CN217072639U

CN217072639U - Lossless trepanning die for back plate

Info

Publication number: CN217072639U
Application number: CN202220644508.5U
Authority: CN
Inventors: 李心跃
Original assignee: Wuxi Jingdian Technology Co ltd
Current assignee: Wuxi Jingdian Technology Co ltd
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2022-07-29
Anticipated expiration: 2032-03-23

Abstract

The utility model discloses a harmless trepanning mould of backplate, including first stamping die and the groove that punches a hole, the inside mould guide pillar that is provided with of first stamping die, and mould guide pillar below is provided with the mould main part, the PTP material has been placed on mould main part surface, and PTP material one side is provided with the lead-out wire, it has the groove that punches a hole to run through open in the middle part of the mould main part, the groove that punches a hole is rectangle structural design, the groove right side that punches a hole is provided with the adhesion point, the groove minor face length of side that punches a hole is less than lead-out wire centre-to-centre spacing length. The utility model discloses a method of compound mould both guarantees to lay levelly and smoothly, guarantees again that the centre does not leak the sky, and the groove of punching a hole adopts the rectangle scheme, and the minor face length of side is less than lead-out wire centre-to-centre spacing 1 millimeter, has two adhesion points, guarantees that the material does not get rid of, also can normally open simultaneously, prevents extravagant material and manual work when having avoided overflowing, has increased the practicality of device self, has ensured the productivity effect maximize.

Description

Lossless trepanning die for back plate

Technical Field

The utility model relates to a mould field specifically is a harmless trepanning mould of backplate.

Background

The mould is various moulds and tools for obtaining required products by injection molding, blow molding, extrusion, die casting or forging forming, smelting, stamping and other methods in industrial production. In short, a mold is a tool used to make a shaped article, the tool being made up of various parts, different molds being made up of different parts. The processing of the appearance of an article is realized mainly by changing the physical state of a formed material, a stamping die is special technological equipment for processing the material (metal or nonmetal) into a part (or a semi-finished product) in cold stamping processing, and is called as a cold stamping die (commonly called as a cold stamping die), the scheme adopted at present is a scheme of a round hole or an elliptical hole, the outer diameter of the round hole is 2-3 mm larger than an outgoing line, the middle of the round hole is hollow, glue overflow is caused at the position of the outgoing line after the round hole or the elliptical hole enters a laminating machine for laminating, the product quality is influenced, and the work of cleaning and clearing the overflow glue of the laminating machine is increased.

The existing method for increasing the isolation small blocks to make up for the defects at present is used for preventing glue overflow, and the method wastes materials and labor, so that technical innovation is performed on the basis of the existing device aiming at the problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a harmless trepanning mould of backplate to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a harmless trepanning mould of backplate, includes first stamping die and the groove that punches a hole, the inside mould guide pillar that is provided with of first stamping die, and mould guide pillar below is provided with the mould main part, the PTP material has been placed on mould main part surface, and PTP material one side is provided with the lead-out wire, it has the groove that punches a hole to run through open in the middle part of the mould main part, the groove that punches a hole is rectangle structural design, the groove right side that punches a hole is provided with the adhesion point, the groove minor face length of punching a hole is less than lead-out wire centre-to-centre spacing length, the adhesion point sets up with the axis symmetry of the groove minor face that punches a hole, it has threely to punch a hole to be equidistant distribution at mould main part outer wall, the mould guide pillar is vertical distribution with the mould main part.

Furthermore, a punching cylinder is arranged above the die guide pillar, and the die guide pillar and the die main body are distributed on the same vertical line of the punching cylinder.

Furthermore, the two sides of the die guide column are provided with upper die locks, and the upper die locks are symmetrically arranged by the central axes of the two die guide columns.

Furthermore, an upper module is arranged at the bottom of the die guide column, and a lower module is arranged below the upper module.

Furthermore, lower die locking is arranged on two sides of the lower die block, and the center lines of the lower die block and the lower die block are symmetrically arranged.

Furthermore, a base is arranged below the outer portion of the first stamping die, and a first die carrier adjusting rod is arranged inside the base.

