CN217060919U - Cooling plate module - Google Patents

Abstract

A cooling plate module includes a cooling plate, a structure, a frame, and an absorber. The cooling plate includes a body, an inlet port, and an outlet port. The body has a first surface and a second surface, and the first surface abuts against the heat source. An inlet port is connected to the second surface and communicates with the body, the inlet port having an inlet. An outlet port is connected to the second surface and communicates with the body, the outlet port having an outlet. The structural part is provided with a third surface and a fourth surface, the third surface is connected with the second surface, the structural part is connected with the mainboard, and the heat source is arranged on the mainboard. The frame body is connected with the fourth surface and defines an accommodating space together with the fourth surface, and the inlet port and the outlet port are located in the accommodating space. The absorbing element is connected with the fourth surface and arranged in the accommodating space, the inlet port and the outlet port penetrate through the structural member and the absorbing element, and the absorbing element is positioned between the fourth surface and the inlet and the outlet. The cooling plate module can prevent the cooling liquid leaked from the connection position of the throat pipe from flowing or splashing to other electronic components to cause the damage of the electronic components.

Description

Cooling plate module

Technical Field

The utility model relates to a cooling plate module.

Background

Along with the improvement of living standard of people, people's demand for computer equipment is also increasing day by day. Manufacturers are also working to improve different computer devices in order to meet the increasing demands of consumers.

Generally, the application of cooling systems has become a common heat dissipation solution for increasing the performance of computer equipment. In order to improve the heat dissipation effect, manufacturers often use cooling fluid as a medium for circulation in the cooling system to remove heat energy from the computer equipment. However, if the connection of the cooling system is poor due to different conditions, the cooling liquid is liable to leak from the cooling system, which may cause a problem that other electronic components or circuits in the computer device are damaged.

Therefore, how to avoid the damage of the electronic components caused by the leakage of the cooling liquid is an important issue of great concern in the industry.

SUMMERY OF THE UTILITY MODEL

One of the objectives of the present invention is to provide a cooling plate module, which can prevent the coolant leaking from the connection of the throat from flowing or splashing to other electronic components, thereby preventing these electronic components from being damaged.

According to an embodiment of the present invention, a cooling plate module includes a cooling plate, a structural member, a frame body, and an absorbing element. The cooling plate includes a body, an inlet port, and an outlet port. The body has opposite first and second surfaces, the first surface being configured to abut a heat source. An inlet port is connected to the second surface and communicates with the body, the inlet port having an inlet configured to allow a cooling fluid to flow into the body. An outlet port is connected to the second surface and communicates with the body, the outlet port having an outlet configured to allow the coolant to flow out of the body. The structural member has a third surface and a fourth surface opposite to each other, the third surface is configured to be connected with the second surface, the structural member is configured to be connected with the main board, and the heat source is disposed on the main board. The frame body is connected with the fourth surface and defines an accommodating space together with the fourth surface, and the inlet port and the outlet port are at least partially positioned in the accommodating space. The absorption element is connected with the fourth surface and arranged in the accommodating space, the inlet port and the outlet port at least partially penetrate through the structural part and the absorption element, and the absorption element is at least partially positioned between the fourth surface and the inlet and the outlet.

In one or more embodiments of the present invention, the frame has an inner wall, and the inner wall is a complete ring.

In one or more embodiments of the present invention, the absorbing element at least partially abuts against the inner wall.

In one or more embodiments of the present invention, the absorbing element at least partially abuts against the inlet port and the outlet port.

In one or more embodiments of the present invention, the structural member and the frame are integrally formed.

In one or more embodiments of the present invention, the absorbing element is a sponge.

According to an embodiment of the present invention, a cooling plate module includes a cooling plate, a frame body, and an absorbing element. The cooling plate includes a main body, a structural plate, an inlet port, and an outlet port. The main body is provided with a side surface, a first surface and a second surface, wherein the first surface and the second surface are opposite to each other, the side surface is connected between the first surface and the second surface, and the first surface is configured to be abutted against a heat source. The structural plate is connected with the side face and provided with a third surface and a fourth surface which are opposite, the third surface is coplanar with the first surface, the structural plate is configured to be connected with the mainboard, and the heat source is arranged on the mainboard. An inlet port is connected to the side and communicates with the body, the inlet port having an inlet configured to allow a cooling fluid to flow into the body. An outlet port is connected to the side and communicates with the body, the outlet port having an outlet configured to allow the coolant to flow out of the body. The frame body is connected with the fourth surface, and defines an accommodating space together with the fourth surface, and the side surface, the inlet port and the outlet port are at least partially positioned in the accommodating space. The absorption element is connected with the fourth surface and arranged in the accommodating space, the main body at least partially penetrates through the absorption element, and at least part of the absorption element is positioned between the fourth surface and the inlet and the outlet.

