CN217043763U - Flow equalizing plate and silicon wafer cleaning tank - Google Patents
Flow equalizing plate and silicon wafer cleaning tank Download PDFInfo
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- CN217043763U CN217043763U CN202220512108.9U CN202220512108U CN217043763U CN 217043763 U CN217043763 U CN 217043763U CN 202220512108 U CN202220512108 U CN 202220512108U CN 217043763 U CN217043763 U CN 217043763U
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Abstract
The utility model discloses an even flow board and silicon chip washing tank relates to the photovoltaic technology field. The uniform flow plate comprises an elastic plate body, a plurality of uniform flow areas are arranged on the elastic plate body at intervals, the uniform flow areas are respectively provided with a plurality of uniform flow holes in a penetrating mode, a groove is formed between any two adjacent uniform flow areas, and the thickness of the groove bottom of the groove is smaller than that of the uniform flow areas. The utility model provides an even flow board can change self shape but does not damage its structure itself to dodge the barrier on the dismouting route, reduce the dismouting degree of difficulty, promote dismouting efficiency.
Description
Technical Field
The utility model relates to a photovoltaic technology field particularly, relates to an even flow board and silicon chip washing tank.
Background
In the production process of the photovoltaic cell, the cleaning and processing of the silicon wafer are mainly carried out in a silicon wafer cleaning tank. The flow equalizing plate is laid below the silicon wafer cleaning tank, and various devices and structures for processing the silicon wafers or fixing the silicon wafer flower baskets are arranged in the space above the flow equalizing plate. At present, the shape of the uniform flow plate configured in the silicon wafer cleaning tank on the market is fixed, when the uniform flow plate is blocked or damaged and needs to be replaced, various devices and structures in the upper space are used as obstacles to prevent the uniform flow plate from being detached, so that the devices and the structures above the uniform flow plate need to be detached firstly, which wastes time and labor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a flow homogenizing plate, it can change self shape but does not damage its structure itself to dodge the barrier on the dismouting route, reduce the dismouting degree of difficulty, promote dismouting efficiency.
Another object of the utility model is to provide a silicon chip washing tank, it has the characteristics that the flow equalizing plate dismouting degree of difficulty is low, the dismouting is efficient.
The utility model provides a technical scheme:
the utility model provides an even flow plate, includes the elastic plate body, the interval is provided with a plurality of even flow regions on the elastic plate body, and is a plurality of even flow region runs through respectively and is provided with a plurality of even flow holes, arbitrary adjacent two be provided with the recess between the even flow region, the tank bottom thickness of recess is less than a plurality of even flow regional thickness.
Further, a plurality of the uniform flow areas are sequentially arranged at intervals along the first direction of the elastic plate body.
Further, the groove penetrates through the elastic plate body along a second direction of the elastic plate body.
Furthermore, the grooves are sequentially arranged in parallel along the first direction of the elastic plate body.
Furthermore, the plurality of grooves are concavely arranged on the same side of the elastic plate body along the thickness direction of the elastic plate body.
Furthermore, the groove is provided with a bottom wall, a first side wall and a second side wall, the first side wall and the second side wall are respectively arranged on two opposite sides of the bottom wall, and the first side wall and the second side wall are both in a concave arc shape.
Further, the degree of the central angle subtended by the first side wall and the second side wall is between 85 ° and 105 °.
Furthermore, any two adjacent uniform flow holes in the first direction of the elastic plate body are arranged in a staggered mode.
Furthermore, any two adjacent uniform flow holes in the second direction of the elastic plate body are arranged in a staggered mode.
The utility model also provides a silicon chip washing tank, include the even flow board, the even flow board includes the elastic plate body, the interval is provided with a plurality of even flow regions on the elastic plate body, and is a plurality of the even flow region runs through respectively and is provided with a plurality of even flow holes, arbitrary adjacent two be provided with the recess between the even flow region, the tank bottom thickness of recess is less than a plurality of the regional thickness of even flow.
