CN217116030U - Photovoltaic module parameter detection circuit - Google Patents

Abstract

The utility model provides a photovoltaic module parameter detection circuitry belongs to solar power station snow melt technical field, especially relates to a photovoltaic module parameter detection circuitry. The utility model provides a photovoltaic module parameter detection circuit that excellent in use effect. The utility model discloses photovoltaic module parameter detection circuitry includes photovoltaic module voltage detection circuitry, current detection circuitry, irradiation detection circuitry, snow depth detection circuitry, angle detection circuitry and temperature detection circuitry, the signal transmission port of its characterized in that CPU circuit respectively with voltage detection circuitry's signal transmission port, current detection circuitry's signal transmission port, irradiation detection circuitry's signal transmission port, snow depth detection circuitry's signal transmission port, angle detection circuitry's signal transmission port, temperature detection circuitry's signal transmission port links to each other, current detection circuitry's detection signal input port links to each other with current transformer, irradiation detection circuitry's detection signal input port links to each other with irradiation sensor's detection signal output port.

Description

Photovoltaic module parameter detection circuit

Technical Field

The utility model belongs to the technical field of the snow melt of solar power station, especially, relate to a photovoltaic module parameter detection circuit.

Background

In the middle and high latitude areas, the accumulated snow in winter can cover the surface of the photovoltaic assembly, and the power generation amount of the photovoltaic power station is greatly reduced. The power generation capacity of the photovoltaic power station can be effectively improved if the accumulated snow on the surface of the photovoltaic component is melted, but the snow melting technology for the photovoltaic power station is still required to be further improved at present.

SUMMERY OF THE UTILITY MODEL

The utility model discloses to above-mentioned problem, provide a photovoltaic module parameter detection circuit's that excellent in use effect hardware basis.

In order to achieve the above object, the present invention adopts the following technical solution, the photovoltaic module parameter detection circuit of the present invention comprises a photovoltaic module voltage detection circuit, a current detection circuit, an irradiation detection circuit, a snow depth detection circuit, an angle detection circuit and a temperature detection circuit, and is characterized in that a signal transmission port of a CPU circuit is connected with a signal transmission port of the voltage detection circuit, a signal transmission port of the current detection circuit, a signal transmission port of the irradiation detection circuit, a signal transmission port of the snow depth detection circuit, a signal transmission port of the angle detection circuit and a signal transmission port of the temperature detection circuit respectively, a detection signal input port of the current detection circuit is connected with a current transformer, a detection signal input port of the irradiation detection circuit is connected with a detection signal output port of the irradiation sensor, a snow depth sensor and a pan/tilt angle sensor are arranged on a numerical control pan/tilt head, a detection signal output port of the holder angle sensor and a detection signal output port of the photovoltaic assembly angle sensor are respectively connected with a detection signal input port of the angle detection circuit; and a detection signal output port of the snow depth sensor is connected with a detection signal input port of the snow depth detection circuit.

As a preferred scheme, the snow depth detection circuit of the present invention includes a common mode inductor LDM1, a first terminal of LDM1 is connected to +24V, a second terminal of LDM1 is connected to one end of inductor L1, the other terminal of L1 is connected to pin 1 of HLK-10D2424B chip P2, pin 2 of P2 is connected to a third terminal of LDM1, and a fourth terminal of LDM1 is grounded; the pin 4 of the P2 is connected with +24V-HM31 through an inductor L2, and the pin 3 of the P2 is connected with GND-HM31 through an inductor L3;

a pin 1 of a chip U2 of ST3485 is connected with UART1-RX, pins 2 and 3 of U2 are connected with RD1, a pin 4 of U2 is connected with UART1-TX, a pin 5 of U2 is respectively connected with ground and one end of a capacitor C21, the other end of C21 is respectively connected with a pin 8 of +3.3V, U2, a pin 6 of U2 is respectively connected with one end of a resistor R5, one end of a resistor R6 and one end of a resistor R7, the other end of R6 is connected with +3.3V, the other end of R7 is connected with RS485-A1, the other end of R5 is respectively connected with a pin 7 of U2, one end of a resistor R3 and one end of a resistor R4, the other end of R3 is connected with ground, and the other end of R4 is connected with RS 485-B1.

As another preferred scheme, the temperature detection circuit adopts QT18B20 chip PE3, and PE 3 's 1, 2, 3 feet link to each other with T-GND, T-DQ, T-3.3V respectively.

As another preferred scheme, the angle detection circuit of the present invention includes a common mode inductor LDM3, a first terminal of LDM3 is connected to +24V, a second terminal of LDM3 is connected to one end of inductor L7, the other terminal of L7 is connected to pin 1 of HLK-10D2424B chip P4, pin 2 of P4 is connected to the third terminal of LDM3, and the fourth terminal of LDM3 is grounded; the pin 4 of the P4 is connected with the +24V-SINDT through an inductor L8, and the pin 3 of the P4 is connected with the GND-SINDT through an inductor L9;

a pin 1 of a chip U4 ST3485 is connected with UART3-RX, pins 2 and 3 of U4 are connected with RD3, a pin 4 of U4 is connected with UART3-TX, a pin 5 of U4 is respectively connected with the ground and one end of a capacitor C38, the other end of C38 is respectively connected with a pin 8 of +3.3V, U4, a pin 6 of U4 is respectively connected with one end of a resistor R16, one end of a resistor R17 and one end of a resistor R18, the other end of R17 is connected with +3.3V, the other end of R18 is connected with RS485-A3, the other end of R16 is respectively connected with a pin 7 of U4, one end of a resistor R14 and one end of a resistor R15, the other end of R14 is grounded, and the other end of R15 is connected with RS 485-B3;

a pin 1 of a chip U5 of ST3485 is connected with UART4-RX, pins 2 and 3 of U5 are connected with RD4, a pin 4 of U5 is connected with UART4-TX, a pin 5 of U5 is respectively connected with ground and one end of a capacitor C39, the other end of C39 is respectively connected with a pin 8 of +3.3V, U5, a pin 6 of U5 is respectively connected with one end of a resistor R21, one end of a resistor R22 and one end of a resistor R23, the other end of R22 is connected with +3.3V, the other end of R23 is connected with RS485-A4, the other end of R21 is respectively connected with a pin 7 of U5, one end of a resistor R19 and one end of a resistor R20, the other end of R19 is connected with ground, and the other end of R20 is connected with RS 485-B4.

Secondly, the irradiation detection circuitry includes LM324 chip CA1A, and 3 feet of CA1A connect CURRENT, and 2 feet of CA1A link to each other with 1 foot of CA1A, resistance R25 one end respectively, and the R25 other end connects ADC5 through resistance R26.

In addition, the current detection circuit of the present invention includes LM324 chip CA1B, pin 5 of CA1B is connected with one end of resistor R29 and one end of resistor R30 respectively, the other end of R29 is connected with the other end of R30 and ground respectively, pin 6 of CA1B is connected with one end of resistor R27 and one end of resistor R28 respectively, the other end of R27 is connected with S-CUR, the other end of R28 is connected with pin 7 of CA1B and one end of resistor R31 respectively, the other end of R31 is connected with pin 9 of LM324 chip CA1C and one end of resistor R32 respectively, pin 10 of CA1C is connected to ground through resistor R33, the other end of R32 is connected with pin 8 of CA1C and one end of resistor R34 respectively, and the other end of R34 is connected with ADC4 through resistor R35;

pins 5-8 of a PE7 chip HDIB-CE-10P2O2 are correspondingly connected with a +24V pin, a GND pin, an S-CUR pin and a GND pin respectively.