In one or more embodiments of the present invention, the frame has an inner wall, and the inner wall is a complete ring.

In one or more embodiments of the present invention, the absorbing element at least partially abuts against the inner wall.

In one or more embodiments of the present invention, the absorbing element is at least partially abutted against the side surface.

In one or more embodiments of the present invention, the structural plate and the frame are integrally formed.

In one or more embodiments of the present invention, the absorbing element is a sponge.

The utility model discloses above-mentioned embodiment has following advantage at least:

(1) since the absorbing member is at least partially located between the fourth surface of the structural member or plate and the inlet of the inlet port and the outlet of the outlet port, even in the event of leakage at the junction of the inlet or outlet and the throat due to poor contact, the leaked coolant is easily absorbed by the absorbing member to prevent the leaked coolant from flowing or splashing onto other electronic components on the motherboard to cause damage to those electronic components.

(2) Because the inner wall of the frame body is in a complete ring shape, even if the absorption element reaches a saturated state after absorbing leaked cooling liquid and cannot continuously absorb the cooling liquid, the excessive cooling liquid is blocked by the frame body and is not easy to flow out of the frame body, and further protection can be provided for other electronic elements on the mainboard.

Drawings

Fig. 1 is a perspective view illustrating a cooling plate module according to an embodiment of the present invention;

FIG. 2 is an exploded view of the cold plate module of FIG. 1;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1;

fig. 4 is a perspective view illustrating a cooling plate module according to another embodiment of the present invention;

FIG. 5 is a schematic perspective view showing the cooling plate module of FIG. 4 with the absorbing element omitted;

fig. 6 is a perspective view illustrating a cooling plate module according to another embodiment of the present invention;

FIG. 7 is an exploded view showing the cold plate module of FIG. 6;

FIG. 8 is a cross-sectional view taken along line B-B of FIG. 6;

fig. 9 is a perspective view showing a cooling plate module according to still another embodiment of the present invention;

fig. 10 is a perspective view showing the cooling plate module of fig. 9, in which an absorption member is omitted.

[ description of symbols ]

100,300 cooling plate module

110,310 cooling plate

111,311 main body

111a,311a first surface

111b,311b second surface

112,312 inlet port

113,313 outlet port

120: structural member

120a third surface

120b fourth surface

130,330 frame body

131,331 inner wall

140,340 absorbing element

311c side surface

314 structural panels

314a third surface

314b fourth surface

500 heat source

600: main board

A-A, B-B line segment

OP1 inlet

OP2 outlet

SP (SP-containing space)

Detailed Description

In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, details of these implementations are not necessary. In addition, for the sake of simplicity, certain conventional structures and elements are shown in simplified schematic form in the drawings, and the same reference numerals will be used throughout the drawings to refer to the same or like elements. And features of different embodiments may be applied interactively, if possible.

Unless defined otherwise, all words (including technical and scientific terms) used herein have their ordinary meaning as is understood by those skilled in the art. Furthermore, the definitions of the above words and phrases in general dictionary should be read in the content of the present specification to be consistent with the meaning and meaning of the relevant fields of the present invention. Unless specifically defined otherwise, these terms are not to be interpreted in an idealized or overly formal sense.

Please refer to fig. 1-2. Fig. 1 is a perspective view illustrating a cooling plate module 100 according to an embodiment of the present invention. Fig. 2 is an exploded view of the cold plate module 100 of fig. 1. In the present embodiment, as shown in fig. 1 to 2, the cooling plate module 100 includes a cooling plate 110, a structure 120, a frame 130, and an absorber 140. The cooling plate 110 includes a main body 111, an inlet port 112, and an outlet port 113. The main body 111 has a first surface 111a (see fig. 3) and a second surface 111b opposite to each other. The inlet port 112 is connected to the second surface 111b and communicates with the main body 111, the inlet port 112 having an inlet OP1, the inlet OP1 being configured to allow the cooling liquid to flow into the main body 111. An outlet port 113 is connected to the second surface 111b and communicates with the body 111, the outlet port 113 having an outlet OP2, the outlet OP2 being configured to allow the coolant to flow out of the body 111. The structural member 120 has a third surface 120a (see fig. 3) and a fourth surface 120b opposite to each other, and the third surface 120a of the structural member 120 is configured to press against and connect with the second surface 111b of the main body 111. The frame 130 is connected to the fourth surface 120b of the structural member 120, and defines an accommodating space SP together with the fourth surface 120 b. For example, the frame 130 and the structural member 120 may be connected by welding, but the invention is not limited thereto. The absorption element 140 is connected to the fourth surface 120b of the structural member 120 and disposed in the accommodating space SP.

