CN217045052U

CN217045052U - Aluminum-based circuit board laser cutting equipment

Info

Publication number: CN217045052U
Application number: CN202123075633.3U
Authority: CN
Inventors: 陈浩波; 傅凯辰
Original assignee: Guangdong Luoke Intelligent Technology Equipment Co ltd
Current assignee: Guangdong Luoke Intelligent Technology Equipment Co ltd
Priority date: 2021-12-08
Filing date: 2021-12-08
Publication date: 2022-07-26
Anticipated expiration: 2031-12-08

Abstract

A laser cutting device for an aluminum-based circuit board comprises a cutting workbench, a clamping device, a laser cutting device and a control computer, wherein the cutting workbench is used for placing the aluminum-based circuit board for laser cutting, the clamping device is used for clamping and fixing the aluminum-based circuit board, the laser cutting device is used for laser cutting the aluminum-based circuit board, the control computer is used for controlling the work of the device, the clamping device is arranged on the cutting workbench, and a carbon dioxide laser and optical fiber laser common cutting mode is adopted, wherein the energy density of the carbon dioxide laser is relatively low, the cutting effect on a paint layer and an insulating layer in the aluminum-based circuit board is good, and the edge of the cut paint layer and the cut insulating layer is free of dust, burrs, deformation, damage and blackening of a copper foil circuit and oxidation; and the optical fiber laser energy density is relatively high, the cutting effect on the aluminum substrate is high, and the edge of the aluminum substrate is smooth and tidy after being cut.

Description

Aluminum-based circuit board laser cutting equipment

Technical Field

The utility model belongs to the technical field of laser cutting equipment, concretely relates to aluminium base circuit board laser cutting equipment.

Background

An aluminum-based circuit board is a unique metal-based circuit board, which has good thermal conductivity, electrical insulation, and machinability, and thus is widely used in the field of electronic circuits.

And the aluminum-based circuit board is applied to specific products, and needs to be cut according to the circuit design of the products to form an aluminum-based circuit board finished product for application. Along with the development of the refinement and the high-end development of the existing electronic circuit products, the requirement on the cutting precision of the aluminum-based circuit board is very high, and the application scale of the aluminum-based circuit board is large, so that the requirement on the cutting efficiency of the aluminum-based circuit board is continuously improved, an unprecedented test is formed on the requirements on the cutting process and the cutting equipment of the aluminum-based circuit board, the requirement on the improvement on the cutting precision of the aluminum-based circuit board is met, and the requirement on the improvement on the cutting efficiency is met.

In the field of cutting of aluminum-based circuit boards, the edge of the cut aluminum-based circuit board is required to have no dust, no burr, no deformation, no damage to a copper foil circuit and the like, while laser cutting has a non-contact processing mode, does not generate stress and dust in the processing process, has small processing gaps, and gradually becomes the mainstream processing mode for cutting the aluminum-based circuit board. In the conventional laser cutting process, pulse laser with low power is generally adopted to repeatedly scan for multiple times according to the same path until the aluminum-based circuit board is cut off. However, this method causes blackening of the edge of the aluminum-based circuit board after cutting because the energy density of the single pulse power is relatively low, the heat conversion ratio is relatively high, and heat accumulation causes carbonization of the material. And the high-power pulse laser is directly adopted to reduce the scanning times, but because the high-power pulse has strong penetrating power and heat is easy to diffuse, the phenomenon of oxidation appears on the rear surface of a product along the width near the cutting edge, the appearance is damaged, and the use of the aluminum-based circuit board can be influenced. There is therefore a need for corresponding technical improvements in laser cutting equipment for aluminum-based circuit boards.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a machining efficiency is high, can avoid the aluminium base circuit board laser cutting equipment of product edge blackening and oxidation.