Furthermore, a second stamping die is arranged outside the die main body, and ejection cylinders are distributed inside the second stamping die.

Furthermore, an ejection forming head is arranged at the top of the ejection cylinder, and a second die carrier adjusting rod is arranged on the right side of the ejection cylinder.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a method of compound mould both guarantees to lay levelly and smoothly, guarantees again that the centre does not leak the sky, and the groove of punching a hole adopts the rectangle scheme, and the minor face length of side is less than lead-out wire centre-to-centre spacing 1 millimeter, has two adhesion points, guarantees that the material does not get rid of, also can normally open simultaneously, prevents extravagant material and manual work when having avoided overflowing, has increased the practicality of device self, has ensured the productivity effect maximize.

Drawings

Fig. 1 is a schematic view of a front view structure of a first stamping die of the present invention;

fig. 2 is a schematic structural view of a second stamping die in front view;

FIG. 3 is a schematic view of the front cross-section structure of the present invention;

fig. 4 is an enlarged schematic structural view of a portion a in fig. 3 according to the present invention.

In the figure: 1. a first stamping die; 2. a die guide post; 3. a mold body; 4. punching a cylinder; 5. locking the upper die; 6. an upper module; 7. a lower module; 8. locking the lower die; 9. a first die carrier adjusting rod; 10. a second stamping die; 11. a base; 12. ejecting out the cylinder; 13. ejecting the forming head; 14. a second die carrier adjusting rod; 15. punching a hole groove; 16. an adhesion point; 17. PTP material; 18. and (6) leading out wires.

Detailed Description

As shown in FIGS. 1-3, a back plate nondestructive trepanning die, a die guide post 2 is arranged in a first stamping die 1, a die main body 3 is arranged below the die guide post 2, a PTP material 17 is placed on the surface of the die main body 3, one side of the PTP material 17 is provided with a leading-out wire 18, the middle of the die main body 3 is provided with punching grooves 15 in a penetrating manner, the punching grooves 15 are in a rectangular structural design, the right side of each punching groove 15 is provided with an adhesion point 16, the side length of the short side of each punching groove 15 is smaller than the center distance length of the leading-out wire 18, the adhesion points 16 are symmetrically arranged on the central axis of the short side of each punching groove 15, the punching grooves 15 are distributed on the outer wall of the die main body 3 at equal intervals, the die guide posts 2 and the die main body 3 are vertically distributed, a punching cylinder 4 is arranged above the die guide post 2, the die guide post 2 and the die main body 3 are distributed on the same vertical line of the punching cylinder 4, upper die guide post 5 is arranged on two sides of the die guide post 2, the upper die locking 5 is symmetrically arranged around the central axis of the two die guide pillars 2, the upper die block 6 is arranged at the bottom of each die guide pillar 2, the lower die block 7 is arranged below the upper die block 6, the lower die locking 8 is arranged on each of two sides of the lower die block 7, and the central lines of the die blocks 7 below the lower die locking 8 are symmetrically arranged, after the device is pressed by the first stamping die 1, the device enters a working procedure, the inner die main body 3 can be subjected to fine adjustment through the first die set adjusting rod 9, the die main body 3 inside the second stamping die 10 can be adjusted through the second die set adjusting rod 14, deviation during pressing is prevented, and the yield of production is guaranteed;

