CN217142632U - Reflow soldering machine heating device - Google Patents
Reflow soldering machine heating device Download PDFInfo
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- CN217142632U CN217142632U CN202123453954.2U CN202123453954U CN217142632U CN 217142632 U CN217142632 U CN 217142632U CN 202123453954 U CN202123453954 U CN 202123453954U CN 217142632 U CN217142632 U CN 217142632U
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Abstract
The utility model relates to the technical field of reflow soldering machines, in particular to a heating device of a reflow soldering machine, which comprises a hot welding chamber and a feeding component; the feed assembly is outside the thermowelding chamber; the hot welding chamber is provided with an openable heat-insulating door, a material conveying net chain is arranged between the heat-insulating doors, and the feeding assembly is butted with the material conveying net chain; the heating assembly comprises a heat insulation sheet, a heating sheet and a heat homogenizing sheet; infrared heating modules are uniformly attached to the heating sheets. The beneficial effects of the utility model reside in that: the utility model provides an among the reflow soldering machine heating device, adiabatic piece makes heating element realize the single face and conducts heat, makes the heat flow to the PCB board more intensively, even hot piece avoids the direct concentrated heating PCB board of energy, makes heating element's more even event of conducting heat reflow soldering machine heating device heating quick even, little with the temperature difference in temperature district, anti-oxidation effect is good.
Description
Technical Field
The utility model relates to a reflow soldering machine technical field, concretely relates to reflow soldering machine heating device.
Background
A currently well known mechanical soldering method for soldering electronic components on a circuit board is a reflow soldering method. The specific flow of the reflow soldering process is as follows: laminate electronic component on the PCB board, there is the soldering paste between electronic component and the PCB board, reflow soldering machine's feeding subassembly butt joint hot welding indoor defeated material net chain, the PCB board passes through the transportation of feeding subassembly, reach defeated material net chain, defeated material net chain drives the PCB board and removes in the hot welding cavity, both sides are equipped with a plurality of heating element respectively and heat the PCB board about defeated material net chain, a plurality of heating element heating temperature are different, make the hot welding cavity form a plurality of warm areas, the purpose makes the temperature variation in the hot welding cavity accord with the required preheating of soldering paste welding, keep warm and the temperature curve of refluence, and then make welding quality improve.
Currently, patent literature with publication number CN 201900352U mentions: in order to solve the problem of low heating efficiency of the PCB in the hot welding chamber, a plurality of fans are additionally arranged in the hot welding chamber to blast airflow to accelerate heat transfer between the heating assembly and the PCB.
However, the structure of the above solution has the following disadvantages: on one hand, the volume of the thermal welding chamber is large, heat cannot be conducted towards the PCB in a one-way mode, the heat is diffused to all parts in the thermal welding chamber, and the thermal efficiency is low; the heat in the hot welding cavity escapes due to the fact that the air flow blown by the fan is not sealed in the hot welding cavity, and the heat preservation effect is poor; on the other hand, the heating assembly in the prior art is generally difficult to uniformly heat, the temperature on the same heating assembly is different, and structures such as a uniform heating device are not arranged, so that the temperature difference of the same temperature zone in a hot welding chamber is larger.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the heating device of the reflow soldering machine has the advantages of rapid and uniform heating, small temperature difference in the same temperature region and oxidation resistance.
In order to solve the technical problem, the utility model discloses a technical scheme be: a heating device of a reflow soldering machine comprises a hot welding chamber and a heating assembly;
the hot welding chamber has two openable and closable heat-insulating doors;
the heating assembly is arranged in the hot welding chamber and comprises a plurality of heating plate groups, and the heating plate groups comprise a first heating plate group and a second heating plate group which are symmetrically arranged above the material conveying net chain and below the material conveying net chain;
the first heating plate group and the second heating plate group have the same structure, and the first heating plate group comprises a heat insulation sheet, a heating sheet and a uniform heating sheet; the heating plate is arranged between the heat insulating plate and the uniform heating plate, the surface of the heating plate facing the material conveying net chain is uniformly attached with infrared heating modules, and the heat insulating plate is arranged on one side of the heating plate far away from the material conveying net chain.
Furthermore, a plurality of heat insulation plates are vertically and uniformly arranged in the heat welding chamber to separate the heating assembly into a plurality of temperature zones, at least more than one group of heating plate groups are arranged between adjacent heat insulation plates, and the heat insulation plates are provided with through holes for the material conveying net chain to pass through.
Furthermore, a plurality of fans are arranged in the hot welding cavity, and a plurality of vertical through holes are formed in the heating plate groups of the second heating plate group; the fan is arranged below the second heating plate group.
Furthermore, the heat insulation sheet and the heating sheet are made of mica, the heat homogenizing sheet is made of a transparent material, and the surface of the heat homogenizing sheet facing the heating sheet is an arc convex surface.