The utility model provides a technical scheme that its technical problem adopted is:

the utility model provides an aluminium base circuit board laser cutting equipment, includes the cutting workstation that is used for placing aluminium base circuit board and carries out laser cutting, the clamping device who is used for the fixed aluminium base circuit board of centre gripping, the laser cutting device who is used for laser cutting aluminium base circuit board and the control computer who is used for controlgear work, clamping device installs on the cutting workstation, laser cutting device includes carbon dioxide laser cutting head, optic fibre laser cutting head, carbon dioxide laser generator, optic fibre laser generator and laser mobile device, carbon dioxide laser cutting head and optic fibre laser cutting head are installed on laser mobile device, carbon dioxide laser cutting head and optic fibre laser cutting head respectively with carbon dioxide laser generator and optic fibre laser generator laser transmission, carbon dioxide laser cutting head and optic fibre laser cutting head transmit laser towards the cutting workstation, the control computer is connected with the clamping device and the laser cutting device through electric signals.

The utility model discloses in, the cutting work platform includes the board and is used for the aluminium base circuit board of bearing to carry out laser cutting's the work or material rest that holds, hold work or material rest and clamping device and all install on the board, it is equipped with the removal dead slot that is used for the clamping device back-and-forth movement in the work or material rest to hold.

The utility model discloses in, clamping device includes preceding centre gripping actuating mechanism, back centre gripping actuating mechanism and is used for driving the centre gripping mobile device of preceding centre gripping actuating mechanism back-and-forth movement, preceding centre gripping actuating mechanism installs on centre gripping mobile device, centre gripping mobile device and back centre gripping actuating mechanism all install on the board.

The utility model discloses in, back centre gripping actuating mechanism's rear is equipped with the finished product unloader that is used for cutting the finished product unloading, finished product unloader lateral transmission unloading.

The utility model discloses in, finished product unloader's rear is equipped with the clout unloader that is used for cutting the clout unloading, clout unloader vertical transmission unloading.

The utility model discloses in, preceding centre gripping actuating mechanism includes fixed chuck, activity chuck and preceding centre gripping driving cylinder, fixed chuck and preceding centre gripping driving cylinder fixed mounting are on centre gripping mobile device, activity chuck bottom is articulated with fixed chuck, activity chuck top is articulated with connecting rod one end, and the connecting rod other end is articulated with push rod one end, and the push rod other end is connected with the action end of preceding centre gripping driving cylinder, is equipped with between push rod and the fixed chuck to be used for the push rod to remove spacing limit slide, is equipped with the step hole that is used for installing limit slide in the push rod, and limit slide installs at the step downthehole, and limit slide passes through the bolt to be connected fixed chuck and slides spacingly, the length in step hole is greater than limit slide's length.

The utility model discloses in, back centre gripping actuating mechanism includes movable clamp plate, lower fixed pressing plate and is used for driving the lift actuating mechanism that movable clamp plate reciprocated, when lift actuating mechanism drive movable clamp plate rebound and lower fixed pressing plate separately, the passageway that passes through after forming aluminium base circuit board laser cutting between upper movable clamp plate and the lower fixed pressing plate.

The utility model discloses in, the centre gripping mobile device is including the back-and-forth movement mechanism who is used for propelling movement aluminium base circuit board back-and-forth movement and the angular adjustment mechanism who is used for adjusting aluminium base circuit board angle and ajusts, back-and-forth movement mechanism installs on the board, angular adjustment mechanism installs on back-and-forth movement mechanism, preceding centre gripping action mechanism installs on angular adjustment mechanism, angular adjustment mechanism includes relative parallel arrangement's bottom plate and roof, the bottom plate is passed through the pivot subassembly with the one end of roof and is connected, the bottom plate passes through arc slip subassembly with the other end of roof and is connected.

