CN217169532U - Injection mold of data line plastics overcoat - Google Patents
Injection mold of data line plastics overcoat Download PDFInfo
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- CN217169532U CN217169532U CN202220471049.5U CN202220471049U CN217169532U CN 217169532 U CN217169532 U CN 217169532U CN 202220471049 U CN202220471049 U CN 202220471049U CN 217169532 U CN217169532 U CN 217169532U
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Abstract
The utility model relates to the field of dies, and discloses an injection mold of a data line plastic jacket, which comprises an upper die and a lower die, wherein the upper die comprises an upper template and an upper module, and the lower die comprises a lower template and a lower module; the upper module is arranged on the upper template, the upper template is provided with an upper die groove, the upper module is provided with an upper wire groove, the upper wire groove is communicated with the upper die groove, the lower template is provided with a lower die groove, the lower module is provided with a lower wire groove, and the lower wire groove is communicated with the lower die groove; the lower module is arranged on the lower template, an upper connecting groove is formed in the position, close to the upper wire groove, of the upper template, an upper connecting convex part is formed in the position, close to the upper wire groove, of the upper module, and the upper connecting convex part is matched with the upper connecting groove; the end face of the lower module protrudes out of the end face of the lower template, a lower connecting groove is formed in the position, close to the lower chute, of the lower template, a lower connecting convex portion is formed in the position, close to the lower chute, of the lower module, and the lower connecting convex portion is matched with the lower connecting groove. The utility model discloses can press when solving the compound die and hinder the heart yearn problem.
Description
Technical Field
The utility model relates to a mould field especially relates to an injection mold of data line plastics overcoat.
Background
The data line is used for connecting the mobile equipment and the computer to achieve the purpose of data transmission or communication. As shown in fig. 1, the data line 10 generally includes a core 110, a port 120, and a plastic jacket 130. The production process of the data cable 10 generally includes welding the terminal end of the core wire 110 to the terminal of the interface 120 to obtain a semi-finished data cable, and then placing the semi-finished data cable in an injection mold to form the plastic outer sheath 130 at the joint of the core wire 110 and the interface 120 through an injection molding process. The plastic outer sleeve is used for coating the joint of the protection core wire and the interface, so that the core wire and the interface are prevented from falling off or being damaged due to winding and pulling in the transfer process of the data wire, and the product quality of the data wire is ensured.
The wire casing of the injection mold of the existing plastic outer sleeve is a parallel wire casing, when a data line semi-finished product is placed into a mold cavity, a core wire can exceed the plane of the mold cavity, the core wire can be crushed when the upper mold and the lower mold are closed, and the joint of the core wire and an interface is damaged.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing an injection mold of data line plastics overcoat, weigh the heart yearn problem when can solving the compound die to avoid the heart yearn impaired with the junction of interface.
The purpose of the utility model is realized through the following technical scheme:
an injection mold of a data line plastic jacket comprises an upper mold and a lower mold, wherein the upper mold comprises an upper template and an upper module, and the lower mold comprises a lower template and a lower module; the upper module is arranged on the upper template, an upper die cavity is formed in the upper template, an upper wire groove is formed in the upper module, the upper wire groove is communicated with the upper die cavity, the lower module is arranged on the lower template, a lower die cavity is formed in the lower template, a lower wire groove is formed in the lower module, and the lower wire groove is communicated with the lower die groove; an upper connecting groove is formed in the position, close to the upper wire groove, of the upper template, an upper connecting convex part is formed in the position, close to the upper wire groove, of the upper module, and the upper connecting convex part is matched with the upper connecting groove; the terminal surface protrusion of lower module in the terminal surface of lower bolster, the lower bolster is close to the position department of lower chute has seted up lower concave groove, the lower module is close to lower convex part has seted up lower concave groove position department, lower convex part with lower concave groove cooperatees.
In one embodiment, the upper mold plate is coupled to the lower mold plate, and the upper mold block is coupled to the lower mold block.
In one embodiment, when the upper mold and the lower mold are closed, the upper mold cavity and the lower mold cavity are connected to form an interface mold cavity, and the upper wire groove and the lower wire groove are connected to form a core wire mold cavity.
In one embodiment, the upper die plate is provided with an upper die boss, an upper die groove is formed in one side of the upper die boss of the upper die plate, and the upper die block is located in the upper die groove; the lower die plate is provided with a lower die boss, a lower die groove is formed in one side of the lower die boss of the lower die plate, and the lower die block is located in the lower die groove.
In one embodiment, the end surface of the upper module protrudes from the end surface of the upper die boss, and the end surface of the lower module protrudes from the end surface of the lower die boss.
