CN217182033U

CN217182033U - Loading frame for capacitor epoxy encapsulation process

Info

Publication number: CN217182033U
Application number: CN202122853718.3U
Authority: CN
Inventors: 毛子潇
Original assignee: Wuxi Mijia Electronic Technology Co ltd
Current assignee: Wuxi Mijia Electronic Technology Co ltd
Priority date: 2021-11-22
Filing date: 2021-11-22
Publication date: 2022-08-12
Anticipated expiration: 2031-11-22

Abstract

The utility model discloses a load frame that is used for condenser epoxy to seal technology relates to the condenser and seals technical field. The loading frame for the capacitor epoxy encapsulation process comprises a base, an encapsulation assembly and a fixing mechanism, wherein two groups of supports are fixedly mounted at the top of the base, a turntable is rotatably mounted on each support, the encapsulation assembly comprises a loading mechanism and a moving mechanism, the loading mechanism is arranged between the two groups of supports, and the moving mechanism is arranged on the outer sides of the two groups of supports and is located right above the loading mechanism. This a load frame for condenser epoxy encapsulates technology, the loading mechanism of runner formula structural design assists the condenser and carries out epoxy encapsulation operation in succession, promotes the efficiency that epoxy encapsulates technology was handled, is convenient for carry out the drawing of patterns to the condenser after encapsulating, further promotes production machining efficiency, is convenient for pass in and out the material, simple structure, operation convenient to use is swift, does benefit to popularization and use.

Description

Loading frame for capacitor epoxy encapsulation process

Technical Field

The utility model relates to a condenser encapsulates technical field, in particular to a load frame that is used for condenser epoxy to encapsulate technology.

Background

The capacitor is usually encapsulated by epoxy resin during production, the existing partial capacitor epoxy encapsulating loading frame is inconvenient for continuous encapsulating operation, and the encapsulated capacitor is inconvenient for demoulding treatment, so that the encapsulating efficiency is influenced, the practicability is poor, and the popularization and the use are not facilitated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a load frame that is used for condenser epoxy to seal technology, can solve and seal the problem of inefficiency and drawing of patterns difficulty.

In order to achieve the above object, the utility model provides a following technical scheme: a loading frame for a capacitor epoxy encapsulation process comprises a base, an encapsulation assembly and a fixing mechanism;

two groups of brackets are fixedly arranged at the top of the base, and turntables are rotatably arranged on the brackets;

the encapsulating assembly comprises a loading mechanism and a movable mechanism, the loading mechanism is arranged between the two groups of supports, the movable mechanism is arranged on the outer sides of the two groups of supports and is positioned right above the loading mechanism, the loading mechanism comprises mounting plates, a loading table and encapsulating grooves, four groups of mounting plates are fixedly mounted on the outer walls of the two groups of turntables and are distributed in an annular array, the loading table is rotatably mounted between the two groups of mounting plates which are distributed in the front and back direction, and nine groups of encapsulating grooves are formed in the top of the loading table;

the fixing mechanism is arranged at the rear sides of the loading mechanism and the moving mechanism.

Preferably, the movable mechanism includes movable frame, guide bar, package closing cap and connecting rod, the top of base is provided with the movable frame, four groups of spacing holes have been seted up on the movable frame, the top fixed mounting of base has four groups of guide bars, the movable frame is established through four groups of spacing hole sleeves and is installed on four groups of guide bars, the top fixedly connected with stopper of guide bar, the inboard of movable frame is provided with nine groups of closing caps and is located nine groups of seal grooves directly over respectively, set up a set of mouth and two sets of perforation of pouring into on the connecting rod, fixed mounting has two sets of connecting rods on the outer wall of package closing cap, the one end of connecting rod and the inner wall fixed connection of movable frame.

Preferably, the fixed establishment includes extension board, inserted bar, connecting plate, reset spring and pull ring, and the top fixed mounting of base has the extension board, has seted up two sets of trepanning on the extension board, and a set of slot has all been seted up to the rear side of mounting panel and loading platform, and two sets of slots and two sets of trepanning are located same horizontal position, and the inserted bar is established to the trepanning endotheca, and the one end fixedly connected with connecting plate of two sets of inserted bars, and the inserted bar is located one section outer wall of extension board rear side and is established and install reset spring, reset spring's both ends respectively with extension board and connecting plate fixed connection, and the rear side fixed mounting of connecting plate has the pull ring.

Preferably, the two groups of the insertion rods can be respectively inserted into the mounting plate and the rear side slot of the loading platform.