The utility model has the advantages that: the utility model discloses an aluminium base circuit board laser cutting equipment has adopted carbon dioxide laser and the mode of optic fibre laser common cutting, and wherein carbon dioxide laser energy density is lower relatively, and is better to the cutting effect of paint layer and insulating layer in the aluminium base circuit board, and the edge has no dust, no burr, no deformation, copper foil circuit not damaged, does not have blackening, no oxidation after paint layer and insulating layer cutting; the optical fiber laser energy density is relatively high, the cutting effect on the aluminum substrate is high, and the edge of the aluminum substrate is smooth and tidy after being cut; the utility model discloses an aluminium base circuit board laser cutting equipment only need can accomplish through carbon dioxide laser cutting and optic fibre laser cutting twice cutting, realizes full automatic cutout to make aluminium base circuit board's cutting accuracy and efficiency improve.

Drawings

The present invention is further described below with reference to the accompanying drawings and embodiments:

FIG. 1 is a flow chart of a laser cutting process for an aluminum-based circuit board according to the present embodiment;

FIG. 2 is a perspective view of the laser cutting apparatus for aluminum-based circuit board in the present embodiment;

FIG. 3 is a schematic structural diagram of a cutting table according to the present embodiment;

FIG. 4 is a schematic structural diagram of a laser cutting apparatus according to the present embodiment;

FIG. 5 is a schematic view of the internal structure of the laser cutting apparatus of this embodiment in one direction;

FIG. 6 is a schematic view of another internal structure of the laser cutting apparatus of the present embodiment;

FIG. 7 is a schematic structural view of the clamping device of the present embodiment mounted on the cutting table;

FIG. 8 is a schematic structural diagram of a front clamping mechanism of the present embodiment;

FIG. 9 is a schematic view of the rear clamping mechanism of the present embodiment;

FIG. 10 is a schematic view of the front clamping actuator of this embodiment mounted on the angle adjustment mechanism;

fig. 11 is a schematic view of the mounting structure of the rotating shaft assembly and the arc sliding assembly in the present embodiment.

Detailed Description

In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention will be combined below to clearly and completely describe the technical solution in the embodiments of the present invention.

As shown in fig. 1, the embodiment discloses a laser cutting process for an aluminum-based circuit board, where the aluminum-based circuit board includes an aluminum substrate a, an insulating layer b is disposed on the aluminum substrate a, the insulating layer b is made of a resin material, a copper foil circuit c formed by etching a copper foil and a recess position are disposed on the insulating layer b, a paint layer d is disposed on the copper foil circuit c and the recess position, a groove e is formed on the recess position by the paint layer d, and the groove e is disposed along an edge of a cutting pattern; the laser cutting process of the aluminum-based circuit board comprises the following steps:

cutting a paint layer d and an insulating layer b along a groove e by using carbon dioxide laser to form a carbon dioxide laser cutting groove f, wherein the width of the carbon dioxide laser cutting groove f is smaller than that of the groove e, and the paint layer d is reserved between a copper foil circuit c and the carbon dioxide laser cutting groove f;

and step two, cutting the aluminum substrate a along the carbon dioxide laser cutting groove f obtained by cutting in the step one by using an optical fiber laser to form an optical fiber laser cutting groove g, wherein the width of the optical fiber laser cutting groove g is smaller than that of the carbon dioxide laser cutting groove f.

In the utility model, the width of the groove e is within the range of 0.1-0.3 mm; the width of the carbon dioxide laser cutting groove f is within the range of 0.1-0.3 mm; the width of the optical fiber laser cutting groove g is within the range of 0.07-0.15 mm.