The voltage detection circuit comprises a VSM025A/10 chip U6, a pin 1 of U6 is connected with PV + through parallel resistors R36 and R37, a pin 2 of U6 is connected with PV-, a pin 5 of U6 is connected with a pin 3 of a LM324 chip CA2A through a resistor R39, a pin 2 of CA2A is respectively connected with a pin 1 of CA2A and one end of a resistor R40, and the other end of R40 is connected with an ADC 1;

a pin 1 of a VSM025A/10 chip U7 and a pin 1 of U7 are connected with PV + through parallel resistors R41 and R42, a pin 2 of U7 is connected with PV-, a pin 5 of U7 is connected with a pin 5 of a LM324 chip CA2B through a resistor R44, a pin 6 of CA2B is respectively connected with a pin 7 of CA2B and one end of a resistor R45, and the other end of R45 is connected with an ADC 2;

the VSM025A/10 chip U8, pin 1 of U8 connects PV + through parallel resistance R46, R47, pin 2 of U8 connects PV-, pin 5 of U8 connects LM324 chip CA 2C's pin 10 through resistance R49, CA 2C's pin 9 connects CA 2C's pin 8, resistance R50 one end separately, R50 another termination ADC 3.

The utility model has the advantages of.

The snow depth detection circuit detects the snow depth in real time through the snow depth sensor, converts 485 signals output by the snow depth sensor into serial TTL (transistor-transistor logic) signals through the level signal conversion circuit to communicate with the CPU (central processing unit), and realizes the electrical isolation of the controller circuit and the snow depth sensor through the power isolation circuit.

The angle detection circuit detects angles of the photovoltaic module and the snow depth sensor in real time through the angle sensor, converts 485 signals output by the angle sensor into serial TTL signals through the level signal conversion circuit to communicate with the CPU, and electrically isolates the controller circuit from the angle sensor through the power isolation circuit.

The irradiation detection circuit detects the irradiation intensity in real time through the irradiation sensor, the irradiation sensor outputs the irradiation intensity through a current signal, the current signal is converted into a voltage signal through the signal conditioning circuit, and the voltage signal is converted into a digital signal through the AD conversion module in the CPU.

The current detection circuit samples the current output by the photovoltaic module in proportion through the current sensor and outputs a corresponding voltage signal, and the voltage signal is converted into a digital signal through an AD conversion module in the CPU after passing through the signal conditioning circuit.

The voltage detection circuit samples the voltage output by the photovoltaic module in proportion through the voltage transformer and outputs a corresponding current signal, the current signal is changed into a voltage signal through the signal conditioning circuit, and the voltage signal is changed into a digital signal through the AD conversion module in the CPU.

The temperature sensor in the temperature detection circuit converts the temperature of the photovoltaic module backboard into a digital signal, communicates with the CPU in a single data bus mode, and sends the temperature information of the photovoltaic module backboard to the CPU.

The snow depth detection circuit, the numerical control holder control circuit, the angle detection circuit, the irradiation detection circuit, the current detection circuit, the voltage detection circuit, the temperature detection circuit, the keyboard and liquid crystal display circuit, the heat tracing band control circuit and the GPRS communication circuit are all connected with the CPU circuit.

Drawings

The present invention will be further described with reference to the accompanying drawings and the following detailed description. The scope of protection of the present invention is not limited to the following description.

Fig. 1 is a schematic diagram of a snow melting controller of a photovoltaic module.

Fig. 2 is a specific schematic circuit diagram a of the present invention.

Fig. 3 is a schematic diagram b of the specific circuit of the present invention.

Fig. 4 is a schematic diagram c of a specific circuit of the present invention.

Fig. 5 shows a specific schematic circuit diagram d of the present invention.

Fig. 6 is a schematic diagram e of the specific circuit of the present invention.

Fig. 7 is a schematic diagram f of a specific circuit according to the present invention.

Fig. 8 is a schematic diagram g of a specific circuit of the present invention.

FIG. 9 is a design diagram of a transverse 'king' shaped heat sink mounted on the back of the photovoltaic module.

Fig. 10 is a diagram of the positions of snow depth detection points of a certain photovoltaic module (all values in the diagram are mm).

Fig. 11 is a dimension chart of the fin (all values in mm in the figure).

Figure 12 is a diagram of the back side mounting position of the heat sink on the photovoltaic module (all values in mm in the figure).

Fig. 13 is a schematic side view of the snow depth detection sensor and the photovoltaic module.

FIG. 14 is a schematic top view of a snow depth detection sensor and photovoltaic module.

Detailed Description

As shown in the figure, the utility model comprises a transverse strip-shaped rectangular plate, a plurality of vertical strip-shaped rectangular plates are evenly distributed along the length direction of the transverse strip-shaped rectangular plate, the front vertical edge of the front vertical strip-shaped plate is the front edge of the radiating fin, and the rear vertical edge of the rear vertical strip-shaped plate is the rear edge of the radiating fin; the center line along the length direction of the transverse strip-shaped rectangular plate passes through the center of the vertical strip-shaped rectangular plate; the heat radiating fins are provided with transverse strip-shaped electric tracing bands, the central lines of the transverse strip-shaped electric tracing bands in the length direction are overlapped with the central lines of the transverse strip-shaped rectangular plates in the length direction, the front ends of the transverse strip-shaped electric tracing bands are flush with the front ends of the heat radiating fins, and the rear ends of the transverse strip-shaped electric tracing bands are flush with the rear ends of the heat radiating fins.

The utility model discloses an use the horizontal "king" style of calligraphy fin that designs to make the heat energy that the electric tracing area sent effectively conduct to photovoltaic module, make the snow melting speed of each position on photovoltaic module surface more even. In addition, compared with the radiating fins fully paved on the photovoltaic module back plate, the designed transverse 'king' shaped radiating fin can greatly reduce the consumption of radiating fin materials and remarkably reduce the cost.

The number of the vertical strip-shaped rectangular plates is four.

The width of the transverse strip-shaped electric tracing band is smaller than that of the transverse strip-shaped rectangular plate.

The plurality of radiating fins are uniformly distributed along the length direction of the photovoltaic module; the length direction of the radiating fin is vertical to the length direction of the photovoltaic module; the front ends of the radiating fins are in the same vertical direction; in the horizontal direction, the heat sink is centered on the back side of the photovoltaic module.

The number of the radiating fins is six.

And a detection point is arranged between every two adjacent radiating fins.

The center of a rectangular area defined by every four adjacent vertical strip-shaped rectangular plates is a detection point.

And selecting x multiplied by y detection points at the photovoltaic module back plate according to the uniform distance, wherein x is the number of transverse detection points, and y is the number of longitudinal detection points. The transverse king-shaped radiating fins are designed to surround each detection point, as shown in fig. 9. And 1 electric tracing band is arranged at the central line position of each radiating fin, and the transverse central line of the radiating fin is superposed with the transverse central line of the electric tracing band.

m is the length (unit mm) of the photovoltaic module, n is the width (unit mm) of the photovoltaic module, k is the transverse distance (unit mm) of the detection points, p is the longitudinal distance (unit mm) of the detection points, q is the longitudinal distance (unit mm) of the heat tracing band, a is the width (unit mm) of the radiating fins, e is the length (unit mm) of the radiating fins, b is the width (unit mm) of the vertical strip-shaped rectangular plates, and c is the width (unit mm) of the transverse strip-shaped rectangular plates;

0.8n < e, 60mm < b < 100mm, 60mm < c < 100mm, 250mm < a < p, k n/(x +1), p m/(y +1), q p, the electrical heat trace length being equal to the fin length e; in the horizontal direction, the radiating fin is centered on the back side of the photovoltaic module, the distance between the left edge of the photovoltaic module and the left edge of the radiating fin is (n-e)/2, and the distance between the right edge of the photovoltaic module and the right edge of the radiating fin is (n-e)/2; the thickness of the radiating fin is between 0.8mm and 1.5 mm.

