CN217086046U

CN217086046U - Backplate subassembly and display device

Info

Publication number: CN217086046U
Application number: CN202220911965.6U
Authority: CN
Inventors: 胡灵超; 张新华; 陈伟雄; 郭玉宝
Original assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Current assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Priority date: 2022-04-19
Filing date: 2022-04-19
Publication date: 2022-07-29
Anticipated expiration: 2032-04-19

Abstract

The utility model discloses a backboard component and a display device, the backboard component comprises a backboard and a first cover plate, a backward protruding surrounding rib is arranged on the rear end face of the backboard, the surrounding rib and the backboard surround to form a first mounting groove, and the first mounting groove is used for mounting a PCB; the first cover plate is used for covering the first mounting groove. The utility model discloses aim at solving the problem that the thickness of current display device's backshell is thicker.

Description

Backplate subassembly and display device

Technical Field

The utility model relates to a display device technical field, concretely relates to backplate subassembly and display device.

Background

The rear shell of the existing display device is mostly formed by plastic injection molding, and the display device is high in cost and thick in thickness, so that the overall attractiveness of the display device is affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a backplate subassembly aims at solving the problem that the thickness of current display device's backshell is thick.

In order to achieve the above object, the utility model provides a backboard component, include:

the back plate is provided with a backward protruding surrounding rib on the back end surface, the surrounding rib and the back plate are surrounded to form a first mounting groove, and the first mounting groove is used for mounting a PCB (printed circuit board); and the number of the first and second groups,

the first cover plate is used for covering the first mounting groove.

Optionally, one end of the first mounting groove is provided with an opening, and the opening of the first mounting groove is arranged towards the first side of the back plate;

the backplate subassembly still includes the second apron, the second apron is installed on the backplate, be equipped with a lid portion of closing on the second apron, lid portion of closing is used for the lid to close the opening of mounting groove, at least part that the lid closed the portion is the opening setting, is used for supplying the IO interface of PCB board certainly the opening position that the lid closed the portion stretches out.

Optionally, a first step groove is formed at a connection position of the rear end of the back plate and the first side portion, and the second cover plate is correspondingly mounted on the first step groove;

the back plate is provided with a plurality of second mounting grooves in a backward concave mode at positions corresponding to the first step grooves, and the second mounting grooves are used for mounting a TCON plate and a sound box respectively.

Optionally, the second mounting groove for mounting the TCON board is disposed at a position corresponding to the first mounting groove, so that the TCON board is disposed between the back board and the PCB.

Optionally, at least a portion of the circumferential rib adjacent to the first side portion is recessed forward to form a lap joint platform, and the lap joint platform is used for the second cover plate to lap joint.

Optionally, enclose the muscle and be equipped with first heavy groove forward in a concave way, the second apron is equipped with the heavy groove of second forward in a concave way, first heavy groove with the heavy groove of second all with first mounting groove intercommunication, first heavy groove with the heavy groove of second encloses jointly and closes and form mounting platform, first apron corresponds to be installed on the mounting platform.

Optionally, a plurality of heat dissipation holes are formed in the surrounding rib, each heat dissipation hole comprises a first hole section and a second hole section which are communicated with each other, the first hole section is formed in the groove wall of the first sinking groove and communicated with the external environment, and the second hole section is formed in the groove bottom of the first sinking groove and communicated with the first mounting groove.

Optionally, a second stepped groove is concavely formed in the second cover plate to form the covering portion, and a groove wall of the second stepped groove is provided with an opening.

Optionally, a plurality of limiting members are installed at the bottom of the first installation groove, and the limiting members are used for limiting the movement of the PCB.

The utility model also provides a display device, display device includes the backplate subassembly, and this backplate subassembly includes:

the first cover plate is used for covering the first mounting groove.

