CN217064108U - Asymmetric rigid-flexible combined plate stacking structure - Google Patents
Asymmetric rigid-flexible combined plate stacking structure Download PDFInfo
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- CN217064108U CN217064108U CN202220453469.0U CN202220453469U CN217064108U CN 217064108 U CN217064108 U CN 217064108U CN 202220453469 U CN202220453469 U CN 202220453469U CN 217064108 U CN217064108 U CN 217064108U
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Abstract
The utility model discloses an asymmetric rigid-flex printed circuit board folds row structure, fold row structure for copper layer and dielectric layer fold the structure of row in turn, fold the plane direction of row structure and divide into first rigid region, bend a district, second rigid region, the cross-sectional direction divide into first fold row layer, second fold row layer, flexible sheet layer, third fold row layer; the first overlapping and arranging layer comprises a buffer compensation area and a first uncovering area, the buffer compensation area is distributed in the flexible folding area and the second rigid area, and the first uncovering area is distributed in the second rigid area; the second laminated row layer comprises a first low-frequency laminated row area and a first high-frequency laminated row area, and the first high-frequency laminated row area is distributed in the flexible folding area and the second rigid area; the flexible board layer is positioned between the second laminated layer and the third laminated layer; the third laminated row layer comprises a second low-frequency laminated row area and a second high-frequency laminated row area, and the second low-frequency laminated row area is distributed in the first rigid area and the flexible folding area; the bent and warped plates are prevented by optimizing the stacking structure.
Description
Technical Field
The utility model relates to a technical field of flexible circuit board processing especially relates to an asymmetric rigid-flex printed circuit board folds row structure.
Background
A Rigid-Flex printed circuit board (Rigid-Flex PCB) is a circuit board with welding support and flexibility, which is formed by combining a Rigid board and a flexible board, combining a thin-layer flexible bottom layer and a Rigid bottom layer and laminating the thin-layer flexible bottom layer and the Rigid bottom layer into a single component. The rigid-flex combined board changes the traditional planar design concept, expands the three-dimensional space concept, brings great convenience to product design and simultaneously brings great technical difficulty challenge.
For a rigid-flex board needing high-frequency signal transmission, a part of rigid area of the rigid-flex board is a high-frequency transmission area, namely, a medium layer is a high-frequency material medium layer, and a formed laminated layer is a high-frequency laminated layer.
According to the prior art, the rigid-flex printed circuit board comprises a low-frequency material and a high-frequency material, an asymmetric structure is formed, the problems of poor lamination glue filling, board bending, board warping and the like are easily caused if a general typesetting mode is adopted, the asymmetry of the stacked structure is aggravated by using the low-frequency material and using the high-frequency material less, and therefore the problems of larger board bending and board warping are easily caused.
SUMMERY OF THE UTILITY MODEL
The utility model discloses mainly solve both to contain the low frequency material, contain the asymmetric rigid-flex printed circuit board of high frequency material again, because of fold arrange the problem that the pressfitting back underfill that the structure is bad produces is bad, the board is bent, the board sticks up.
Based on the above problems, the utility model provides an asymmetric rigid-flex printed circuit board folds row structure, fold row structure for the alternating structure that folds row of copper layer and dielectric layer, its characterized in that, fold the plane direction of row structure and divide into first rigid region, bend the district, the second rigid region, the cross-sectional direction divide into first fold row layer, the second folds row layer, flexible sheet layer, the third folds the row layer; the first laminated layer comprises a buffer compensation area and a first uncovering area, the buffer compensation area is distributed in the flexible folding area and the second rigid area, and the first uncovering area is distributed in the second rigid area; the second laminated layer comprises a first low-frequency laminated region and a first high-frequency laminated region, and the first high-frequency laminated region is distributed in the flexible folding region and the second rigid region; the flexible sheet layer is positioned between the second and third tiers of stacking; the third laminated row layer comprises a second low-frequency laminated row area and a second high-frequency laminated row area, and the second low-frequency laminated row area is distributed in the first rigid area and the flexible folding area.
Optionally, the first stacked layer further includes a first release film layer, and the first release film layer is attached to the surface of the first stacked layer and is distributed in the second rigid region.
Optionally, the second stacked area further includes a second release film layer, and the second release film layer is attached to the surface of the first high-frequency stacked area and is distributed in the bending area.
Optionally, the flexible sheet layer further comprises a cover film layer, the cover film layer is attached to two sides of the flexible sheet layer respectively, and the cover film layer is distributed in the flexible folding area and partially extends into the first rigid area and the second rigid area.
Optionally, the third stacked layer further includes a third release film layer, and the third release film layer is attached to the surface of the second low-frequency stacked region and is distributed in the bending region.
Optionally, the thickness of the first low-frequency tandem region is greater than the thickness of the first high-frequency tandem region.