The power supply control loops of the heat tracing bands installed on each photovoltaic module are mutually independent. The power supply control loops of the heat tracing bands installed on each photovoltaic module are mutually independent. When snow is accumulated on the surface of the photovoltaic module, all the electric tracing bands are not started to melt snow, but only the upper and lower adjacent electric tracing bands at the positions where the detection points with the accumulated snow are identified are powered and heated, so that only the positions with the accumulated snow are heated, and the positions without the accumulated snow are not heated, therefore, electric energy can be greatly saved, and snow melting cost is reduced.

The photovoltaic module is 2094mm in length, and 1038mm in width.

The radiating fins are made of aluminum.

Taking a photovoltaic module with model number YL450D-40d1/2 manufactured by British energy (Chinese) limited as an example, the module is 2094mm in length and 1038mm in width. 15 detection points (5 rows × 3 columns) were selected at a uniform pitch on the photovoltaic module backsheet as shown in fig. 10. The transverse king-shaped aluminum radiating fins are designed, the size of each radiating fin is shown in fig. 11, the 15 points are surrounded, and each photovoltaic module uses 6 radiating fins. 1 electric tracing band is installed at the central line position of each radiating fin, the installation position is shown in figure 12, and the solar panel uses 6 electric tracing bands in total. Taking the photovoltaic module of the model as an example, if the aluminum radiating fins are fully paved on the back surface, the thickness of the radiating fins is 1mm according to the aluminum density of 2700kg/m ³ The aluminum material used was calculated to be 5.8686444 kg. If the designed transverse king-shaped aluminum radiating fin is used, 2.356776kg of aluminum material is needed, and the aluminum material consumption is 40.16% of that of the radiating fin fully paved on the back plate.

Through the utility model discloses a fin can detect the detection site snow degree of depth, and photovoltaic module detection site snow degree of depth detection method is:

the snow depth detection sensor is arranged on a numerical control electric holder, the holder is used for controlling the snow depth detection sensor to rotate horizontally and in pitch, and the holder is fixed on an upright post vertical to the horizontal plane. The stand is installed at the extension line direction of No. 1 photovoltaic module central line. f is the distance (unit mm) between the stand column and the photovoltaic module No. 1 in the center line direction of the photovoltaic module No. 1, h is the height (unit mm) from the horizontal plane where the front edge of the photovoltaic module No. 1 is located on the stand column to the horizontal plane where the snow depth detection sensor is located, m is the length (unit mm) of the photovoltaic module, n is the width (unit mm) of the photovoltaic module, j is the distance (unit mm) of the photovoltaic module, beta is the horizontal rotation angle (unit DEG) of the snow depth detection sensor probe, d1 is the snow depth (unit mm) detected in the direction indicated by the snow depth detection sensor, d2 is the snow depth (unit mm) projected to the overlooking center line direction of the photovoltaic module by d1, d is the snow depth (unit mm) projected to the normal line direction of the photovoltaic module by d2, theta is the included angle (unit DEG) between the photovoltaic module and the horizontal plane, and delta is the pitching rotation angle (unit DEG) of the snow depth detection sensor probe.

In order to obtain an accumulated snow depth value d of a certain detection point of the photovoltaic module, firstly, a horizontal rotation angle beta and a pitching rotation angle delta when the snow depth detection sensor points to the detection point need to be calculated, the snow depth detection sensor is rotated to the angle by controlling the numerical control electric holder, and then the snow depth detection sensor carries out accumulated snow depth detection. Finally, the snow depth d1 detected by the snow depth detection sensor in the direction is converted into the snow depth d in the normal direction of the photovoltaic module through an algorithm (the following algorithm). Taking 5 typical points in fig. 14 as an example (the snow depth algorithm of other points can be obtained by taking the snow depth algorithm of the 5 typical points as a reference), the snow depth calculation method is as follows.

(1) Algorithm for detecting snow depth at No. 1 point

Firstly, the angle delta of the numerical control electric pan-tilt which needs to rotate in a pitching mode and the angle beta of the numerical control electric pan-tilt which needs to rotate in a horizontal mode are calculated, and the calculation is as follows.

By

To obtain

By

To obtain

Then, the snow depth d1 detected by the snow depth detection sensor in the direction pointed by the numerical control electric pan-tilt is converted into the snow depth d in the normal direction of the photovoltaic module, and the calculation is as follows.

By

D2 ═ d1 × cos β

By

D2 × sin (θ + δ) ═ d1 × cos β × sin (θ + δ)

(2) Algorithm for detecting snow depth of No. 2 detection point

The detection point No. 2 is located on the center line of the photovoltaic module No. 1, so the horizontal rotation angle beta is 0 degree, and d1 is d 2. The angle delta of the numerical control electric pan-tilt required to rotate in pitch is calculated as follows.

By

To obtain

The snow depth d1 detected by the snow depth detection sensor in the direction pointed by the numerical control electric pan-tilt is converted into the snow depth d in the normal direction of the photovoltaic module, and the calculation is as follows.

By

And d1 ═ d2, d ═ d1 × sin (θ + δ)

(3) Algorithm for detecting snow depth at No. 3 detection point

Firstly, the angle delta of the numerical control electric pan-tilt which needs to rotate in a pitching mode and the angle beta of the numerical control electric pan-tilt which needs to rotate in a horizontal mode are calculated, and the calculation is as follows.

By

To obtain

By

To obtain

Then, the snow depth d1 detected by the snow depth detection sensor in the direction pointed by the numerical control electric pan-tilt is converted into the snow depth d in the normal direction of the photovoltaic module, and the calculation is as follows.

By

D2 ═ d1 × cos β

By

D2 × sin (θ + δ) ═ d1 × cos β × sin (θ + δ)

(4) Algorithm for detecting snow depth at No. 4 detection point

The No. 4 detection point is located on the No. 2 photovoltaic module, so the physical quantity j of the spacing between the photovoltaic modules needs to be included in the calculation. Firstly, the angle delta of the numerical control electric pan-tilt which needs to rotate in a pitching mode and the angle beta of the numerical control electric pan-tilt which needs to rotate in a horizontal mode are calculated, and the calculation is as follows.

By

To obtain

By

To obtain

Then, the snow depth d1 detected by the snow depth detection sensor in the direction pointed by the numerical control electric pan-tilt is converted into the snow depth d in the normal direction of the photovoltaic module, and the calculation is as follows.

By

D2 ═ d1 × cos β

By

D2 × sin (θ + δ) ═ d1 × cos β × sin (θ + δ)

(5) Algorithm for detecting snow depth at No. 5 detection point

Firstly, the angle delta of the numerical control electric pan-tilt which needs to rotate in a pitching mode and the angle beta of the numerical control electric pan-tilt which needs to rotate in a horizontal mode are calculated, and the calculation is as follows.

By

To obtain

By

To obtain

Then, the snow depth d1 detected by the snow depth detection sensor in the direction pointed by the numerical control electric pan-tilt is converted into the snow depth d in the normal direction of the photovoltaic module, and the calculation is as follows.

By

D2 ═ d1 × cos β

By

D2 × sin (θ + δ) d1 × cos β × sin (θ + δ) is obtained.