In one embodiment, the upper mold plate has an upper clearance groove formed on the other side of the upper mold boss, and the lower mold plate has a lower clearance groove formed on the other side of the lower mold boss.
In one embodiment, the upper wire slot is located at the middle position of the upper module, and the lower wire slot is located at the middle position of the lower module.
In one embodiment, the bottom surface of the upper module extends downward to form a lower protrusion, and the upper line groove is formed at the bottom end of the lower protrusion.
In one embodiment, the lower protrusion is located at a middle position of the upper module.
In one embodiment, the upper convex portion and the lower convex portion are both trapezoidal structures.
Compared with the prior art, the utility model discloses at least, following advantage has:
when this injection mold uses, arrange the semi-manufactured goods of data line in injection mold, make the interface of the semi-manufactured goods of data line arrange the interface die cavity in, the core wire die cavity is arranged in to the core wire of the semi-manufactured goods of data line, the terminal surface protrusion of lower module in the terminal surface of lower bolster, the complete holding of core wire is in the core wire die cavity, connect the junction of convex part protection core wire and interface down through last module on and the lower convex part protection core wire of lower module, can not press the core wire completely during the compound die, crush the core wire problem during can solving the compound die, thereby avoid the junction of core wire and interface impaired.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a data line.
Fig. 2 is a combination view of an injection mold for a plastic sheath of a data line according to an embodiment of the present invention.
Fig. 3 is an exploded view of an injection mold of a plastic sheath for a data line according to an embodiment of the present invention.
Fig. 4 is a structural view of an upper die of an injection mold for a plastic sheath of a data line according to an embodiment of the present invention.
Fig. 5 is a structural view of a lower mold of an injection mold for a plastic cover of a data line according to an embodiment of the present invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are illustrated in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Referring to fig. 1 to 5, an injection mold 20 for a plastic sheath of a data line includes an upper mold 210 and a lower mold 220; the upper mold 210 comprises an upper mold plate 211 and an upper mold block 212, the upper mold block 212 is arranged on the upper mold plate 211, the upper mold plate 211 is provided with an upper mold groove 2111, the upper mold block 212 is provided with an upper mold groove 2121, the upper mold groove 2121 is communicated with the upper mold groove 2111, an upper connecting groove 2112 is arranged at the position of the upper mold plate 211 close to the upper mold groove 2121, an upper connecting convex part 2122 is arranged at the position of the upper mold block 212 close to the upper mold groove 2111, and the upper connecting convex part 2122 is matched with the upper connecting groove 2112; the lower die 220 comprises a lower template 221 and a lower module 222, the lower module 222 is arranged on the lower template 221, a lower die slot 2211 is arranged on the lower template 221, a lower wire slot 2221 is arranged on the lower module 222, the lower wire slot 2221 is communicated with the lower die slot 2211, the end face of the lower module 222 protrudes out of the end face of the lower template 221, the lower template 221 is close to the position of the lower wire slot 2221, a lower convex portion 2222 is arranged at the position of the lower die slot 2211, and the lower convex portion 2222 is matched with the lower concave portion 2212. The upper template 211 is matched with the lower template 221, and the upper module 212 is matched with the lower module 222; when the upper die and the lower die are closed, the upper die slot 2111 and the lower die slot 2211 are connected to form an interface die cavity, and the upper wire slot 2121 and the lower wire slot 2221 are connected to form a core wire die cavity. Thus, when the injection mold 20 is used, the semi-finished data line is placed in the injection mold 20, the interface 120 of the semi-finished data line is placed in the interface cavity, the core wire 110 of the semi-finished data line is placed in the core wire cavity, the end surface of the lower module 222 protrudes out of the end surface of the lower template 221, the core wire is completely contained in the core wire cavity, the joint of the core wire and the interface is protected through the upper convex part 2122 of the upper module 212 and the lower convex part 2222 of the lower module 222, the core wire cannot be completely pressed during mold closing, the problem that the core wire is damaged by pressing during mold closing can be solved, and therefore the joint of the core wire and the interface is prevented from being damaged.
Further, the upper die plate 211 is provided with an upper die boss 2113, an upper die groove 2114 is formed in one side of the upper die plate 211 on the upper die boss 2113, and the upper die block 212 is located in the upper die groove 2114; the lower template 221 is provided with a lower mold boss 2213, a lower mold groove 2214 is formed in one side of the lower mold boss 2213 of the lower template 221, and the lower module 222 is located in the lower mold groove 2214. Further, the end surface of the upper mold block 212 protrudes beyond the end surface of the upper mold boss 2113, and the end surface of the lower mold block 222 protrudes beyond the end surface of the lower mold boss 2213. Further, the upper convex portion 2122 and the lower convex portion 2222 are each of a trapezoidal structure.
