CN217157556U

CN217157556U - Display module and electronic equipment

Info

Publication number: CN217157556U
Application number: CN202220269128.8U
Authority: CN
Inventors: 贺建文
Original assignee: Zhejiang Lianxinkang Technology Co ltd
Current assignee: Zhejiang Lianxinkang Technology Co ltd
Priority date: 2022-02-09
Filing date: 2022-02-09
Publication date: 2022-08-09
Anticipated expiration: 2032-02-09

Abstract

The utility model provides a display module assembly and electronic equipment, this display module assembly include the frame and locate the PCB board of frame one side, be equipped with drive IC on the PCB board, the last shielding subassembly that is equipped with of drive IC, the insulating cement on locating drive IC of shielding subassembly, the conducting layer of drive IC one side is kept away from including locating the insulating cement still to the shielding subassembly, the conducting layer lid closes drive IC, the conducting layer still include with frame connection's ground connection portion, be equipped with the copper exposure district on the PCB board, the conducting layer forms the route through copper exposure district and PCB board. The utility model provides a display module assembly through using the fixed conducting layer of insulating cement, has replaced the fixed shield cover of needs through SMT among the prior art, has reduced manufacturing cost, and the conducting layer still includes the ground connection portion with frame connection simultaneously, and the conducting layer passes through dew copper district and PCB board formation route, carries out ground connection through the frame with conducting layer and PCB board and metal material, avoids the ESD influence, prevents that static from causing the damage to components and parts.

Description

Display module and electronic equipment

Technical Field

The utility model relates to a display module assembly technical field, in particular to display module assembly and electronic equipment.

Background

The display module comprises a PCB and a drive IC arranged on the PCB, and because the accommodating space of the electronic equipment is limited, the drive IC is interfered when other components transmit signals, a shielding case is usually arranged on the drive IC and is a shell made of metal.

In the prior art, the shielding case needs to be installed by adopting SMT (surface mount technology), the production cost is high, and meanwhile, the shielding case is adopted to cover the drive IC, so that the later-stage maintenance of the product is not facilitated.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model aims at providing a display module assembly and electronic equipment aims at solving and adopts the shield cover to cover drive IC among the prior art and closes, need carry out SMT technology installation, the higher technical problem of its manufacturing cost.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a display module assembly, includes the frame and locates the PCB board of frame one side, be equipped with driver IC on the PCB board, the last shielding subassembly that is equipped with of driver IC, shielding subassembly is including locating insulating cement on the driver IC, shielding subassembly is still including locating the insulating cement is kept away from the conducting layer of driver IC one side, the conducting layer lid closes driver IC, the conducting layer still include with frame connection's ground connection portion, be equipped with the dew copper district on the PCB board, the conducting layer pass through dew copper district with the PCB board forms the route.

Compared with the prior art, the beneficial effects of the utility model reside in that: the display module in the utility model is characterized in that the drive IC is covered by the conductive layer which is arranged on the insulating glue and is arranged on one side of the insulating glue, to shield the transmission signals of other components and parts to protect the driving IC and ensure the normal operation of the driving IC, the shielding component in the utility model, the conducting layer fixed by the insulating glue replaces the shielding cover fixed by SMT in the prior art, reduces the production cost and is convenient for later equipment maintenance, meanwhile, the conductive layer also comprises a grounding part connected with the frame, a copper exposing area is arranged on the PCB, the conductive layer forms a passage with the PCB through the copper exposing area, the PCB carries out ground protection through the conducting layer and the frame, and simultaneously, the conducting layer, the PCB and the frame made of metal materials are grounded, so that the influence of ESD (electrostatic discharge) is avoided, and the damage of static electricity to components is prevented.

According to one aspect of the above technical scheme, a display screen is arranged on the inner side of the frame, and the PCB is arranged on the back of the display screen.

According to one aspect of the above technical scheme, a conductive double-sided adhesive tape is arranged on the back of the display screen, and the PCB is fixed on the display screen through the conductive double-sided adhesive tape.

According to one aspect of the above technical scheme, one side of the display screen close to the PCB is provided with a socket.

According to an aspect of the above technical scheme, one side of the frame is provided with shading glue, and the shading glue is arranged close to the display screen.

According to one aspect of the above technical solution, the conductive layer is a conductive cloth.

According to one aspect of the above technical solution, the conductive layer is a conductive copper foil.

The utility model discloses an on the other hand still provides an electronic equipment, including the display module assembly among the above-mentioned technical scheme.

Drawings

Fig. 1 is a schematic structural view of a display module according to a first embodiment of the present invention;

FIG. 2 is an enlarged view of portion A of FIG. 1;

description of the main element symbols:

frame structure	10	Display screen	20
				Shading glue	11	Conductive layer	30
Insulating glue	40	Interface	50
				PCB board	60	Copper exposed area	61

The following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 2, a display module according to a first embodiment of the present invention is shown, including a frame 10 and a PCB 60 disposed on one side of the frame 10, the PCB 60 is provided with a driver IC (not shown), the driver IC is provided with a shielding assembly, the shielding assembly includes an insulating adhesive 40 disposed on the driver IC, the shielding assembly further includes a conductive layer 30 disposed on one side of the insulating adhesive 40 away from the driver IC, the conductive layer 30 covers the driver IC, the conductive layer 30 further includes a grounding portion connected to the frame 10, the PCB 60 is provided with a copper exposing area 61, and the conductive layer 30 forms a passage with the PCB 60 through the copper exposing area 61. Specifically, in the present embodiment, the copper exposed regions 61 are provided on both sides of the PCB 60, the frame 10 is made of iron, the conductive layer 30 is connected to the copper exposed regions 61 of the PCB 60 to form a via, and the PCB 60 is grounded through a grounding portion on one side of the conductive layer 30.