Because the vaporization temperature of the paint layer d and the insulating layer b is lower, only carbon dioxide laser cutting with relatively lower energy density is needed, and the phenomena of blackening, oxidization and the like at the edge of the carbon dioxide laser cutting groove f can be avoided while the paint layer d and the insulating layer b are cut in place at one time by adopting the carbon dioxide laser cutting; the aluminum substrate a has relatively high vaporization temperature and needs to be cut by optical fiber laser with high energy density, so that the aluminum substrate a is also cut in place at one time, and the edge of the optical fiber laser cutting groove g is smooth and tidy. In the laser cutting process, the width of the carbon dioxide laser cutting groove f must be smaller than that of the groove e, so that the copper foil circuit c is prevented from being damaged in the carbon dioxide laser cutting process, and after the carbon dioxide laser cutting is ensured, a paint layer d still remains between the copper foil circuit c and the carbon dioxide laser cutting groove f, and the copper foil circuit c is prevented from being exposed. In a similar way, in the optical fiber laser cutting process, the optical fiber laser cutting groove g must be smaller than the carbon dioxide laser cutting groove f, the side wall of the carbon dioxide laser cutting groove f cannot be touched in the optical fiber laser cutting process, and the optical fiber laser is prevented from cutting the paint layer d and the insulating layer b. If cut paint layer d and the insulating layer b of carbon dioxide laser cutting groove f lateral wall during optic fibre laser cutting, can cause the influence to copper foil circuit c's protective properties, can even cause the influence to copper foil circuit c's electric conductive property, and because the energy density of optic fibre laser is higher, cut paint layer d and insulating layer b can make aluminium base circuit board surface blackening and oxidation, and the aluminium sediment that aluminium base board a cutting produced bonds with insulating layer b and the paint layer d of fuse state and forms burr or string sediment, influence the cutting effect, the cutting yields is not high.

As shown in fig. 2 to fig. 11, based on the laser cutting process of the aluminum-based circuit board disclosed in the above embodiment, the embodiment further discloses a laser cutting apparatus for the aluminum-based circuit board, which comprises a cutting table 1 for placing the aluminum-based circuit board to perform laser cutting, a clamping device 2 for clamping and fixing the aluminum-based circuit board, a laser cutting device 3 for laser cutting the aluminum-based circuit board, and a control computer 4 for controlling the apparatus to work, wherein the clamping device 2 is installed on the cutting table 1, the laser cutting device 3 comprises a carbon dioxide laser cutting head 31, an optical fiber laser cutting head 32, a carbon dioxide laser generator 33, an optical fiber laser generator and a laser moving device 34, the carbon dioxide laser cutting head 31 and the optical fiber laser cutting head 32 are installed on the laser moving device 34, carbon dioxide laser cutting head 31 and optic fibre laser cutting head 32 respectively with carbon dioxide laser generator 33 and optic fibre laser generator laser transmission, carbon dioxide laser cutting head 31 and optic fibre laser cutting head 32 are towards 1 laser-emitting of cutting table, control computer 4 passes through signal of telecommunication with clamping device 2, laser cutting device 3 and is connected, and the cutting equipment of this embodiment fixes a position through setting up the industry camera, realizes quick location through mark point on the aluminium base circuit board of industry camera discernment to improve cutting equipment's cutting efficiency and precision. And the control computer 4 controls the intensity power of the laser to change in direct proportion with the moving speed to form a control mode of energy following, so that the laser energy used for cutting each part of the aluminum-based circuit board is kept consistent when the aluminum-based circuit board is subjected to laser cutting, and the cutting is more uniform. The fiber laser generator is not shown in the drawings of the specification.

As a preferred embodiment, laser transmission is performed between the carbon dioxide laser generator 33 and the carbon dioxide laser cutting head 31 in a laser reflection manner, an emission head 331 for emitting carbon dioxide laser is arranged in the carbon dioxide laser generator 33, and after the carbon dioxide laser emitted by the emission head 331 is reflected by a plurality of laser lenses 332, the carbon dioxide laser enters the carbon dioxide laser cutting head 31. The optical fiber laser generator and the optical fiber laser cutting head 32 are connected by an optical cable for laser transmission. Because the energy density requirement of the carbon dioxide laser is low, the carbon dioxide laser is transmitted in a laser mode, long-distance laser transmission can be realized, and the problem of disordered circuit layout can be avoided; the energy density of fiber laser is high, and laser transmission needs to be carried out through an optical cable. The optical fiber laser adopts the optical cable for laser transmission, and has the advantages that: 1. the energy loss of the optical fiber laser can be reduced, and the optical fiber laser cutting head 32 can emit the optical fiber laser with high energy density for cutting; 2. the safety is improved, the optical fiber laser is higher in energy density, the human body can be damaged when the optical fiber laser is contacted with the human body, and the optical fiber laser can be prevented from leaking to damage the human body through optical cable transmission. The optical cable is not drawn in the drawings of the specification either.

