CN217060903U

CN217060903U - Buckle type dustproof cooling computer main machine case

Info

Publication number: CN217060903U
Application number: CN202220906234.2U
Authority: CN
Inventors: 宋志远; 刘烨
Original assignee: Wuchang Institute of Technology
Current assignee: Wuchang Institute of Technology
Priority date: 2022-04-19
Filing date: 2022-04-19
Publication date: 2022-07-26
Anticipated expiration: 2032-04-19

Abstract

The utility model discloses a dustproof cooling computer mainframe machine case of buckle formula, the power distribution box comprises a box body, the inner wall fixed mounting of box has the electronic component body, and the front of box is rotated and is connected with the chamber door, and the inner wall fixed mounting of box has two sliding frame, and sliding frame's inner wall sliding connection has first dustproof otter board, and logical groove has been seted up to the left surface of box, and the left surface of box is provided with the dustproof otter board of grafting frame and second respectively, and the upper surface and the lower surface of the dustproof otter board of second all are provided with the buckle piece. This dustproof cooling computer mainframe of buckle formula machine case, people open the chamber door, can be convenient take out first dustproof otter board from the inner wall slip of sliding frame, the snap ring supports to the buckle piece and presses fixedly, has further fixed the dustproof otter board of second, only needs stimulate the snap ring left, can relieve the snap ring to the restriction of buckle piece and the dustproof otter board of second, people can be convenient take off the dustproof otter board of second to the dismouting process of dust screen has been simplified.

Description

Buckle type dustproof cooling computer main machine case

Technical Field

The utility model relates to a computer machine case technical field specifically is a dustproof cooling computer host computer machine case of buckle formula.

Background

The inside of the computer mainframe case contains a large number of circuit structures and various electronic elements, and because the structures and the electronic elements generate a large amount of heat during working, a heat dissipation device and a dust screen are needed to be used inside the case to dissipate heat and prevent dust of a working computer, so that the computer is prevented from being broken down.

The dust screen of machine case all need be unpack apart and clear up after using a period, but current dust screen all adopts the bolt fastening on quick-witted case, and is more loaded down with trivial details to the dismouting process of dust screen, and for this reason, we release a buckle formula dustproof cooling computer mainframe machine case.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dustproof cooling computer mainframe of buckle formula machine case to solve the problem of proposing in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a dustproof cooling computer host computer machine case of buckle formula, the power distribution box comprises a box body, the inner wall fixed mounting of box has the electronic component body, the front of box is rotated and is connected with the chamber door, the inner wall fixed mounting of box has two sliding frame, sliding frame's inner wall sliding connection has first dustproof otter board, logical groove has been seted up to the left surface of box, the left surface of box is provided with respectively inserts frame and the dustproof otter board of second, the upper surface and the lower surface of the dustproof otter board of second all are provided with the buckle piece, the inner wall at inserting frame is pegged graft on the surface of below buckle piece, the left surface fixed mounting of box has the installing frame, the inner wall rotation of installing frame is connected with the axis of rotation, the fixed surface of axis of rotation installs the snap ring, the draw-in groove has been seted up to the left surface of top buckle piece, the surface of snap ring supports the pressure contact with the inner wall of draw-in groove, the inner wall of box is provided with heat dissipation mechanism and stop gear respectively.

Preferably, the surface cover of axis of rotation is equipped with the torsional spring, the tip of torsional spring and the inner wall fixed connection of installing frame.

Preferably, the heat dissipation mechanism comprises a placing frame, a heat dissipation groove is formed in the lower surface of the placing frame, an electric fan is fixedly mounted on the inner wall of the placing frame, and a semiconductor refrigerator is fixedly mounted on the right side face of the placing frame.

Preferably, a U-shaped frame is fixedly mounted on the inner left side wall of the box body, the surface of the placing frame is in sliding connection with the inner wall of the U-shaped frame, and the surface of the refrigerating end of the semiconductor refrigerator is in abutting contact with the surface of the electronic element body.

