection and flow control; the Ethernet interface 15 has a self-adaptive MDI/X function, so that the interface is used as an uplink interface of another interface, the requirement on a crossed cable is eliminated, and hot plug of the interface is realized; the optical fiber interface 16 and the Ethernet interface 15 are arranged at the edge of the printed circuit board 10 side by side; in this embodiment, two sets of fiber optic interfaces 16 are disposed side-by-side on the printed circuit board 10; the optical fiber interface 16 faces the outer edge of the printed circuit board 10, and the optical fiber interface 16 partially extends out of the edge of the printed circuit board 10; the optical fiber interfaces 16 are molded plug-in coupling type single-mode optical fiber connectors, and one group of the optical fiber interfaces 16 is provided with two interfaces which are respectively responsible for input and output of the Ethernet; the LED indicator light 17 is arranged on the edge of the printed circuit board 10 on the same side as the optical fiber interface 16; the LED indicator light 17 is provided with a plurality of bulbs, and the LED indicator light 17 faces towards the outer edge of the printed circuit board 10 in a consistent direction; the LED indicator light 17 bulb extends out of the edge of the printed circuit board 10; the LED indicator light 17 displays the working state of the corresponding optical fiber interface 16 through the color and the flicker thereof; the integrated chip 11 is arranged in the middle of the printed circuit board 10, the integrated chip 11 is used for processing data received by the Ethernet interface 15 and the optical fiber interface 16, and meanwhile, the integrated chip 11 can control the color and the flicker of the LED signal lamp according to the state information transmitted by the optical fiber interface 16; the integrated chip 11 controls the electronic components of the utility model by controlling the current; a semiconductor heat conducting sheet 12 is pasted on the integrated chip 11, the refrigerating surface of the semiconductor heat conducting sheet 12 faces the integrated chip 11, and the heating surface of the semiconductor heat conducting sheet 12 faces upwards vertically; the four corners of the printed circuit board 10 are respectively provided with a mounting hole 18 for mounting the printed circuit board 10.
The housing includes: a lower case 30 and an upper case 20 in an L-shape; the lower shell 30 and the upper shell 20 are connected to form a square box structure matched with the printed circuit board 10, the printed circuit board 10 is installed in the square box structure, wherein a through hole 34 is formed in the lower shell 30, the through hole 34 is matched with the ethernet interface 15, the LED indicator light 17 and the optical fiber interface 16, and a power supply port 21 matched with the power supply interface 14 is formed in the upper shell 20; the Ethernet interface 15, the LED indicator light 17 and the optical fiber interface 16 extend out of the printed circuit board 10 and are partially accommodated in the through hole 34; the power interface 14 extends out of the printed circuit board 10 and is partially accommodated in the power port 21; the square box structure formed by connecting the upper shell 20, the lower shell 30 and the printed circuit board 10 is a sealing structure, and the shell is filled with inert gas to protect all electronic components on the printed circuit board 10; a circle of elastic ring is arranged at the edges of the through hole 34 and the power interface 14, and the elastic ring tightly fills gaps between the through hole 34 and the power interface 14 and among electronic components, so that the air tightness of the shell is improved, the inert gas is prevented from overflowing, and meanwhile, the Ethernet interface 15, the optical fiber interface 16, the LED indicator lamp 17 and the power interface 14 exposed out of the shell are prevented from being damaged due to falling or vibration of the switch; the upper surface of the upper shell 20 is provided with a heat dissipation groove 23, the heat dissipation groove 23 is angled at the other side of the upper shell 20 away from the ethernet interface 15, and the heat dissipation groove 23 has an upward and lateral open surface; the bottom end of the heat dissipation groove 23 is attached to the semiconductor heat conducting sheet 12, and the integrated chip 11 conducts heat to the bottom of the heat dissipation groove 23 through the semiconductor heat conducting sheet 12; a heat radiating fin 42 is arranged in the heat radiating groove 23 at a position corresponding to the integrated chip 11, the heat radiating fin 42 is of a multi-sheet structure, and the heat radiating fin 42 is parallel to the inner walls of the two sides of the heat radiating groove 23; the heat dissipation plate 42 is provided with a fan at one side of the lateral opening surface of the heat dissipation groove 23, the air outlet of the fan faces the heat dissipation plate 42, and the fan blows air from the outside of the heat dissipation groove 23 to the heat dissipation plate 42 in the heat dissipation groove 23; a mounting seat 31 is mounted on the inner side of the lower shell 30, the mounting seat 31 corresponds to the mounting hole 18, the mounting seat 31 is of a columnar structure, the top of the mounting seat is provided with a screw hole, and a screw passes through the mounting hole 18 to be engaged with the screw hole so as to mount the printed circuit board 10 on the inner side of the lower shell 30; the inner side edge of the lower shell 30 is provided with a flange structure 32 protruding upwards, the flange structure 32 is provided with a plurality of second connecting holes 33, the upper shell 20 is provided with first connecting holes 22 matched with the second connecting holes 33 at positions corresponding to the second connecting holes 33, and the first connecting holes 22 and the second connecting holes 33 connect and mount the upper shell 20 and the lower shell 30 through screw connection; and sealant is tightly filled between the first connecting hole 33 and the screw, so that the air tightness inside the shell is ensured, and the electronic components are prevented from being damaged or poor in heat dissipation due to the fact that external dust enters the shell.
