CN217135693U

CN217135693U - MEMS vibration sensor packaging structure

Info

Publication number: CN217135693U
Application number: CN202220623288.8U
Authority: CN
Inventors: 李干平
Original assignee: Shenzhen Zhuobin Electronics Co ltd
Current assignee: Shenzhen Zhuobin Electronics Co ltd
Priority date: 2022-03-21
Filing date: 2022-03-21
Publication date: 2022-08-05
Anticipated expiration: 2032-03-21

Abstract

The application discloses MEMS vibration sensor packaging structure, including lag, drain pan, top shell, spread groove, MEMS chip, isolator constructs protection machanism, isolator constructs including buffering net, trachea and guide pin, the inside top fixed connection spread groove of top shell, spread groove inner wall fixed surface connects the buffering net, the fixed connection trachea is link up to the spread groove bottom, inside trachea one end through connection top shell, spread groove bottom fixed connection guide pin, protection machanism includes gum cover and protection network, lag middle part fixed connection protection network, drain pan inner wall fixed surface connects the gum cover, gum cover inner wall fixed connection circuit board, it is fixed connection lag respectively with drain pan outer wall surface to push up the shell. Wrap up through surrounding the circuit board with the gum cover, and will top shell and drain pan wrap up the lag, and the lag adopts the sound absorbing material of rubber material to make, the reduction sound signal of the very big degree of being convenient for is to vibration sensor's noise disturbance.

Description

MEMS vibration sensor packaging structure

Technical Field

The application relates to the field of MEMS vibration sensors, in particular to a MEMS vibration sensor packaging structure.

Background

Vibrations are widely present in nature, industry and human life, and various vibrations transmit various signals. The information carried in the vibration is acquired by means of various vibration sensors, and the vibration sensors are widely applied to various fields such as energy, chemical industry, medicine, automobiles, metallurgy, machine manufacturing, military industry, scientific research and teaching and the like. Reading the sound signal transmitted by the air vibration through a microphone; the accelerometer is used for measuring the acceleration of the vibrating object; the ultrasonic detector detects and analyzes a vibration signal of mechanical equipment, and is used for judging the self degradation degree of the machine and predicting the service life of the machine; the geological disaster early warning device detects geological vibration caused by seismic waves to early warn disasters such as earthquakes and the like.

The conventional vibration microphone is easily influenced by a sound signal transmitted in the air, so that the received signal has high noise, and the yield and the reliability of the vibration sensor are reduced. Therefore, a package structure of a MEMS vibration sensor is proposed to address the above problems.

Disclosure of Invention

The embodiment provides a package structure of a MEMS vibration sensor, which is used to solve the problem that a vibration microphone in the prior art is easily affected by a sound signal transmitted in the air, so that the received signal has high noise, thereby reducing the yield and reliability of the vibration sensor.

According to one aspect of the application, a MEMS vibration sensor package structure is provided, which includes a protective cover, a bottom case, a top case, a connecting groove, a MEMS chip, an isolation mechanism protection mechanism;

the isolation mechanism comprises a buffer net, an air pipe and a guide pin, the top end in the top shell is fixedly connected with a connecting groove, the surface of the inner wall of the connecting groove is fixedly connected with the buffer net, the bottom end of the connecting groove is communicated with the fixed connecting air pipe, one end of the air pipe is communicated with the inside of the top shell, and the bottom end of the connecting groove is fixedly connected with the guide pin;

the protection mechanism comprises a rubber sleeve and a protection net, the middle of the protection net is fixedly connected with the protection net, the surface of the inner wall of the bottom shell is fixedly connected with the rubber sleeve, the inner wall of the rubber sleeve is fixedly connected with a circuit board, and the surface of the top shell and the surface of the outer wall of the bottom shell are respectively fixedly connected with the protection net.

Further, the top end of the circuit board is fixedly connected with the controller and the MEMS chip.

Furthermore, the surface of the inner wall of the MEMS chip is fixedly connected with the back plate and the vibrating membrane layer.

Further, the protecting sleeve is made of sound-absorbing rubber materials.

Furthermore, the top end of the outer wall surface of the top shell is provided with an air hole.

Further, the top shell is fixedly connected with the bottom shell through bolts.

Through the above-mentioned embodiment of this application, isolation mechanism protection machanism has been adopted, the influence of the acoustic signal of vibration microphone transmission in receiving the air easily has been solved, it is big to lead to the noise in the signal of receipt, thereby the yield of vibration sensor and the problem of reliability have been reduced, it wraps up through encircleing the circuit board with the gum cover to have gained, and will top shell and drain pan parcel lag, and the lag adopts the sound absorbing material of rubber material to make, the effect of the noise interference of the reduction acoustic signal of the very big degree of being convenient for to vibration sensor.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic overall perspective view of an embodiment of the present application;

FIG. 2 is a schematic diagram of the overall internal structure of an embodiment of the present application;

fig. 3 is a schematic top view of an embodiment of the present application.