Preferably, the top fixed mounting of movable frame has the handle, and the cover is established and is installed the rubber sleeve on the outer wall of handle, the lifting movable frame of being convenient for.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) this a load frame for condenser epoxy encapsulates technology uses through the cooperation of mounting panel, loading platform, encapsulation groove and encapsulation lid, and the loading mechanism auxiliary capacitor of runner formula structural design carries out epoxy encapsulation operation in succession, promotes the efficiency that epoxy encapsulates technology and handles, simple structure, and operation convenient to use is swift, does benefit to popularization and use.

(2) This a load frame for condenser epoxy encapsulates technology uses through the cooperation of movable frame, guide bar, encapsulation lid and connecting rod, is convenient for carry out the drawing of patterns to the condenser after the encapsulation, further promotes production machining efficiency, the business turn over material of being convenient for.

Drawings

The invention will be further described with reference to the following figures and examples:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the present invention;

fig. 3 is an enlarged view of the part a of the present invention.

Reference numerals: the device comprises a base 1, a bracket 2, a turntable 3, a loading mechanism 4, a mounting plate 401, a loading platform 402, an encapsulation groove 403, a movable mechanism 5, a movable frame 501, a guide rod 502, an encapsulation cover 503, a connecting rod 504, a fixed mechanism 6, a support plate 601, an insertion rod 602, a connecting plate 603, a return spring 604 and a pull ring 605.

Detailed Description

This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the terms greater than, less than, exceeding, etc. are understood to exclude the number, and the terms above, below, inside, etc. are understood to include the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

The first embodiment is as follows:

referring to fig. 1-3, the present invention provides a technical solution: a loading frame for a capacitor epoxy encapsulation process comprises a base 1, an encapsulation assembly and a fixing mechanism 6, wherein two groups of supports 2 are fixedly installed at the top of the base 1, a rotary disc 3 is rotatably installed on each support 2, the encapsulation assembly comprises a loading mechanism 4 and a moving mechanism 5, the loading mechanism 4 is arranged between the two groups of supports 2, the moving mechanism 5 is arranged on the outer side of each group of supports 2 and is positioned right above the loading mechanism 4, the loading mechanism 4 comprises a mounting plate 401, a loading table 402 and encapsulation grooves 403, four groups of mounting plates 401 are fixedly installed on the outer wall of each group of rotary discs 3 and are distributed in an annular array, the loading table 402 is rotatably installed between the two groups of mounting plates 401 which are distributed in the front and back, nine groups of encapsulation grooves are formed in the top of the loading table 402, the fixing mechanism 6 is arranged on the rear sides of the loading mechanism 4 and the moving mechanism 5, and the loading mechanism 4 designed in a rotary wheel type structure assists in continuous epoxy encapsulation operation of capacitors 403, the efficiency of epoxy encapsulation technology processing is promoted, simple structure, operation convenient to use is swift, promotes actual operating efficiency.

Further, the moving mechanism 5 includes a moving frame 501, guide rods 502, an encapsulating cover 503 and a connecting rod 504, the top of the base 1 is provided with the moving frame 501, four sets of limiting holes are formed in the moving frame 501, four sets of guide rods 502 are fixedly mounted at the top of the base 1, the moving frame 501 is mounted on the four sets of guide rods 502 through the four sets of limiting hole sleeves, a limiting block is fixedly connected to the top end of the guide rod 502, nine sets of encapsulating covers 503 are arranged on the inner side of the moving frame 501 and are respectively located right above the nine sets of encapsulating grooves 403, a set of injecting ports and two sets of through holes are formed in the connecting rod 504, two sets of connecting rods 504 are fixedly mounted on the outer wall of the encapsulating cover 503, one ends of the connecting rods 504 are fixedly connected with the inner wall of the moving frame 501, demolding is convenient for the encapsulated capacitor, the production and processing efficiency is further improved, and the time consumption is reduced.

Still further, the top fixed mounting of movable frame 501 has the handle, and the cover is established and is installed the rubber sleeve on the outer wall of handle.

Example two:

referring to fig. 1-3, on the basis of the first embodiment, the fixing mechanism 6 includes a supporting plate 601, an insertion rod 602, a connecting plate 603, a return spring 604 and a pull ring 605, the supporting plate 601 is fixedly mounted on the top of the base 1, two sets of holes are formed in the supporting plate 601, a set of slots are formed in the rear sides of the mounting plate 401 and the loading platform 402, the two sets of slots and the two sets of holes are located at the same horizontal position, the insertion rod 602 is mounted in the slots in a sleeved manner, one end of the two sets of insertion rods 602 is fixedly connected to the connecting plate 603, the return spring 604 is mounted on a section of outer wall of the insertion rod 602 located at the rear side of the supporting plate 601 in a sleeved manner, two ends of the return spring 604 are respectively fixedly connected to the supporting plate 601 and the connecting plate 603, and the pull ring 605 is fixedly mounted at the rear side of the connecting plate 603.