The utility model relates to a photovoltaic component snow melting controller, which comprises a CPU circuit, a heat tracing band control circuit, a photovoltaic component voltage detection circuit, a current detection circuit, an irradiation detection circuit, a keyboard and a liquid crystal screen circuit, a GPRS communication circuit, a numerical control pan-tilt control circuit, a snow depth detection circuit, an angle detection circuit and a temperature detection circuit, wherein a signal transmission port of the CPU circuit is respectively connected with a signal transmission port of the heat tracing band control circuit, a signal transmission port of the voltage detection circuit, a signal transmission port of the current detection circuit, a signal transmission port of the irradiation detection circuit, a signal transmission port of the keyboard and the liquid crystal screen circuit, a signal transmission port of the GPRS communication circuit, a signal transmission port of the numerical control pan-tilt control circuit, a signal transmission port of the snow depth detection circuit, a signal transmission port of the angle detection circuit and a signal transmission port of the temperature detection circuit, the control signal output port of the heat tracing band control circuit is connected with the electric heat tracing band, the detection signal input port of the current detection circuit is connected with a current transformer (a junction box on the back of the photovoltaic component outputs two wires which are respectively the positive and negative outputs of the photovoltaic component, the center of the current transformer is provided with a round hole which can penetrate a wire with the diameter of 13.6mm to the maximum, the positive or negative wire of the photovoltaic component penetrates the hole to detect the current value output by the photovoltaic component), the detection signal input port of the irradiation detection circuit is connected with the detection signal output port of the irradiation sensor, the numerical control pan-tilt control circuit is connected with a numerical control pan-tilt, the numerical control pan-tilt is arranged on an upright post, the upper end of the numerical control pan-tilt is provided with a snow depth sensor and a pan-tilt angle sensor, the photovoltaic component is provided with a photovoltaic component angle sensor, the detection signal output port of the pan-tilt angle sensor and the detection signal output port of the photovoltaic component angle sensor are respectively connected with the detection signal output port of the angle detection circuit The input ports are connected; and a detection signal output port of the snow depth sensor is connected with a detection signal input port of the snow depth detection circuit.

The CPU circuit is the core of the controller, and the completed work comprises the steps of collecting various physical signals, controlling the rotation of the numerical control electric pan-tilt, calculating the accumulated snow depth of the detected point on the surface of the photovoltaic module, and judging which electric tracing bands need to be powered and heated, which power supply modes are adopted by the electric tracing bands, and the like.

The snow depth detection circuit detects the snow depth in real time through the snow depth sensor, converts 485 signals output by the snow depth sensor into serial TTL (transistor-transistor logic) signals through the level signal conversion circuit to communicate with the CPU (central processing unit), and realizes the electrical isolation of the controller circuit and the snow depth sensor through the power isolation circuit.

The numerical control cradle head control circuit realizes horizontal rotation and pitching rotation of the cradle head through real-time control of the CPU on the cradle head, 485 signals output by the cradle head are converted into serial TTL (transistor-transistor logic) signals through the level signal conversion circuit to be communicated with the CPU, and electric isolation between the controller circuit and the numerical control electric cradle head is realized through the power isolation circuit.

The angle detection circuit detects the angles of the photovoltaic module and the snow depth sensor in real time through the angle sensor, converts a 485 signal output by the angle sensor into a serial TTL signal through the level signal conversion circuit to communicate with the CPU, and realizes the electrical isolation of the controller circuit and the angle sensor through the power isolation circuit.

The irradiation detection circuit detects the irradiation intensity in real time through the irradiation sensor, the irradiation sensor outputs the irradiation intensity through a current signal, the current signal is changed into a voltage signal through the signal conditioning circuit, and the voltage signal is changed into a digital signal through the AD conversion module in the CPU.

The current detection circuit samples the current output by the photovoltaic module in proportion through the current sensor and outputs a corresponding voltage signal, and the voltage signal is converted into a digital signal through an AD conversion module in the CPU after passing through the signal conditioning circuit.

The voltage detection circuit samples the voltage output by the photovoltaic module in proportion through the voltage transformer and outputs a corresponding current signal, the current signal is changed into a voltage signal through the signal conditioning circuit, and the voltage signal is changed into a digital signal through the AD conversion module in the CPU.

The temperature sensor in the temperature detection circuit converts the temperature of the photovoltaic module backboard into a digital signal, communicates with the CPU in a single data bus mode, and sends the temperature information of the photovoltaic module backboard to the CPU.

The CPU in the keyboard and liquid crystal screen circuit identifies the trigger key in an external interruption and scanning mode, and the CPU communicates with the liquid crystal screen module in a serial synchronous communication mode and controls the liquid crystal screen to display contents. The keyboard and the liquid crystal display circuit have the functions of setting system control parameters and checking the working state of the system.

The heat tracing band control circuit outputs a control signal from an IO port of the CPU, and controls whether the coil at the control end of the relay supplies power or not after optical coupling isolation, thereby controlling whether each heat tracing band supplies power or not for heating. The 24V power supply at the control end of the relay is electrically isolated from the 24V power supply in the controller circuit through the power isolation circuit.

And the CPU in the GPRS communication circuit is communicated with the GPRS wireless transparent transmission module through a serial asynchronous communication interface, and remote wireless communication is realized through a GPRS network.

The snow depth detection circuit, the numerical control holder control circuit, the angle detection circuit, the irradiation detection circuit, the current detection circuit, the voltage detection circuit, the temperature detection circuit, the keyboard and liquid crystal display circuit, the heat tracing band control circuit and the GPRS communication circuit are all connected with the CPU circuit.

The utility model discloses during the use, install the snow depth detection sensor on the electronic cloud platform of numerical control, carry out horizontal rotation and every single move rotation through cloud platform control snow depth detection sensor, the cloud platform fix on one with horizontal plane vertically stand, the column mouting is at the extension line direction of No. 1 photovoltaic module central line. An angle sensor is mounted on the snow depth detecting sensor for detecting an angle at which the snow depth detecting sensor is directed. And the other angle sensor is arranged on the photovoltaic module and used for detecting the included angle between the photovoltaic module and the horizontal plane. The output lead of the photovoltaic module passes through a round hole in the center of the current sensor (in fig. 14, 3 photovoltaic modules are electrically connected in series); and respectively connecting the positive and negative electrodes of the output ends of the 3 photovoltaic modules to a PV + pin and a PV-pin of a voltage signal input port connector in the voltage detection circuit. And fixing the temperature sensor on the area, far away from the heat tracing band and the covering area of the heat radiating fin, on the back plate of the photovoltaic assembly. And fixing the irradiation sensor on a plane with the same inclination angle as the photovoltaic module, wherein the irradiation sensor cannot be shielded by a shadow. With each fin according to the utility model the position requirement is fixed on the photovoltaic module backplate, fixes each companion torrid zone at each fin horizontal center line position.

