CN217088181U

CN217088181U - High-temperature baking structure for vacuum pipeline

Info

Publication number: CN217088181U
Application number: CN202220553709.4U
Authority: CN
Inventors: 焦纪强; 蒙峻; 柴振; 谢文君; 万亚鹏; 魏宁斐; 朱小荣; 马向利
Original assignee: Institute of Modern Physics of CAS
Current assignee: Institute of Modern Physics of CAS
Priority date: 2022-03-14
Filing date: 2022-03-14
Publication date: 2022-07-29
Anticipated expiration: 2032-03-14

Abstract

The utility model relates to a high temperature toasts structure for vacuum pipe, include by interior and wrap up insulating layer, zone of heating, heat insulation layer and the protective layer at the vacuum pipe outer wall outward in proper order. The total thickness of the high-temperature baking structure is 2 mm-3.5 mm, and compared with the traditional high-temperature baking structure with the thickness of 5mm, the total thickness of the baking structure is greatly reduced, the requirement of the air gap of the magnet is lowered, and the manufacturing cost of the magnet is further lowered. Insulating layer, temperature sensor, zone of heating, heat insulation layer and protective layer shaping baking sleeve as an organic whole, baking sleeve parcel is in on the outer wall of vacuum pipe. The integral composite structure is adopted to reduce the task load of installing the baking sleeve and improve the construction progress of a vacuum system of the large-scale particle accelerator.

Description

High-temperature baking structure for vacuum pipeline

Technical Field

The utility model relates to a particle accelerator engineering technical field especially relates to a novel high temperature toasts structure for vacuum pipe.

Background

Under the atmospheric condition, the inner wall of a vacuum pipeline in a vacuum system can adsorb a large amount of gas molecules, mainly comprising water vapor, and secondly comprising carbon monoxide, hydrogen, carbon dioxide, nitrogen and the like. The release speed of the gases in the vacuum environment is in direct proportion to the temperature of the system, and the release rate of the gases at normal temperature is slow. Therefore, in order to accelerate the release rate of gas molecules, the gas is required to be baked and degassed at a high temperature of 100-350 ℃ and discharged through a vacuum pump, so that the requirement of a vacuum system on extremely high vacuum degree is met. In the particle accelerator, the air gap of the magnet is closely related to the thickness of the baking structure, and in order to reduce the manufacturing cost of the magnet, the space reserved outside the vacuum pipeline for installing the high-temperature baking structure is very limited.

In the existing baking structure, on one hand, the total thickness of the heating layer and the heat insulating layer is more than 5mm, and the baking structure is too thick to meet the requirement of an air gap of a magnet and cannot finish high-temperature baking; on the other hand, the heating layer and the heat insulation layer in the baking structure are mutually independent and are of a non-integral structure, the heating layer needs to be installed firstly and then the heat insulation layer needs to be installed during baking, the workload is large, and the construction progress of a particle accelerator vacuum system is influenced.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model aims at providing a high temperature toasts structure for vacuum pipe, the gross thickness is 2mm ~ 3.5mm, can reduce the manufacturing cost of magnet, satisfies magnet air gap demand, and high temperature toasts the structure simultaneously and is monolithic structure, does not influence ion accelerator vacuum system's construction progress.

In order to achieve the purpose, the utility model adopts the following technical proposal:

the technical scheme of the utility model a high temperature toasts structure for vacuum pipe, include by interior and wrap up insulating layer, zone of heating, heat insulation layer and the protective layer at the vacuum pipe outer wall outward in proper order.

Further, the heating device also comprises a temperature sensor, wherein the temperature sensor is arranged in the heating layer.

Further, insulating layer, temperature sensor, zone of heating, heat insulation layer and protective layer shaping baking sleeve as an organic whole, baking sleeve parcel is in on the outer wall of vacuum pipe.

Further, the insulating layer is made of a polyimide film.

Further, the zone of heating includes fixed bed and nickel chromium alloy silk layer, the fixed bed covers the surface of insulating layer, nickel chromium alloy silk layer covers outside the fixed bed.

Further, the fixed layer is made of high temperature resistant cloth or stainless steel wire mesh.