Further, the heating assembly also comprises a bolt assembly, and a bolt of the bolt assembly penetrates through the heat insulation sheet, the heating sheet and the edge of the even heat sheet; the heat insulation sheet, the heating sheet and the uniform heat sheet are detachably connected through a bolt assembly.
Further, the heating device of the reflow soldering machine also comprises an air charging and discharging pipe; and the air charging and discharging pipe is connected to the outer surface of the hot welding cavity, communicated with the inner space of the hot welding cavity and used for pumping air and charging inert gas into the hot welding cavity.
The beneficial effects of the utility model reside in that: the utility model provides an among the reflow soldering machine heating device, adiabatic piece makes heating element realize the single face and conducts heat, makes the heat flow to the PCB board more intensively, even hot piece avoids the direct concentrated heating PCB board of energy, makes heating element's heat transfer more even, even attached infrared heating module and planiform heating element on the heating piece make the PCB board of every position on the defeated material net chain be heated the same. The heat insulation sheet also reduces the volume of a heat diffusion space, improves the heat efficiency, is used together with the heat insulation door to seal the hot welding chamber, and ensures that the heat insulation effect of the hot welding chamber is excellent; the heat insulation door prevents the welding of the PCB from being oxidized. Therefore, the heating device of the reflow soldering machine has the advantages of rapid and uniform heating, small temperature difference in the same temperature region and excellent anti-oxidation effect.
Drawings
Fig. 1 is a schematic view of the overall structure of a heating device of a reflow soldering machine according to an embodiment of the present invention;
FIG. 2 is a schematic view of a partial structure of a heating device of a reflow soldering machine according to an embodiment of the present invention;
fig. 3 is a schematic partial structural view of a heating device of a reflow soldering machine according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a heating assembly of a heating device of a reflow soldering machine according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a heating plate of a heating device of a reflow soldering machine according to an embodiment of the present invention;
description of reference numerals:
1. a hot weld chamber;
11. an insulated door; 12. a material conveying net chain; 13. a heating assembly; 131. a heat insulating sheet;
132. a heating plate; 1321. an infrared heating module;
133. heat homogenizing sheets; 134. a through hole;
14. a heat insulation plate;
2. a feeding assembly.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1-4, a heating device of a reflow soldering machine includes a thermal soldering chamber 1 and a heating assembly 13;
the hot welding chamber 1 has two openable and closable heat-insulating doors 11; the heating assembly 13 is arranged in the hot welding chamber 1 and comprises a heat insulation sheet 131, a heating sheet 132 and a heat homogenizing sheet 133; the heating sheet 132 is arranged between the heat insulating sheet 131 and the heat homogenizing sheet 133, the infrared heating modules 1321 are uniformly attached to the heating sheet 132, and the heat insulating sheet 131 is arranged on one side of the heating sheet 132 far away from the material conveying net chain 12.
The beneficial effects of the utility model reside in that: the utility model provides an among the reflow soldering machine heating device, adiabatic piece 131 makes heating element 13 realize the single face and conducts heat, makes the heat flow to the PCB board more intensively, even hot piece 133 avoids the direct concentrated heating PCB board of energy, makes heating element 13's heat transfer more even, even attached infrared heating module 1321 and planiform heating element 13 on the heating piece 132 make the PCB board of every position on the defeated material net chain 12 be heated the same. The thermal insulation sheet 131 also reduces the volume of a heat diffusion space, improves thermal efficiency, seals the hot welding chamber 1 when used together with the thermal insulation door 11, and provides excellent heat insulation effect of the hot welding chamber 1; the heat insulating door 11 prevents soldering of the PCB board from being oxidized. Therefore, the heating device of the reflow soldering machine has the advantages of rapid and uniform heating, small temperature difference in the same temperature region and excellent anti-oxidation effect.
Referring to fig. 2-5 of the drawings,
furthermore, two heating components 13 are arranged, namely a first heating plate group arranged above the material conveying net chain 12 and a second heating plate group arranged below the material conveying net chain;
a plurality of vertical through holes 134 are provided in the second heating plate group.
As can be seen from the above description, the through holes 134 serve as channels for air to pass through, which facilitates designing a fan and other structures to make the heating assembly 13 heat the PCB more uniformly and at a faster heating rate.
Furthermore, a plurality of heat insulation plates 14 are vertically and uniformly arranged in the hot welding chamber 1, the hot welding chamber 1 is divided into a plurality of temperature zones, and the material conveying net chain 12 penetrates through the heat insulation plates 14.
As can be seen from the above description, the above arrangement provides a simple and efficient structure for avoiding heat conduction between temperature zones.