The CPU circuit adopts a MM32F3273D7P chip U1, pins 1-4 of U1 are correspondingly connected with +3.3V, LCD-A0, LCD-RST and LCD-CS respectively, pin 5 of U1 is connected with one end of a resistor R1, one end of a crystal oscillator X1 and one end of a capacitor C1 respectively, the other end of C1 is connected with ground and one end of a capacitor C2 respectively, the other end of C2 is connected with the other end of X1, the other end of R1 and pin 6 of U1 respectively, pins 7-12 of U1 are connected with RST, RD2, RD3, SCL SDA, and GND respectively, pin 12 of U1 is connected with the positive electrode of a capacitor C3 and one end of a capacitor C4 respectively, the negative electrode of C3 is connected with the other end of C4, pin RX 13 of U1, pin 14-32 of U384 is connected with UART, 1-TX, 1-RX, 1-RX, ADC 1-RX, ADC 1-RX, ADC 1-RX, ADC 1-RX and ADC 1-RX-1-RX, ADC 1-RX and ADC 1-RX, GND, +3.3V are correspondingly connected, pins 18 and 19 of U1 are connected with two ends of C5, and pins 31 and 32 of U1 are connected with two ends of C6;

pins 33-64 of U1 are correspondingly connected with pins L6-L1, pins LE 3-LE 1, pins UART1-RX, pins UART1-TX, pins RD1, pins INT3, pins JTMS, pins GND, +3.3V, pins JTCK, pins ROW 5-ROW 1, pins COL 5-COL 1, pins GND, pins RD4, pins T-DQ, pins GND and pins +3.3V respectively;

the 3 pin of the BM117-3.3 chip P1 is connected with +15V, the 2 pin of the P1 is connected with +3.3V, one end of a switch SW1 is respectively connected with the ground and one end of a capacitor C13, the other end of SW1 is respectively connected with one end of a resistor R2, the RST and the other end of the capacitor C13, and the other end of R2 is connected with + 3.3V.

The CPU is 32-bit microcontroller produced by Shanghai flexible microelectronics Limited, and the model is MM32F3273D 7P. The communication module is an embedded GPRS wireless transparent transmission module produced by Jinan people Internet of things technology Limited, and the model is USR-GPRS232-7S 3. The liquid crystal screen module is made of JLX12864G-183-BN, which is produced by Shenzhen crystal union electronics Limited. The relay is a low-power-consumption micro relay produced by Ningbo Vitaceae New epoch electric appliances Limited, the model is HK4100F-DC24V-SDAG, the coil voltage is 24V, and the coil power consumption is 0.15W. The 24V power isolation module is made of a product produced by electronics Limited of Henrezhi, Heizideke, and has the model of HLK-10D 2424B. The 3.3V power supply module is a product produced by Shanghai Baili microelectronics Inc., and the model is BM 1117-3.3. The voltage transformer is a product produced by Nanjing Hodgkin technologies, Inc., and has a model number of VSM 025A/10. The current sensor is a product produced by Jojoba sensing technology Limited in Jiangsu, and the model is HDIB-CE-10P2O 2.

The snow depth detection circuit comprises a common-mode inductor LDM1, wherein the first end of an LDM1 is connected with +24V, the second end of an LDM1 is connected with one end of an inductor L1, the other end of the L1 is connected with a pin 1 of an HLK-10D2424B chip P2, a pin 2 of a P2 is connected with the third end of the LDM1, and the fourth end of the LDM1 is grounded; the pin 4 of the P2 is connected with +24V-HM31 through an inductor L2, and the pin 3 of the P2 is connected with GND-HM31 through an inductor L3;

a pin 1 of a chip U2 of ST3485 is connected with UART1-RX, pins 2 and 3 of U2 are connected with RD1, a pin 4 of U2 is connected with UART1-TX, a pin 5 of U2 is respectively connected with ground and one end of a capacitor C21, the other end of C21 is respectively connected with a pin 8 of +3.3V, U2, a pin 6 of U2 is respectively connected with one end of a resistor R5, one end of a resistor R6 and one end of a resistor R7, the other end of R6 is connected with +3.3V, the other end of R7 is connected with RS485-A1, the other end of R5 is respectively connected with a pin 7 of U2, one end of a resistor R3 and one end of a resistor R4, the other end of R3 is connected with ground, and the other end of R4 is connected with RS 485-B1.

The snow depth sensor is a laser snow depth sensor produced by Austrian SOMMER company, the model is HM31, and the snow depth measuring range is 0-15 m. The numerical control electric pan-tilt adopts a worm and gear light pan-tilt produced by Sichuan convergent optical communication Limited, the model is HY-LW18-01B, the horizontal rotation angle range is 0-360 degrees, the pitching angle range is-60 degrees, and the positioning precision is 0.1 degrees. An angle sensor is mounted on the snow depth detection sensor to detect the angle pointed by the snow depth detection sensor. An angle sensor is installed on a photovoltaic module backboard and used for detecting an included angle between a photovoltaic module and a horizontal plane, the angle sensor is a double-shaft inclination angle sensor produced by Shenzhen Weite Intelligent science and technology Limited, the model is SINDT02-485, and the angle detection precision is 0.1 degrees. The temperature sensor adopts a wide temperature measurement range single-bus temperature measurement chip manufactured by Beijing seven-core Zhongchuang science and technology Limited, the model is QT18B20The range is-55 ℃ to +125 ℃, the maximum error is +/-0.5 ℃ in the range of-10 ℃ to +85 ℃, and the maximum error is +/-1.5 ℃ in the full temperature range. The irradiation sensor is a product produced by Wuhan cloud technology Limited, the model is YGC-TBQ-KV-A2, and the irradiation detection range is 0-2000W/m ² . The electric tracing band is made of glass fiber constant power electric tracing band produced by Anhui Huanrei electric heating appliances, the model is RDP2-J4-60, 220V is used for supplying power, the heating power is 60W/m, and the width of the electric tracing band is 9.5 mm.

The numerical control holder control circuit comprises a common-mode inductor LDM2, wherein the first end of an LDM2 is connected with +24V, the second end of an LDM2 is connected with one end of an inductor L4, the other end of the L4 is connected with a pin 1 of an HLK-10D2424B chip P3, a pin 2 of the P3 is connected with the third end of the LDM2, and the fourth end of the LDM2 is grounded; the pin 4 of the P3 is connected with +24V-HY through an inductor L5, and the pin 3 of the P3 is connected with GND-HY through an inductor L6;

a pin 1 of a chip U3 of ST3485 is connected with UART2-RX, pins 2 and 3 of U3 are connected with RD2, a pin 4 of U3 is connected with UART2-TX, a pin 5 of U3 is respectively connected with ground and one end of a capacitor C29, the other end of C29 is respectively connected with a pin 8 of +3.3V, U3, a pin 6 of U3 is respectively connected with one end of a resistor R10, one end of a resistor R11 and one end of a resistor R12, the other end of R11 is connected with +3.3V, the other end of R12 is connected with RS485-A2, the other end of R10 is respectively connected with a pin 7 of U3, one end of a resistor R8 and one end of a resistor R9, the other end of R8 is connected with ground, and the other end of R9 is connected with RS 485-B2.

The temperature detection circuit adopts a QT18B20 chip PE3, and pins 1, 2 and 3 of the PE3 are respectively connected with T-GND, T-DQ and T-3.3V.

The angle detection circuit comprises a common-mode inductor LDM3, wherein the first end of an LDM3 is connected with +24V, the second end of an LDM3 is connected with one end of an inductor L7, the other end of the L7 is connected with a pin 1 of an HLK-10D2424B chip P4, a pin 2 of the P4 is connected with the third end of the LDM3, and the fourth end of the LDM3 is grounded; the pin 4 of the P4 is connected with the +24V-SINDT through an inductor L8, and the pin 3 of the P4 is connected with the GND-SINDT through an inductor L9;

a pin 1 of a chip U4 ST3485 is connected with UART3-RX, pins 2 and 3 of U4 are connected with RD3, a pin 4 of U4 is connected with UART3-TX, a pin 5 of U4 is respectively connected with the ground and one end of a capacitor C38, the other end of C38 is respectively connected with a pin 8 of +3.3V, U4, a pin 6 of U4 is respectively connected with one end of a resistor R16, one end of a resistor R17 and one end of a resistor R18, the other end of R17 is connected with +3.3V, the other end of R18 is connected with RS485-A3, the other end of R16 is respectively connected with a pin 7 of U4, one end of a resistor R14 and one end of a resistor R15, the other end of R14 is grounded, and the other end of R15 is connected with RS 485-B3;

the 1 pin of a ST3485 chip U5 is connected with a UART4-RX, the 2 and 3 pins of a U5 are connected with an RD4, the 4 pin of a U5 is connected with a UART4-TX, the 5 pin of the U5 is respectively connected with the ground and one end of a capacitor C39, the other end of the C39 is respectively connected with the 8 pin of +3.3V, U5, the 6 pin of the U5 is respectively connected with one end of a resistor R21, one end of a resistor R22 and one end of a resistor R23, the other end of the R22 is connected with +3.3V, the other end of the R23 is connected with an RS485-A4, the other end of the R21 is respectively connected with the 7 pin of a U5, one end of a resistor R19 and one end of a resistor R20, the other end of the R19 is connected with the ground, and the other end of the R20 is connected with an RS 485-B4.