In the embodiment, the carbon dioxide laser cutting head 31 is provided with a high-pressure air pipe 35 for blowing air to the surface of the aluminum-based circuit board before cutting to remove impurities and a dust extractor 36 for extracting smoke generated in the cutting process of the aluminum-based circuit; the fiber laser cutting head 32 is also equipped with a high pressure air duct and a water cooling duct for cooling the fiber laser cutting head 32. The high-pressure air pipe and the water-cooling pipe provided for the fiber laser cutting head 32 are not shown in the drawings of the specification.

In this embodiment, the carbon dioxide laser cutting head 31, the high-pressure air pipe 35 and the dust extractor 36 are configured to form a carbon dioxide laser cutting assembly, the carbon dioxide laser cutting assembly is mounted on the first moving plate 341 through the clamping assembly 37, and the first moving plate 341 is connected with a spacing adjusting mechanism 342 for adjusting a spacing between the carbon dioxide laser cutting head 31 and the fiber laser cutting head 32. The optical fiber laser cutting head 32, the high-pressure air pipe 35 and the water cooling pipeline are matched to form an optical fiber laser cutting assembly, the optical fiber laser cutting assembly is installed on an optical fiber laser adjusting mechanism 343 used for adjusting the vertical height of the optical fiber laser cutting head 32, the carbon dioxide laser cutting assembly, the clamping assembly 37, the first moving plate 341 and the interval adjusting mechanism 342 are installed on the second moving plate 344 together, the optical fiber laser cutting assembly and the optical fiber laser adjusting mechanism 343 are also installed on the second moving plate 344, the second moving plate 344 is connected with a front-back movement cutting mechanism 345, and the front-back movement cutting mechanism 345 drives the second moving plate 344 to move back and forth, so that all parts installed on the second moving plate 344 are driven to move back and forth. Meanwhile, the front-back moving cutting mechanism 345 is arranged on the left-right moving cutting mechanism 346, the left-right moving cutting mechanism 346 drives the front-back moving cutting mechanism 345 to move left and right, all parts on the front-back moving cutting mechanism 345 are driven to move left and right, and the carbon dioxide laser cutting head 31 and the optical fiber laser cutting head 32 synchronously move front and back and cut and synchronously move left and right to cut are realized by arranging the front-back moving cutting mechanism 345 and the left-right moving cutting mechanism 346. In order to adjust the vertical height of the carbon dioxide laser cutting assembly, a plurality of mounting hole positions 347 used for being connected with the clamping assemblies 37 are arranged on the first moving plate 341, the mounting hole positions 347 are arranged along the vertical height direction, and the clamping assemblies 37 are mounted on the mounting hole positions 347 with different heights to form height adjustment of the carbon dioxide laser cutting head 31. Meanwhile, the first moving plate 341 and the second moving plate 344 are connected by a slider-slide mechanism 348, so that the movement stability of the carbon dioxide laser cutting assembly is improved when the distance between the carbon dioxide laser cutting head 31 and the optical fiber laser cutting head 32 is adjusted.