The technical scheme of the utility model in, through the rear end of backplate is formed with enclose the muscle, thereby can reduce the whole thickness of backplate subassembly, enclose the muscle with the backplate is with the cooperation the backplate forms first mounting groove, first mounting groove is used for supplying the installation of PCB board, and passes through first apron lid closes first mounting groove to the realization is to PCB's protection. The formation mode of the surrounding rib is not limited, the surrounding rib 2 can be welded on the back of the back plate, or the surrounding rib can be formed by punching the back of the back plate, in this embodiment, the surrounding rib is formed by punching the back of the back plate, so that the back plate and the surrounding rib are integrally formed, the large surface of the back plate is not damaged, a large area is not formed and is suspended, the strength of the back plate can be enhanced, and the whole strength of the back plate is higher and the thickness of the back plate is thinner.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is an exploded schematic view of an embodiment of a backplane assembly provided by the present invention;

fig. 2 is a schematic front view of the back plate assembly provided by the present invention;

FIG. 3 is an enlarged schematic view of portion A of FIG. 2;

FIG. 4 is a schematic front view of the back plate of FIG. 1;

fig. 5 is a schematic front view of the second cover plate in fig. 1.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Back plate assembly	9	First sink
1	Back plate	10	Second sink tank
				2	Enclose muscle	11	Mounting platform
3	First mounting groove	12	Heat dissipation hole
				4	First cover plate	12a	First hole section
5	Second cover plate	12b	Second hole section
				5a	Covering part	13	Second step groove
6	First step groove	14	Position limiting piece
				7	Second mounting groove	15	PCB board
8	Lap joint platform	16	TCON board

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

In view of this, the present invention provides a back plate assembly, and fig. 1 to 5 illustrate an embodiment of the present invention.

Referring to fig. 1, 2 and 4, the back plate assembly 100 includes a back plate 1 and a first cover plate 4, a surrounding rib 2 protruding backward is disposed on a rear end surface of the back plate 1, the surrounding rib 2 and the back plate 1 surround to form a first mounting groove 3, and the first mounting groove 3 is used for mounting a PCB 15; the first cover plate 4 is used for covering the first mounting groove 3.

The technical scheme of the utility model in, through the rear end of backplate 1 is formed with enclose muscle 2, thereby can reduce backplate subassembly 100's whole thickness, enclose muscle 2 with backplate 1 is with the cooperation backplate 1 forms first mounting groove 3, first mounting groove 3 is used for supplying the installation of PCB board 15, and passes through 4 lids of first apron close first mounting groove 3 to the protection of realization to PCB. The formation mode of the surrounding rib 2 is not limited, and may be welding the surrounding rib 2 behind the back plate 1, or forming the surrounding rib 2 by punching backwards on the back plate 1, in this embodiment, specifically adopting the back plate 1 to punch backwards to form the surrounding rib 2, so that the back plate 1 and the surrounding rib 2 are integrally formed, the large surface of the back plate 1 is not damaged, a large area is not formed, the strength of the back plate 1 can be enhanced, and the overall strength of the back plate 1 is higher and the thickness of the back plate 1 is thinner.

It should be noted that, the surrounding rib 2 is in the rear end of the back plate 1 is set up the position and is not limited, and can be set up at any position, and the surrounding rib 2 is not completely surrounded and is set up, thereby when the PCB 15 is installed in the first mounting groove 3, the IO interface of the PCB 15 can stretch out outside the groove of the first mounting groove 3 for the user to wire.

In addition, when the PCB 15 is mounted in the first mounting groove 3, the PCB 15 is mounted in a reverse direction, so that the device surface of the PCB faces the back plate 1, and since the back plate 1 is not easily deformed, that is, the PCB 15 is not easily impacted, compared with the conventional back cover which is easily affected by external impact or weather, etc., a larger safety distance needs to be reserved, a smaller gap can be reserved in this embodiment, so as to reduce the overall thickness of the back plate assembly 100; wherein, 15 pin faces of PCB board go the orientation after the pin is handled first apron 4, first apron 4 adopts plastic class insulating material, has avoided in the traditional scheme 15 pin orientation of PCB board 1, backplate 1 is electrically conductive for the metal and need reserve pin creepage safe distance to further reduce complete machine thickness, and the first apron 4 of the plastic class that sets up can effectively reduce its self and warp owing to have 15 auxiliary stay of PCB board.