Further, the upper mold plate 211 has an upper clearance slot 2115 formed on the other side of the upper mold boss 2113, and the lower mold plate 221 has a lower clearance slot 2215 formed on the other side of the lower mold boss 2213. In this way, the upper clearance groove 2115 and the lower clearance groove 2215 prevent the interface from being exposed to the interface cavity portion when the injection mold 20 is closed.
Further, the upper slot 2121 is located at the middle position of the upper module 212, and the lower slot 2221 is located at the middle position of the lower module 222, so that the upper slot 2121 and the lower slot 2221 are reasonably distributed.
Further, the bottom surface of the upper module 212 extends downward to form a lower boss 2123, the lower boss 2123 is located at a middle position of the upper module 212, and the upper line groove 2121 is formed at a bottom end of the lower boss 2123. Therefore, the core wire is accommodated and protected by the upper wire groove 2121 which forms the bulge, and the core wire is prevented from being crushed during die assembly.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An injection mold of a data line plastic jacket comprises an upper mold and a lower mold, wherein the upper mold comprises an upper template and an upper module, and the lower mold comprises a lower template and a lower module; the upper module is arranged on the upper template, the upper template is provided with an upper die groove, the upper module is provided with an upper wire groove, the upper wire groove is communicated with the upper die groove, the lower module is arranged on the lower template, the lower die groove is arranged on the lower template, the lower module is provided with a lower wire groove, and the lower wire groove is communicated with the lower die groove; the upper mold is characterized in that an upper connecting groove is formed in the position, close to the upper wire groove, of the upper mold plate, an upper connecting convex part is formed in the position, close to the upper wire groove, of the upper mold block, and the upper connecting convex part is matched with the upper connecting groove; the terminal surface protrusion of lower module in the terminal surface of lower bolster, the lower bolster is close to the position department of lower chute has seted up lower concave groove, the lower module is close to lower convex part has seted up lower concave groove position department, lower convex part with lower concave groove cooperatees.
2. The injection mold for the plastic jacket of a data line according to claim 1, wherein the upper mold plate is matched with the lower mold plate, and the upper mold block is matched with the lower mold block.
3. The injection mold for the plastic casing of the data line according to claim 1, wherein when the upper mold and the lower mold are closed, the upper mold cavity and the lower mold cavity are connected to form an interface mold cavity, and the upper mold cavity and the lower mold cavity are connected to form a core wire mold cavity.
4. The injection mold for the plastic outer sleeve of the data line according to claim 1, wherein the upper mold plate is provided with an upper mold boss, an upper mold groove is formed in one side of the upper mold plate on the upper mold boss, and the upper mold block is positioned in the upper mold groove; the lower die plate is provided with a lower die boss, a lower die groove is formed in one side of the lower die boss of the lower die plate, and the lower die block is located in the lower die groove.
5. The injection mold for the plastic casing of the data line as claimed in claim 4, wherein the end surface of the upper mold block protrudes from the end surface of the upper mold boss, and the end surface of the lower mold block protrudes from the end surface of the lower mold boss.
6. The injection mold of the data line plastic sheath of claim 4, wherein the upper mold plate is provided with an upper clearance groove on the other side of the upper mold boss, and the lower mold plate is provided with a lower clearance groove on the other side of the lower mold boss.
7. The injection mold for a plastic cover of a data line of claim 1, wherein the upper wire groove is located at a middle position of the upper module and the lower wire groove is located at a middle position of the lower module.
8. The injection mold for the plastic housing of the data line as claimed in claim 1, wherein the bottom surface of the upper module extends downward to form a lower protrusion, and the upper line groove is formed at the bottom end of the lower protrusion.
9. The injection mold for a plastic cover of a data line of claim 8, wherein the lower protrusion is located at a middle position of the upper module.
10. The injection mold for plastic casings of data wires according to claim 1, wherein the upper and lower connection protrusions are each a trapezoidal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220471049.5U CN217169532U (en) | 2022-03-03 | 2022-03-03 | Injection mold of data line plastics overcoat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220471049.5U CN217169532U (en) | 2022-03-03 | 2022-03-03 | Injection mold of data line plastics overcoat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217169532U true CN217169532U (en) | 2022-08-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220471049.5U Active CN217169532U (en) | 2022-03-03 | 2022-03-03 | Injection mold of data line plastics overcoat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217169532U (en) |
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2022
- 2022-03-03 CN CN202220471049.5U patent/CN217169532U/en active Active
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