As a preferred embodiment, the cutting workbench 1 includes a machine table 11 and a material bearing frame 12 for bearing the aluminum-based circuit board to perform laser cutting, the material bearing frame 12 and the clamping device 2 are both installed on the machine table 11, a moving empty slot 13 for the clamping device 2 to move back and forth is arranged in the material bearing frame 12, and the control computer 4 is arranged on the machine table 11. The aluminum-based circuit board conveying device is characterized in that the material bearing frame 12 is composed of a plurality of bearing strips 121 which are arranged in parallel at intervals, the movable empty grooves 13 are formed by arranging adjacent bearing strips 121 at intervals, the bearing strips 121 extend in the front-back direction, a plurality of idler wheels 122 are arranged on the side walls of the bearing strips 121 for the aluminum-based circuit board to be easily conveyed on the material bearing frame 12 in the front-back direction, the aluminum-based circuit board is placed on the material bearing frame 12, the bottom surface of the aluminum-based circuit board is supported through the idler wheels 122, and the idler wheels 122 rotate when the aluminum-based circuit board is conveyed in the front-back direction.

As a preferred embodiment, the clamping device 2 includes a front clamping actuating mechanism 21, a rear clamping actuating mechanism 22, and a clamping moving device 23 for driving the front clamping actuating mechanism 21 to move forward and backward, the front clamping actuating mechanism 21 is installed on the clamping moving device 23, and both the clamping moving device 23 and the rear clamping actuating mechanism 22 are installed on the machine platform 11. When the aluminum-based circuit board is fed, the aluminum-based circuit board to be cut is placed on the material bearing frame 12, one end of the aluminum-based circuit board is clamped through the front clamping action mechanism 21, then the aluminum-based circuit board on the front clamping action mechanism 21 is conveyed to the rear clamping action mechanism 22 through the clamping moving device 23, and the feeding work can be completed after the other end of the aluminum-based circuit board is clamped through the rear clamping action mechanism 22.

In this embodiment, the front clamping actuating mechanism 21 includes a fixed chuck 211, a movable chuck 212 and a front clamping driving cylinder 213, the fixed chuck 211 and the front clamping driving cylinder 213 are fixedly mounted on the clamping moving device 23, the bottom of the movable chuck 212 is hinged to the fixed chuck 211, the movable chuck 212 is hinged to the fixed chuck 211 through a first hinge shaft 214, the top of the movable chuck 212 is hinged to one end of a connecting rod 215, the movable chuck 212 is hinged to the connecting rod 215 through a second hinge shaft 216, the other end of the connecting rod 215 is hinged to one end of a push rod 217, the connecting rod 215 is hinged to the push rod 217 through a third hinge shaft 218, the other end of the push rod 217 is connected to an actuating end of the front clamping driving cylinder 213, a limit slider 219 for limiting the movement of the push rod 217 is disposed between the push rod 217 and the fixed chuck 211, a stepped hole 210 for mounting the limit slider 219 is disposed in the push rod 217, the limiting sliding block 219 is installed in the step hole 210, the limiting sliding block 219 penetrates through the connecting and fixing clamp 211 through a bolt to be limited in sliding, and the length of the step hole 210 is larger than that of the limiting sliding block 219. And a plurality of front clamping actuating mechanisms 21 are arranged on the clamping moving device 23 in a left-right transverse arrangement. The operation principle of the front clamping operation mechanism 21 is as follows: the front clamping driving cylinder 213 extends back and forth to drive the push rod 217 to move back and forth, the limit slider 219 limits the push rod 217 up and down, the push rod 217 can slide back and forth under the matching action of the limit slider 219 and the step hole 210, and the push rod 217 pulls the fixed chuck 211 through the connecting rod 215 to turn the fixed chuck 211 around the first hinge shaft 214, so that the opening and closing action between the fixed chuck 211 and the movable chuck 212 is realized.

In this embodiment, the rear clamping mechanism 22 includes an upper movable platen 221, a lower fixed platen 222, and a lifting driving mechanism 223 for driving the upper movable platen 221 to move up and down, and when the lifting driving mechanism 223 drives the upper movable platen 221 to move up and separate from the lower fixed platen 222, a channel 225 through which the aluminum-based circuit board passes after being laser-cut is formed between the upper movable platen 221 and the lower fixed platen 222. The upper movable pressing plate 221 and the lower fixed pressing plate 222 are respectively provided with a feeding position 224 for the front clamping mechanism 21 to move into, when the aluminum-based circuit board is cut and processed to the processing excess material closest to the front clamping mechanism 21, the aluminum-based circuit board moves into the feeding position 224 through the front clamping mechanism 21, and the final processing excess material is sent out.