Further, one end of the first mounting groove 3 is provided with an opening, and the opening of the first mounting groove 3 is arranged towards the first side of the back plate 1; backplate subassembly 100 still includes second apron 5, second apron 5 is installed on backplate 1, be equipped with a lid on the second apron 5 and close a portion 5a, lid closes a portion 5a and is used for the lid to close the opening of mounting groove, the lid closes at least part of a portion 5a and is the opening setting for supply PCB board 15 IO interface certainly the opening position that the lid closed a portion 5a stretches out. By making the opening of the first installation groove 3 face the first side portion, wherein the first side portion can be any one of the upper, lower, left and right sides of the rear end of the back plate 1, specifically, in this embodiment, the opening of the first mounting groove 3 is disposed toward the lower end of the back plate 1, so that the IO interface of the PCB 15 extends out of the first mounting groove 3 downwards to adapt to the use habit of users, and the second cover plate 5 is mounted at the opening position corresponding to the first mounting groove 3, the opening position of the first mounting groove 3 is covered by the covering part 5a on the second cover plate 5, the opening position of the first mounting groove 3 can be protected in a large-area sealing mode, and only the socket part of the IO interface of the PCB extends out of the opening position of the covering part 5a, so that the protection effect on the PCB 15 is further enhanced.

Referring to fig. 1 and 4, a first step groove 6 is formed at a connection position of the rear end of the back plate 1 and the first side portion, and the second cover plate 5 is correspondingly mounted on the first step groove 6; the back plate 1 is provided with a plurality of second mounting grooves 7 at positions corresponding to the first step grooves 6 in a backward concave manner, and each second mounting groove 7 is used for mounting a TCON plate 16 and a sound box. By forming the first step groove 6, when the second cover plate 5 is installed, the second cover plate 5 is not exposed forward from the front end view of the back plate 1, so as to improve the overall aesthetic degree of the back plate assembly 100, and the second cover plate 5 is supported and installed by the step formed by the first step groove 6, so as to improve the installation stability of the second cover plate 5, in addition, a plurality of second installation grooves 7 are formed at the position of the first step groove 6, so that a TCON plate 16 and sound box parts can be installed, that is, the second cover plate 5 can protect a plurality of parts simultaneously while protecting the opening position of the first installation groove 3, and the second cover plate 5 is arranged in a long strip shape to adapt to the first step groove 6; wherein, second apron 5 can adopt integrated into one piece mode to form to improve bulk strength and convenient loading and unloading, also can adopt the concatenation formula of two segmentations, reduce the mould size and mould plastics the board, thereby reduce cost.

It is to be understood that the second mounting groove 7 is not limited to mounting the TCON plate 16 and the speaker, and accordingly, other parts may be mounted to the second mounting groove 7.

Further, the second mounting groove 7 for mounting the TCON board 16 is disposed corresponding to the first mounting groove 3, so that the TCON board 16 is disposed between the back plate 1 and the PCB 15. Through making TCON board 16 sink and be located the below of PCB board 15, can make PCB board 15 fully be close to backplate 1 removes, makes whole space reach the minimizing, can make first apron 4 minimizing design to the requirement such as the material, intensity, thickness of sheet reduces, has effectively reduced the cost simultaneously.

Referring to fig. 4, at least a portion of the surrounding rib 2 near the first side portion is recessed forward to form a lap joint platform 8, and the lap joint platform 8 is used for the second cover plate 5 to lap joint. Through be formed with on the muscle 2 overlap joint platform 8 corresponds the cover and establishes promptly the open position of first mounting groove 3 the portion 5a that closes can partly overlap joint on overlap joint platform 8 to can be to second apron 5 the portion 5a that closes plays the effect that intensity supported.

Referring to fig. 2, the surrounding rib 2 is provided with a first sinking groove 9 in a forward concave manner, the second cover plate 5 is provided with a second sinking groove 10 in a forward concave manner, the first sinking groove 9 and the second sinking groove 10 are both communicated with the first mounting groove 3, the first sinking groove 9 and the second sinking groove 10 jointly enclose to form a mounting platform 11, and the first cover plate 4 is correspondingly mounted on the mounting platform 11. Through search for fast enclose muscle 2 with be provided with on the second apron 5 respectively first heavy groove 9 with the heavy groove 10 of second, can be right all can support all sides of first apron 4 scope, just first apron 4 install to during the mounting platform 11 is last, sink by first apron 4 and second apron 5 surround, make its week side can not show out on the one hand, lead to easily receiving the external environment condition destruction or the condition that drops to appear, on the other hand, install first apron 4 in, can not increase backplate subassembly 100's whole thickness to reach further reduction backplate subassembly 100's effect.