Further, the heat insulating sheet 131 and the heating sheet 132 are made of mica, the heat spreader 133 is made of a transparent material, and the surface of the heat spreader facing the heating sheet is an arc-shaped convex surface.
As can be seen from the above description, the mica is a simple and efficient heat insulation material; the even heating sheet 133 made of glass uniformly refracts and scatters the energy emitted by the heating sheet 132, so that the uneven heating of the PCB is avoided.
Further, the heating assembly 13 further comprises a bolt assembly, wherein a bolt of the bolt assembly penetrates through the edges of the heat insulation sheet 131, the heating sheet 132 and the even heat sheet 133; the heat insulating sheet 131, the heating sheet 132 and the heat uniforming sheet 133 are detachably connected by a bolt assembly.
As can be seen from the above description, the above arrangement provides a simple and efficient detachable attachment structure for the heating assembly 13.
Further, a fan is further arranged in the hot welding chamber 1, and the fan is arranged below the second heating plate group.
As can be seen from the above description, the passage of the air flow blown by the fan through the second heating plate group causes the hot air to exchange heat with the PCB board.
Further, the heating device of the reflow soldering machine also comprises an air charging and discharging pipe; the gas charging and discharging pipe is connected to the outer surface of the hot welding chamber 1, communicated with the inner space of the hot welding chamber 1, and used for pumping gas and charging inert gas into the hot welding chamber 1.
From the foregoing description, it can be seen that the above arrangement provides a simple and efficient means for preventing weld oxidation and venting.
Example one
The utility model provides a reflow soldering machine heating device's application scene does: the electronic element needs to be welded on the PCB, and the PCB is coated with soldering paste to be attached to the electronic element.
Referring to fig. 1-5, a heating device of a reflow soldering machine includes a thermal welding chamber 1 and a feeding assembly 2; said feeding assembly 2 is external to the thermowelding chamber 1;
the hot welding chamber 1 is provided with a fan, a material conveying net chain 12, a heating component 13, a heat insulation door 11, a heat insulation plate 14 and an air charging and discharging pipe.
The material conveying net chain 12 comprises a net chain, a roll shaft and a gear disc, the gear disc is arranged on the circumference of the roll shaft, the net chain is meshed with the gear disc, and power is input from the roll shaft.
The heat insulation plates 14 are vertically and uniformly arranged to divide the hot welding chamber 1 into a plurality of temperature zones; the material conveying net chains 12 are horizontally arranged and penetrate through the heat insulation plates 14 one by one; both ends of the feed net chain 12 are respectively faced to an openable and closable heat-insulating door 11. The feeding net chain 12 is driven by a roll shaft.
The heat-insulating door 11 is flat and vertically arranged, and the openable and closable movement structure thereof may be: embedded in the side wall of the hot welding chamber 1 and driven by a cylinder assembly in the side wall. The cylinder assembly may be electrically connected to a sensor, and the sensor acquires information that the PCB is about to enter or leave, so that the heat-insulating door 11 may be automatically opened and closed.
In each temperature zone, a first heating plate group is arranged above the material conveying net chain 12, a second heating plate group is arranged below the material conveying net chain 12, and the number of the first heating plate group and the second heating plate group can be multiple, and is specifically determined according to the size of the heating component 13 and the size of the temperature zone space.
And a fan is arranged below the second heating plate group, and the blowing direction of the fan faces to the material conveying network chain 12.
The heating component 13 comprises a mica-material heat insulation sheet 131, a heating sheet 132 and a glass-material uniform heating sheet 133, the uniform heating sheet 133 is close to and faces the material conveying net chain 12, and the heating sheet 132 is arranged between the uniform heating sheet 133 and the heat insulation sheet 131; the heating sheet 132 has an infrared heating module 1321 attached uniformly to one surface. The infrared heating module 1321 includes an infrared lamp tube made of electrically connected heating resistance wires, an infrared lamp and quartz material.
The second heating plate group differs from the first heating plate group in that: the second heating plate group is provided with a plurality of through holes 134 for serving as channels for air flow blown by the fan.
The gas charging and discharging pipe is connected to the outer surface of the hot welding chamber 1, communicated with the inner space of the hot welding chamber 1, and used for pumping gas and charging inert gas into the hot welding chamber 1.
The infrared heating module 1321 is electrically connected with a heating circuit, each temperature zone is provided with a set of heating circuit, the heating circuits can be electrically connected with a time sequence control circuit, the time sequence control circuit can convert video signals into electric signals, a worker can edit a temperature characteristic curve on a controller of the reflow soldering machine, and the time sequence control circuit controls the temperature of the infrared heating module 1321 of each temperature zone according to the temperature characteristic curve.