Please refer to fig. 3. Fig. 3 is a schematic cross-sectional view along line a-a of fig. 1. In the present embodiment, as shown in fig. 1 to 3, the first surface 111a of the main body 111 is disposed to abut against the heat source 500, so that the cooling plate 110 takes away heat energy of the heat source 500 to radiate the heat energy from the heat source 500. For example, the heat source 500 may be a chip or a die and is disposed on a motherboard 600 of the electronic device, and the motherboard 600 may be an Application Specific Integrated Circuit (ASIC) board, for example, but the invention is not limited thereto. For clarity and simplicity of the drawings, the heat source 500 and the motherboard 600 are not shown in FIGS. 1-2. Furthermore, the structural member 120 is configured to connect to the main board 600, and the connection manner between the structural member 120 and the main board 600 may be, for example, a screw connection, but the present invention is not limited thereto. The inlet port 112 and the outlet port 113 of the cooling plate 110 are at least partially located in the accommodating space SP, and the inlet port 112 and the outlet port 113 of the cooling plate 110 at least partially pass through the structural member 120 and the absorption element 140. It is noted that in this embodiment, the absorbing element 140 is at least partially located between the fourth surface 120b of the structural member 120 and the inlet OP1 of the inlet port 112 and the outlet OP2 of the outlet port 113.

In practical applications, a user connects the inlet OP1 and the outlet OP2 of the cooling plate 110 with a throat (not shown) to allow the cooling liquid to flow into and out of the main body 111. For example, the throat may be sleeved over a portion of the inlet port 112 and a portion of the outlet port 113, respectively, and clamped to the inlet port 112 and the outlet port 113 with a clamp, respectively. As described above, the absorbing element 140 is at least partially located between the fourth surface 120b of the structure 120 and the inlet OP1 of the inlet port 112 and the outlet OP2 of the outlet port 113. In this way, even if the inlet OP1 or the outlet OP2 is in poor contact with the throat pipe and leaks, the leaked coolant is easily absorbed by the absorption element 140, so as to prevent the leaked coolant from flowing or splashing to other electronic components (not shown) on the motherboard 600 and causing damage to the electronic components. The cooling fluid absorbed by the absorbing element 140 can then be carried away by thermal evaporation from the environment. For example, the absorbing element 140 is a sponge, but the present invention is not limited thereto.

Further, as shown in fig. 1 to 3, the frame 130 has an inner wall 131, and the inner wall 131 is in a complete ring shape (see fig. 1 to 2), that is, the frame 130 completely surrounds the accommodating space SP and the absorbing element 140. Therefore, even if the absorption element 140 reaches a saturated state after absorbing the leaked cooling liquid and cannot absorb the cooling liquid any more, the excessive cooling liquid is blocked by the frame 130 and is not easy to flow out of the frame 130, so that the other electronic components on the motherboard 600 can be further protected.

Furthermore, as shown in fig. 1 and 3, the absorption element 140 at least partially abuts against the inner wall 131 of the frame 130, so as to fix the position of the absorption element 140 relative to the frame 130. Additionally, the absorbing element 140 also at least partially abuts the inlet port 112 and the outlet port 113 of the cooling plate 110.

Please refer to fig. 4-5. Fig. 4 is a perspective view illustrating a cooling plate module 100 according to another embodiment of the present invention. Fig. 5 is a schematic perspective view illustrating the cooling plate module 100 of fig. 4, in which the absorption element 140 is omitted. In the present embodiment, as shown in fig. 4 to 5, the structure 120 and the frame 130 are integrally formed. For example, the height difference between the integrally formed structural member 120 and the frame 130 can be formed by milling or molding, but the invention is not limited thereto.