Further, the heat insulation layer sequentially comprises a first high-temperature-resistant double-sided aluminum-plated film, a first heat insulation layer, a second high-temperature-resistant double-sided aluminum-plated film, a second heat insulation layer and a third high-temperature-resistant double-sided aluminum-plated film from inside to outside.

Further, the protective layer is made of high-temperature-resistant aluminized cloth, silica gel cloth or other non-metallic materials.

Further, under the condition of lower than 25 ℃, the thermal conductivity of the first heat-insulating layer and the second heat-insulating layer is less than or equal to 0.02W/m.K.

Further, the total thickness of the high-temperature baking structure is 2-3.5 mm.

The utility model discloses owing to take above technical scheme, it has following advantage:

(1) the utility model discloses a novel high temperature toasts structure, include by interior and wrap up well insulating layer, zone of heating, heat insulation layer and the protective layer at the vacuum pipe outer wall in proper order outward, the gross thickness is 2mm ~ 3.5mm, replaces traditional thickness to toast the structure for 5mm high temperature completely, has reduced greatly and has toasted the total thickness of structure.

(2) The total thickness of the baking structure is reduced, so that the air gap of the magnet is reduced, and the manufacturing cost of the magnet is greatly reduced.

(3) Insulating layer, temperature sensor, zone of heating, heat insulation layer and protective layer shaping stoving as an organic whole

The baking sleeve adopts an integral composite structure to reduce the task load of installing the baking sleeve, and the construction progress of a vacuum system of a large-scale particle accelerator is improved.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Like reference numerals refer to like parts throughout the drawings. In the drawings:

FIG. 1 is a cross-sectional view of a high temperature baked structure for a vacuum line wrapped around the outer wall of the vacuum line;

the reference symbols in the drawings denote the following:

1. a vacuum line; 11. an outer wall of the pipeline; 12. the inner wall of the pipeline; 2. an insulating layer; 3. a temperature sensor; 4. a heating layer; 41. a fixed layer; 42. a nichrome wire; 5. a heat insulating layer; 51. a first high-temperature resistant double-sided aluminizer; 52. a first thermal insulation layer; 53. a second high-temperature resistant double-sided aluminizer; 54. a second thermal insulation layer; 55. a third high-temperature resistant double-sided aluminizer; 6. and a protective layer.

Detailed Description

Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

As shown in fig. 1, the embodiment of the utility model provides a high temperature toasts structure for vacuum pipe, the gross thickness that high temperature toasted the structure is 2mm ~ 3.5mm, compares traditional thickness and is 5 mm's high temperature toasts structure, has reduced the gross thickness that toasts the structure greatly, has reduced the requirement of magnet air gap, and then reduces the manufacturing cost of magnet.

The high-temperature baking structure comprises an insulating layer 2, a heating layer 4, a heat insulating layer 5 and a protective layer 6 which are sequentially wrapped on the outer wall 11 of the vacuum pipeline from inside to outside.

According to the different shapes of the vacuum pipelines, the high-temperature baking structure can be in a circular shape, an oval shape, a runway shape, a polygonal shape and other structural shapes.

The vacuum pipeline 1 consists of a pipeline inner wall 12 and a pipeline outer wall 12, a vacuum cavity is formed in the middle, the vacuum pipeline is baked on line through a novel high-temperature baking structure, the baking temperature is 100-350 ℃, and the requirement of the high vacuum degree of a system is met.

The insulating layer 2 is made of a polyimide film, and the vacuum pipeline is prevented from being short-circuited due to the fact that the heating wires are exposed after being fused in the high-temperature baking process.

The high-temperature baking structure further comprises a temperature sensor 3, wherein the temperature sensor 3 is preferably a K-type thermocouple and is integrated into the heating layer 4 for detecting the temperature of the vacuum pipeline in the high-temperature baking process.

Insulating layer 2, temperature sensor 3, zone of heating 4, heat insulation layer 5 and the 6 shaping baking sleeve of formula as an organic whole of protective layer, the baking sleeve parcel is at vacuum pipe 1's outer wall. The novel high-temperature baking structure which is integrally compounded is adopted, so that the task load of installing the baking sleeve is reduced, and the construction progress of a vacuum system of a large-scale particle accelerator is promoted.