Compared with the prior art, the utility model provides an interval is provided with a plurality of even flow regions on the elastic plate body of even flow board, is provided with the recess between two arbitrary adjacent even flow regions, and the tank bottom thickness of recess is less than the regional thickness of a plurality of even flows. The elastic plate body has certain elastic deformation capacity, and in the actual dismounting process, the elastic deformation is easier to occur due to the smaller thickness of the groove bottom of the groove. Therefore, the grooves are used as turning positions to turn over a plurality of uniform flow areas of the elastic plate body, so that the shape of the elastic plate body is changed, obstacles on a dismounting path are avoided, various devices and structures above the elastic plate body are prevented from being dismounted, the silicon wafer cleaning tank is quickly dismounted and mounted, and time and labor are saved. Therefore, the utility model provides an advantageous effect of flow equalizing plate includes: the shape of the device can be changed without damaging the structure of the device, so that obstacles on a dismounting path are avoided, the dismounting difficulty is reduced, and the dismounting efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below. It is appreciated that the following drawings depict only certain embodiments of the invention and are therefore not to be considered limiting of its scope. For a person skilled in the art, it is possible to derive other relevant figures from these figures without inventive effort.
Fig. 1 is a schematic structural view of a uniform flow plate according to an embodiment of the present invention at a first viewing angle;
fig. 2 is a schematic structural view of the uniform flow plate provided by the embodiment of the present invention at a second viewing angle;
fig. 3 is an enlarged schematic view of the area a in fig. 2.
An icon: 100-a uniform flow plate; 110-a resilient plate body; 111-a uniform flow region; 1111-flow homogenizing holes; 113-a groove; 1131-bottom wall; 1133 — a first sidewall; 1135 — a second sidewall; 115-mounting holes.
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention will be combined below to clearly and completely describe the technical solution in the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.
In the description of the present invention, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or orientations or positional relationships that a product of the present invention is usually placed when used, or orientations or positional relationships that a person skilled in the art usually understands, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be further noted that, unless otherwise explicitly stated or limited, the terms "disposed" and "connected" should be broadly construed, for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect through an intermediate medium, and the connection may be internal to the two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
The following describes in detail embodiments of the present invention with reference to the accompanying drawings.
Examples
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic structural view of the flow equalizing plate 100 provided in the present embodiment at a first viewing angle, and fig. 2 is a schematic structural view of the flow equalizing plate 100 at a second viewing angle.
The flow equalizing plate 100 provided in this embodiment is applied to a silicon wafer cleaning tank in a photovoltaic cell production process, and the flow equalizing plate 100 includes an elastic plate body 110, it can be understood that the elastic plate body 110 has a certain elastic deformation capability, and the flow equalizing plate is made of a plastic material in this embodiment, and can also be made of an acid and alkali corrosion resistant metal plate material in other embodiments.
In practical application, the cleaning solution in the silicon wafer cleaning tank is divided into a plurality of uniform flow holes 1111 by the plurality of uniform flow holes 1111 arranged in the plurality of uniform flow areas 111, and enters the tank body. A groove 113 is arranged between any two adjacent uniform flow regions 111, and the thickness of the groove bottom of the groove 113 is smaller than that of the plurality of uniform flow regions 111.
It is understood that the elastic plate body 110 is a plate-shaped structure with a uniform thickness, and the groove 113 is milled from one side of the elastic plate body 110, i.e. the thickness of the groove bottom of the groove 113 is smaller than the thickness of the elastic plate body 110 at other positions. Therefore, the strength at the groove 113 is lower than that of the plurality of uniform flow regions 111, and two adjacent uniform flow regions 111 can be easily folded at the groove 113 therebetween.
In practical application, the flow equalizing plate 100 is laid below the silicon wafer cleaning tank, and when the flow equalizing plate 100 needs to be detached, the grooves 113 on the elastic plate body 110 are used as turning positions to turn over the multiple flow equalizing areas 111, so that the shape of the elastic plate body 110 is changed, the vertical area of the elastic plate body 110 is reduced, multiple devices and structures arranged above the silicon wafer cleaning tank can be avoided, and the flow equalizing plate 100 can be taken out smoothly.