Please refer to fig. 6-7. Fig. 6 is a schematic perspective view illustrating a cooling plate module 300 according to still another embodiment of the present invention. Fig. 7 is an exploded view showing the cooling plate module 300 of fig. 6. In the present embodiment, as shown in fig. 6 to 7, the cooling plate module 300 includes a cooling plate 310, a frame 330, and an absorption element 340. The cooling plate 310 includes a main body 311, a structural plate 314, an inlet port 312, and an outlet port 313. The main body 311 has a side 311c, a first surface 311a (see fig. 8) and a second surface 311b, the first surface 311a and the second surface 311b are opposite to each other, and the side 311c is connected between the first surface 311a and the second surface 311 b. The structural plate 314 is connected to the side 311c and has a third surface 314a (see fig. 8) and a fourth surface 314b opposite to each other. The inlet port 312 is connected to the side 311c and communicated with the main body 311, the inlet port 312 has an inlet OP1, and the inlet OP1 is configured to allow the cooling liquid to flow into the main body 311. An outlet port 313 is connected to side 311c and communicates with body 311, outlet port 313 having an outlet OP2, outlet OP2 configured to allow coolant to flow out of body 311. The frame 330 is connected to the fourth surface 314b of the structural plate 314, and defines an accommodating space SP together with the fourth surface 314b, and the side surface 311c, the inlet port 312 and the outlet port 313 are at least partially located in the accommodating space SP. The absorption element 340 is connected to the fourth surface 314b of the structural plate 314 and disposed in the accommodating space SP.

Please refer to fig. 8. FIG. 8 is a cross-sectional view taken along line B-B of FIG. 6. In the present embodiment, as shown in fig. 6 to 8, the third surface 314a of the structural plate 314 is coplanar with the first surface 311a of the main body 311, and the first surface 311a is disposed to abut against the heat source 500, so that the cooling plate 310 takes away the heat energy of the heat source 500 to dissipate the heat of the heat source 500. For example, the heat source 500 may be a chip or a die and is disposed on a motherboard 600 of the electronic device, and the motherboard 600 may be an ASIC board, for example, but the invention is not limited thereto. For clarity and simplicity of the drawings, the heat source 500 and the main board 600 are not shown in fig. 6 to 7. Moreover, the structural board 314 is configured to connect to the main board 600, and the connection manner between the structural board 314 and the main board 600 may be, for example, a screw connection, but the present invention is not limited thereto. The inlet port 312 and the outlet port 313 of the cooling plate 310 are at least partially located in the accommodating space SP, and the main body 311 of the cooling plate 310 at least partially passes through the absorption element 340. It is noted that in the present embodiment, the absorbing element 340 is at least partially located between the fourth surface 314b of the structural plate 314 and the inlet OP1 of the inlet port 312 and the outlet OP2 of the outlet port 313.

In practical applications, a user connects the inlet OP1 and the outlet OP2 of the cooling plate 310 with a throat (not shown) to allow the cooling liquid to flow into and out of the main body 311. For example, the throat may be sleeved over a portion of inlet port 312 and a portion of outlet port 313, respectively, and clamped to inlet port 312 and outlet port 313, respectively, with clamps. As described above, the absorbing element 340 is at least partially located between the fourth surface 314b of the structural panel 314 and the inlet OP1 of the inlet port 312 and the outlet OP2 of the outlet port 313. In this way, even if the inlet OP1 or the outlet OP2 is in a leak state due to poor contact with the throat, the leaked coolant is easily absorbed by the absorption element 340, so as to prevent the leaked coolant from flowing or splashing to other electronic components (not shown) on the motherboard 600 to damage the electronic components. The cooling fluid absorbed by the absorbing element 340 may then be carried away by thermal evaporation from the environment. For example, the absorbing element 340 is a sponge, but the present invention is not limited thereto.

Further, as shown in fig. 6 to 8, the frame 330 has an inner wall 331, and the inner wall 331 is in a complete ring shape (see fig. 6 to 7), that is, the frame 330 completely surrounds the accommodating space SP and the absorbing element 340. Therefore, even if the absorption element 340 is saturated after absorbing the leaked coolant and cannot absorb the coolant continuously, the excess coolant is blocked by the frame 330 and is not easy to flow out of the frame 330, so that other electronic components on the motherboard 600 can be further protected.

Further, as shown in fig. 6 and 8, the absorbing element 340 at least partially abuts against the inner wall 331 of the frame 330 to fix the position of the absorbing element 340 relative to the frame 330. In addition, the absorption element 340 is also at least partially abutted against the side surface 311c of the cooling plate 310.