The irradiation detection circuit comprises an LM324 chip CA1A, a pin 3 of CA1A is connected with a CURRENT, a pin 2 of CA1A is respectively connected with a pin 1 of CA1A and one end of a resistor R25, and the other end of R25 is connected with an ADC5 through the resistor R26.

Pins 1, 2 and 3 of the PE6 of the YGC-TBQ-KV-A2 chip are correspondingly connected with +24V, GND and CURRENT respectively.

The current detection circuit comprises an LM324 chip CA1B, wherein a pin 5 of CA1B is respectively connected with one end of a resistor R29 and one end of a resistor R30, the other end of R29 is respectively connected with the other end of R30 and the ground, a pin 6 of CA1B is respectively connected with one end of a resistor R27 and one end of a resistor R28, the other end of R27 is connected with an S-CUR, the other end of R28 is respectively connected with a pin 7 of CA1B and one end of a resistor R31, the other end of R31 is respectively connected with a pin 9 of LM324 chip CA1C and one end of a resistor R32, a pin 10 of CA1C is grounded through a resistor R33, the other end of R32 is respectively connected with a pin 8 of CA1C and one end of a resistor R34, and the other end of R34 is connected with an ADC4 through a resistor R35;

pins 5-8 of a PE7 chip HDIB-CE-10P2O2 are correspondingly connected with a +24V pin, a GND pin, an S-CUR pin and a GND pin respectively.

The voltage detection circuit comprises a VSM025A/10 chip U6, a pin 1 of U6 is connected with PV + through parallel resistors R36 and R37, a pin 2 of U6 is connected with PV-, a pin 5 of U6 is connected with a pin 3 of a LM324 chip CA2A through a resistor R39, a pin 2 of CA2A is respectively connected with a pin 1 of CA2A and one end of a resistor R40, and the other end of R40 is connected with an ADC 1;

a pin 1 of a VSM025A/10 chip U7 and a pin 1 of U7 are connected with PV + through parallel resistors R41 and R42, a pin 2 of U7 is connected with PV-, a pin 5 of U7 is connected with a pin 5 of a LM324 chip CA2B through a resistor R44, a pin 6 of CA2B is respectively connected with a pin 7 of CA2B and one end of a resistor R45, and the other end of R45 is connected with an ADC 2;

the VSM025A/10 chip U8, pin 1 of U8 connects PV + through parallel resistance R46, R47, pin 2 of U8 connects PV-, pin 5 of U8 connects LM324 chip CA 2C's pin 10 through resistance R49, CA 2C's pin 9 connects CA 2C's pin 8, resistance R50 one end separately, R50 another termination ADC 3.

The keyboard and liquid crystal screen circuit comprises a 74LV08A chip U9 and a JLX12864G-183-BN chip U10, wherein 1, 2, 5, 8, 9 and 12 pins of the U9 are correspondingly connected with COL1, COL2, COL3, INT3, COL5 and COL4 respectively;

the 8-12 pins of the U10 are correspondingly connected with the SDA, the SCL, the LCD-A0, the LCD-RST and the LCD-CS respectively.

The control circuit of the heat tracing band comprises a common mode inductor LDM4, the first end of an LDM4 is connected with +24V, the second end of an LDM4 is connected with one end of an inductor L10, the other end of the L10 is connected with a pin 1 of an HLK-10D2424B chip P5, a pin 2 of the P5 is connected with the third end of the LDM4, and the fourth end of the LDM4 is grounded; the pin 4 of the P5 is connected with the +24V-RELAY through an inductor L11, and the pin 3 of the P5 is connected with the GND-RELAY through an inductor L12;

pins 3, 4, 7, 8, 13 and 14 of a 74LVC373ADB chip U11 are correspondingly connected with pins L1-L6 respectively, pin 11 of U11 is connected with pin LE1, and pins 2, 5, 6, 9, 12 and 15 of U11 are correspondingly connected with pins L1-1-L1-6 respectively;

pins 2, 4, 6 and 8 of the TLP521-4 chip U12 are correspondingly connected with pins L1-1 to L1-4 respectively; pins 2 and 4 of the TLP521-2 chip U13 are correspondingly connected with pins L1-5 and L1-6 respectively; the 15, 13, 11 and 9 pins of U12 are correspondingly connected with KM1-1, KM1-2, KM1-3 and KM1-4 respectively, and the 7 and 5 pins of U13 are correspondingly connected with KM1-5 and KM1-6 pins respectively;

pins 2, 4, 6 and 8 of the TLP521-4 chip U15 are correspondingly connected with pins L2-1 to L2-4 respectively; pins 2 and 4 of the TLP521-2 chip U16 are correspondingly connected with pins L2-5 and L2-6 respectively; the 15, 13, 11 and 9 pins of U15 are correspondingly connected with KM2-1, KM2-2, KM2-3 and KM2-4 respectively, and the 7 and 5 pins of U16 are correspondingly connected with KM2-5 and KM2-6 pins respectively;

pins 3, 4, 7, 8, 13 and 14 of a 74LVC373ADB chip U14 are correspondingly connected with pins L1-L6 respectively, pin 11 of U14 is connected with pin LE2, and pins 2, 5, 6, 9, 12 and 15 of U14 are correspondingly connected with pins L2-1-L2-6 respectively;

pins 2, 4, 6 and 8 of the TLP521-4 chip U18 are correspondingly connected with pins L3-1 to L3-4 respectively; pins 2 and 4 of the TLP521-2 chip U19 are correspondingly connected with pins L3-5 and L3-6 respectively; the 15, 13, 11 and 9 pins of U18 are correspondingly connected with KM3-1, KM3-2, KM3-3 and KM3-4 respectively, and the 7 and 5 pins of U19 are correspondingly connected with KM3-5 and KM3-6 pins respectively;

pins 3, 4, 7, 8, 13 and 14 of a 74LVC373ADB chip U17 are correspondingly connected with pins L1-L6 respectively, pin 11 of U17 is connected with pin LE3, and pins 2, 5, 6, 9, 12 and 15 of U17 are correspondingly connected with pins L3-1-L3-6 respectively.