Preferably, the limiting mechanism comprises a telescopic cylinder fixedly connected with the right side wall in the box body, the inner wall of the telescopic cylinder is connected with a telescopic column in a sliding mode through a tension spring, and a limiting column is fixedly mounted at the end of the telescopic column.

Preferably, the upper surface of the box body is provided with a plurality of air inlets.

Preferably, the left side surface of the box body is provided with a plurality of exhaust holes.

Preferably, the upper surface and the lower surface of the placing frame are fixedly provided with a sleeve frame, and the inner wall of the sleeve frame is connected with a limiting concave plate in a sliding manner.

The utility model provides a dustproof cooling computer host computer machine case of buckle formula possesses following beneficial effect:

1. this dustproof cooling computer mainframe of buckle formula machine case, through setting up sliding frame and snap ring, support when the chamber door is closed and press first dustproof otter board, and then fix first dustproof otter board, people open the chamber door, can be convenient slide first dustproof otter board from sliding frame's inner wall and take out, simultaneously under the effect of torsional spring, the lower extreme that the axis of rotation can drive the snap ring extrudees right, and then utilize the snap ring to support to press the buckle piece fixedly, the dustproof otter board of second has further been fixed, only need stimulate the snap ring left, can relieve the restriction of snap ring to buckle piece and the dustproof otter board of second, people can be convenient take off the dustproof otter board of second, thereby the dismouting process of dust screen has been simplified.

2. This dustproof cooling computer mainframe of buckle formula is through setting up stop gear, and flexible post moves right under the effect of extension spring, and spacing post and then supports right and press spacing concave plate, and further lay the frame and be driven and extrude the removal right to make the surface of semiconductor cooler refrigeration end closely laminate with the surface of electronic component body, optimized the refrigeration radiating effect of semiconductor cooler to the electronic component body.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the three-dimensional structure of the present invention;

FIG. 3 is a perspective view of the placement frame;

FIG. 4 is a schematic view of a three-dimensional front cross-section structure of the telescopic frame;

FIG. 5 is an enlarged view of the structure at A in FIG. 2;

fig. 6 is a schematic three-dimensional top-cut structure diagram of the mounting frame.

In the figure: the electronic component comprises a box body 1, an electronic component body 2, a box door 3, a sliding frame 4, a first dustproof screen plate 5, an inserting frame 6, a second dustproof screen plate 7, a buckling block 8, a mounting frame 9, a clamping ring 10, a torsion spring 11, a placing frame 12, a heat dissipation groove 13, an electric fan 14, a semiconductor refrigerator 15, a sleeve frame 16, a limiting concave plate 17, a U-shaped frame 18, a telescopic cylinder 19, a tension spring 20, a telescopic column 21, a limiting column 22, an air inlet 23 and an air outlet 24.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a dustproof cooling computer mainframe machine case of buckle formula, includes box 1, and the inner wall fixed mounting of box 1 has electronic component body 2, and the front of box 1 is rotated and is connected with chamber door 3, and the inner wall fixed mounting of box 1 has two sliding frame 4, and the inner wall sliding connection of sliding frame 4 has first dustproof otter board 5.

Logical groove has been seted up to the left surface of box 1, the left surface of box 1 is provided with respectively and inserts frame 6 and the dustproof otter board 7 of second, the upper surface and the lower surface of the dustproof otter board 7 of second all are provided with buckle piece 8, peg graft at the inner wall of inserting frame 6 in the surface of below buckle piece 8, the left surface fixed mounting of box 1 has installing frame 9, the inner wall of installing frame 9 rotates and is connected with the axis of rotation, the surperficial cover of axis of rotation is equipped with torsional spring 11, the tip of torsional spring 11 and the inner wall fixed connection of installing frame 9, the fixed surface of axis of rotation has snap ring 10, the draw-in groove has been seted up to the left surface of top buckle piece 8, the surface of snap ring 10 supports the pressure contact with the inner wall of draw-in groove, the inner wall of box 1 is provided with heat dissipation mechanism and stop gear respectively.