In this embodiment, the clamping moving device 23 includes a front-and-back moving mechanism 231 for pushing the aluminum-based circuit board to move back and forth and an angle adjusting mechanism 232 for adjusting the angle of the aluminum-based circuit board to be adjusted, the front-and-back moving mechanism 231 is installed on the machine platform 11, the angle adjusting mechanism 232 is installed on the front-and-back moving mechanism 231, the front clamping actuating mechanism 21 is installed on the angle adjusting mechanism 232, the angle adjusting mechanism 232 includes a bottom plate 2321 and a top plate 2322 which are arranged in parallel relatively, the bottom plate 2321 is connected with one end of the top plate 2322 through a rotating shaft assembly 2323, and the bottom plate 2321 is connected with the other end of the top plate 2322 through an arc sliding assembly 2324. When the aluminum-based circuit board is conveyed back and forth, the aluminum-based circuit board is driven by the back and forth movement mechanism 231; when the clamping angle of the aluminum-based circuit board deviates, the aluminum-based circuit board needs to be straightened to carry out laser cutting, and the aluminum-based circuit board needs to be driven by the angle adjusting mechanism. When the angle of the aluminum-based circuit board is swung, one end of the top plate 2322 needs to be driven to rotate around the rotating shaft assembly 2323, the other end of the top plate 2322 swings under the guiding effect of the arc-shaped sliding assembly 2324, the central axis of the rotating shaft assembly 2323 is used as the original point of the top plate 2322, and the guiding track of the arc-shaped sliding assembly 2324 is used as the circumferential line to move, so that after the top plate 2322 swings for a certain angle, the aluminum-based circuit board clamped in the front clamping action mechanism 21 is swung, the cutting equipment has diversified self-adjusting capacity, the cutting precision of the aluminum-based circuit board is guaranteed, and the yield is improved.

In a preferred embodiment, a finished product blanking device 5 for cutting and blanking finished products is arranged behind the rear clamping actuating mechanism 22, and the finished product blanking device 5 transversely transmits blanking. And a residual material blanking device 6 for cutting and blanking residual materials is arranged behind the finished product blanking device 5, and the residual material blanking device 6 longitudinally transmits blanking. And the finished product blanking device 5 and the excess material blanking device 6 are both belt conveyors.

The above description is only the preferred embodiment of the present invention, and the technical solutions of the objects of the present invention are all within the protection scope of the present invention as long as the objects are achieved by the substantially same means.

Claims

1. The utility model provides an aluminium base circuit board laser cutting equipment which characterized in that: comprises a cutting workbench (1) for placing an aluminum-based circuit board for laser cutting, a clamping device (2) for clamping and fixing the aluminum-based circuit board, a laser cutting device (3) for laser cutting the aluminum-based circuit board and a control computer (4) for controlling the work of equipment, wherein the clamping device (2) is installed on the cutting workbench (1), the laser cutting device (3) comprises a carbon dioxide laser cutting head (31), an optical fiber laser cutting head (32), a carbon dioxide laser generator (33), an optical fiber laser generator and a laser moving device (34), the carbon dioxide laser cutting head (31) and the optical fiber laser cutting head (32) are installed on the laser moving device (34), the carbon dioxide laser cutting head (31) and the optical fiber laser cutting head (32) are respectively transmitted with the carbon dioxide laser generator (33) and the optical fiber laser generator, the carbon dioxide laser cutting head (31) and the optical fiber laser cutting head (32) emit laser towards the cutting workbench (1), and the control computer (4) is connected with the clamping device (2) and the laser cutting device (3) through electric signals.