Similarly, when the uniform flow plate 100 is installed, the groove 113 is used as a turning position to turn over the elastic plate body 110, and the shape and structure of the elastic plate body 110 are adjusted to ensure that the elastic plate body 110 can smoothly reach the installation position where the silicon wafer cleaning tank is placed through gaps between a plurality of devices and structures arranged above the silicon wafer cleaning tank. After reaching the lower installation position, the elastic plate body 110 is relaxed, so that the elastic plate body 110 recovers a plate-shaped structure, and the installation is smooth.
It can be seen that, in the flow equalizing plate 100 provided in this embodiment, the groove 113 is disposed on the elastic plate body 110 as a turning position of the flow equalizing regions 111, so that the elastic plate body 110 can be turned over easily, the shape can be changed to avoid obstacles in the process of dismounting and mounting, smooth dismounting in the silicon wafer cleaning tank can be realized, additional dismounting of other devices and structures in the silicon wafer cleaning tank can be avoided, and the flow equalizing plate has the characteristics of low dismounting difficulty and high dismounting efficiency.
Referring to fig. 1, the direction of arrow a is the first direction, and the direction of arrow B is the second direction.
In this embodiment, the flow equalizing regions 111 are sequentially disposed at intervals along the first direction of the elastic plate body 110, that is, in this embodiment, the elastic plate body 110 is rectangular, and the flow equalizing regions 111 are sequentially disposed at intervals along a direction parallel to the long side extending direction of the elastic plate body 110.
Correspondingly, the plurality of grooves 113 are sequentially arranged in parallel along the first direction of the elastic plate body 110, that is, the plurality of grooves 113 are sequentially arranged at intervals along the extending direction parallel to the long edge of the elastic plate body 110, and the plurality of grooves 113 are respectively arranged between the plurality of groups of two adjacent uniform flow regions 111.
In other embodiments, the plurality of uniform flow regions 111 may be arranged on the elastic plate body 110 in other arrangement manners according to practical application conditions, and only the arrangement condition of the plurality of grooves 113 needs to be adaptively adjusted.
In order to easily fold the plurality of uniform flow areas 111, in the present embodiment, the plurality of grooves 113 penetrate through the elastic plate body 110 along the second direction of the elastic plate body 110, that is, the plurality of grooves 113 each penetrate through the elastic plate body 110 along a direction parallel to the extending direction of the wide side of the elastic plate body 110.
Moreover, in the present embodiment, for the convenience of processing and turning over, the plurality of grooves 113 are all concavely disposed on the same side of the elastic plate body 110 along the thickness direction of the elastic plate body 110. In other embodiments, a portion of the groove 113 may be recessed on the other side of the elastic plate body 110 according to practical application conditions.
In order to facilitate the installation of the flow equalizing plate 100 and not affect the flow equalizing effect of the flow equalizing plate 100, in this embodiment, mounting holes 115 are penetratingly formed in the position of the elastic plate body 110 corresponding to the groove 113 and other positions different from the flow equalizing region 111, and the mounting holes 115 are used for being matched with fasteners such as bolts and the like to mount and fix the elastic plate body 110 in the silicon wafer cleaning tank.
In addition, considering that the plurality of uniform flow holes 1111, which are formed by penetrating the plurality of uniform flow regions 111, affect the overall strength of the elastic plate body 110, in order to reduce the effect, in the present embodiment, the uniform flow holes 1111 of the respective uniform flow regions 111 are arranged in a staggered manner. That is, two leveling holes 1111 adjacent to each other in the first direction of the spring plate body 110 are offset from each other, and two leveling holes 1111 adjacent to each other in the second direction of the spring plate body 110 are also offset from each other.
In this embodiment, the elastic plate body 110 is rectangular, the first direction is the length direction of the elastic plate body 110, and the second direction is the width direction of the elastic plate body 110. In other embodiments, the elastic plate body 110 may also have other shapes, and the first direction and the second direction may be adaptively adjusted according to specific application conditions.