Furthermore, the semiconductor heat conducting sheet 12 is attached to the lower cooling surface of the integrated chip 11 through heat dissipation silicone grease, so as to increase the contact area between the semiconductor heat conducting sheet 12 and the integrated chip 11 and improve the heat conduction efficiency between the semiconductor heat conducting sheet 12 and the integrated chip 11; the heating surface at the upper end of the semiconductor heat conducting fin 12 is attached to the bottom of the heat dissipation groove 23 through heat dissipation silicone grease, so that the contact area between the semiconductor heat conducting fin 12 and the bottom of the heat dissipation groove 23 is increased, and the heat conduction efficiency between the semiconductor heat conducting fin 12 and the bottom of the heat dissipation groove 23 is improved; the bottom of the heat radiating fin 42 is attached to the bottom of the heat radiating groove 23 through heat radiating silicone grease, so that the contact area between the heat radiating fin 42 and the bottom of the heat radiating groove 23 is increased, and the heat conduction efficiency between the heat radiating fin 42 and the upper shell 20 is improved.
Furthermore, a charging seat 24 adapted to the fan is embedded in the bottom of the fan through the heat dissipation slot, a charging base 13 adapted to the charging seat 24 is disposed on the printed circuit board at a position corresponding to the charging seat 24, a lower end surface of the charging seat 24 is electrically connected to an upper end surface of the charging base 13, and the charging base 13 is electrically connected to the printed circuit board; the charging seat 24 with the positive negative pole electric connection of charging base 13, printed circuit board loops through charging base 13, charging seat 24 and supplies power to the fan, and this application is supplying power to fan 41 through embedded charging seat 24 when guaranteeing the inside gas tightness of shell.
The number of apparatuses and the scale of the process described here are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields of application suitable for this invention, and further modifications may be readily made by those skilled in the art, and the invention is therefore not limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.
Claims (10)
1. An ethernet switch for facilitating heat dissipation, comprising:
a printed circuit board and a housing;
the printed circuit board is provided with an integrated chip;
the shell comprises an upper shell and a lower shell, the upper shell and the lower shell are connected to form a sealed square structure matched with the printed circuit board, and the printed circuit board is installed in the sealed square structure; the upper surface of the upper shell is provided with a heat dissipation groove connected with an external space, and the bottom end of the heat dissipation groove is attached to the upper end surface of the integrated chip; the heat dissipation groove is internally provided with a heat dissipation sheet and a fan at the corresponding position of the integrated chip; the heat generated by the integrated chip is conducted to the heat conducting fins in the heat radiating grooves through the upper shell, and then the heat is radiated to the outer space of the shell through the heat radiating fins by the fan.
2. The ethernet switch facilitating heat dissipation according to claim 1, wherein the printed circuit board further comprises an ethernet port, an optical fiber port, an LED indicator and a power interface, and the integrated chip, the ethernet port, the optical fiber port, the LED indicator and the power interface are electrically connected to the printed circuit board and disposed on the same surface of the printed circuit board.
3. The ethernet switch facilitating heat dissipation of claim 2, wherein the power interface is disposed on a narrower side edge of the printed circuit board, the power interface partially extending beyond the edge of the printed circuit board and facing outward from the printed circuit board;
the Ethernet port, the optical fiber port, the LED indicator light and the power interface are arranged on the side edge of the wider side of the printed circuit board, and the Ethernet port, the optical fiber port, the LED indicator light and the power interface partially extend out of the printed circuit board and face the outer side of the printed circuit board.
4. The ethernet switch for facilitating heat dissipation of claim 3, wherein the enclosure is filled with an inert gas.
5. The ethernet switch facilitating heat dissipation of claim 1, wherein a semiconductor heat conducting sheet is attached to an upper end surface of the ic, the semiconductor heat conducting sheet is electrically connected to the pcb, and the cooling surface of the semiconductor heat conducting sheet faces the ic.
6. The ethernet switch for facilitating heat dissipation of claim 1, wherein the heat sink is disposed at a corner of the upper housing, the heat sink having an open face facing upward and laterally.
7. The ethernet switch facilitating heat dissipation according to claim 6, wherein the heat sink is disposed inside the heat sink, the fan is disposed inside the heat sink, and the fan blows air toward the heat dissipation space of the heat sink;
the heat dissipation fin is of a multi-sheet structure, and the heat dissipation space of the heat dissipation fin is provided with upward and lateral open faces so that the fan can conveniently enter air from the lateral direction and exit air from the lateral direction.
8. The ethernet switch facilitating heat dissipation of claim 3, wherein said upper housing has a power port adapted to said power interface, said power interface extending beyond said printed circuit board portion to be received in said power port;
the lower shell is provided with a through hole matched with the Ethernet port, the optical fiber interface and the LED indicator lamp, and the Ethernet port, the optical fiber interface and the LED indicator lamp extend out of the printed circuit board and are partially accommodated in the through hole.
9. The ethernet switch facilitating heat dissipation of claim 8, wherein the edge of the through hole and the power port is provided with a ring of elastic rings, and the elastic rings tightly fill the gap between the through hole and the power port and between each electronic component.
10. The ethernet switch for facilitating heat dissipation of claim 1, wherein said printed circuit board has a plurality of mounting holes, said lower case has mounting seats on the inner side thereof at positions corresponding to said mounting holes, said mounting seats have screw holes at the top ends thereof, and said printed circuit board is mounted on the inner side of said lower case by screws passing through said mounting holes to engage with said screw holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123114730.9U CN217183667U (en) | 2021-12-13 | 2021-12-13 | Ethernet switch convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123114730.9U CN217183667U (en) | 2021-12-13 | 2021-12-13 | Ethernet switch convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217183667U true CN217183667U (en) | 2022-08-12 |
Family
ID=82713626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123114730.9U Active CN217183667U (en) | 2021-12-13 | 2021-12-13 | Ethernet switch convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217183667U (en) |
-
2021
- 2021-12-13 CN CN202123114730.9U patent/CN217183667U/en active Active
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