Further, two sets of insertion rods 602 are inserted into the mounting plate 401 and the rear slots of the loading platform 402, respectively.

The working principle is as follows: lifting the movable frame 501 through a handle, loading a capacitor to be encapsulated into an encapsulating groove 403 below the movable frame 501, then lowering the movable frame 501, ensuring that two groups of electrodes on the capacitor penetrate two groups of through holes on an encapsulating cover 503, forming an encapsulating cavity between the encapsulating groove 403 and the encapsulating cover 503, injecting epoxy resin into the encapsulating cavity through an injecting port on the encapsulating cover 503 by using external epoxy resin injecting equipment, encapsulating the capacitor by the epoxy resin, lifting the encapsulating cover 503 after the epoxy resin is cooled and formed, taking out the encapsulated capacitor from the encapsulating groove 403 by the encapsulating cover 503 to achieve a demolding effect, taking down the encapsulated capacitor, pulling the pull ring 605 to the rear side, separating two groups of insertion rods 602 from the slots on the rear sides of the mounting plate 401 and the loading platform 402, lifting the movable frame 501, rotating the mounting plate 401, and rotating the next loading platform 402 to the original place where the loading platform 402 stays, the pull ring 605 is released, the return spring 604 rebounds under the action of the stress thereon, the two groups of insertion rods 602 are inserted back into the mounting plate 401 and the rear side slot of the loading platform 402 again, and the above steps are repeated to start the next round of packaging operation.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims

1. A loading frame for a capacitor epoxy encapsulation process comprises a base (1), an encapsulation assembly and a fixing mechanism (6), and is characterized in that:

two groups of brackets (2) are fixedly arranged at the top of the base (1), and the brackets (2) are rotatably provided with turntables (3);

the encapsulating assembly comprises a loading mechanism (4) and a moving mechanism (5), the loading mechanism (4) is arranged between two groups of supports (2), the moving mechanism (5) is arranged on the outer sides of the two groups of supports (2) and is positioned right above the loading mechanism (4), the loading mechanism (4) comprises mounting plates (401), a loading table (402) and encapsulating grooves (403), four groups of mounting plates (401) are fixedly mounted on the outer walls of two groups of turntables (3) and are distributed in an annular array, the loading table (402) is rotatably mounted between the two groups of mounting plates (401) distributed in the front and back direction, and nine groups of encapsulating grooves (403) are formed in the top of the loading table (402);

the fixed mechanism (6) is arranged at the rear side of the loading mechanism (4) and the movable mechanism (5).

2. A carrier for use in a capacitor epoxy encapsulation process as recited in claim 1, wherein: the movable mechanism (5) comprises a movable frame (501), guide rods (502), an encapsulating cover (503) and connecting rods (504), the top of the base (1) is provided with the movable frame (501), four groups of limiting holes are formed in the movable frame (501), four groups of guide rods (502) are fixedly mounted at the top of the base (1), the movable frame (501) is arranged on the four groups of guide rods (502) through the four groups of limiting holes in a sleeved mode, limiting blocks are fixedly connected to the top ends of the guide rods (502), nine groups of encapsulating covers (503) are arranged on the inner side of the movable frame (501) and are respectively located right above the nine groups of encapsulating grooves (403), a group of injecting ports and two groups of through holes are formed in the connecting rods (504), two groups of connecting rods (504) are fixedly mounted on the outer wall of the encapsulating cover (503), and one end of each connecting rod (504) is fixedly connected with the inner wall of the movable frame (501).

3. A carrier for use in a capacitor epoxy encapsulation process as recited in claim 1, wherein: fixed establishment (6) include extension board (601), inserted bar (602), connecting plate (603), reset spring (604) and pull ring (605), the top fixed mounting of base (1) has extension board (601), two sets of trepanning have been seted up on extension board (601), a set of slot has all been seted up to the rear side of mounting panel (401) and loading platform (402), two sets of slots and two sets of trepanning are located same horizontal position, the cover is established and is installed inserted bar (602) to the trepanning endotheca, the one end fixedly connected with connecting plate (603) of two sets of inserted bar (602), the cover is established on one section outer wall that inserted bar (602) is located extension board (601) rear side and is installed reset spring (604), the both ends of reset spring (604) respectively with extension board (601) and connecting plate (603) fixed connection, the rear side fixed mounting of connecting plate (603) has pull ring (605).

4. A carrier for use in a capacitor epoxy encapsulation process as recited in claim 3, wherein: two groups of the insertion rods (602) can be respectively inserted into the mounting plate (401) and the rear side slot of the loading platform (402).

5. A carrier for use in a capacitor epoxy encapsulation process as recited in claim 2, wherein: the top fixed mounting of activity frame (501) has the handle, and the cover is established and is installed the rubber sleeve on the outer wall of handle.