In the figure: 1. a protective sleeve; 2. a bottom case; 3. a rubber sleeve; 4. a circuit board; 5. a controller; 6. an MEMS chip; 7. a back plate; 8. vibrating the membrane layer; 9. connecting grooves; 10. air holes are formed; 11. a protective net; 12. a buffer network; 13. an air tube; 14. a top shell; 15. and (6) guiding the needle.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1-3, a package structure of a MEMS vibration sensor includes a protective cover 1, a bottom case 2, a top case 14, a connecting groove 9, a MEMS chip 6, and an isolation mechanism protection mechanism;

the isolation mechanism comprises a buffer net 12, an air pipe 13 and a guide pin 15, the top end inside the top shell 14 is fixedly connected with a connecting groove 9, the surface of the inner wall of the connecting groove 9 is fixedly connected with the buffer net 12, the bottom end of the connecting groove 9 is communicated with the fixed connecting air pipe 13, one end of the air pipe 13 is communicated with the inside of the top shell 14, and the bottom end of the connecting groove 9 is fixedly connected with the guide pin 15;

the protection mechanism comprises a rubber sleeve 3 and a protection net 11, the middle of the protection sleeve 1 is fixedly connected with the protection net 11, the inner wall surface of the bottom shell 2 is fixedly connected with the rubber sleeve 3, the inner wall of the rubber sleeve 3 is fixedly connected with a circuit board 4, the outer wall surfaces of the top shell 14 and the bottom shell 2 are respectively fixedly connected with the protection sleeve 1, the protection sleeve 1 is wrapped by surrounding the circuit board 4 with the rubber sleeve 3, the top shell 14 and the bottom shell 2 are wrapped by the protection sleeve 1, and the protection sleeve 1 is made of a sound-absorbing material made of rubber materials, so that noise interference of sound signals to the vibration sensor is reduced to a great extent;

4 top fixed connection controllers of circuit board 5 and

MEMS chip

6, 6 inner wall fixed surface of MEMS chip connects back plate 7 and vibration membrane layer 8, is convenient for receive sound, lag 1 adopts to inhale the sound rubber material and makes, is convenient for inhale the sound, bleeder vent 10 is seted up on 14 outer wall surface tops of top shell, the transmission sound of being convenient for, top shell 14 passes through bolt fixed connection drain pan 2.

When the utility model is used, a speaker makes a sound, the exhaled air and the sound are guided into the connecting groove 9 through the air holes 10, the buffer net 12 is arranged in the connecting groove 9, the impulsive force of the buffer gas is convenient to buffer, the air is guided out along the air pipe 13, the impact force of the gas is convenient to prevent from influencing the vibration sensor, the vibration generated by the sound is guided into the vibrating film layer 8 along the guide pin 15 to be processed, the capacitance value between the vibrating film layer 8 and the back electrode plate 7 is changed, the sound signal is obtained, the signal of the capacitance change is received by the controller 5 to be processed, the circuit board 4 is wrapped by surrounding the rubber sleeve 3, the protecting sleeve 1 is wrapped by the top shell 14 and the bottom shell 2, the protecting sleeve 1 is made of the sound absorbing material made of the rubber material, the noise interference of the external sound signal to the vibration sensor is convenient to be greatly reduced, and when the speaker makes a call in a noisy environment, the vibration sensor can shield sound signals, only transmits the sound signals when a caller speaks, and achieves the noise reduction effect.

The application has the advantages that:

1. the protective sleeve is made of sound-absorbing materials made of rubber materials, so that noise interference of sound signals to the vibration sensor is reduced to a great extent;

2. the person of making a voice of the caller sends sound, and inside air and the sound of exhalation passed through the leading-in spread groove of bleeder vent, and through at the inside buffering net that sets up of spread groove, the impulsive force of buffer gas of being convenient for, and the air derives along the trachea, and the vibrations that the sound produced were handled along the leading-in rete that shakes of guide pin, are convenient for prevent that gaseous impact force from influencing vibration sensor.

It is well within the skill of those in the art to implement, without undue experimentation, the present application is not directed to software and process improvements, as they relate to circuits and electronic components and modules.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A MEMS vibration sensor packaging structure is characterized in that: the MEMS chip protection device comprises a protection cover (1), a bottom shell (2), a top shell (14), a connecting groove (9), an MEMS chip (6) and an isolation mechanism protection mechanism;

the isolation mechanism comprises a buffer net (12), an air pipe (13) and a guide pin (15), the top end inside the top shell (14) is fixedly connected with a connecting groove (9), the surface of the inner wall of the connecting groove (9) is fixedly connected with the buffer net (12), the bottom end of the connecting groove (9) is communicated with the fixedly connected air pipe (13), one end of the air pipe (13) is communicated with the inside of the top shell (14), and the bottom end of the connecting groove (9) is fixedly connected with the guide pin (15);

protection machanism includes gum cover (3) and protection network (11), protection cover (1) middle part fixed connection protection network (11), drain pan (2) inner wall fixed surface connects gum cover (3), gum cover (3) inner wall fixed connection circuit board (4), top shell (14) and drain pan (2) outer wall surface difference fixed connection protection cover (1).

2. The MEMS vibration sensor package structure of claim 1, wherein: and the top end of the circuit board (4) is fixedly connected with the controller (5) and the MEMS chip (6).

3. A MEMS vibration sensor package according to claim 1, wherein: the inner wall surface of the MEMS chip (6) is fixedly connected with the back plate (7) and the vibrating membrane layer (8).

4. The MEMS vibration sensor package structure of claim 1, wherein: the protecting sleeve (1) is made of sound-absorbing rubber materials.

5. The MEMS vibration sensor package structure of claim 1, wherein: the top end of the outer wall surface of the top shell (14) is provided with an air hole (10).

6. The MEMS vibration sensor package structure of claim 1, wherein: the top shell (14) is fixedly connected with the bottom shell (2) through bolts.