The use and the working principle of the heating device of the reflow soldering machine are as follows:
the working personnel firstly open the heat insulation door 11, open the air charging and discharging pump connected with the air charging and discharging pipe, charge the inert gas into the hot welding chamber 1, discharge oxygen out of the hot welding chamber 1 as much as possible, and then close the heat insulation door 11;
placing the PCB on the feeding component 2, and starting the feeding component 2 and the material conveying network chain 12; when the PCB board enters the material conveying network chain 12 from the feeding assembly 2, the heat insulation door 11 is automatically opened and closed;
the PCB is introduced into the thermal welding chamber 1 and moved in each temperature zone formed by the thermal insulation board 14, and the thermal welding chamber 1 is pre-heated and temperature-adjusted to conform to a temperature profile set by a worker.
The temperature zone is formed by the temperature difference of the plurality of heating elements 13, and the heat insulation plates 14, so that the material conveying net chain 12 passes through the plurality of heat insulation plates 14 and has a gap with the heat insulation plates 14, and the gap can be passed by the PCB.
The PCB board more specifically moves in the hot melting chamber in the form of: after entering the hot melting chamber, the PCB moves between the first heating plate group and the second heating plate group, and the PCB also passes through the heat insulation plate 14 on the material conveying net chain 12, so that the movement of the PCB is not hindered because a gap exists between the upper surface of the material conveying net chain 12 and the vertical heat insulation plate 14.
In the heating assembly 13, the infrared heating module 1321 of the heating plate 132 is uniformly attached to the surface of the heating plate 132 facing the feeding net chain 12, the heat insulating plate 131 prevents the heat from being conducted in the direction away from the feeding net chain 12, and the heat equalizing plate 133 refracts and scatters the energy emitted from the heating plate 132, so that the energy is more uniformly irradiated on the PCB.
The second heating plate group is provided with a through hole 134, and the fan blows airflow at the lower end of the second heating plate group to blow heat to the direction of the material conveying net chain 12 and make full contact with the PCB.
And after the PCB welding process is finished once, opening an air charging and discharging pump connected with an air charging and discharging pipe to discharge waste gas from the air charging and discharging pipe.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (6)
1. A heating device of a reflow soldering machine is characterized by comprising a hot welding chamber and a heating assembly;
the hot welding chamber has two openable and closable heat-insulating doors;
the heating assembly is arranged in the hot welding chamber and comprises a plurality of heating plate groups, and the heating plate groups comprise a first heating plate group and a second heating plate group which are symmetrically arranged above the material conveying net chain and below the material conveying net chain;
the first heating plate group and the second heating plate group respectively comprise a heat insulation sheet, a heating sheet and a uniform heating sheet; the heating plate is arranged between the heat insulating plate and the uniform heating plate, the surface of the heating plate facing the material conveying net chain is uniformly attached with infrared heating modules, and the heat insulating plate is arranged on one side of the heating plate far away from the material conveying net chain.
2. The heating device of the reflow soldering machine according to claim 1, wherein a plurality of heat insulation plates are vertically and uniformly arranged in the heat soldering chamber to separate the heating assembly into a plurality of temperature zones, at least an integer of more than one heating plate group is arranged between adjacent heat insulation plates, and the heat insulation plates are provided with through holes for a material conveying net chain to pass through.
3. The heating device of the reflow soldering machine according to claim 1, wherein a plurality of fans are further arranged in the hot welding chamber, and a plurality of vertical through holes are formed in the heating plate groups of the second heating plate group; the fan is arranged below the second heating plate group.
4. The heating device of the reflow soldering machine according to claim 1, wherein the heat insulating sheet and the heating sheet are made of mica, the heat homogenizing sheet is made of transparent material, and the surface of the heat homogenizing sheet facing the heating sheet is an arc convex surface.
5. The reflow soldering machine heating apparatus according to claim 1, wherein the heating assembly further comprises a bolt assembly, a bolt of the bolt assembly penetrates through the heat insulating sheet, the heating sheet and the edge of the heat uniforming sheet; the heat insulation sheet, the heating sheet and the uniform heat sheet are detachably connected through a bolt assembly.
6. The reflow soldering machine heating apparatus according to claim 1, further comprising a gas filling and discharging pipe; and the air charging and discharging pipe is connected to the outer surface of the hot welding cavity, communicated with the inner space of the hot welding cavity and used for pumping air and charging inert gas into the hot welding cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123453954.2U CN217142632U (en) | 2021-12-31 | 2021-12-31 | Reflow soldering machine heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123453954.2U CN217142632U (en) | 2021-12-31 | 2021-12-31 | Reflow soldering machine heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217142632U true CN217142632U (en) | 2022-08-09 |
Family
ID=82687626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123453954.2U Active CN217142632U (en) | 2021-12-31 | 2021-12-31 | Reflow soldering machine heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217142632U (en) |
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2021
- 2021-12-31 CN CN202123453954.2U patent/CN217142632U/en active Active
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