Through setting up sliding frame 4 and snap ring 10, support when chamber door 3 is closed and press first dustproof mesh plate 5, and then fix first dustproof mesh plate 5, people open chamber door 3, can be convenient slide first dustproof mesh plate 5 from sliding frame 4's inner wall and take out, simultaneously under torsional spring 11's effect, the lower extreme that the axis of rotation can drive snap ring 10 extrudees right, and then utilize snap ring 10 to support to press to buckle piece 8 fixed, second dustproof mesh plate 7 has further been fixed, only need stimulate snap ring 10 left, can relieve the restriction of snap ring 10 to buckle piece 8 and second dustproof mesh plate 7, people can be convenient take off second dustproof mesh plate 7, thereby the dismouting process of dust screen has been simplified.

The upper surface of the box body 1 is provided with a plurality of air inlets 23, and the left side surface of the box body 1 is provided with a plurality of air outlets 24.

The heat dissipation mechanism comprises a placing frame 12, a heat dissipation groove 13 is arranged on the lower surface of the placing frame 12, an electric fan 14 is fixedly arranged on the inner wall of the placing frame 12, a semiconductor refrigerator 15 is fixedly arranged on the right side surface of the placing frame 12, a U-shaped frame 18 is fixedly arranged on the inner left side wall of the box body 1, the surface of the placing frame 12 is in sliding connection with the inner wall of the U-shaped frame 18, the surface of the refrigerating end of the semiconductor refrigerator 15 is in abutting contact with the surface of the electronic element body 2, after the semiconductor refrigerator 15 and the electric fan 14 in the heat dissipation mechanism are started, the refrigerating end of the semiconductor refrigerator 15 refrigerates and dissipates heat to the electronic element body 2, the electric fan 14 can absorb air from the outside of the box body 1 through the through groove on the surface of the box body 1 and the air inlet hole 23, and blows air to the heating end of the semiconductor refrigerator 15, optimizing the cooling effect of the semiconductor refrigerator 15, and simultaneously the air carrying heat can be discharged through the exhaust hole 24.

The upper surface and the lower surface of the placing frame 12 are fixedly provided with a sleeve frame 16, the inner wall of the sleeve frame 16 is connected with a limit concave plate 17 in a sliding manner, a limit mechanism comprises a telescopic cylinder 19 fixedly connected with the right side wall in the box body 1, the inner wall of the telescopic cylinder 19 is connected with a telescopic column 21 in a sliding manner through a tension spring 20, the end part of the telescopic column 21 is fixedly provided with a limit column 22, the telescopic column 21 moves rightwards under the action of the tension spring 20 through the limit mechanism, the limit column 22 further presses the limit concave plate 17 rightwards, the further placing frame 12 is driven to move in a rightward extruding manner, so that the surface of the refrigerating end of the semiconductor refrigerator 15 is tightly attached to the surface of the electronic element body 2, the refrigerating and heat dissipating effects of the semiconductor refrigerator 15 on the electronic element body 2 are optimized, the limit concave plate 17 is retracted into the inner wall of the sleeve frame 16, the drawing limit effect of the limit column 22 on the placing frame 12 can be eliminated, people can conveniently take out the placing frame 12.