Referring to fig. 3, fig. 3 is an enlarged schematic view of the area a in fig. 2, the groove 113 is provided with a bottom wall 1131, a first side wall 1133 and a second side wall 1135, and the first side wall 1133 and the second side wall 1135 are respectively disposed on two opposite sides of the bottom wall 1131 and are connected to the side walls of the elastic plate 110.
In order to increase the folding degree of the elastic plate body 110 and reduce the folding difficulty of the elastic plate body 110, in this embodiment, the first side wall 1133 and the second side wall 1135 are both in the shape of a concave arc, and the degree of the central angle subtended by the first side wall 1133 and the second side wall 1135 is between 85 ° and 105 °, in this embodiment, the preferred value is 90 °.
In summary, the flow equalizing plate 100 of the present embodiment is configured with the groove 113 as the turning position of the flow equalizing regions 111 on the elastic plate 110, so that the elastic plate 110 can be easily turned over, and the shape can be changed to avoid obstacles in the process of dismounting and mounting, thereby realizing smooth dismounting and mounting in the silicon wafer cleaning tank and avoiding additional dismounting of other devices and structures in the silicon wafer cleaning tank.
Therefore, the flow equalizing plate 100 provided by the present embodiment has the characteristics of low difficulty and high efficiency in assembly and disassembly.
The embodiment also provides a silicon wafer cleaning tank for cleaning and processing a silicon wafer in a photovoltaic cell production process, wherein the silicon wafer cleaning tank is provided with the flow equalizing plate 100.
In practical application, for the disassembly and assembly of the uniform flow plate 100, various devices and structures arranged at the upper part of the silicon wafer cleaning tank can be prevented from being disassembled, and the uniform flow plate 100 can be folded by taking the groove 113 as a folding position to change the shape, so that a plurality of devices and structures are avoided, and the rapid disassembly and assembly is realized. Therefore, the silicon wafer cleaning tank provided by the embodiment has the characteristic of easy disassembly and assembly.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides an even flow board, its characterized in that, includes the elastic plate body, the interval is provided with a plurality of even flow regions on the elastic plate body, and is a plurality of even flow region runs through respectively and is provided with a plurality of even flow holes, arbitrary adjacent two be provided with the recess between the even flow region, the tank bottom thickness of recess is less than a plurality of even flow regional thickness.
2. The flow distribution plate of claim 1, wherein a plurality of the flow distribution regions are sequentially spaced along the first direction of the resilient plate body.
3. The flow distribution plate of claim 2 wherein the groove extends through the spring plate body in a second direction of the spring plate body.
4. The flow distribution plate of claim 2, wherein the plurality of grooves are arranged in parallel in a first direction of the resilient plate.
5. The flow distribution plate according to claim 4, wherein the plurality of grooves are recessed on the same side of the resilient plate body in the thickness direction of the resilient plate body.
6. The flow distribution plate according to claim 1, wherein the groove has a bottom wall, a first side wall and a second side wall, the first side wall and the second side wall are respectively disposed on two opposite sides of the bottom wall, and both the first side wall and the second side wall are in a concave arc shape.
7. The flow distribution plate of claim 6 wherein the first and second sidewalls subtend a central angle of between 85 ° and 105 °.
8. The flow distribution plate according to claim 1, wherein any two of the flow distribution holes adjacent to each other in the first direction of the elastic plate body are disposed in a staggered manner.
9. The flow distribution plate according to claim 1, wherein any two of the flow distribution holes adjacent to each other in the second direction of the elastic plate body are disposed in a staggered manner.
10. A silicon wafer cleaning tank comprising the flow distribution plate of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220512108.9U CN217043763U (en) | 2022-03-09 | 2022-03-09 | Flow equalizing plate and silicon wafer cleaning tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220512108.9U CN217043763U (en) | 2022-03-09 | 2022-03-09 | Flow equalizing plate and silicon wafer cleaning tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217043763U true CN217043763U (en) | 2022-07-26 |
Family
ID=82489221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220512108.9U Active CN217043763U (en) | 2022-03-09 | 2022-03-09 | Flow equalizing plate and silicon wafer cleaning tank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217043763U (en) |
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2022
- 2022-03-09 CN CN202220512108.9U patent/CN217043763U/en active Active
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