The GPRS communication circuit comprises a USR-GPRS232-7S3 chip U20, pins 6 and 7 of U20 are correspondingly connected with a USR-TX and a USR-RX respectively, a pin 10 of U20 is connected with a PWR, and a pin 15 of U20 is connected with a G-LINK;

pin 1 of TPS79328DBVR chip P6 is respectively connected with +3.3V, one end of capacitor C64 and one end of resistor R74, the other end of R74 is connected with pin 3 of P6, the other end of C64 is respectively connected with ground and pin 2 of P6, pin 4 of P6 is respectively connected with ground and one end of capacitor C65 through capacitor C66, and the other end of C65 is connected with pin 5 of P6;

the base electrode of an NPN triode Q1 is respectively connected with one end of a resistor R75 and one end of a resistor R76, the other end of R75 is connected with a USR-TX, the other end of R76 is respectively connected with +2.8V and one end of a resistor R77, the other end of R77 is respectively connected with the collector electrode of Q1 and the base electrode of an NPN triode Q2, the emitter electrodes of Q1 and Q2 are grounded, the collector electrode of Q2 is respectively connected with one end of a resistor R78 and a UART5-RX, and the other end of R78 is connected with + 3.3V;

a pin 1 of the TLP521-1 chip U21 is connected with a GPRS-PWR through a resistor R83, a pin 2 of the U21 is grounded, a pin 4 of the U21 is connected with +3.3V, a pin 3 of the U21 is respectively connected with one end of a resistor R84, one end of a capacitor C67 and one end of a resistor R85, and the other end of the R84 is respectively connected with the other end of the capacitor C67 and the ground; the other end of the R85 is connected with the base electrode of an NPN triode Q5, the emitter electrode of Q5 is grounded, and the collector electrode of Q5 is connected with the PWR;

the base electrode of an NPN triode Q3 is respectively connected with one end of a resistor R79 and one end of a resistor R80, the other end of R79 is connected with UART5-TX, the other end of R80 is respectively connected with +3.3V and one end of a resistor R81, the other end of R81 is respectively connected with the collector electrode of Q3 and the base electrode of an NPN triode Q4, the emitter electrodes of Q3 and Q4 are grounded, the collector electrode of Q4 is respectively connected with one end of a resistor R82 and USR-RX, and the other end of R82 is connected with + 2.8V;

the base electrode of an NPN triode Q6 is connected with G-LINK through a resistor R86, the collector electrode of Q6 is respectively connected with one end of a +4V resistor R88 through a light-emitting diode LED1 and a resistor R87 in sequence, and the other end of R88 is respectively connected with the emitter electrode of Q6 and the ground through a light-emitting diode LED 2;

a pin 1 of the MP2303 chip P7 is connected with MP-BS, a pin 2 of the P7 is respectively connected with a cathode of a diode D11 and one end of a resistor R89, an anode of D11 is connected with +15V, and the other end of R89 is connected with a pin 7 of the P7; the pin 3 of the P7 is respectively connected with +4V, one end of a capacitor C72, one end of an inductor L13, one end of a capacitor C73, one end of a capacitor C74 and one end of a resistor R90, the other end of the C72 is respectively connected with the MP-BS and the cathode of a diode D12, the anode of the D12 is connected with the other end of the L13, the other end of the R90 is respectively connected with the pin 5 of the P7 and one end of a resistor R91, the other end of the R91 is respectively connected with the ground and one end of a resistor R92, and the other end of the R92 is connected with the pin 6 of the P7 through the capacitor C75.

Wherein P1 is a 3.3V power module, and the maximum output current is 1A, which supplies power for the electronic components in the controller that need 3.3V power supply. The P2-P5 are 24V direct current power supply isolation modules, have the maximum output power of 10W, are used for realizing the electrical isolation between the controller and various external devices and preventing the influence of electromagnetic interference and surge caused by the external devices on the controller. P6 is a 2.8V power supply module, has a maximum output current of 200mA, and supplies power for a communication level conversion circuit in the GPRS communication circuit. P7 is a 4V power module, and the maximum output current is 3A, and the power is supplied to the GPRS wireless transparent transmission module in the GPRS communication circuit.

PE 1-PE 7 are external devices and are connected with a controller circuit board through connectors, so that power supply and data transmission are achieved. Wherein, the PE1 is a snow depth sensor with the model of HM31 and is connected with the circuit board through a connector J3; PE2 is a numerical control electric pan-tilt with model number HY-LW18-01B, and is connected with the circuit board through a connector J4; PE3 is a temperature sensor, the model is QT18B20, and is connected with the circuit board through a connector J5; the PE4 is an angle detection sensor installed on the snow depth sensor, is of a type SINDT02-485, and is connected with the circuit board through a connector J6; the PE5 is an angle detection sensor installed on the photovoltaic module backboard, is of a model number of SINDT02-485, and is connected with the circuit board through a connector J7; the PE6 is an irradiation sensor, the model is YGC-TBQ-KV-A2, and is connected with the circuit board through a connector J8; PE7 is a current sensor, model HDIB-CE-10P2O2, and is connected with the circuit board through a connector J9.

The connectors J10, J11 and J12 are voltage signal input ports of the photovoltaic module. A pin 1 of the connector J10 is connected with the positive output end of the No. 1 photovoltaic module, and a pin 2 of the connector J10 is connected with the negative output end of the No. 1 photovoltaic module. Pin 1 of connector J11 is connected with No. 2 photovoltaic module's anodal output, and connector J11's pin 2 is connected with No. 2 photovoltaic module's negative pole output. A pin 1 of the connector J12 is connected with the positive electrode output end of the No. 3 photovoltaic module, and a pin 2 of the connector J12 is connected with the negative electrode output end of the No. 3 photovoltaic module.

A pin 1 of the connector J14 is connected with a live wire of an alternating current 220V power supply, and a pin 2 of the connector J14 is connected with a zero wire of the alternating current 220V power supply. The pins 1, 3, 5, 7, 9 and 11 of the connector J15 are connected with one end of the 6 heat tracing bands of the No. 1 photovoltaic module, and the pins 2, 4, 6, 8, 10 and 12 of the J15 are connected with the other end of the 6 heat tracing bands of the No. 1 photovoltaic module back plate. The pins 1, 3, 5, 7, 9 and 11 of the connector J16 are connected with one end of the 6 heat tracing bands of the No. 2 photovoltaic module backboard, and the pins 2, 4, 6, 8, 10 and 12 of the J16 are connected with the other end of the 6 heat tracing bands of the No. 2 photovoltaic module. The pins 1, 3, 5, 7, 9 and 11 of the connector J17 are connected with one end of the 6 heat tracing bands of the No. 3 photovoltaic module backboard, and the pins 2, 4, 6, 8, 10 and 12 of the J17 are connected with the other end of the 6 heat tracing bands of the No. 3 photovoltaic module.

In addition, connector J1 is the DC power supply interface of the controller, J2 is the program downloading interface of the CPU, and connector J13 is connected with the 5 × 5 keyboard.

R24 is a 1% precision resistor with a resistance of 150 Ω. R38, R43, R48 are precision resistors of 1% precision and resistance values of 130 Ω. R90 is a precision resistor with 1% precision and has a resistance of 40.2K omega. R91 is a 1% precision resistor with a resistance of 10K Ω.

The light emitting diode LED1 (green) is a GPRS communication network status indicator lamp, and indicates that the GPRS network connection is established when the light emitting diode LED1 is turned on, and indicates that the GPRS network connection is disconnected when the light emitting diode LED1 is turned off. The light emitting diode LED2 (red) is a power indicator lamp of the GPRS wireless transparent transmission module, and when the power indicator lamp is turned on, the power indicator lamp indicates that the GPRS wireless transparent transmission module is powered on, and when the power indicator lamp is turned off, the power indicator lamp indicates that the GPRS wireless transparent transmission module stops supplying power.

LDM 1-LDM 4 are common mode inductors for suppressing common mode electromagnetic interference signals in the power supply, and the inductance value is 10 mH.

The utility model discloses a MM32F3273D7P chip is as the CPU of controller, and the general input/output port quantity of this chip is 52, if need control more quantity electric tracing bands, and the accessible chooses the more chip of general input/output port quantity to realize as CPU or through increasing input/output port expander circuit for use.