The working principle is as follows: when people use the case, the semiconductor refrigerator 15 and the electric fan 14 in the heat dissipation mechanism can be opened, the refrigerating end of the semiconductor refrigerator 15 carries out refrigeration and heat dissipation on the electronic element body 2, the electric fan 14 can absorb air from the outside of the case body 1 through the through groove and the air inlet 23 on the surface of the case body 1 and blow the air to the heating end of the semiconductor refrigerator 15, the refrigerating effect of the semiconductor refrigerator 15 is optimized, meanwhile, the air carrying heat can be discharged through the air outlet 24, the air entering the inside of the case body 1 through the through groove and the air inlet 23 can be absorbed and separated by the first dustproof mesh plate 5 and the second dustproof mesh plate 7, when the first dustproof mesh plate 5 and the second dustproof mesh plate 7 are taken out and cleaned, people open the case door 3, and can conveniently take out the first dustproof mesh plate 5 from the inner wall of the sliding frame 4 in a sliding manner, meanwhile, the clamping ring 10 is pulled leftwards, the limitation of the clamping ring 10 on the clamping block 8 and the second dustproof screen plate 7 can be removed, people can conveniently take down the second dustproof screen plate 7, and therefore the assembling and disassembling process of the dustproof screen is simplified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a dustproof cooling computer mainframe of buckle formula machine case, includes box (1), its characterized in that: the electronic component box is characterized in that an electronic component body (2) is fixedly mounted on the inner wall of the box body (1), the front surface of the box body (1) is rotatably connected with a box door (3), two sliding frames (4) are fixedly mounted on the inner wall of the box body (1), the inner wall of each sliding frame (4) is slidably connected with a first dustproof screen plate (5), a through groove is formed in the left side surface of the box body (1), an inserting frame (6) and a second dustproof screen plate (7) are respectively arranged on the left side surface of the box body (1), buckling blocks (8) are respectively arranged on the upper surface and the lower surface of each second dustproof screen plate (7), the surfaces of the lower buckling blocks (8) are inserted into the inner wall of the inserting frame (6), a mounting frame (9) is fixedly mounted on the left side surface of the box body (1), a rotating shaft is rotatably connected with the inner wall of the mounting frame (9), a buckling ring (10) is fixedly mounted on the surface of the rotating shaft, and a clamping groove is formed in the left side surface of the upper buckling block (8), the surface of the clamping ring (10) is in abutting contact with the inner wall of the clamping groove, and the inner wall of the box body (1) is provided with a heat dissipation mechanism and a limiting mechanism respectively.

2. The host computer case of claim 1, wherein: the surface cover of axis of rotation is equipped with torsional spring (11), the tip of torsional spring (11) and the inner wall fixed connection of installing frame (9).

3. The snap-in dustproof cooling computer host case according to claim 1, characterized in that: the heat dissipation mechanism comprises a placement frame (12), a heat dissipation groove (13) is formed in the lower surface of the placement frame (12), an electric fan (14) is fixedly mounted on the inner wall of the placement frame (12), and a semiconductor refrigerator (15) is fixedly mounted on the right side surface of the placement frame (12).

4. The host computer case of claim 3, wherein the cooling chamber comprises: the inner left side wall of the box body (1) is fixedly provided with a U-shaped frame (18), the surface of the placing frame (12) is connected with the inner wall of the U-shaped frame (18) in a sliding mode, and the surface of the refrigerating end of the semiconductor refrigerator (15) is in abutting contact with the surface of the electronic element body (2).

5. The host computer case of claim 1, wherein: the limiting mechanism comprises a telescopic cylinder (19) fixedly connected with the inner right side wall of the box body (1), the inner wall of the telescopic cylinder (19) is connected with a telescopic column (21) through a tension spring (20) in a sliding mode, and a limiting column (22) is fixedly mounted at the end of the telescopic column (21).

6. The snap-in dustproof cooling computer host case according to claim 1, characterized in that: the upper surface of the box body (1) is provided with a plurality of air inlets (23).

7. The snap-in dustproof cooling computer host case according to claim 1, characterized in that: the left side surface of the box body (1) is provided with a plurality of exhaust holes (24).

8. The host computer case of claim 3, wherein the cooling chamber comprises: the upper surface and the lower surface of the placing frame (12) are fixedly provided with a sleeve frame (16), and the inner wall of the sleeve frame (16) is connected with a limiting concave plate (17) in a sliding manner.