2. The laser cutting equipment for the aluminum-based circuit board as claimed in claim 1, wherein: the cutting workbench (1) comprises a machine table (11) and a material bearing frame (12) used for bearing the aluminum-based circuit board for laser cutting, wherein the material bearing frame (12) and the clamping device (2) are both installed on the machine table (11), and a moving empty groove (13) used for the clamping device (2) to move back and forth is formed in the material bearing frame (12).

3. The laser cutting equipment for the aluminum-based circuit board as claimed in claim 2, wherein: the clamping device (2) comprises a front clamping action mechanism (21), a rear clamping action mechanism (22) and a clamping moving device (23) for driving the front clamping action mechanism (21) to move back and forth, the front clamping action mechanism (21) is installed on the clamping moving device (23), and the clamping moving device (23) and the rear clamping action mechanism (22) are installed on the machine table (11).

4. The laser cutting equipment for the aluminum-based circuit board as claimed in claim 3, wherein: and a finished product blanking device (5) for cutting and blanking finished products is arranged behind the rear clamping action mechanism (22), and the finished product blanking device (5) transversely transmits blanking.

5. The laser cutting device for the aluminum-based circuit board as recited in claim 4, wherein: and a residual material blanking device (6) for cutting residual material blanking is arranged behind the finished product blanking device (5), and the residual material blanking device (6) longitudinally transmits blanking.

6. The laser cutting device for the aluminum-based circuit board as recited in claim 3, wherein: the front clamping action mechanism (21) comprises a fixed chuck (211), a movable chuck (212) and a front clamping driving cylinder (213), the fixed chuck (211) and the front clamping driving cylinder (213) are fixedly installed on a clamping moving device (23), the bottom of the movable chuck (212) is hinged to the fixed chuck (211), the top of the movable chuck (212) is hinged to one end of a connecting rod (215), the other end of the connecting rod (215) is hinged to one end of a push rod (217), the other end of the push rod (217) is connected with the action end of the front clamping driving cylinder (213), a limiting slide block (219) used for limiting the movement of the push rod (217) is arranged between the push rod (217) and the fixed chuck (211), a step hole (210) used for installing the limiting slide block (219) is arranged in the push rod (217), the limiting slide block (219) is installed in the step hole (210), the limiting slide block (219) penetrates through a bolt to be connected with the fixed chuck (211) for limiting the sliding, the length of the step hole (210) is larger than that of the limiting sliding block (219).

7. The laser cutting equipment for the aluminum-based circuit board as claimed in claim 3, wherein: the rear clamping action mechanism (22) comprises an upper movable pressing plate (221), a lower fixed pressing plate (222) and a lifting driving mechanism (223) for driving the upper movable pressing plate (221) to move up and down, and when the lifting driving mechanism (223) drives the upper movable pressing plate (221) to move up and separate from the lower fixed pressing plate (222), a channel (225) through which the aluminum-based circuit board passes after being cut by laser is formed between the upper movable pressing plate (221) and the lower fixed pressing plate (222).

8. The laser cutting device for the aluminum-based circuit board as recited in claim 3, wherein: the clamping moving device (23) comprises a front-back moving mechanism (231) used for pushing the aluminum-based circuit board to move back and forth and an angle adjusting mechanism (232) used for adjusting the angle of the aluminum-based circuit board to be adjusted in a positive manner, the front-back moving mechanism (231) is installed on the machine table (11), the angle adjusting mechanism (232) is installed on the front-back moving mechanism (231), the front clamping action mechanism (21) is installed on the angle adjusting mechanism (232), the angle adjusting mechanism (232) comprises a bottom plate (2321) and a top plate (2322) which are arranged in parallel relatively, the bottom plate (2321) is connected with one end of the top plate (2322) through a rotating shaft assembly (2323), and the other end of the bottom plate (2321) is connected with the other end of the top plate (2322) through an arc-shaped sliding assembly (2324).