It should be understood that the above detailed description of the present invention is only for illustrating the present invention and is not limited by the technical solutions described in the embodiments of the present invention, and those skilled in the art should understand that the present invention can still be modified or equivalently replaced to achieve the same technical effects; as long as the use requirement is satisfied, the utility model is within the protection scope.

Claims (6)

1. A photovoltaic module parameter detection circuit comprises a photovoltaic module voltage detection circuit, a current detection circuit, an irradiation detection circuit, a snow depth detection circuit, an angle detection circuit and a temperature detection circuit, and is characterized in that a signal transmission port of a CPU circuit is respectively connected with a signal transmission port of the voltage detection circuit, a signal transmission port of the current detection circuit, a signal transmission port of the irradiation detection circuit, a signal transmission port of the snow depth detection circuit, a signal transmission port of the angle detection circuit and a signal transmission port of the temperature detection circuit, a detection signal input port of the current detection circuit is connected with a current transformer, a detection signal input port of the irradiation detection circuit is connected with a detection signal output port of an irradiation sensor, a snow depth sensor and a cradle head angle sensor are arranged at the upper end of a numerical control cradle head, a photovoltaic module angle sensor is arranged on the photovoltaic module, a detection signal output port of the holder angle sensor and a detection signal output port of the photovoltaic module angle sensor are respectively connected with a detection signal input port of the angle detection circuit; and a detection signal output port of the snow depth sensor is connected with a detection signal input port of the snow depth detection circuit.

2. The photovoltaic module parameter detection circuit according to claim 1, wherein the snow depth detection circuit comprises a common mode inductor LDM1, a first terminal of LDM1 is connected to +24V, a second terminal of LDM1 is connected to one terminal of inductor L1, the other terminal of L1 is connected to pin 1 of HLK-10D2424B chip P2, pin 2 of P2 is connected to the third terminal of LDM1, and the fourth terminal of LDM1 is grounded; the pin 4 of the P2 is connected with +24V-HM31 through an inductor L2, and the pin 3 of the P2 is connected with GND-HM31 through an inductor L3;

the 1 pin of a ST3485 chip U2 is connected with UART1-RX, the 2 and 3 pins of U2 are connected with RD1, the 4 pin of U2 is connected with UART1-TX, the 5 pin of U2 is respectively connected with ground and one end of a capacitor C21, the other end of C21 is respectively connected with 8 pins of +3.3V, U2, the 6 pin of U2 is respectively connected with one end of a resistor R5, one end of a resistor R6 and one end of a resistor R7, the other end of R6 is connected with +3.3V, the other end of R7 is connected with RS485-A1, the other end of R5 is respectively connected with the 7 pin of U2, one end of a resistor R3 and one end of a resistor R4, the other end of R3 is connected with ground, and the other end of R4 is connected with RS 485-B1.

3. The photovoltaic module parameter detection circuit of claim 1, wherein the temperature detection circuit adopts a QT18B20 chip PE3, and pins 1, 2 and 3 of PE3 are respectively connected with T-GND, T-DQ and T-3.3V.

4. The photovoltaic module parameter detection circuit of claim 1, wherein the angle detection circuit comprises a common mode inductor LDM3, a first terminal of LDM3 is connected to +24V, a second terminal of LDM3 is connected to one terminal of inductor L7, the other terminal of L7 is connected to pin 1 of HLK-10D2424B chip P4, a pin 2 of P4 is connected to the third terminal of LDM3, and a fourth terminal of LDM3 is connected to ground; the pin 4 of the P4 is connected with the +24V-SINDT through an inductor L8, and the pin 3 of the P4 is connected with the GND-SINDT through an inductor L9;

a pin 1 of a chip U4 of ST3485 is connected with UART3-RX, pins 2 and 3 of U4 are connected with RD3, a pin 4 of U4 is connected with UART3-TX, a pin 5 of U4 is respectively connected with the ground and one end of a capacitor C38, the other end of C38 is respectively connected with a pin 8 of +3.3V, U4, a pin 6 of U4 is respectively connected with one end of a resistor R16, one end of a resistor R17 and one end of a resistor R18, the other end of R17 is connected with +3.3V, the other end of R18 is connected with RS485-A3, the other end of R16 is respectively connected with a pin 7 of U4, one end of a resistor R14 and one end of a resistor R15, the other end of R14 is grounded, and the other end of R15 is connected with RS 485-B3;

the 1 pin of a ST3485 chip U5 is connected with UART4-RX, the 2 and 3 pins of U5 are connected with RD4, the 4 pin of U5 is connected with UART4-TX, the 5 pin of U5 is respectively connected with ground and one end of a capacitor C39, the other end of C39 is respectively connected with 8 pins of +3.3V, U5, the 6 pin of U5 is respectively connected with one end of a resistor R21, one end of a resistor R22 and one end of a resistor R23, the other end of R22 is connected with +3.3V, the other end of R23 is connected with RS485-A4, the other end of R21 is respectively connected with the 7 pin of U5, one end of a resistor R19 and one end of a resistor R20, the other end of R19 is connected with ground, and the other end of R20 is connected with RS 485-B4.

5. The photovoltaic module parameter detection circuit of claim 1, wherein the irradiation detection circuit comprises an LM324 chip CA1A, a pin 3 of CA1A is connected to CURRENT, a pin 2 of CA1A is connected to a pin 1 of CA1A and one end of a resistor R25, and the other end of R25 is connected to the ADC5 through the resistor R26.

6. The photovoltaic module parameter detection circuit of claim 1, wherein the current detection circuit comprises an LM324 chip CA1B, a pin 5 of CA1B is connected to one end of a resistor R29 and one end of a resistor R30 respectively, the other end of R29 is connected to the other end of R30 and ground respectively, a pin 6 of CA1B is connected to one end of a resistor R27 and one end of a resistor R28 respectively, the other end of R27 is connected to S-CUR, the other end of R28 is connected to a pin 7 of CA1B and one end of a resistor R31 respectively, the other end of R31 is connected to a pin 9 of CA1C and one end of a resistor R32 of the LM324 chip CA1, a pin 10 of CA1C is grounded through a resistor R33, the other end of R32 is connected to a pin 8 of CA1C and one end of a resistor R34 respectively, and the other end of R34 is connected to the ADC4 through a resistor R35;

pins 5-8 of a PE7 chip HDIB-CE-10P2O2 are correspondingly connected with a +24V pin, a GND pin, an S-CUR pin and a GND pin respectively;

the voltage detection circuit comprises a VSM025A/10 chip U6, a pin 1 of U6 is connected with PV + through parallel resistors R36 and R37, a pin 2 of U6 is connected with PV-, a pin 5 of U6 is connected with a pin 3 of a LM324 chip CA2A through a resistor R39, a pin 2 of CA2A is respectively connected with a pin 1 of CA2A and one end of a resistor R40, and the other end of R40 is connected with an ADC 1;

a pin 1 of a VSM025A/10 chip U7 and a pin 1 of U7 are connected with PV + through parallel resistors R41 and R42, a pin 2 of U7 is connected with PV-, a pin 5 of U7 is connected with a pin 5 of a LM324 chip CA2B through a resistor R44, a pin 6 of CA2B is respectively connected with a pin 7 of CA2B and one end of a resistor R45, and the other end of R45 is connected with an ADC 2;

VSM025A/10 chip U8, U8's 1 foot connects PV + through parallel resistance R46, R47, U8's 2 foot connects PV-, U8's 5 foot connects LM324 chip CA 2C's 10 foot through resistance R49, CA 2C's 9 foot respectively with CA 2C's 8 foot, resistance R50 one end links to each other, R50 other end termination ADC 3.

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