Further, due to the influences of the forming process and the quality performance of the back plate 1, the sheet size cost of the first cover plate 4, the safety regulation limitation of the internal power supply, and the like, both the back plate 1 and the first cover plate 4 are not suitable for forming holes for heat dissipation, and in this embodiment, referring to fig. 2 and 3, a plurality of heat dissipation holes 12 are formed in the surrounding rib 2, each heat dissipation hole 12 includes a first hole section 12a and a second hole section 12b which are communicated with each other, the first hole section 12a is formed in the groove wall of the first sinking groove 9 and communicated with the external environment, and the second hole section 12b is formed in the groove bottom of the first sinking groove 9 and communicated with the first mounting groove 3. Because the louvre 12 is seted up on first heavy groove 9, and louvre 12 forms and is the angle setting each other first hole section 12a with second hole section 12b first apron 4 lid can not influence its radiating effect when closing, and is the setting of L type louvre 12 can have good dustproof effect, can effectively protect the part that is located fast search first mounting groove 3, and probe class article can not insert from the external environment to in the first mounting groove 3, its ann rule performance is better.

Referring to fig. 5, a second stepped groove 13 is concavely disposed on the second cover plate 5 to form the covering portion 5a, and a groove wall of the second stepped groove 13 is open. Through be provided with on the second apron 5 second step groove 13 is in order to form the portion 5a that closes is covered, the IO interface that corresponds PCB board 15 promptly falls on a cell wall on second step groove 13, and under the prerequisite that does not influence it and can peg graft fast to form a guard space that is the dog-ear setting, protect the IO interface part of PCB.

Referring to fig. 1 and 4, a plurality of position limiters 14 are mounted at the bottom of the first mounting groove 3, and the position limiters 14 are used for limiting the movement of the PCB 15. The limiting member 14 is not limited in the setting form, and may be a fixing boss or a rivet, so as to limit the movement of the PCB 15 in the first mounting groove 3, and prevent the PCB from being damaged.

The utility model also provides a display device, wherein, display device does not confine to the TV, also can be display equipment such as computer, display device includes backplate subassembly 100, above-mentioned embodiment is referred to backplate subassembly 100's concrete structure, because this display device has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is not given here again.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A backplane assembly, comprising:

the first cover plate is used for covering the first mounting groove.

2. The back plate assembly of claim 1, wherein an end of the first mounting slot is open, the opening of the first mounting slot being disposed toward the first side of the back plate;

3. The backplate assembly of claim 2, wherein a first stepped groove is formed at a connection position of the rear end of the backplate and the first side portion, and the second cover plate is correspondingly mounted on the first stepped groove;

4. The backplane assembly of claim 3, wherein the second mounting slot for mounting the TCON board is disposed corresponding to the first mounting slot for positioning the TCON board between the backplane and the PCB.

5. A backplate assembly according to claim 2, wherein the circumferential rib is recessed forwardly adjacent at least part of the first side portion to form a landing platform for the second cover plate.

6. The back plate assembly as claimed in claim 5, wherein the surrounding rib is recessed forward to form a first sunken groove, the second cover plate is recessed forward to form a second sunken groove, the first sunken groove and the second sunken groove are both communicated with the first mounting groove, the first sunken groove and the second sunken groove together enclose to form a mounting platform, and the first cover plate is correspondingly mounted on the mounting platform.

7. The backing plate assembly of claim 6 wherein the ribs have a plurality of heat dissipation holes formed therein, each heat dissipation hole comprising a first hole section and a second hole section communicating with each other, the first hole section being formed in a wall of the first recess and communicating with the external environment, and the second hole section being formed in a bottom of the first recess and communicating with the first mounting groove.

8. The backing plate assembly of claim 2 wherein the second cover plate is recessed with a second stepped groove to form the covering portion, a groove wall of the second stepped groove being open.

9. The backplane assembly according to claim 1, wherein a plurality of stoppers are mounted on a bottom of the first mounting groove for restricting movement of the PCB.

10. A display device comprising a backplane assembly according to any one of claims 1 to 9.