Specifically, in the display module of this embodiment, by disposing the insulating adhesive 40 on the driver IC, and disposing the conductive layer 30 on one side of the insulating adhesive 40, the conductive layer 30 covers the driver IC to shield the transmission signal of other components, so as to protect the driver IC and ensure the normal operation of the driver IC, the shielding assembly of the present invention replaces the shielding cover fixed by SMT in the prior art with the conductive layer 30 fixed by the insulating adhesive 40, so as to reduce the production cost and facilitate the later equipment maintenance, and at the same time, the conductive layer 30 further includes a grounding portion connected to the frame 10, the PCB 60 is disposed with a copper exposing area 61, the conductive layer 30 forms a passage with the PCB 60 through the copper exposing area 61, that is, the PCB 60 performs the ground protection with the frame 10 through the conductive layer 30, and the PCB 60 is grounded with the frame 10 made of metal material, reduce ESD (electrostatic discharge) influence and prevent the static from damaging components.

Further, in this embodiment, a display screen 20 is disposed in the frame 10, a conductive double-sided tape is disposed on a back surface of the display screen 20, the PCB board 60 is fixedly disposed on the back surface of the display screen 20 through the conductive double-sided tape, a socket 50 is disposed on a side of the display screen 20 close to the PCB board 60, and the socket 50 is used for connecting the main board with the display screen 20 and outputting a signal.

In this embodiment, in order to prevent the light emitted by the display module from leaking from the frame 10, a light shielding glue 11 is disposed on one side of the frame 10, and the light shielding glue 11 is disposed near the display screen 20, so as to prevent the light source in the display module from leaking from the edge of the frame 10 and causing light leakage.

In addition, the conductive layer 30 in the present embodiment is a conductive copper foil, which is exemplified and not limited, and it can be understood that, in other embodiments of the present invention, the conductive layer 30 can also be a material having conductive performance, such as a conductive cloth.

To sum up, in the display module according to the above-mentioned embodiment of the present invention, the insulating glue 40 is disposed on the driver IC, and the conductive layer 30 is disposed on one side of the insulating glue 40, the conductive layer 30 covers the driver IC to shield the transmission signal of other components, so as to protect the driver IC and ensure the normal operation of the driver IC, the shielding assembly of the present invention replaces the shielding cover fixed by SMT in the prior art with the conductive layer 30 fixed by the insulating glue 40, thereby reducing the production cost and facilitating the later equipment maintenance, and meanwhile, the conductive layer 30 further includes a grounding portion connected to the frame 10, the PCB 60 is provided with the copper exposing portion 61, the conductive layer 30 forms a passage with the PCB 60 through the copper exposing portion 61, i.e. the PCB 60 performs ground protection with the frame 10 through the conductive layer 30, and the PCB 60 is grounded with the frame 10 made of metal material, the influence of ESD (electrostatic discharge) is avoided, the damage of static electricity to components is prevented, and the light leakage phenomenon of the display module is prevented by arranging the shading glue 11 on one side of the frame 10.

The second embodiment of the utility model also provides an electronic equipment, including the display module assembly in the above-mentioned embodiment, particularly, above-mentioned electronic equipment can be cell-phone, flat board etc..

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The display module is characterized by comprising a frame and a PCB arranged on one side of the frame, wherein a drive IC is arranged on the PCB, a shielding assembly is arranged on the drive IC and comprises an insulating adhesive arranged on the drive IC, the shielding assembly further comprises a conducting layer arranged on one side, away from the drive IC, of the insulating adhesive, the conducting layer covers the drive IC, the conducting layer comprises a grounding part connected with the frame, a copper exposing area is arranged on the PCB, and the conducting layer forms a passage with the PCB through the copper exposing area.

2. The display module assembly of claim 1, wherein a display screen is disposed inside the frame, and the PCB is disposed on a back surface of the display screen.

3. The display module assembly of claim 2, wherein a conductive double-sided tape is disposed on a back surface of the display screen, and the PCB is fixed to the display screen through the conductive double-sided tape.

4. The display module assembly of claim 2, wherein a socket is disposed on a side of the display screen adjacent to the PCB.

5. The display module assembly of claim 2, wherein a side of the frame is provided with a light blocking glue, and the light blocking glue is disposed adjacent to the display screen.

6. The display module according to any one of claims 1 to 5, wherein the conductive layer is a conductive cloth.

7. The display module of any one of claims 1-5, wherein the conductive layer is a conductive copper foil.

8. An electronic device comprising the display module according to any one of claims 1 to 7.