The utility model discloses a three key technology, one of them is for stretching into the folding district with the first high frequency of second fold row layer and folds the district, its two is for stretching into the folding district with the second low frequency of third fold row layer and folds the district, so, in the pressfitting in-process, the harmomegathus effect in first high frequency fold row district is greater than first low frequency fold row district, and the harmomegathus effect in the second low frequency fold row district of the third fold row layer of the other side of flexible sheet layer is greater than second high frequency fold row district, the pressfitting that has formed good and has used the flexible sheet layer as symmetrical harmomegathus and draw each other, offset each other folds the row structure, utilize the distribution that high frequency material and low frequency material are more homogenized, from folding row structure stop the production of back adhesive filling bad after the pressfitting, board song, board warp the board; the third step, the first laminated arrangement layer is set to be paved in the whole first rigid area, the bending area and the second rigid area instead of being arranged in the first rigid area, the height difference of the whole pressing can be effectively reduced by the first laminated arrangement layer, the asymmetry in the thickness and the number of structural layers is reduced, meanwhile, the mode of setting the same medium layer material in a large area can be utilized, the pressing expansion and contraction performance is more uniform, and the problems of plate bending and plate warping are further prevented.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a stacked structure of asymmetric rigid-flex panels according to the present invention;
fig. 2 is the utility model discloses a finished product rigid-flex printed circuit board cross-sectional schematic diagram that asymmetric rigid-flex printed circuit board folded row structure made.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name(s) | |
| 10 | Stacking |
210 | The first low-frequency overlapping region | |
| A | First rigid region | 220 | A first high frequency overlapping region | |
| | Bending area | 222 | Second release film layer | |
| C | Second |
300 | |
|
| 100 | First laminated |
333 | |
|
| 110 | |
400 | Third layer of stacked |
|
| 120 | First uncovering |
410 | Second low |
|
| 111 | The first |
420 | Second high |
|
| 200 | Second laminated |
444 | Third release film layer |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the scope protected by the embodiments of the present invention.
In order to better understand the technical scheme, the technical scheme is described in detail with reference to the attached drawings.
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of an asymmetric rigid-flex board stacking structure of the present invention; as can be seen from the figure, in this example, the lamination structure 10 is a structure in which copper layers and dielectric layers are alternately laminated, and the plane direction of the lamination structure 10 is divided into a first rigid region a, a flexible region B, and a second rigid region C, that is, the rigid-flexible board is composed of a rigid region and a flexible region, but in lamination, the rigid layer needs to cover the flexible region to complete processing.
The cross-sectional direction of the stacked structure 10 is divided into a first stacked layer 100, a second stacked layer 200, a flexible board layer 300, and a third stacked layer 400, that is, the whole stacked structure is formed by stacking the stacked layers.
The first stacked layer 100 includes a buffer compensation area 110 and a first uncovering area 120, the buffer compensation area 110 is distributed in the flexible folding area B and the second rigid area C, and the first uncovering area 120 is distributed in the second rigid area C; it should be noted that, in the finished board, the first lamination 100 actually needs to remain only in the first rigid region a, but in this embodiment, extending the first lamination 100 to the flexible folding region B and the second rigid region C helps to make the compression expansion and contraction performance more uniform by disposing the same dielectric layer material in a large area.
The second stacked layer 200 includes a first low-frequency stacked region 210 and a first high-frequency stacked region 220, and the first high-frequency stacked region 220 is distributed in the flexible folding region B and the second rigid region C; it should be noted that the first high-frequency stacked region 220 is disposed in the flexible region B and the second rigid region C, and the non-first low-frequency stacked region 210 is disposed in the flexible region B and the second rigid region C, so as to increase the coverage area of the high-frequency material, thereby increasing the influence of expansion and contraction of the high-frequency material during the pressing process, and in cooperation with the third stacked layer 400, the expansion and contraction are mutually constrained and offset.
The flexible sheet 300 layer is located between the second lamination layer 200 and the third lamination layer 400.
The third stacked layer 400 includes a second low-frequency stacked region 410 and a second high-frequency stacked region 420, and the second low-frequency stacked region 410 is distributed in the first rigid region a and the flexible folding region B; it should be noted that, corresponding to the second busbar layer 200, the third busbar layer 400 distributes the second low-frequency busbar region 410 in the first rigid region a and the bending region B, rather than distributing the second high-frequency busbar region 420 in the first rigid region a and the bending region B, which can be mutually constrained and offset with the expansion and contraction and stress of the second busbar layer 200, so that the compression expansion and contraction regions of the whole product are balanced in the same direction, thereby avoiding the problems of plate bending and plate warping.
Referring to fig. 2, fig. 2 is a schematic cross-sectional view of a finished rigid-flex printed circuit board manufactured by an asymmetric rigid-flex printed circuit board stacking structure according to the present invention; the finished rigid-flex board shown in fig. 2 is finally formed by utilizing the asymmetric rigid-flex board stacking structure shown in fig. 1 and through subsequent processing.