Please refer to fig. 9-10. Fig. 9 is a perspective view illustrating a cooling plate module 300 according to another embodiment of the present invention. Fig. 10 is a perspective view illustrating the cooling plate module 300 of fig. 9, in which the absorption member 340 is omitted. In the present embodiment, as shown in fig. 9 to 10, the structure plate 314 and the frame 330 are integrally molded. For example, the height difference between the structural plate 314 and the frame 330 can be formed by milling or molding, but the invention is not limited thereto.

To sum up, the technical solution disclosed by the above embodiments of the present invention has at least the following advantages:

(1) since the absorbing element is located at least partially between the fourth surface of the structural member or plate and the inlet of the inlet port and the outlet of the outlet port, even in the event of a leak at the junction of the inlet or outlet and the throat due to poor contact, the leaked coolant is readily absorbed by the absorbing element to prevent the leaked coolant from flowing or splashing onto other electronic components on the motherboard and causing damage to those electronic components.

(2) Because the inner wall of the frame body is in a complete ring shape, even if the absorption element reaches a saturated state after absorbing leaked cooling liquid and cannot continuously absorb the cooling liquid, the excessive cooling liquid is blocked by the frame body and is not easy to flow out of the frame body, and further protection can be provided for other electronic elements on the mainboard.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims (12)

1. A cold plate module, comprising:

a cooling plate, comprising:

a body having a first surface and a second surface opposite to the first surface, the first surface being configured to abut a heat source;

an inlet port connected to the second surface and communicating with the body, the inlet port having an inlet configured to allow a cooling fluid to flow into the body; and

an outlet port connected to the second surface and communicating with the body, the outlet port having an outlet configured to allow the cooling fluid to flow out of the body;

a structural member having a third surface and a fourth surface opposite to each other, the third surface being configured to be connected to the second surface, the structural member being configured to be connected to a motherboard, the heat source being disposed on the motherboard;

the frame body is connected with the fourth surface and defines an accommodating space together with the fourth surface, and the inlet port and the outlet port are at least partially positioned in the accommodating space; and

and the absorbing element is connected with the fourth surface and arranged in the accommodating space, the inlet port and the outlet port at least partially penetrate through the structural member and the absorbing element, and at least part of the absorbing element is positioned between the fourth surface and the inlet and the outlet.

2. The cold plate module of claim 1, wherein the frame has an inner wall that is substantially annular.

3. A cooling plate module according to claim 2, characterized in that the absorption element abuts at least partly against the inner wall.

4. A cooling plate module according to claim 1, characterized in that the absorption element abuts at least partially against the inlet port and the outlet port.

5. The cooling plate module of claim 1, wherein the structural member is integrally formed with the frame.

6. A cooling plate module according to claim 1, characterized in that the absorption element is a sponge.

7. A cold plate module, comprising:

a cooling plate, comprising:

a main body having a side surface, a first surface and a second surface, the first surface and the second surface being opposite to each other, the side surface being connected between the first surface and the second surface, the first surface being configured to abut a heat source;

a structural plate connected to the side surface and having a third surface and a fourth surface opposite to the third surface, the third surface being coplanar with the first surface, the structural plate being configured to connect to a main board, the heat source being disposed on the main board;

an inlet port connected to the side and communicating with the body, the inlet port having an inlet configured to allow a cooling fluid to flow into the body; and

an outlet port connected to the side and communicating with the body, the outlet port having an outlet configured to allow the cooling fluid to exit the body;

the frame body is connected with the fourth surface and defines an accommodating space together with the fourth surface, and the side surface, the inlet port and the outlet port are at least partially positioned in the accommodating space; and

an absorbing element connected with the fourth surface and arranged in the accommodating space, wherein the main body at least partially penetrates through the absorbing element, and the absorbing element is at least partially positioned between the fourth surface and the inlet and the outlet.

8. The cold plate module of claim 7, wherein the frame has an inner wall that is substantially annular.

9. A cooling plate module according to claim 8, characterized in that the absorption element abuts at least partly against the inner wall.

10. A cooling plate module according to claim 7, characterized in that the absorption element abuts at least partially against the side face.

11. The cooling plate module of claim 7, wherein the structural plate is integrally formed with the frame.

12. A cooling plate module according to claim 7, characterized in that the absorption element is a sponge.

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