The zone of heating 4 is formed by the complex of fixed bed 41 and nichrome wire layer 42, and wherein nichrome wire layer 42 evenly arranges in fixed bed 41 according to the required heating area of vacuum pipe 1, fixed bed 41 cover in on the insulating layer 2. The fixing layer 41 is made of high temperature resistant cloth or stainless steel wire mesh. The nickel-chromium alloy wire layer 42 is heated by passing an electric current through it by means of an external power supply.

The heat insulation layer 5 is formed by compounding a first high-temperature-resistant double-sided aluminizer 51, a first heat insulation layer 52, a second high-temperature-resistant double-sided aluminizer 53, a second heat insulation layer 54 and a third high-temperature-resistant double-sided aluminizer 55 from inside to outside in sequence, and a super heat insulation effect is achieved.

The protective layer 6 is made of high-temperature-resistant aluminized cloth, silica gel cloth or other non-metallic materials and is used for preventing the high-temperature baking structure from being damaged by the external environment.

The total thickness of the novel high-temperature baking structure is 2-3.5 mm.

The first heat insulating layer 52 and the second heat insulating layer 54 have a thermal conductivity (at 25 ℃) of 0.02W/m.K or less.

The first high-temperature resistant double-sided aluminum-plated film 51, the first heat-insulating layer 52, the second high-temperature resistant double-sided aluminum-plated film 53, the second heat-insulating layer 54, and the third high-temperature resistant double-sided aluminum-plated film 55 may be formed in a conventionally known manner, such as plating, painting, and the like.

The utility model discloses a high temperature toasts structure for vacuum pipe, the gross thickness is 2mm ~ 3.5mm, can reduce the manufacturing cost of magnet, satisfies magnet air gap demand, and high temperature toasts the structure simultaneously and is monolithic structure, does not influence ion accelerator vacuum system's construction progress. The high-temperature baking structure adopts an integrally-compounded novel high-temperature baking structure, so that the task load of installing the baking sleeve is reduced, and the construction progress of a vacuum system of a large-scale particle accelerator is promoted.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides a high temperature toasts structure for vacuum tube, its characterized in that includes insulating layer, zone of heating, heat insulation and the protective layer of parcel in proper order at vacuum tube outer wall from inside to outside.

2. The high temperature baking structure for vacuum pipes of claim 1, further comprising a temperature sensor installed in the heating layer.

3. The high-temperature baking structure for the vacuum pipeline as claimed in claim 2, wherein the insulating layer, the temperature sensor, the heating layer, the insulating layer and the protective layer are formed into an integrated baking sleeve, and the baking sleeve is wrapped on the outer wall of the vacuum pipeline.

4. The high-temperature baking structure for vacuum pipes as claimed in claim 1, wherein the insulating layer material is a polyimide film.

5. The high-temperature baking structure for the vacuum pipe according to claim 1, wherein the heating layer comprises a fixing layer and a nickel-chromium alloy wire layer, the fixing layer covers the surface of the insulating layer, and the nickel-chromium alloy wire layer covers the fixing layer.

6. The high-temperature baking structure for the vacuum pipeline as claimed in claim 5, wherein the fixing layer is made of high-temperature-resistant cloth or stainless steel wire mesh.

7. The high-temperature baking structure for a vacuum pipe according to claim 5, wherein the heat insulating layer comprises, in order from inside to outside, a first high-temperature resistant double-sided aluminum plated film, a first heat insulating layer, a second high-temperature resistant double-sided aluminum plated film, a second heat insulating layer, and a third high-temperature resistant double-sided aluminum plated film.

8. The high-temperature baking structure for the vacuum pipeline as claimed in claim 6, wherein the protective layer is made of high-temperature-resistant aluminized cloth, silica gel cloth or other non-metallic materials.

9. The high-temperature baking structure for vacuum ducts as claimed in claim 7, wherein the thermal conductivity of the first and second thermal insulation layers is 0.02W/m-K or less at a temperature lower than 25 ℃.

10. The high-temperature baking structure for a vacuum pipe according to claim 1, wherein the total thickness of the high-temperature baking structure is 2mm to 3.5 mm.