Referring to fig. 1, in the embodiment, the first stacked layer 100 further includes a first release film layer 111, the first release film layer 111 is attached to the surface of the first stacked layer 110 and distributed in the second rigid region C; the position of the first release film layer 111 is the area where the first uncovering area 120 is located, after the rigid-flex printed circuit board is processed, the first uncovering area 120 needs to be removed in an uncovering manner, and the first release film layer 111 plays a releasing role.
In this embodiment, the second stacking area 200 further includes a second release film layer 222, the second release film layer 222 is attached to the surface of the first high frequency stacking area 220 and is distributed in the bending area B, and similarly, the second release film layer 222 also plays a release role, so as to facilitate the subsequent uncovering process to remove the first stacking area 100 and the second stacking area 200 in the bending area B.
In this embodiment, the flexible board layer 300 further includes a cover film 333, the cover film 333 is respectively attached to two sides of the flexible board layer 300, the cover film 333 is distributed in the bending region B and partially extends into the first rigid region a and the second rigid region C; the cover film 333 serves to protect the copper layer circuit in the bending region B and can perform a bending function.
In this embodiment, the third stacked layer 400 further includes a third release film layer 444, the third release film layer 444 is attached to the surface of the second low frequency stacked region 410 and is distributed in the bending region B, and similarly, the third release film layer 444 plays a release role, so as to facilitate subsequent cover uncovering processing to remove the third stacked region 400 of the bending region B.
In this embodiment, the thickness of the first low frequency bank region 210 is greater than the thickness of the first high frequency bank region 220, and optionally, the asymmetric flex-rigid board may also have asymmetric thicknesses in the low frequency region and the high frequency region.
In conclusion, the technical personnel in the field understand easily, the utility model provides an asymmetric rigid-flex printed circuit board folds row structure adopts the mode that the row's of folding of flexbile plate both sides layer was compensated each other in turn on the one hand, reduces the harmomegathus influence of single material, and on the other hand adopts the mode that increases the low frequency material area, makes pressfitting harmomegathus performance homogenize more, has further prevented the crooked, the board of board upwarp the emergence of problem, and the structure sets up ingenious reasonable, is favorable to the processing of asymmetric rigid-flex printed circuit board.
The above only is the preferred embodiment of the present invention, not therefore the limitation of the patent scope of the embodiments of the present invention, all are in the utility model of the embodiment of the present invention conceive, utilize the equivalent structure transformation that embodiment of the present invention description and attached drawing content do, or directly/indirectly use and all include in other relevant technical fields the embodiment of the present invention is in the patent protection scope.
Claims (6)
1. A laminated structure of asymmetric rigid-flex boards is characterized in that copper layers and dielectric layers are alternately laminated,
the plane direction of the laminated structure is divided into a first rigid area, a flexible folding area and a second rigid area, and the cross section direction is divided into a first laminated layer, a second laminated layer, a flexible plate layer and a third laminated layer;
the first laminated layer comprises a buffer compensation area and a first uncovering area, the buffer compensation area is distributed in the flexible folding area and the second rigid area, and the first uncovering area is distributed in the second rigid area;
the second laminated layer comprises a first low-frequency laminated region and a first high-frequency laminated region, and the first high-frequency laminated region is distributed in the flexible folding region and the second rigid region;
the flexible sheet layer is positioned between the second and third tiers;
the third laminated row layer comprises a second low-frequency laminated row area and a second high-frequency laminated row area, and the second low-frequency laminated row area is distributed in the first rigid area and the flexible folding area.
2. The laminated structure of asymmetric rigid-flex printed boards according to claim 1, wherein the first laminated layer further comprises a first release film layer attached to the surface of the first laminated layer and distributed in the second rigid region.
3. The laminated structure of asymmetric rigid-flex printed circuit boards according to claim 1, wherein the second laminated region further comprises a second release film layer, and the second release film layer is attached to the surface of the first high-frequency laminated region and distributed in the bending region.
4. The laminated structure of asymmetric rigid-flex panels according to claim 1, wherein said flexible panel layer further comprises a covering film layer, said covering film layer is attached to both sides of said flexible panel layer, said covering film layer is distributed in said flexible folding region and partially extends into said first rigid region and said second rigid region.
5. The laminated structure of asymmetric rigid-flex printed boards according to claim 1, wherein the third laminated layer further comprises a third release film layer, and the third release film layer is attached to the surface of the second low-frequency laminated region and distributed in the bending region.
6. The asymmetric rigid-flex panel stacking structure as recited in claim 1, wherein said first low frequency stacking region has a thickness greater than a thickness of said first high frequency stacking region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220453469.0U CN217064108U (en) | 2022-03-04 | 2022-03-04 | Asymmetric rigid-flexible combined plate stacking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220453469.0U CN217064108U (en) | 2022-03-04 | 2022-03-04 | Asymmetric rigid-flexible combined plate stacking structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217064108U true CN217064108U (en) | 2022-07-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220453469.0U Active CN217064108U (en) | 2022-03-04 | 2022-03-04 | Asymmetric rigid-flexible combined plate stacking structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217064108U (en) |
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- 2022-03-04 CN CN202220453469.0U patent/CN217064108U/en active Active
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