as shown in fig. 4, a base 11 is arranged below the outer portion of the first stamping die 1, a first die carrier adjusting rod 9 is arranged inside the base 11, a second stamping die 10 is arranged outside the die body 3, ejection cylinders 12 are distributed inside the second stamping die 10, an ejection forming head 13 is arranged at the top of each ejection cylinder 12, and a second die carrier adjusting rod 14 is arranged on the right side of each ejection cylinder 12; the PTP material 17 is placed below a die main body 3 in a first stamping die 1, the upper die 6 fixes the PTP material through an upper die locking 5, then a punching cylinder 4 is pressed down to drive a die guide post 2 to move downwards simultaneously, so that the upper die 6 and a lower die 7 are closed, then the PTP material 17 moves a second stamping die 10 after the first stamping die 1 punches a hole, a forming head 13 is ejected out to form an angle of 70 degrees, the material is flat when the PTP material 17 is placed on a battery piece without influencing the subsequent process, the PTP material 17 is pressed into an outgoing line 18 when the PTP material reaches the position of the specified process, the device adopts a composite die method, the laying is flat, no hollow space is left in the middle, a punching groove 15 adopts a rectangular scheme, the side length of a short side is smaller than 1 mm of the center distance of the outgoing line 18, two adhesion points 16 are arranged, the material is not removed, the material can be normally lifted at the same time, the material and manpower are prevented from being wasted when the overflow is avoided, the practicability of the device is improved, and the maximization of production benefit is guaranteed;

the working principle is as follows: when the backboard lossless trepanning die is used, PTP materials 17 are placed below a die main body 3 inside a first stamping die 1, an upper die block 6 fixes the upper die block through an upper die locking rod 5, then a punching cylinder 4 is pressed down to drive a die guide post 2 to move downwards simultaneously, the upper die block 6 and a lower die block 7 are closed, the inner die main body 3 can be subjected to fine adjustment through a first die set adjusting rod 9, the die main body 3 inside a second stamping die 10 can be adjusted through a second die set adjusting rod 14, the PTP materials 17 after holes are punched by the first stamping die 1 move a second stamping die 10, an ejection forming head 13 forms an angle of 70 degrees, the materials are flat when the PTP materials 17 reach the battery piece, the subsequent processes are not influenced, the PTP materials 17 are pressed into an outgoing line 18 when the position of the specified processes is reached, and the backboard lossless trepanning die working principle is the backboard lossless trepanning die.

Claims

1. The lossless trepanning die for the backboard comprises a first stamping die (1) and punching grooves (15), and is characterized in that a die guide pillar (2) is arranged inside the first stamping die (1), a die main body (3) is arranged below the die guide pillar (2), a PTP material (17) is placed on the surface of the die main body (3), an outgoing line (18) is arranged on one side of the PTP material (17), the punching grooves (15) penetrate through the middle part of the die main body (3), the punching grooves (15) are designed in a rectangular structure, adhesion points (16) are arranged on the right side of the punching grooves (15), the side length of the short sides of the punching grooves (15) is smaller than the center distance of the outgoing line (18), the adhesion points (16) are symmetrically arranged by the central axis of the short sides of the punching grooves (15), and the punching grooves (15) are distributed on the outer wall of the die main body (3) at equal intervals, the die guide columns (2) and the die main body (3) are vertically distributed.

2. The back plate lossless trepanning die according to claim 1, characterized in that a punching cylinder (4) is arranged above the die guide pillar (2), and the die guide pillar (2) and the die main body (3) are distributed in the same vertical line of the punching cylinder (4).

3. The back plate lossless trepanning die according to claim 1, characterized in that the upper die locks (5) are arranged on two sides of the die guide pillar (2), and the upper die locks (5) are symmetrically arranged with the central axis of the two die guide pillars (2).

4. A backboard lossless trepanning mould according to claim 1, wherein the bottom of the mould guide pillar (2) is provided with an upper mould block (6), and a lower mould block (7) is arranged below the upper mould block (6).

5. A backboard lossless trepanning mould according to claim 4, wherein the lower module (7) is provided with lower mould locks (8) on both sides, and the lower mould locks (8) are symmetrically arranged on the center line of the lower module (7).

6. The backboard lossless trepanning die according to claim 1, wherein a base (11) is arranged below the outer portion of the first stamping die (1), and a first die carrier adjusting rod (9) is arranged inside the base (11).

7. The back plate lossless trepanning die is characterized in that a second stamping die (10) is arranged outside the die body (3) at the same time, and ejection cylinders (12) are distributed inside the second stamping die (10).

8. The back plate lossless trepanning die is characterized in that an ejection forming head (13) is arranged at the top of the ejection cylinder (12), and a second die carrier adjusting rod (14) is arranged on the right side of the ejection cylinder (12).